JP2008171840A - Liquid-cooled heat sink and design method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform an optimal design based on the capacity and the like of each electronic component in a case where a plurality of electronic components are arranged on the surface of a heat sink so as to be separated from each other.
In order to improve the heat transfer property of a heating element having a larger calorific value or a heating element located downstream, the heat transfer area of the fin is increased, or the flow rate of the coolant flowing directly under the fin or Increase the flow rate.
[Selection] Figure 1

Description

  The present invention relates to a liquid-cooled heat sink that cools a semiconductor or other electronic component such as a power IC that generates a large amount of heat, and a design method thereof.

  An electronic component having a large calorific value, such as a power IC, is attached to the outer surface of the heat sink body through which the coolant flows. When there are a plurality of the electronic components, it is necessary to set the optimum cooling condition according to the heat generation amount and the size of each electronic component separated from each other.

  However, when a plurality of electronic components are mounted on the heat sink so as to be separated from each other, a plurality of factors overlap and affect each other, so that it is difficult to obtain optimum cooling performance for each electronic component. That is, each electronic component has a different calorific value, size or application, liquid temperature is different between the upstream and downstream sides of the cooling liquid, the flow rate of the cooling liquid is not uniform directly under each electronic component, It is extremely difficult to optimize the cooling of each electronic component due to thermal effects on each other depending on the distance between components, non-uniform adhesion between the heat sink surface and the electronic component, and other factors. is there.

JP 2001-168869 A

Therefore, conventionally, the entire cooling design has been performed based on electronic components that are most likely to have the highest temperature. As a result, an excessive heat transfer area is secured for other electronic components, which increases the cost, weight, and pressure loss of the heat sink.
Then, this invention makes it a subject to solve the problem which concerns.

According to the present invention, the inner fin (2) is interposed in the flat heat sink body (1), the coolant (3) is circulated therein, and the heat sink body (1) is flat. In a liquid-cooled heat sink having a plurality of mounting surfaces on which a plurality of electronic components (4) are fixed in contact with a part of the outer surface,
When the heat generation amount of the electronic component (4) attached to the first mounting surface (5a) is larger than that of the second mounting surface (5b),
Or when the first heating surface (5a) is located downstream of the coolant (3) and the second mounting surface (5b) is located upstream of the same calorific value,
A liquid-cooled heat sink configured such that the heat transfer property of the inner fin (2a) immediately below the first mounting surface (5a) is greater than that of the inner fin (2b) of the second mounting surface (5b). is there.

The present invention according to claim 2 is the method according to claim 1,
The inner fin (2) is a corrugated type that is bent into a waveform,
The heat transfer area of the inner fin (2a) immediately below the first mounting surface (5a) is larger than that of the fin (2b) directly below the second mounting surface (5b) as follows. A liquid-cooled heat sink having one or more of the configurations.
The fin pitch is small, the fin amplitude is large, the fin plate thickness is thick, the fin is provided with a louver, the fin material has high thermal conductivity, and the fin is not present in other portions.

The present invention according to claim 3 provides the method according to claim 1,
The inner fin (2) has side frame parts (7) on both sides, and a plurality of spaced apart inclined bones (8) inclined between the side frame parts (7) or corrugated bones ( 6) are connected by a bone part, and there is at least a pair of them arranged in a plane, and they are stacked in the thickness direction so that the bone parts of the adjacent inner fins (2) intersect each other. It is of the configured helibone type,
One of the following, so that the heat transfer area of the bone part immediately below the first attachment surface (5a) is larger than that of the bone part immediately below the second attachment surface (5b). A liquid-cooled heat sink having the above configuration.
Inclined bone or wave bone pitch is small, inclined bone or wave bone is wide, inclined bone or wave bone has a high heat transfer coefficient, has a large number of steps, and there is no inclined bone or wave bone in other parts It is.

A fourth aspect of the present invention provides the method according to any one of the first to third aspects,
In the configuration in which there is a pair of mounting surfaces (5a) and (5b) at the upstream end and the downstream end in the flow direction of the coolant (3) of the heat sink body (1), and there is no mounting surface at the intermediate portion.
A liquid-cooled heat sink having any of the following conditions so that the heat transfer area of the fins directly below each mounting surface (5a) and (5b) is larger than that directly below the intermediate portion.
For the corrugated fin type
The fin pitch is small, the fin amplitude is large, the fin plate is thick, the fin is provided with a louver, the heat conductivity of the fin material is high, and no fin exists in the portion directly below the intermediate portion.
In the case of the above-mentioned helicone type inner fin
The bone part immediately below the attachment surfaces (5a) and (5b) has one or more of the following configurations as compared to the bone part directly below the intermediate part.
Inclined bone or wave bone pitch is small, inclined bone or wave bone is wide, inclined bone or wave bone has a high heat transfer coefficient, has a large number of steps, and there is no inclined bone or wave bone in other parts It is.

The present invention according to claim 5 is the invention according to claim 3,
The inner fin (2) has a partition part (9) provided in the direction of the side frame part (7) between the side frame parts (7), and the partition part (9) and both side frame parts (7) There are at least one pair connected by a large number of the bone parts, and they are stacked in the thickness direction, and the adjacent inner fins (2) have the bone parts intersecting each other in a plane, and The side frame part (7) and the partition part (9) are laminated in alignment, and the outer periphery of the laminated body is closed with a heat sink body composed of a pair of plates or flat tubes,
The partition portion (9) has a first flow portion (10) and a second flow portion (11) on both sides of the partition portion (9), and an inlet side manifold portion (12) and an outlet at both ends of the flow portions (10) and (11). A side manifold portion (13), and at the inlet side manifold (12), the coolant (3) is divided and guided to the first flow portion (10) and the second flow portion (11), It is configured so that it merges at the outlet side manifold part (13),
The inlet side manifold section (12) is provided with a flow path reducing means (14) at or near the end of the partition section (9) to restrict the flow of the coolant (3) to the second circulation section (11). It is a liquid-cooled heat sink.

The present invention according to claim 6 provides the method according to claim 3,
At least three of the inner fins (2) each have a first bone part on one side frame part (7) side between both side frame parts (7), and a second bone part on the other side. Have
The two adjacent inner fins (2) are laminated in the thickness direction, and the inclined bone (8a) or wave bone of the first bone portion overlaps each other in a plane so that the second bone portion The inclined bone (8b) or the corrugated bone intersect each other, and the side frame portion (7) and the partition portion (9) are aligned and laminated,
The at least one remaining inner fin (2) and the adjacent inner fin (2) include the inclined bone (8a) or wave bone of the first bone portion and the inclined bone (8b) or second bone portion. Waves intersect each other, and the side frame portion (7) and the partition portion (9) are aligned and laminated,
The outer periphery of the laminate is closed with a heat sink body consisting of a pair of plates or flat tubes,
A first flow portion (10) is provided on the first bone portion side, a second flow portion (11) is provided on the second bone portion side, and both flow portions (10) and (11) are provided at both ends. An inlet side manifold portion (12) and an outlet side manifold portion (13) are provided, and the coolant (3) is supplied to the inlet side manifold (12) from the first flow portion (10) and the second flow portion (11). And a liquid-cooled heat sink configured to be guided by the outlet manifold section (13).

The present invention described in claim 7 provides the method according to claim 3,
The inner fin (2) has a partition part (9) provided in the direction of the side frame part (7) between the side frame parts (7), and the partition part (9) and both side frame parts (7) There are at least one pair connected between the bone parts, and they are laminated in the thickness direction, and the adjacent inner fins (2) are such that the bone parts intersect each other in a plane, The outer periphery is closed by a heat sink body consisting of a pair of plates or flat tubes,
A first circulation part (10) and a second circulation part (11) on both sides of the partition part;
The partition portion (9) has a first flow portion (10) and a second flow portion (11) on both sides of the partition portion (9), and an inlet side manifold portion (12) and an outlet at both ends of the flow portions (10) and (11). A side manifold portion (13), and at the inlet side manifold (12), the coolant (3) is divided and guided to the first flow portion (10) and the second flow portion (11), It is configured so that it merges at the outlet side manifold part (13),
The flow velocity at which the width of the partitioning portion (9) and / or the width of the side frame (7) is amplified to reduce the cross section of the flow path to a part of the first flow portion (10) and the second flow portion (11). The liquid cooling heat sink is provided with a speed increasing portion (22), and a mounting surface (5) of the electronic component is disposed immediately above the flow speed increasing portion (22).

According to the present invention, the inner fin (2) is interposed in the flat heat sink body (1), the coolant (3) is circulated therein, and the heat sink body (1) is flat. In a method for manufacturing a liquid-cooled heat sink having a plurality of mounting surfaces on which a plurality of electronic components (4) are fixed in contact with a part of the outer surface,
When the electronic component (4) is attached to each mounting surface (5) and the coolant (3) is circulated, the heat transfer portion of the inner fin immediately below the electronic component (4) that has the highest temperature. A liquid-cooled heat sink characterized by adjusting the heat transfer area to be large or the flow rate of the coolant to be large so that the heat exchange amount is larger than that directly below other electronic components (4) This is the design method.

  In the present invention, the heat generation amount of the electronic component 4 attached to the attachment surface 5a is larger than that of the electronic component 4 attached to the attachment surface 5b, or the inner fin 2 directly below the second attachment surface 5a located on the downstream side of the coolant 3. Since the heat transfer property is configured to be larger than that of the inner fin 2 positioned on the upstream side, some of the electronic components 4 can be prevented from becoming abnormally high in temperature, and the temperature can be made uniform.

In the above configuration, the first mounting surface 5a and the second mounting surface 5b of the electronic component 4 are present at the upstream end portion and the downstream end portion in the flow direction of the coolant 3 and are not present at the intermediate portion. The heat transfer area of the inner fin 2 immediately below the first mounting surface 5a and the second mounting surface 5b can be configured to be larger than that directly below the intermediate portion.
In this case, the electronic component 4 can be efficiently cooled on the mounting surfaces 5a and 5b, and the flow resistance can be reduced at the intermediate portion in the flow direction of the coolant 3 so that the coolant 3 can flow smoothly. Then, due to the presence of the intermediate portion, the mounting surfaces 5a and 5b can be separated from each other, and the influence of the thermal influences of both can be made as small as possible. Thus, it is possible to reliably cool the electronic components 4 attached to both the attachment surfaces 5a and 5b (claim 4).

In the inner fin 2 of the helibone type, a partition portion 9 is provided, a first flow portion 10 and a tank second flow portion 11 are provided on both sides thereof, and a flow path reduction portion 14 is provided at an end of the partition portion 9 or in the vicinity thereof. Thus, the flow of the coolant 3 to the second flow part 11 can be restricted.
In this case, a large amount of the coolant 3 can be actively circulated through the first circulation part 10 to increase the cooling effect of the electronic component 4 in the first circulation part 10 (Claim 5).

  In the above-described configuration, the inclined bones 8a (including the wave bone 6, the same applies hereinafter) of the first bone portions of the two adjacent inner fins 2 are overlapped with each other in plan view, and the inclined bones 8b of the second bone portion are overlapped. In which the remaining inner fin 2 and the inclined bone 8a of the first bone portion and the inclined bone 8b of the second bone portion of the inner fin 2 adjacent thereto intersect with each other, the first Suppressing the stirring effect of the cooling fluid on the bone side compared to the second, promoting the cooling on the second bone side, and improving the cooling effect of the electronic components attached to that part from that of the first (Claim 6).

  In the above-described configuration, the flow velocity accelerating portion 22 that amplifies the width of the partition portion 8 and / or the width of the side frame 7 and reduces the cross section of the flow path to a part of the first flow portion 10 and the second flow portion 11. In the case where the electronic component mounting surface 5 is disposed immediately above the flow velocity accelerating portion 22, the cooling effect of the electronic component on the flow velocity accelerating portion 22 can be improved more than that of other portions. (Claim 7).

According to the design method of the liquid-cooled heat sink of the present invention, when the plurality of electronic components 4 are attached to the respective attachment surfaces 5 on the outer surface of the heat sink body 1 and the coolant 3 is circulated inside, the electron whose temperature is highest The heat transfer area is increased or the circulation of the coolant is increased so that the heat exchange amount of the heat transfer portion of the inner fin 2 immediately below the component 4 is greater than that directly below the other electronic component 4. Therefore, an optimum liquid-cooled heat sink can be designed efficiently and quickly.
That is, when a plurality of electronic components 4 having different heat generation amounts are provided on the upper surface of the heat sink, the temperature of each electronic component 4 can be designed quickly so as to be uniform.

Next, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is an exploded perspective schematic view of a heat sink showing a first embodiment of the present invention, and FIG. 2 is a plan view with the upper plate 16 removed in its assembled state.
This heat sink has a pair of helibone type inner fins 2 and a pair of plates 16 and 17 disposed on both upper and lower surfaces thereof. And they are laminated in the thickness direction, and each contact part is integrally brazed and fixed. The electronic components 4 are arranged on the plurality of mounting surfaces 5 provided on the outer surface of the plate 16 so as to be separated from each other. In this example, water flows from the inlet pipe 18 of the lower plate 17 as the coolant 3 into the inner fin 2 between the pair of plates 16 and 17, and flows out from the outlet pipe 19.

Each inner fin 2 is made of a stamped and formed body of a metal plate, and the outer periphery has a substantially rectangular plane by a pair of side frame portion 7 and end frame portion 20, and coolant flows out at both corners of one diagonal line. A protruding frame portion for entry is formed. A partition 9 is arranged between the pair of side frames 7, a first flow part 10 is arranged between the partition 9 and the left side frame 7, and the partition 9 and the right side frame 7. The second circulation part 11 is arranged between the two.
A large number of inclined bones 8 are formed in the first flow part 10 in parallel with the partition part 9 and the side frame part 7 in parallel with each other, and the second flow part 11 has a large number of wave bones 6 in the upstream and downstream parts, respectively. Are arranged in parallel to each other, and a large number of inclined bones 8 are arranged between the upstream portion and the downstream portion of each wave bone 6. The interval between the inclined bones 8 in the second circulation part 11 is larger than that in the first circulation part 10.
Although not shown in the drawing, the interval between the corrugated bones 6 is smaller than the interval between the inclined bones 8 in the first flow part 10 and the width of the inclined bones 8 is widened to increase the heat transfer area. Yes. Furthermore, the heat transfer area of the downstream part of each circulation part 10 and 11 is made larger than that of the upstream part. In addition, these heat transfer areas can also be made the same.

Next, the direction of the inclined bone 8 is opposite between the inner fin 2 positioned on the upper side in the stacking direction and the inner fin 2 positioned on the lower side. Further, the wave bone 6 is shifted in half pitch position by the upper and lower inner fins 2 in the wave phase. Further, the tip of the partition 9 protrudes more than the most upstream corrugated bone 6 and the inclined bone 8, and the end frame portion 20 facing it protrudes toward the partition 9, and thereby the flow path reducing portion of the upstream manifold section 12. 14 is formed. The corrugated bones 6, the inclined bones 8, the side frame portions 7, and the end frame portions 20 are formed flush with each other, and the upper and lower partition portions 9, the inner fins 2, and the end frame portions 20 are aligned with each other. These inclined bones and corrugated bones 6 constitute a bone portion, an upstream manifold portion 12 is provided on the upstream side, and a downstream manifold portion 13 is provided on the downstream side.
The plurality of inner fins 2 and the plates 16 and 17 are laminated in the thickness direction, and the contact portions are integrally brazed and fixed. The ends of the pair of inlet pipes 18 and outlet pipes 19 communicate with the lowermost plate 17 in the stacking direction.

The electronic parts 4 are attached to the respective attachment surfaces 5 on the heat sink plate 16 thus separated by means such as soldering. When the electronic component 4 is a power IC or the like, the lower surface side of the electronic component 4 is usually bonded to the mounting surface 5 via a heat conductive insulating substrate (not shown).
Then, the coolant 3 is supplied from the inlet pipe 18 to the manifold portion 13 of the pair of inner fins 2, which vertically moves the gaps between the inclined bones 8 and the corrugated bones 6 of the first flow portion 10 and the second flow portion 11. Circulates in a meandering manner, flows from the downstream manifold portion 13 to the outlet pipe 19 and flows out.

The coolant 3 that has flowed to the outside is cooled by a heat exchanger (not shown), and flows into the inside through the inlet pipe 18 again and circulates. And while the cooling fluid 3 distribute | circulates the inside of a heat sink, the heat | fever from each electronic component 4 is absorbed.
Each electronic component 4 has a different calorific value size and application, and is located on the upstream side in the flow direction of the coolant 3 and located on the downstream side. Further, the first flow part 10 and the second flow part 11 have different flow rates due to the presence of the flow path reduction part 14 and the difference in flow path resistance. In addition, the heat radiation area of the fin is different in each part of each flow path. The surface temperature of each electronic component 4 is relatively high and low due to the difference in the heat exchange amount between these parts, the difference in the heat generation amount of the electronic component 4, and others.

  In this case, the present invention adjusts the heat transfer area of the fin immediately below the electronic component 4 having the highest surface temperature to be large. That is, in the helibone type of FIG. 1, if the width is the same, the pitch of the wave bone 6 or the inclined bone 8 is shortened. Alternatively, the plate thickness is increased. Furthermore, the heat transfer coefficient can be improved. A plurality of combinations thereof can also be taken. As a result, the heat absorption from each electronic component 4 can be optimized and the surface temperature of each electronic component 4 can be made uniform.

In designing the heat sink, the following is considered.
When the calorific value of the electronic component 4 attached to the first mounting surface 5a is larger than that of the second mounting surface 5b, or when the calorific value is the same, the first first mounting surface 5a is downstream of the coolant 3. When the second mounting surface 5b is positioned on the upstream side, the heat conductivity of the fin 2a immediately below the first mounting surface 5a is greater than that of the fin 2b directly below the second mounting surface 5b. Great.
Further, when the inner fin 2 has the partitioning portion 9, the upstream side manifold is configured to increase the flow rate of the heat generation amount larger than any one of the electronic components 4 located on both sides of the partitioning portion 9. The flow path reduction part 14 is provided in the part 12 for adjustment.

In the second flow part 11, the density of fins made of the corrugated bones 6 provided at the upstream end part and the downstream end part thereof is larger than that of the intermediate inclined bone 8. At the same time, the flow path resistance in the inclined bone 8 of the second flow part 11 becomes small. With this configuration, the heat transfer directly under the electronic component 4 on the aggregate of the corrugated bones 6 is improved, the cooling effect is increased, and the pressure loss in the midstream region of the second circulation part 11 is reduced. In addition, by providing the midstream region, the thermal influence between the electronic component 4 on the upstream side and the electronic component 4 on the downstream side can be reduced as much as possible.
Further, the inclined bone 8 in the second flow part 11 may be removed. Furthermore, the inclined bone 8 can be removed also in the middle flow area in the first flow part 10. As a result, the pressure loss in the midstream region in the first flow section 10 can be reduced, and the thermal influence between the upstream electronic component 4 and the downstream electronic component 4 can be reduced as much as possible.

Next, FIG. 3 is an exploded perspective view of a heat sink showing a second embodiment of the present invention, and the inner fin 2 of this example is of a corrugated fin type in which a metal plate is bent into a corrugated shape. And the inner fin 2b located in the upstream and the inner fin 2a located in the downstream part each have a small fin pitch, and the inner fin 2 located in the midstream part is larger. In this example, the wave amplitudes of the inner fins 2b and 2a are the same.
These inner fins 2 are accommodated in the heat sink body 1 and both ends thereof are closed by end lids 21, and an inlet pipe 18 and an outlet pipe 19 are communicated with both ends (or lower parts) in the longitudinal direction of the heat sink body 1. It has been done.

  In this example, the electronic components 4 are respectively attached to the upstream attachment surface 5 and the downstream attachment surface 5 of the heat sink body 1. Then, the coolant 3 is guided to the inside from the inlet pipe 18, flows through each inner fin 2, and flows out from the outlet pipe 19. Inner fins 2a and 2b having a large heat transfer area are disposed at the upstream and downstream portions of the coolant 3, respectively, and efficiently absorb the heat from the electronic components 4 disposed therein.

  Also in the design of such a corrugated inner fin 2, the same fin design as the above-described helibone type inner fin 2 is possible. For example, since the temperature of the coolant 3 of the electronic component 4 located on the downstream side of the coolant 3 is higher than that of the upstream side, in the case of the same electronic component 4 on the upstream side and the downstream side, the downstream side It is necessary to make the heat radiation area of the inner fin 2a on the side larger than that on the upstream side. Thereby, the surface temperature of each electronic component 4 can be made uniform. Therefore, the pitch of the inner fins 2 on the downstream side may be further reduced to improve the heat transfer area.

The following means can be taken instead of or together with the fin pitch. One or more of the above-described configurations can be employed, such as increasing the fin plate thickness, providing a fin with a louver, and selecting a fin material with high heat transfer. Thereby, the surface temperature of the electronic component 4 on the upstream side and the electronic component 4 on the downstream side can be made uniform.
Moreover, a partition (not shown) is provided in the middle of the heat sink body 1 in the width direction, different inner fins are arranged on both sides thereof, and electronic components can be attached immediately above the inner fins. In this case, the cooling of each electronic component can be optimized by changing the flow rate on both sides of the partition or changing the heat transfer area of the fins.

Next, FIG. 4 shows a third embodiment of the present invention, in which (A) is an exploded perspective view of the heat sink, and (B) is a longitudinal sectional view showing an assembled state thereof.
The corrugated fin of this example is of an offset type, and has a large number of cut-and-raised portions formed in the wave traveling direction and the ridge line direction, respectively. In this example, the amplitude of the upstream inner fin 2 is formed larger than the amplitude of the downstream side.
In this example, the electronic component 4 on the first mounting surface 5a on the downstream side has an extremely small amount of heat generation compared to that on the upstream side. Therefore, even if the amplitude of the downstream inner fin 2 close to the outlet pipe 19 is reduced and the heat dissipation area is reduced, the heat generation of the electronic component 4 on the downstream side can be sufficiently absorbed. In this example, the inner fin 2 does not exist in the midstream portion that is intermediate between the upstream side and the downstream side.
By doing so, the upstream electronic component 4 and the downstream electronic component 4 do not affect each other thermally, and the pressure loss of the coolant 3 can be reduced in the midstream portion.

Next, FIG. 5 shows an embodiment of a fourth liquid-cooled heat sink according to the present invention, in which (A) is a schematic exploded perspective view of the heat sink, and (B) is the second inner fin 2 and the third third from the left. It is a perspective explanatory view showing a combination state with the second inner fin 2.
In this example, there are six inner fins 2 (a minimum of three is sufficient), each inner fin 2 has a partition 9 in the middle in the width direction, and the first bones on both sides thereof. Part and a second bone part.
And each inner fin 2 is laminated | stacked on the thickness direction. In this example, the adjacent inner fins 2 in the first to third and fourth to sixth groups from the left are the inclined bones 8a (or unillustrated wave bones) of the first bone portion located on the left side in the figure. , The same applies hereinafter) overlap each other in plan view (see FIG. 5B), and all the inclined bones 8b of the second bone portion located on the right side intersect each other. At the same time, the side frame portion 7 and the partition portion 9 are aligned.
In the first to third and fourth to sixth pairs from the left, the first inclined bones 8a located on the left side also intersect each other. A pair of plates 17 and 18 are attached to both sides of the laminated body of the inner fins 2.

The first flow part 10 is provided on the first bone part side, the second flow part 11 is provided on the second bone part side, and the inlet side manifold part 12 is provided at both ends of both flow parts 10 and 11. An outlet side manifold portion 13, and the coolant 3 is branched and guided to the first flow portion 10 and the second flow portion 11 by the inlet side manifold 12, and is merged by the outlet side manifold portion 13. It is configured as follows.
By comprising in this way, the stirring effect of the 1st bone | frame part side cooling liquid is suppressed compared with the 2nd thing, cooling of the 2nd bone | frame part side is accelerated | stimulated, and the electronic component attached to the part The cooling effect can be improved over that of the first.

Next, FIG. 6 is a schematic exploded perspective view showing a fifth embodiment of the liquid-cooled heat sink of the present invention. This liquid-cooled heat sink has a pair of helibone type inner fins 2 and a pair of plates 16 and 17. Each inner fin 2 has a partition portion 9 in the middle in the width direction, and the partition portion 9 and both side frame portions 7 are connected by a bone portion. As for each inner fin 2, the said bone part mutually cross | intersects planarly.
A first flow part 10 and a second flow part 11 are provided on both sides of the partition part, and an inlet side manifold part 12 and an outlet side manifold part 13 are provided at both ends of both flow parts 10 and 11. The width of the partition portion 9 and the width of the side frame 7 are amplified in the middle in the longitudinal direction, and a flow velocity accelerating portion 22 for reducing the cross section of the flow path is provided in a part of the first flow portion 10 and the second flow portion 11. The mounting surface 5 of the electronic component 4 having a large heat dissipation amount is disposed immediately above the flow velocity accelerating portion 22, and the electronic component 4 having a small heat dissipation amount is attached to the other portion. This is because the flow rate of the cooling liquid in the flow rate accelerating portion 22 becomes large, and the amount of heat absorbed per unit area of the mounting surface 5 directly above it increases.

1 is an exploded perspective view schematically showing a first embodiment of a heat sink according to the present invention. The top view which removed the plate 16 in the assembly state of the heat sink. The disassembled perspective view which shows 2nd Embodiment of the heat sink of this invention. The exploded perspective view which shows 3rd Embodiment of the heat sink of this invention, and the longitudinal cross-sectional view which shows the assembly state. The disassembled perspective view which shows 4th Embodiment of the heat sink of this invention, and the perspective explanatory drawing which shows the combined state of an inner fin. The disassembled perspective view which shows 5th Embodiment of the heat sink of this invention.

Explanation of symbols

1 Heat sink body 2 Inner fin
2a Inner fin
2b Inner fin 3 Coolant 4 Electronic component 5 Mounting surface

5a First mounting surface
5b Second mounting surface 6 Corrugated bone 7 Side frame 8 Inclined bone
8a inclined bone
8b Inclined bone 9 Partition
10 1st Distribution Department
11 Second Distribution Department

12 Inlet side manifold
13 Outlet manifold
14 Channel reduction part
16 plates
17 plates
18 inlet pipe
19 Outlet pipe
20 End frame
21 End cover
22 Flow speed increaser
23 Central wide part
24 Wide side

Claims (8)

An inner fin (2) is interposed inside the flat heat sink body (1), the coolant (3) circulates inside, and a plurality of electronic components are formed on a part of the flat outer surface of the heat sink body (1). In the liquid cooling heat sink having a plurality of mounting surfaces to which (4) is fixed in contact,
When the heat generation amount of the electronic component (4) attached to the first mounting surface (5a) is larger than that of the second mounting surface (5b),
Or when the first heating surface (5a) is located downstream of the coolant (3) and the second mounting surface (5b) is located upstream of the same calorific value,
A liquid-cooled heat sink configured such that the heat transfer property of the inner fin (2a) immediately below the first mounting surface (5a) is greater than that of the inner fin (2b) of the second mounting surface (5b). In claim 1,
The inner fin (2) is a corrugated type that is bent into a waveform,
The heat transfer area of the inner fin (2a) immediately below the first mounting surface (5a) is larger than that of the fin (2b) directly below the second mounting surface (5b) as follows. A liquid-cooled heat sink having one or more of the configurations.
The fin pitch is small, the fin amplitude is large, the fin plate thickness is thick, the fin is provided with a louver, the heat conductivity of the fin material is high, and there are no fins in other portions. In claim 1,
The inner fin (2) has side frame parts (7) on both sides, and a plurality of spaced apart inclined bones (8) inclined between the side frame parts (7) or corrugated bones ( 6) are connected by a bone part, and there is at least a pair of them arranged in a plane, and they are stacked in the thickness direction so that the bone parts of the adjacent inner fins (2) intersect each other. It is of the configured helibone type,
One of the following, so that the heat transfer area of the bone part immediately below the first attachment surface (5a) is larger than that of the bone part immediately below the second attachment surface (5b). A liquid-cooled heat sink having the above configuration.
The pitch of the tilted bone or wave bone is small, the width of the tilted bone or wave bone is wide, the heat transfer rate of the tilted bone or wave bone is high, the number of steps is high, and there is no tilted bone or wave bone in other parts. In any one of Claims 1-3,
In the configuration in which there is a pair of mounting surfaces (5a) and (5b) at the upstream end and the downstream end in the flow direction of the coolant (3) of the heat sink body (1), and there is no mounting surface at the intermediate portion.
A liquid-cooled heat sink having any of the following conditions so that the heat transfer area of the fins directly below each mounting surface (5a) and (5b) is larger than that directly below the intermediate portion.
For the corrugated fin type
The fin pitch is small, the fin amplitude is large, the fin plate is thick, the fin is provided with a louver, the heat conductivity of the fin material is high, and no fin exists in the portion directly below the intermediate portion.
In the case of the above-mentioned helicone type inner fin
The bone part immediately below the attachment surfaces (5a) and (5b) has one or more of the following configurations as compared to the bone part directly below the intermediate part.
The pitch of the tilted bone or wave bone is small, the width of the tilted bone or wave bone is wide, the heat transfer rate of the tilted bone or wave bone is high, the number of steps is high, and there is no tilted bone or wave bone in other parts. In claim 3,
The inner fin (2) has a partition part (9) provided in the direction of the side frame part (7) between the side frame parts (7), and the partition part (9) and both side frame parts (7) There are at least one pair connected by a large number of the bone parts, and they are stacked in the thickness direction, and the adjacent inner fins (2) have the bone parts intersecting each other in a plane, and The side frame part (7) and the partition part (9) are laminated in alignment, and the outer periphery of the laminated body is closed with a heat sink body composed of a pair of plates or flat tubes,
The partition portion (9) has a first flow portion (10) and a second flow portion (11) on both sides of the partition portion (9), and an inlet side manifold portion (12) and an outlet at both ends of the flow portions (10) and (11). A side manifold portion (13), and at the inlet side manifold (12), the coolant (3) is divided and guided to the first flow portion (10) and the second flow portion (11), It is configured so that it merges at the outlet side manifold part (13),
The inlet side manifold section (12) is provided with a flow path reducing means (14) at or near the end of the partition section (9) to restrict the flow of the coolant (3) to the second circulation section (11). Liquid-cooled heat sink. In claim 3,
At least three of the inner fins (2) each have a first bone part on one side frame part (7) side between both side frame parts (7), and a second bone part on the other side. Have
The two adjacent inner fins (2) are laminated in the thickness direction, and the inclined bone (8a) or wave bone of the first bone portion overlaps each other in a plane so that the second bone portion The inclined bone (8b) or the corrugated bone intersect each other, and the side frame portion (7) and the partition portion (9) are aligned and laminated,
The at least one remaining inner fin (2) and the adjacent inner fin (2) include the inclined bone (8a) or wave bone of the first bone portion and the inclined bone (8b) or second bone portion. Waves intersect each other, and the side frame portion (7) and the partition portion (9) are aligned and laminated,
The outer periphery of the laminate is closed with a heat sink body consisting of a pair of plates or flat tubes,
A first flow portion (10) is provided on the first bone portion side, a second flow portion (11) is provided on the second bone portion side, and both flow portions (10) and (11) are provided at both ends. An inlet side manifold portion (12) and an outlet side manifold portion (13) are provided, and the coolant (3) is supplied to the inlet side manifold (12) from the first flow portion (10) and the second flow portion (11). And a liquid-cooled heat sink configured to be guided at the outlet and to join at the outlet side manifold section (13). In claim 3,
The inner fin (2) has a partition part (9) provided in the direction of the side frame part (7) between the side frame parts (7), and the partition part (9) and both side frame parts (7) There are at least one pair connected between the bone parts, and they are laminated in the thickness direction, and the adjacent inner fins (2) are such that the bone parts intersect each other in a plane, The outer periphery is closed by a heat sink body consisting of a pair of plates or flat tubes,
A first circulation part (10) and a second circulation part (11) on both sides of the partition part;
The partition portion (9) has a first flow portion (10) and a second flow portion (11) on both sides of the partition portion (9), and an inlet side manifold portion (12) and an outlet at both ends of the flow portions (10) and (11). A side manifold portion (13), and at the inlet side manifold (12), the coolant (3) is divided and guided to the first flow portion (10) and the second flow portion (11), It is configured so that it merges at the outlet side manifold part (13),
The flow velocity at which the width of the partitioning portion (9) and / or the width of the side frame (7) is amplified to reduce the cross section of the flow path to a part of the first flow portion (10) and the second flow portion (11). A liquid-cooled heat sink in which a speed increasing portion (22) is provided, and a mounting surface (5) for an electronic component is disposed immediately above the speed increasing portion (22). An inner fin (2) is interposed inside the flat heat sink body (1), the coolant (3) circulates inside, and a plurality of electronic components are formed on a part of the flat outer surface of the heat sink body (1). In the manufacturing method of the liquid cooling heat sink having a plurality of mounting surfaces to which (4) is contact-fixed,
When the electronic component (4) is attached to each mounting surface (5) and the coolant (3) is circulated, the heat transfer portion of the inner fin immediately below the electronic component (4) that has the highest temperature. A liquid-cooled heat sink characterized by adjusting the heat transfer area to be large or the flow rate of the coolant to be large so that the heat exchange amount is larger than that directly below other electronic components (4) Design method.

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