CN114096122A

CN114096122A - Heat dissipation assembly and electronic equipment

Info

Publication number: CN114096122A
Application number: CN202111347992.1A
Authority: CN
Inventors: 胡院林
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-11-15
Filing date: 2021-11-15
Publication date: 2022-02-25

Abstract

The application relates to a heat dissipation assembly and an electronic device. Wherein, radiator unit includes: the fan is provided with an impeller, and an air inlet and an air outlet are formed on two sides of the impeller; the first heat dissipation piece is connected with the heat source and arranged on one side of the air outlet; the second heat dissipation piece is arranged on one side of the air inlet; the Stirling heat engine comprises a cold cavity, a hot cavity communicated with the cold cavity and a connecting rod structure connected between the cold cavity and the hot cavity; the hot cavity is connected with the first heat dissipation piece, and the cold cavity is connected with the second heat dissipation piece; the connecting rod structure moves according to the back-and-forth flow of the air flow between the hot cavity and the cold cavity so as to drive the impeller to rotate. In the heat dissipation assembly, heat generated by a heat source is conducted to the hot cavity, so that a temperature difference is formed between the hot cavity and the cold cavity, airflow flows between the hot cavity and the cold cavity, and the fan is driven by the connecting rod to blow and dissipate heat. The radiating assembly is high in radiating efficiency, the PCB does not need to be additionally powered, the energy utilization rate is improved, the energy consumption of the system is reduced, and the intelligent adjusting radiating effect can be achieved according to the temperature condition of a heat source.

Description

Heat dissipation assembly and electronic equipment

Technical Field

The present application relates to the field of heat dissipation technologies, and in particular, to a heat dissipation assembly and an electronic device.

Background

At present, for electronic devices such as CPE (Customer Premise Equipment), PC (Personal Computer), and router, the fan is generally driven and controlled by taking power from a PCB (Printed Circuit board), so that the fan dissipates heat of the heat source of the electronic device. However, the fan needs to consume extra power, so that the system energy consumption of the electronic device is increased, and the endurance time of the electronic device is shortened.

Disclosure of Invention

In view of the above, there is a need for a heat dissipation assembly that can reduce system power consumption, and an electronic device having the heat dissipation assembly.

In one aspect, the present application provides a heat dissipation assembly, comprising:

the fan is provided with an impeller, and an air inlet and an air outlet are respectively formed on two sides of the impeller;

the first heat dissipation piece is used for being connected with a heat source and arranged on one side of the air outlet;

the second heat dissipation piece is arranged on one side of the air inlet; and

the Stirling heat engine comprises a cold cavity, a hot cavity communicated with the cold cavity and a connecting rod structure connected between the cold cavity and the hot cavity; the hot cavity is connected with the first heat dissipation element, and the cold cavity is connected with the second heat dissipation element; the connecting rod structure is connected with the impeller and moves according to the back-and-forth flow of the airflow between the hot cavity and the cold cavity so as to drive the impeller to rotate.

Among the above-mentioned radiator unit, the heat that the heat source produced conducts to the heat chamber via first radiating piece to make the gaseous process that realizes the heat absorption of constant volume and isothermal expansion in the heat chamber, in addition, because the air current temperature of air intake one side is lower relatively, so just so make the second radiator that is located air intake one side play the cooling action to the cold chamber, make the gaseous process that realizes the heat release of constant volume and isothermal compression in the cold chamber. Therefore, low-temperature airflow in the cold cavity absorbs heat after entering the hot cavity and rises in temperature, the heated air returns to the cold cavity and is cooled, the airflow flows back and forth between the cold cavity and the hot cavity through transmission of the connecting rod structure between the hot cavity and the cold cavity, and finally the heat is continuously transferred from the first heat dissipation piece to the second heat dissipation piece, so that heat dissipation of a heat source is realized. Meanwhile, under the driving of the connecting rod structure, the impeller continuously rotates, so that the first heat dissipation part and the heat source are cooled by blowing, and the purpose of heat dissipation is achieved. Under the combined action of the heat conduction of the first heat dissipation member and the blowing of the fan, the heat source can realize quick heat dissipation and maintain a certain temperature range, so that the heat dissipation assembly has higher heat dissipation efficiency. In addition, the Stirling heat engine fully utilizes the heat of the heat source to convert the heat energy into the kinetic energy of the fan, so that the fan can work without additionally taking electricity from the PCB, the utilization rate of the energy is improved, the energy consumption of the electronic equipment is reduced, and the endurance time of the electronic equipment is prolonged. In addition, if the heat source load is more, the temperature of the heat source load is higher, more heat is conducted to the hot cavity through the first heat dissipation part, the temperature difference between the hot cavity and the cold cavity is larger, the rotating speed of the impeller is higher, the flowing speed of airflow blown out from the air outlet is accelerated, and the heat dissipation effect is improved. If the load of the heat source is less, the temperature of the heat source is lower, the temperature difference between the hot cavity and the cold cavity is smaller, and the rotating speed of the impeller is smaller or even the impeller does not need to rotate. Therefore, the radiating assembly can automatically adjust the radiating effect according to the temperature condition of the heat source, and the purpose of intelligent adjustment is achieved.

In one aspect, the present application provides an electronic device, comprising:

the air conditioner comprises a shell, a fan and a fan, wherein the shell is provided with an air inlet hole and an air outlet hole;

a heat source built in the case; and

in the heat dissipation assembly, the heat dissipation assembly is arranged in the shell and is connected with the heat source; the air inlet hole, the air inlet, the air outlet and the air outlet hole are communicated in sequence.

Among the above-mentioned electronic equipment, radiator unit can realize high-efficient heat dissipation to the heat source, and can make full use of the heat energy of heat source, improves the utilization ratio of energy for electronic equipment's system energy consumption can reduce. In addition, the heat dissipation assembly can also automatically adjust the heat dissipation effect according to the temperature condition of the heat source to achieve the purpose of intelligent adjustment, so that the heat source is maintained within a certain working temperature range, the service life of the heat source is prolonged, the reliability and the user experience of the electronic equipment are improved, and the electronic equipment conforms to the development trend of energy conservation, emission reduction and intelligent adjustment.

Drawings

FIG. 1 is a schematic structural diagram of a partial structure of an electronic apparatus according to an embodiment of the present application;

FIG. 2 is a pictorial cross-sectional view of the structure shown in FIG. 1;

FIG. 3 is an isometric view of the structure shown in FIG. 2;

FIG. 4 is a schematic structural view of a heat sink assembly of the structure shown in FIG. 2;

FIG. 5 is a simplified schematic diagram of the construction of the Stirling heat engine of the heat sink assembly of FIG. 4;

FIG. 6 is an exploded view of the heat dissipation assembly shown in FIG. 4;

FIG. 7 is a schematic view of the heat sink assembly shown in FIG. 4 from another perspective;

fig. 8 is a schematic view of another installation state of the heat dissipation assembly in the housing of the electronic device shown in fig. 1.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, but the present application may be practiced in many ways different from those described herein, and similar modifications may be made by those skilled in the art without departing from the spirit of the present application, and the present application is therefore not limited to the specific embodiments disclosed below.

In the description of the present application, it is to be understood that the terms "upper", "lower", "inner", "outer", "axial", "radial", "circumferential", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are used only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "above" or "over" a second feature may be directly or obliquely above the second feature, or simply indicate that the first feature is at a higher level than the second feature. A first feature "under," "below," and "beneath" a second feature may be directly or obliquely under the first feature or may simply mean that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1 and 3, an electronic device generally includes a heat source 100 and a PCB 200, the heat source 100 is connected to the PCB 200, and an internal power source or an external power source of the electronic device is connected to the PCB 200 and supplies power to the heat source 100 through the PCB 200. The heat source 100 consumes power during operation and generates a large amount of heat, and the generated heat may cause the temperature of the heat source 100 itself to increase, and once the temperature exceeds a certain range, the heat source 100 may be in danger of failure. Therefore, the heat source 100 is maintained within a certain working temperature range by using an efficient heat dissipation method, which is of great significance to the improvement of the reliability and the user experience of the electronic device. Generally, the heat source 100 in the electronic device is embodied as a chip.

The present application protects an electronic device having a heat dissipation assembly 300, wherein the heat dissipation assembly 300 dissipates heat from a heat source 100 in the electronic device. The electronic device may be a CPE (Customer Premise Equipment), a router, a PC (Personal Computer), or the like.

As shown in conjunction with fig. 1-6, in some embodiments, the heat sink assembly 300 includes a fan 310, a first heat sink 330, a second heat sink 360, and a stirling heat engine 350. The fan 310 has an impeller 313, and an air inlet 311 and an air outlet 312 are respectively formed on both sides of the impeller 313, and when the impeller 313 rotates, the air flow can be forced to flow in from the air inlet 311 and flow out from the air outlet 312. The first heat dissipation element 330 is disposed at one side of the air outlet 312 and connected to the heat source 100. The second heat dissipation member 360 is disposed at one side of the air inlet 311. The stirling heat engine 350 comprises a cold chamber 351, a hot chamber 352 and a connecting rod structure 353, wherein the hot chamber 352 is communicated with the cold chamber 351, and the connecting rod structure 353 is connected between the cold chamber 351 and the hot chamber 352. Hot cavity 352 is connected to first heat sink 330 and cold cavity 351 is connected to second heat sink 360. The linkage 353 is connected to the impeller 313 and moves in response to the back and forth flow of air between the hot chamber 352 and the cold chamber 351 to rotate the impeller 313.

In the heat dissipation assembly 300, the heat generated by the heat source 100 is conducted to the heat cavity 352 through the first heat dissipation member 330, so that the gas in the heat cavity 352 realizes the processes of constant-volume heat absorption and isothermal expansion, and in addition, because the temperature of the gas flow at the side of the air inlet 311 is relatively low, the second heat sink at the side of the air inlet 311 cools the cold cavity 351, so that the gas in the cold cavity 351 realizes the processes of constant-volume heat release and isothermal compression. Therefore, the low-temperature airflow in the cold cavity 351 absorbs heat to raise the temperature after entering the hot cavity 352, the heated air returns to the cold cavity 351 to be cooled, the airflow is enabled to flow back and forth between the cold cavity 351 and the hot cavity 352 through transmission of the connecting rod structure 353 between the hot cavity 352 and the cold cavity 351, and finally the heat is continuously transferred from the first heat dissipation element 330 to the second heat dissipation element 360, so that the heat dissipation of the heat source 100 is realized. Meanwhile, under the driving of the connecting rod structure 353, the impeller 313 continuously rotates, so as to blow air to cool the first heat sink 330 and the heat source 100, thereby achieving the purpose of heat dissipation. Under the combined action of the heat conduction of the first heat dissipation element 330 and the blowing of the fan 310, the heat source 100 can dissipate heat quickly and maintain a certain temperature range, so that the heat dissipation assembly 300 has high heat dissipation efficiency. In addition, the stirling heat engine 350 makes full use of the heat source 100 to convert the heat energy into the kinetic energy of the fan 310, so that the fan 310 can work without additionally taking electricity from the PCB 200, the utilization rate of the energy is improved, the energy consumption of the electronic device is reduced, and the endurance time of the electronic device is prolonged.

In addition, if the heat source 100 is loaded more, the temperature thereof will be higher, more heat is conducted to the hot chamber 352 through the first heat dissipation member 330, and the temperature difference between the hot chamber 352 and the cold chamber 351 is made larger, the rotation speed of the impeller 313 is faster, so as to increase the flow speed of the airflow blown out by the air outlet 312, and improve the heat dissipation effect. If the heat source 100 is less loaded and the temperature thereof will be lower, the smaller the temperature difference between the hot chamber 352 and the cold chamber 351, the smaller the rotation speed of the impeller 313 and even the less the impeller needs to rotate. Therefore, the heat dissipation assembly 300 can adjust the heat dissipation effect according to the temperature of the heat source 100, so as to achieve the purpose of intelligent adjustment.

It should be noted that in the embodiment shown in fig. 2, the fan 310 is an axial fan. In other embodiments, the fan 310 may also be a centrifugal fan, a mixed-flow fan, or other types of fans. For each type of fan 310, it has an air inlet 311 and an air outlet 312. In the embodiment shown in fig. 2, the first heat dissipation member 330 is located in the axial direction of the axial flow fan, and in other embodiments, the positions of the fan 310 and the first heat dissipation member 330 may be adjusted according to the type of the fan 310.

Referring to fig. 1 to 6, in some embodiments, the hot chamber 352 includes a first cylinder 352a and a first piston 352b slidably disposed in the first cylinder 352a, the cold chamber 351 includes a second cylinder 351a and a second piston 351b slidably disposed in the second cylinder 351a, and the connecting rod structure 353 has one end connected to the first piston 352b and the other end connected to the second piston 351 b. The linkage 353 enables transmission between the first and

second pistons

352b, 351b, thereby causing the flow of gas to and from the hot and

cold chambers

352, 351 to be periodic. Further, the gas medium in the hot chamber 352 and the cold chamber 351 is hydrogen or helium.

Further, the link structure 353 includes a first rod 353a, a second rod 353b, a third rod 353c and a fourth rod 353 d. One end of the first rod 353a is fixedly connected to the first piston 352b, the other end is rotatably connected to the second rod 353b, and one end of the second rod 353b, which is far away from the first rod 353a, is rotatably connected to the predetermined position P of the impeller 313. One end of the third rod 353c is fixedly connected to the second piston 351b, the other end is rotatably connected to the fourth rod 353d, and one end of the fourth rod 353d, which is far away from the third rod 353c, is rotatably connected to the predetermined position P. The predetermined position P is offset from the rotation center Q of the impeller 313. The second rod 353b and the fourth rod 353d are rotatably connected to the impeller 313 at the same position, so that the impeller 313 rotates around the rotation center Q under the combined action of the two.

Further, the stirling heat engine 350 includes an air pipe 354, and both ends of the air pipe 354 are connected to the first cylinder 352a and the second cylinder 351a, respectively, and communicate the internal space of the first cylinder 352a with the internal space of the second cylinder 351a, so that the air in the cold chamber 351 and the air in the hot chamber 352 can flow back and forth periodically through the air pipe 354.

In some embodiments, at least one heat dissipation channel 331 is formed through the first heat dissipation member 330, and the air inlet 311, the air outlet 312 and the heat dissipation channel 331 are sequentially communicated to form an air flow channel. By providing the heat dissipation channel 331 inside the first heat dissipation member 330, the surface area of the first heat dissipation member 330 can be increased, thereby facilitating rapid heat dissipation. Under the rotation action of the impeller 313 in the fan 310, the airflow can flow in from the air inlet 311, flow out from the air outlet 312, and further enter the heat dissipation channel 331 to blow and dissipate heat of the surface of the first heat dissipation member 330, and finally, the heated airflow is discharged from one end of the heat dissipation channel 331 far away from the air outlet 312.

In some embodiments, the first heat dissipation member 330 includes a heat dissipation body 332 connected to the heat source 100, and a connection plate 333 connected between the heat dissipation body 332 and the thermal cavity 352, the heat dissipation body 332 is spaced apart from the fan 310, and the heat dissipation channel 331 is opened in the heat dissipation body 332. The heat dissipation channel 331 and the air outlet 312 are arranged at an interval, so that the airflow blown out from the air outlet 312 can be diffused into a larger space range, and the first heat dissipation member 330 can be blown to dissipate heat by a larger area, thereby improving the heat dissipation effect. In particular, in the case where there are a plurality of heat dissipation paths 331, the arrangement is such that the airflow blown out from the air outlet 312 flows into each heat dissipation path 331, thereby accelerating heat dissipation. In addition, the heat dissipation body 332 can conduct heat generated from the heat source 100 to the connection plate 333 and transfer the heat to the thermal cavity 352 via the connection plate 333.

Further, the airflow passage is linear. It can be understood that the air inlet 311, the air outlet 312, and the heat dissipation channel 331 are substantially linearly arranged in sequence and are sequentially communicated with each other, so that the length of the air flow channel can be shortened, the circulation path of the air flow can be shortened, the air flow carrying heat can be rapidly discharged, and the heat dissipation is accelerated. Further, the air inlet 311 is disposed coaxially with the air inlet 311, and the heat dissipation passage 331 extends in a direction parallel to the axial direction of the air inlet 311, so that the air flow passage is substantially linear.

In some embodiments, the heat dissipation body 332 includes a first heat dissipation plate 332a, a second heat dissipation plate 332b, and a third heat dissipation plate 332c connected between the first heat dissipation plate 332a and the second heat dissipation plate 332 b. The first heat sink 332a is connected to the heat source 100, and the second heat sink 332b is connected to the connection plate 333. The number of the third heat dissipation plates 332c is at least two, the third heat dissipation plates 332c are arranged at intervals, the first heat dissipation plate 332a, the second heat dissipation plate 332b and two adjacent third heat dissipation plates 332c enclose a heat dissipation channel 331 together, and thus the first heat dissipation plate 332a, the second heat dissipation plate 332b and more than two third heat dissipation plates 332c enclose a plurality of heat dissipation channels 331 together. Thus, at least two third heat dissipation plates 332c may be combined with the first and second

heat dissipation plates

332a and 332b to obtain at least one heat dissipation path 331. With this configuration, the surface area of the heat dissipating body 332 can be increased, and the heat dissipating capability of the heat dissipating body 332 can be improved.

Further, more than two third heat dissipation plates 332c are uniformly distributed between the first heat dissipation plate 332a and the second heat dissipation plate 332b, so that a plurality of heat dissipation passages 331 with uniform calibers and uniform extension directions can be obtained. Further, the air inlet 311 and the air outlet 312 are coaxially disposed, and the third heat dissipation plate 332c, the first heat dissipation plate 332a, and the second heat dissipation plate 332b extend in a direction parallel to the axial direction of the air inlet 311, so that the heat dissipation passage 331 extends in the axial direction of the air inlet 311.

In some embodiments, webs 333 are welded to the outer surface of thermal cavity 352. Alternatively, the connection plate 333 is filled with a thermally conductive interface material with the outer surface of the thermal cavity 352. In this manner, a seamless connection between the connection plate 333 and the thermal cavity 352 is achieved, thereby allowing rapid conduction of heat from the connection plate 333 to the thermal cavity 352. In other embodiments, the connection plate 333 and the thermal cavity 352 may be fixed by, for example, screw locking, and in this case, the connection plate 333 and the outer surface of the thermal cavity 352 are only in contact, but not welded, so that there is a micro-gap between the connection plate 333 and the outer surface of the thermal cavity 352, and the micro-gap will prevent the heat of the connection plate 333 from being transferred to the thermal cavity 352. By filling the thermal interface material between the connection plate 333 and the outer surface of the thermal cavity 352, the micro-voids can be filled, thereby improving thermal conductivity.

Specifically, the connection plate 333 includes a first connection part 333a and a second connection part 333b, and the first connection part 333a is connected to the second connection part 333 b. The first connection part 333a is connected to the heat dissipation body 332, and specifically, the first connection part 333a is integrally formed with the second heat dissipation plate 332 b. The second connection part 333b is shaped like a flat plate and is surface-bonded to the outer surface of the thermal cavity 352, so that the connection plate 333 has a large contact area with the outer surface of the thermal cavity 352, thereby realizing rapid heat transfer from the first heat sink 330 to the thermal cavity 352 and improving heat transfer efficiency. Specifically, second connection portion 333b is welded to the outer surface of thermal chamber 352 to achieve fusion with the outer surface of thermal chamber 352. Alternatively, the second connection part 333b and the outer surface of the thermal cavity 352 are filled with a thermal interface material. Further, the thermal interface material may be of the silicone grease, thermal gel, thermal pad, or the like type. Further, at least a part of the connecting plate 333 extends in the circumferential direction of the air outlet 312. Specifically, the second connecting portion 333b extends in the circumferential direction of the air outlet 312.

In this application, to avoid the contact between the connection plate 333 and the cold chamber 351, a support plate 390 is disposed on the outer surface of the hot chamber 352, the connection plate 333 is mounted on the support plate 390, and the support plate 390 supports the connection plate 333 and also allows the heat of the connection plate 333 to be transferred to the hot chamber 352 through the support plate 390. Specifically, the second connection portion 333b is surface-to-surface engaged with the support plate 390. In other embodiments, the support plate 390 may be integrally formed with the second coupling part 333 b. In order to achieve rapid heat transfer from the connection plate 333 to the heat chamber 352, the support plate 390 needs to have high heat conductivity. Specifically, the material of the support plate 390 may be a high thermal conductive metal, for example, aluminum alloy, copper alloy, etc. The material of the supporting plate 390 may also be a high thermal conductive material, such as high thermal conductive graphite. The support plate 390 may also be a heat pipe. Further, in order to ensure high heat conductivity of the support plate 390, it is required that the support plate 390 has a thermal conductivity of more than 150W/m.K.

In some embodiments, the heat dissipation assembly 300 includes two first heat dissipation members 330 spaced apart from each other, and a receiving gap 380 for receiving the heat source 100 is formed between the two first heat dissipation members 330. By disposing the heat source 100 between the two first heat dissipation members 330, the two first heat dissipation members 330 can dissipate heat from the heat source 100 together, so as to improve the heat dissipation effect. Further, in the embodiment where the heat dissipation body 332 includes the first heat dissipation plate 332a, two first heat dissipation plates 332a are shared in the two first heat dissipation members 330, and the two first heat dissipation plates 332a are arranged in parallel and spaced apart to form the receiving gap 380. It can be understood that the air outlet 312 is communicated with one end of the receiving gap 380, and the air flow blown out from the air outlet 312 can enter the receiving gap 380 to directly blow and dissipate heat of the heat source 100. In the embodiment shown in fig. 2, the number of the first heat dissipation elements 330 is two, and in other embodiments, the number of the first heat dissipation elements 330 may be set to other numbers such as 4, 6, 8, etc. according to the number of the heat sources 100 in the electronic device.

Further, the heat sources 100 are mounted on both sides of the PCB 200, and the PCB 200 and the heat sources 100 are located in the receiving gap 380. The two first heat dissipation members 330 correspond to both sides of the PCB board 200, respectively. Thus, a greater number of heat sources 100 can be mounted on the PCB 200, thereby improving the utilization of the PCB 200. Meanwhile, the two first heat dissipation members 330 can also fully dissipate the heat of the heat source 100 at the two sides of the PCB 200, respectively. Further, a plurality of heat sources 100 are installed on the same side of the PCB 200, and the plurality of heat sources 100 are arranged at intervals, so that the airflow can fully flow through each heat source 100, and a good heat dissipation effect is achieved.

It should be noted that the first heat dissipation element 330 is mainly used for dissipating heat from the heat source 100 and conducting part of the heat to the thermal cavity 352, and in order to realize rapid heat transfer from the first heat dissipation element 330 to the thermal cavity 352, the first heat dissipation element 330 needs to have high heat conduction performance. Specifically, the material of the first heat dissipation element 330 may be a high thermal conductive metal, such as aluminum, aluminum alloy, copper alloy, etc. The material of the first heat dissipation element 330 may also be a high thermal conductive material, such as high thermal conductive graphite. The first heat dissipating member 330 may also be a Vapor Chamber (VC). Further, in order to ensure high heat conduction performance of the first heat dissipation member 330, the first heat dissipation member 330 is required to have a heat conduction coefficient greater than 150W/m · K.

Referring to fig. 1 and 7, in some embodiments, the second heat dissipation element 360 is disposed at one side of the air inlet 311 and connected to the cold cavity 351, and by disposing the second heat dissipation element 360, heat of the cold cavity 351 can be dissipated quickly, so as to maintain the cold cavity 351 at a lower temperature, which is beneficial to forming a temperature difference between the cold cavity 351 and the hot cavity 352.

In order to achieve rapid heat dissipation, the second heat dissipation member 360 needs to have high heat conductivity. The material of the second heat dissipation element 360 may be metal, such as aluminum, aluminum alloy, copper alloy, etc. The material of the second heat dissipation element 360 may also be a high thermal conductive material, such as high thermal conductive graphite. The second heat dissipating member 360 may also be a Vapor Chamber (VC). Further, in order to ensure high heat conduction performance of the second heat dissipation member 360, the second heat dissipation member 360 is required to have a heat conduction coefficient greater than 150W/m · K.

In some embodiments, the second heat dissipation member 360 extends along the circumferential direction of the air inlet 311, and is formed with a plurality of guiding grooves 361 extending along the radial direction of the air inlet 311 and communicating with the air inlet 311, and the plurality of guiding grooves 361 may increase the surface area of the second heat dissipation member 360, improve the heat dissipation capability of the second heat dissipation member 360, and collectively guide the airflow from the outer periphery to the air inlet 311, thereby maintaining the cold chamber 351 at a lower temperature.

Further, the second heat sink 360 includes a first heat-conducting plate 362 and a second heat-conducting plate 363. The first heat-conducting plate 362 is connected to the cold chamber 351 and extends along the circumferential direction of the air inlet 311, a plurality of second heat-conducting plates 363 are connected to the first heat-conducting plate 362, and any two adjacent second heat-conducting plates 363 are arranged at intervals to form a flow-guiding groove 361. The first heat conduction plate 362 may provide a larger installation space for installing more second heat conduction plates 363 along the circumferential extension of the intake ports 311, thereby improving the heat dissipation capability of the second heat sink 360. Specifically, the second heat conducting plates 363 extend in a plate shape along the radial direction of the air inlet 311, so that a gap between two adjacent second heat conducting plates 363 extends in the radial direction of the air inlet 311 and is communicated with the air inlet 311, thereby forming a flow guide groove 361, and a plurality of flow guide grooves 361 can be formed between a plurality of second heat conducting plates 363.

In some embodiments, second heat dissipation element 360 is welded to an outer surface of cold chamber 351. Alternatively, a thermal interface material is filled between the second heat dissipation member 360 and the outer surface of the cold cavity 351. In this manner, a seamless connection between second heat dissipation element 360 and the outer surface of cold chamber 351 may be achieved, such that heat from cold chamber 351 may be quickly conducted to second heat dissipation element 360. In other embodiments, the second heat dissipation element 360 may be fixed to the outer surface of the cold cavity 351 by, for example, screw locking, and in this case, the second heat dissipation element 360 is only in contact with the outer surface of the cold cavity 351, but not welded to the outer surface of the cold cavity 351, so that there is a micro gap between the second heat dissipation element 360 and the outer surface of the cold cavity 351, and the micro gap will block the heat transfer from the cold cavity 351 to the second heat dissipation element 360. By filling the thermal interface material between the second heat sink 360 and the outer surface of the cold chamber 351, the micro-voids can be filled, thereby improving thermal conductivity. Specifically, the first heat conductive plate 362 is welded to the outer surface of the cold chamber 351 to achieve fusion with the outer surface of the cold chamber 351. Alternatively, a heat conductive interface material is filled between the first heat conductive plate 362 and the outer surface of the cold chamber 351. Further, the thermal interface material may be of the silicone grease, thermal gel, thermal pad, or the like type.

Referring to fig. 1 to 3 again, in the present application, the electronic device further includes a housing 500, and the heat source 100 and the heat dissipation assembly 300 are all disposed in the housing 500. The casing 500 is provided with an air inlet 510 and an air outlet 520, the air inlet 510, the air inlet 311, the air outlet 312 and the air outlet 520 are sequentially communicated, so that the air flow enters the casing 500 through the air inlet 510, and further passes through the air inlet 311 and the air outlet 312 in sequence under the rotation action of the impeller 313, is blown to the first heat sink 330 and the heat source 100, and finally carries a part of heat to flow out of the air outlet 520.

Further, the air inlet holes 510 are plural, and the plural air inlet holes 510 extend along the axial direction of the air inlet 311 and are uniformly distributed to correspond to the entire air inlet 311. The air outlet holes 520 are plural, and the plural air outlet holes 520 extend along the axial direction of the air outlet 312 and are uniformly distributed to correspond to the entire air outlet 312.

Further, the stirling heat engine 350 is located between the casing 500 and the fan 310, and is spaced apart from the casing 500. The Stirling heat engine 350 is spaced apart from the housing 500, so that heat exchange with the housing 500 can be prevented from affecting the temperature of the hot cavity 352 and the cold cavity 351. In addition, the stirling heat engine 350 can fully utilize the gap between the casing 500 and the fan 310, so that the waste of the internal space of the casing 500 is avoided, and the space utilization rate is improved.

Further, the second heat dissipation member 360 maintains substantially the same temperature as the ambient temperature due to the proximity to the air inlet holes 510, so that the cold chamber 351 can be maintained at a relatively low temperature. Further, the housing 500 is spaced apart from the first heat dissipation member 330, so that heat exchange between the first heat dissipation member 330 and the housing 500 may be prevented.

For the electronic device, according to the requirement of the internal installation environment, the air inlet 510 can be opened at any position of the housing 500, and only the air inlet 311 of the fan 310 needs to be arranged corresponding to the air inlet 510, and the first heat dissipation member 330 is arranged at one side of the air outlet 312 of the fan 310, and the air outlet 520 corresponds to one side of the first heat dissipation member 330 far away from the air outlet 312, so that the consistent use effect can be achieved. For example, as shown in fig. 1, the air inlet 510 can be located below the electronic device and the air outlet 520 can be located above the electronic device, so that the air flows from bottom to top. As shown in fig. 8, the air outlet 520 is located at the lower side of the electronic device, and the air inlet 510 is located at the upper side, so that the air flow can flow from the top to the bottom.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A heat sink assembly, comprising:

the second heat dissipation piece is arranged on one side of the air inlet; and

2. The heat dissipation assembly of claim 1, wherein the hot chamber comprises a first cylinder and a first piston slidably disposed within the first cylinder, the cold chamber comprises a second cylinder and a second piston slidably disposed within the second cylinder, and one end of the rod structure is connected to the first piston and the other end is connected to the second piston.

3. The heat dissipation assembly of claim 2, wherein the link structure comprises a first rod, a second rod, a third rod, and a fourth rod; one end of the first rod body is fixedly connected with the first piston, the other end of the first rod body is rotatably connected with the second rod body, and one end, far away from the first rod body, of the second rod body is rotatably connected to a set position of the impeller; one end of the third rod body is fixedly connected with the second piston, the other end of the third rod body is rotatably connected with the fourth rod body, and one end of the fourth rod body, which is far away from the third rod body, is rotatably connected to the set position; the predetermined position is offset from a center of rotation of the impeller.

4. The heat dissipation assembly according to claim 2, wherein the stirling heat engine includes an air pipe, both ends of which are connected to the first cylinder and the second cylinder, respectively, and communicate an inner space of the first cylinder with an inner space of the second cylinder.

5. The heat dissipating assembly of claim 1, wherein the first heat dissipating member has at least one heat dissipating channel formed therethrough, and the air inlet, the air outlet and the heat dissipating channel are sequentially communicated to form an air flow channel.

6. The heat dissipation assembly of claim 5, wherein the first heat dissipation element comprises a heat dissipation body connected to the heat source and a connection plate connected between the heat dissipation body and the thermal cavity, the heat dissipation body is spaced apart from the fan, and the heat dissipation channel is open to the heat dissipation body.

7. The heat removal assembly of claim 6, wherein the webs are fused to the outer surface of the thermal cavity; or a heat conducting interface material is filled between the connecting plate and the outer surface of the heat cavity.

8. The heat dissipation assembly of claim 1, wherein the heat dissipation assembly comprises two first heat dissipation members arranged at intervals, and a receiving gap is formed between the two first heat dissipation members for receiving the heat source.

9. The heat dissipation assembly of claim 1, wherein the second heat dissipation member is welded to an outer surface of the cold chamber; or a heat conduction interface material is filled between the second heat dissipation piece and the outer surface of the cold cavity.

10. The heat dissipation assembly of claim 1, wherein the second heat dissipation member extends in a circumferential direction of the air inlet, and is formed with a plurality of flow guide grooves extending in a radial direction of the air inlet and communicating with the air inlet.

11. The heat sink assembly as recited in claim 10 wherein said second heat sink element comprises a first heat conducting plate and a plurality of second heat conducting plates, said first heat conducting plate being connected to said cold chamber and extending circumferentially around said air inlet, said plurality of second heat conducting plates being connected to said first heat conducting plate, any two adjacent second heat conducting plates being spaced apart to form said channels.

12. An electronic device, comprising:

a heat source built in the case; and

the heat sink assembly of any of claims 1-11, the heat sink assembly being disposed within the housing and being coupled to the heat source; the air inlet hole, the air inlet, the air outlet and the air outlet hole are communicated in sequence.

13. The electronic device of claim 12, wherein the stirling heat engine is located between the housing and the fan and spaced from the housing.

14. The electronic device of claim 12, comprising a PCB board, both sides of which are mounted with the heat source; the heat dissipation assembly comprises two first heat dissipation pieces arranged at intervals, and the two first heat dissipation pieces correspond to two sides of the PCB respectively.