CN221043598U

CN221043598U - Heat dissipating device and electronic equipment

Info

Publication number: CN221043598U
Application number: CN202322357179.3U
Authority: CN
Inventors: 赵巍然; 夏云波
Original assignee: Lenovo Beijing Ltd
Current assignee: Lenovo Beijing Ltd
Priority date: 2023-08-31
Filing date: 2023-08-31
Publication date: 2024-05-28
Anticipated expiration: 2033-08-31

Abstract

The application provides a heat dissipation device and an electronic device, wherein the heat dissipation device comprises: the shell comprises a first shell and a second shell which are oppositely arranged, and the first shell and the second shell are connected with the third shell to form a containing space; the target shell adopts a first heat dissipation component with a capillary structure; the target housing is at least one of a first housing, a second housing, and a third housing.

Description

Heat dissipating device and electronic equipment

Technical Field

The present application relates to the field of heat dissipation technologies, and in particular, to a heat dissipation device and an electronic device.

Background

In the working process of the electronic equipment, as the electronic element can generate larger heat, the heat is dissipated in a mode of combining a heat pipe, a Vapor chamber (VC for short), fins and a fan, the heat pipe and the Vapor chamber transfer the heat to the fan, and the fins and the fan are utilized for heat exchange, so that the temperature is reduced. The fan housing is not effectively utilized, and the heat conduction efficiency is low, so that the heat dissipation effect is poor.

Disclosure of utility model

The embodiment of the application provides a heat dissipation device and electronic equipment:

The first aspect of the present application provides a heat dissipating device, comprising:

The shell comprises a first shell and a second shell which are oppositely arranged, and the first shell and the second shell are connected with a third shell to form a containing space;

The target shell adopts a first heat dissipation component with a capillary structure; the target housing is at least one of the first housing, the second housing, and the third housing.

In some modified embodiments of the first aspect of the present application, the first heat dissipation component is a temperature equalizing plate or a heat pipe.

In some embodiments, the third housing is the first heat dissipating component for carrying heat away by the gas flow during operation.

In some embodiments, the first housing and/or the second housing is the first heat sink assembly, and the first housing and/or the second housing is in communication with the third housing for heat transfer with the third housing.

In some embodiments, a seal assembly is further included, the seal assembly being disposed at a junction of the first housing, the second housing, and the third housing.

In some embodiments, the heat sink further comprises a heat sink fin disposed in the accommodating space, the heat sink fin adopting a second heat sink assembly having a capillary structure;

The side edges of the radiating fins are connected with the first shell and/or the second shell.

In some embodiments, the device further comprises a diversion component, wherein the diversion component is arranged in the accommodating space in an arc shape;

the flow guide assembly adopts a third heat dissipation assembly with a capillary structure;

The side edge of the flow guiding component is connected with the first shell and/or the second shell.

In some embodiments, the first housing and the second housing are connected by the heat sink fins, or,

The first shell is connected with the second shell through the flow guide assembly;

The heat dissipation fins or the flow guide assembly provides supporting force for the first shell and the second shell and is used for increasing back pressure of the heat dissipation device.

In some embodiments, the first housing is in communication with the second housing through the third housing; and/or the number of the groups of groups,

The first shell is communicated with the second shell through the radiating fins, or the first shell is communicated with the second shell through the flow guide assembly;

So that the first housing exchanges heat with the second housing.

A second aspect of the present application provides an electronic device, comprising:

a heat conducting device and a heat dissipating device of the first aspect;

the heat conduction device and the shell are of an integrated structure; or alternatively, the first and second heat exchangers may be,

The heat conduction device and the shell are of a split combined structure.

Drawings

The above, as well as additional purposes, features, and advantages of exemplary embodiments of the present application will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. In the drawings, wherein like or corresponding reference numerals indicate like or corresponding parts, there are shown by way of illustration, and not limitation, several embodiments of the application, in which:

Fig. 1 schematically illustrates a schematic structural view of a heat sink and a heat conducting device of an embodiment at a first view angle;

FIG. 2 schematically illustrates a partial enlarged view at C in FIG. 1;

FIG. 3 schematically illustrates a structural schematic diagram of a second view of a heat sink and a heat conduction device of an embodiment;

FIG. 4 schematically illustrates a partial enlarged view at D in FIG. 3;

fig. 5 schematically illustrates a schematic structural view of a third view of a heat dissipating device and a heat conducting device according to an embodiment.

Fig. 6 schematically shows a schematic structural view of a heat dissipating device and a heat conducting device of another embodiment;

fig. 7 schematically illustrates a connection diagram of another embodiment of a housing, heat fins and sealing assembly.

Reference numerals illustrate:

100. A heat sink; 1. a housing; 11. a first housing; 12. a second housing; 13. a third housing; 2. a heat radiation fin; 3. a flow guiding assembly; 4. a fan; 200. and a heat conduction device.

Detailed Description

Embodiments of the present disclosure are described in further detail below with reference to the drawings and examples. The following detailed description of the embodiments and the accompanying drawings are provided to illustrate the principles of the disclosure and not to limit the scope of the disclosure, which may be embodied in many different forms and not limited to the specific embodiments disclosed herein, but rather to include all technical solutions falling within the scope of the claims.

The present disclosure provides these embodiments in order to make the present disclosure thorough and complete, and fully convey the scope of the disclosure to those skilled in the art. It should be noted that: the relative arrangement of parts and steps, the composition of materials, numerical expressions and numerical values set forth in these embodiments should be construed as exemplary only and not limiting unless otherwise specifically stated.

In the description of the present disclosure, unless otherwise indicated, the meaning of "plurality" is greater than or equal to two; the terms "upper," "lower," "left," "right," "inner," "outer," and the like indicate an orientation or positional relationship merely for convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present disclosure. When the absolute position of the object to be described is changed, the relative positional relationship may be changed accordingly.

Furthermore, the use of the terms first, second, and the like in this disclosure do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The "vertical" is not strictly vertical but is within the allowable error range. "parallel" is not strictly parallel but is within the tolerance of the error. The word "comprising" or "comprises" and the like means that elements preceding the word encompass the elements recited after the word, and not exclude the possibility of also encompassing other elements.

It should also be noted that, in the description of the present disclosure, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms in the present disclosure may be understood as appropriate by those of ordinary skill in the art. When a particular device is described as being located between a first device and a second device, there may or may not be an intervening device between the particular device and either the first device or the second device.

All terms used in the present disclosure have the same meaning as understood by one of ordinary skill in the art to which the present disclosure pertains, unless specifically defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods, and apparatus should be considered part of the specification.

Example 1

As shown in fig. 1 to 5, embodiment 1 of the present application provides a heat dissipating device 100, including;

The shell 1 comprises a first shell 11 and a second shell 12 which are oppositely arranged, wherein the first shell 11 and the second shell 12 are connected with a third shell 13 to form a containing space;

The target housing 1 adopts a first heat dissipation component with a capillary structure; the target housing 1 is at least one housing 1 among the first housing 11, the second housing 12, and the third housing 13.

Specifically, the accommodating space in the housing 1 may be used for providing the fan 4, and heat is taken away by using the air flow generated by the fan 4 to realize heat dissipation. Since all or part of the housing 1 is made of the first heat dissipation assembly with the capillary structure, the first heat dissipation assembly can enable the wind blown by the fan 4 to directly contact with the surface of the first heat dissipation assembly, so that heat exchange is faster.

The first housing 11 and the second housing 12 may each be plate-shaped, and the fan 4 is disposed between the first housing 11 and the second housing 12. The fan 4 is connected with the first surface of the first shell 11 and has a preset distance with the first surface of the second shell 12; or the fan 4 is coupled to the first surface of the second housing 12 with a predetermined distance from the first surface of the first housing 11. Wherein the fan 4 and the housing 1 may be coupled in the form of a paste or a bolt, the first surface of the first housing 11 is opposite to the first surface of the second housing 12.

The third housing 13 is for connecting the first housing 11 and the second housing 12 and forming an accommodating space. The third housing 13 may be plate-shaped or tubular with a certain curvature, and in order to reduce the overall volume of the heat dissipating device 100, the sides of the third housing 13 are connected to a portion of the edges of the first surface of the first housing 11 and a portion of the edges of the first surface of the second housing 12, respectively, such that the third housing 13 forms a semi-enclosed structure with the first housing 11 and the second housing 12, and an opening of the semi-enclosed structure is used for air-out.

The setting of the target housing 1 has three cases in total: firstly, only one shell 1 is taken as a target shell 1, at the moment, the first shell 11 is taken as the target shell 1, and the second shell 12 and the third shell 13 adopt original structures; or the second shell 12 is the target shell 1, and the first shell 11 and the third shell 13 adopt original structures; or the third shell 13 is the target shell 1, and the first shell 11 and the second shell 12 adopt original structures; secondly, two shells 1 are taken as target shells 1, at the moment, a first shell 11 and a second shell 12 are taken as target shells 1, and a third shell 13 adopts an original structure; or the first shell 11 and the third shell 13 are target shells 1, and the second shell 12 adopts an original structure; or the second shell 12 and the third shell 13 are target shells 1, and the first shell 11 adopts an original structure; three housings 1 are all target housings 1, i.e., the first housing 11, the second housing 12, and the third housing 13 are all target housings 1. The heat dissipation is performed by using all or part of the housing 1 without additionally increasing the space occupied by the heat dissipation device 100.

The whole shell 1 can be made of metal, and the first shell 11, the second shell 12 and the third shell 13 can be connected in a welding mode.

In the heat dissipating device 100 provided by the application, at least one shell 1 of the first shell 11, the second shell 12 and the third shell 13 is a first heat dissipating component, so that at least one shell 1 of the three shells 1 has a heat dissipating function, the heat dissipating effect of the heat dissipating device 100 is enhanced, and the space occupied by the heat dissipating device 100 is not increased.

As shown in fig. 1 and 2, in some embodiments, the first heat dissipation component is a temperature equalizing plate or a heat pipe.

Specifically, to facilitate the processing of the housing 1, the first heat dissipation component may be a known temperature equalizing plate or a heat pipe.

Since the fan 4 is disposed in the accommodating space, and the fan 4 is connected to the first surface of the first housing 11 or the first surface of the second housing 12, it is required that the first surface of the first housing 11 and the first surface of the second housing 12 have a certain size, so that the accommodating space capable of accommodating the fan 4 is formed after the first housing 11, the second housing 12 and the third housing 13 are connected.

Thus, when the first casing 11 is the target casing 1 in the design of the casing 1, the first casing 11 is a temperature equalizing plate; when the second casing 12 is the target casing 1, the second casing 12 is a temperature equalizing plate; when the first casing 11 and the second casing 12 are both the target casing 1, the first casing 11 and the second casing 12 are both temperature equalizing plates.

As shown in fig. 6 and 7, when the third housing 13 is the target housing 1 and the third housing 13 is tubular, the first heat dissipation member is a heat pipe. In order to intercept heat generated by the electronic device and improve heat dissipation efficiency, the third housing 13 may be disposed in a strong wind area, and the third housing 13 may be welded with the heat dissipation fins 2 and the heat conduction device 200. When the whole shell 1 is made of metal, the third shell 13 can be welded with the first shell 11 and the second shell 12 respectively, so that the heat dissipation area is increased, and the heat dissipation effect is further improved. In the process of assembling, other parts except the third shell 13 can be preassembled, then the third shell 13 is welded, and in order to ensure tightness, the sealing assembly 5 can be added at the joint of the third shell 13 and the first shell 11 and the second shell 12 for sealing treatment.

When the third casing 13 is the target casing 1 and the third casing 13 is plate-shaped, the first heat dissipation component is a temperature equalizing plate, and the third casing 13 may be welded with the first casing 11 and the second casing 12 respectively, so as to increase the heat dissipation area and further improve the heat dissipation effect. In order to facilitate the processing, the third housing 13 may be spaced from the heat sink fins 2.

In some embodiments, the third housing 13 is the first heat dissipating component, and is configured to remove heat from the gas flowing during operation.

Because the fan 4 mainly flows to the periphery side of the fan 4 in the working process, when the third shell 13 is the first heat dissipation component, the third shell 13 arranged between the first shell 11 and the second shell 12 can be directly contacted with wind at the position of the fan 4, thereby being more beneficial to taking away heat and enhancing the heat dissipation effect.

As shown in fig. 1 to 5, in some embodiments, the first housing 11 and/or the second housing 12 is the first heat dissipation component, and the first housing 11 and/or the second housing 12 are in communication with the third housing 13 for achieving heat transfer with the third housing 13.

Specifically, in order to enhance the communication effect of the third casing 13 with the first casing 11 and/or the second casing 12, the third casing 13 may employ a temperature equalizing plate. The design of the communication of the third housing 13 includes three cases in total: the first capillary structure in the first shell 11 is communicated with the capillary structure in the third shell 13, and the third shell 13 is connected with the second shell 12; secondly, the capillary structure in the second shell 12 is communicated with the capillary structure in the third shell 13, and the third shell 13 is connected with the first shell 11; thirdly, the capillary structure in the first housing 11 communicates with the capillary structure in the third housing 13, while the capillary structure in the second housing 12 also communicates with the capillary structure in the first housing 11. The design of intercommunication can make the transmission of heat between first casing 11 and/or second casing 12 and the third casing 13, improves the holistic sameness of casing 1, further strengthens the radiating effect of casing 1.

As shown in fig. 6 and 7, in some embodiments, the sealing assembly 5 is further included, and the sealing assembly 5 is disposed at a connection of the first housing 11, the second housing 12, and the third housing 13.

In particular, the sealing assembly 5 is used for sealing treatment, ensuring the stability of the connection. When the first shell 11 and/or the second shell 12 are/is communicated with the third shell 13, the sealing assembly 5 can also ensure the tightness of the communication part, ensure the normal heat dissipation of the first heat dissipation assembly, and further ensure the heat dissipation effect of the heat dissipation device 100. The sealing assembly 5 may be a sealing strip or a sealant.

As shown in fig. 3 and 4, in some embodiments, the heat dissipation device further includes a heat dissipation fin 2, where the heat dissipation fin 2 is disposed in the accommodating space, and the heat dissipation fin 2 adopts a second heat dissipation component with a capillary structure;

the side edges of the heat radiation fins 2 are connected with the first housing 11 and/or the second housing 12.

Specifically, the second heat dissipation assembly may select a temperature equalizing plate. The side edges of the heat radiation fins 2 may be connected to the first housing 11 to be spaced apart from or in contact with the second housing 12; or the side edge of the heat radiation fin 2 may be connected to the second housing 12 to be spaced apart from or in contact with the second housing 12; or the side edges of the heat radiation fins 2 are respectively connected with the first housing 11 and the second housing 12.

The heat dissipation device has the advantages that the traditional heat dissipation fins 2 are replaced by the heat dissipation plates, the capillary structures inside the heat dissipation fins 2 are used for further soaking, the overall heat dissipation performance of the heat dissipation device 100 is improved, the fans 4 and the heat dissipation fins 2 are enabled to directly conduct heat exchange, and the heat conduction efficiency is improved.

As shown in fig. 1 and 2, in some embodiments, the device further includes a flow guiding assembly 3, where the flow guiding assembly 3 is disposed in an arc shape in the accommodating space;

The flow guiding component 3 adopts a third heat dissipation component with a capillary structure;

the side edges of the flow guiding assembly 3 are connected with the first shell 11 and/or the second shell 12.

Specifically, the arcuate flow guiding assembly 3 can change the direction of the air flowing out of the fan 4, so that the air flow with a certain temperature can be smoothly blown out of the housing 1, thereby enhancing the heat dissipation effect of the heat dissipation device 100.

The side edge of the diversion component 3 can be connected with the first shell 11 and separated from or contacted with the second shell 12; or the side edge of the diversion component 3 can be connected with the second shell 12 and separated from or contacted with the second shell 12; or the side edges of the diversion component 3 are respectively connected with the first shell 11 and the second shell 12. Wherein, the diversion component 3 can select a plurality of curved samming boards, and a plurality of samming board intervals set up and make diversion component 3 wholly form the arc, further change the direction of fan 4 air-out. The third heat dissipation component with the capillary structure is adopted by the flow guiding component 3, so that the heat dissipation effect of the heat dissipation device 100 can be further enhanced.

As shown in fig. 1 to 4, in some embodiments, the first housing 11 and the second housing 12 are connected through the heat radiation fins 2, or,

The first shell 11 is connected with the second shell 12 through the flow guiding assembly 3;

The heat dissipation fins 2 or the flow guiding assembly 3 provides a supporting force between the first housing 11 and the second housing 12 for increasing the back pressure of the heat dissipation device 100.

Specifically, in order to further provide the supporting forces of the first housing 11 and the second housing 12 and increase the back pressure of the heat dissipating device 100, the heat dissipating fins 2 may be connected to the first housing 11 and the second housing 12, and the air guiding assembly 3 may be connected to the first housing 11 and the second housing 12, respectively.

The heat dissipation fins 2 can be arranged at the rear air outlet position, and the heat dissipation fins 2 are perpendicular to the first surface of the first shell 11 and the first surface of the second shell 12, so that vertical placement is realized, the supporting force on the first shell 11 and the second shell 12 is improved, and the back pressure of the heat dissipation device 100 is increased.

The flow guiding component 3 can be arranged at a side air outlet position and used for changing the air outlet direction of the fan 4, so that the air flow can be smoothly blown out of the system, and the air flow can be directly led to take away part of heat of the air blown out by the fan 4 due to the arrangement of the flow guiding component at the air outlet position, and meanwhile, the top post is replaced, and the back pressure of the fan 4 is improved.

As shown in fig. 1-4, in some embodiments, the first housing 11 communicates with the second housing 12 through the third housing 13; and/or the number of the groups of groups,

The first shell 11 is communicated with the second shell 12 through the radiating fins 2, or the first shell 11 is communicated with the second shell 12 through the flow guiding component 3;

So that the first housing 11 exchanges heat with the second housing 12.

Specifically, the heat exchange can be realized by the communication design of the first shell 11 and the second shell 12, the overall temperature uniformity of the shell 1 is improved, and the heat dissipation effect of the shell 1 is enhanced. In practical design, the first shell 11 and the second shell 12 may be communicated through the third shell 13, meanwhile, the first shell 11 and the second shell 12 are communicated through the heat dissipation fins 2, and the first shell 11 and the second shell 12 are communicated through the flow guiding component 3; or the third shell 13 is two heat pipes, the first shell 11 is connected with one side of the radiating fin 2 through one third shell 13, and one end of one third shell 13 is connected with a heat source; the second shell 12 is connected with the other side edge of the heat radiation fin 2 through the other third shell 13, and the end parts of the two third shells 13 are contacted, so that heat exchange is realized, and the heat radiation effect of the heat radiation device 100 is enhanced.

Example 2

As shown in fig. 1 to 7, embodiment 2 of the present application provides an electronic device, including:

The heat conduction device 200 and the heat dissipation device 100 of embodiment 1; the heat dissipating device 100 includes:

The target housing 1 adopts a first heat dissipation component with a capillary structure; the target housing 1 is at least one housing 1 among the first housing 11, the second housing 12, and the third housing 13;

The heat conduction device 200 and the shell 1 are of an integrated structure; or alternatively, the first and second heat exchangers may be,

The heat conduction device 200 and the housing 1 are in a split combined structure.

Specifically, when the heat conduction device 200 is a temperature equalization plate and the target housing 1 of the housing 1 is a temperature equalization plate, the capillary structure of the target housing 1 can be communicated with the capillary structure in the heat conduction device 200, and at this time, the heat conduction device 200 and the housing 1 are in an integrated structure, so that the temperature equalization performance of the electronic equipment is further enhanced, and the heat dissipation effect is ensured; or when the heat conduction device 200 is a temperature equalization plate and the target shell 1 of the shell 1 is a heat pipe, the heat conduction device 200 and the shell 1 are in a split combined structure; when the heat conduction device 200 is a heat pipe and the target housing 1 of the housing 1 is a temperature equalization plate, the heat conduction device 200 and the housing 1 are in a split combined structure; or when the heat conduction device 200 and the housing 1 are both heat pipes, the heat conduction device 200 and the housing 1 are in a split combined structure.

In practical application, the quantity of the heat conduction devices and the heat dissipation devices can be selected according to practical requirements.

The electronic device provided in embodiment 2 of the present application includes the heat dissipating device 100 of embodiment 1, where at least one casing 1 of the first casing 11, the second casing 12 and the third casing 13 of the heat dissipating device 100 is a first heat dissipating component, so that at least one casing 1 of the three casings 1 has a heat dissipating function, a heat dissipating effect of the heat dissipating device 100 is enhanced, and a space occupied by the heat dissipating device 100 is not increased.

Thus, various embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concepts of the present disclosure, some details known in the art are not described. How to implement the solutions disclosed herein will be fully apparent to those skilled in the art from the above description.

Although some specific embodiments of the present disclosure have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. It will be understood by those skilled in the art that the foregoing embodiments may be modified and equivalents substituted for elements thereof without departing from the scope and spirit of the disclosure. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict.

Claims

1. A heat sink, comprising;

2. The heat sink of claim 1, wherein,

The first heat dissipation component is a temperature equalizing plate or a heat pipe.

3. The heat sink of claim 1, wherein,

The third shell is the first heat dissipation component and is used for taking away heat through gas flow in the working process.

4. A heat sink as in claim 3, wherein,

The first shell and/or the second shell are/is the first heat dissipation component, and the first shell and/or the second shell are/is communicated with the third shell and are/is used for realizing heat transfer with the third shell.

5. A heat sink according to any one of claims 1 to 3, wherein,

The sealing assembly is arranged at the joint of the first shell, the second shell and the third shell.

6. The heat sink of claim 1, wherein,

The heat dissipation device also comprises heat dissipation fins, wherein the heat dissipation fins are arranged in the accommodating space, and the heat dissipation fins adopt a second heat dissipation assembly with a capillary structure;

7. The heat sink of claim 6 wherein the heat sink is configured to dissipate heat from the heat sink,

The air guide assembly is arranged in the accommodating space in an arc shape;

8. The heat sink of claim 7 wherein the heat sink is configured to dissipate heat from the heat sink,

The first shell and the second shell are connected through the heat radiation fins, or,

9. The heat sink of claim 7 wherein the heat sink is configured to dissipate heat from the heat sink,

The first shell is communicated with the second shell through the third shell; and/or the number of the groups of groups,

So that the first housing exchanges heat with the second housing.

10. An electronic device, comprising:

a heat conducting device and a heat dissipating device according to any one of claims 1-9;

The heat conduction device and the shell are of a split combined structure.