CN212910505U

CN212910505U - Intelligent device radiator

Info

Publication number: CN212910505U
Application number: CN202021229331.XU
Authority: CN
Inventors: 曾健明
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-06-29
Filing date: 2020-06-29
Publication date: 2021-04-06
Anticipated expiration: 2030-06-29

Abstract

The embodiment of the application discloses smart machine radiator for reduce effectively because of the damage that the high temperature or the temperature crossed and cause smart machine or radiator itself, the very big degree improves the security. The method in the embodiment of the application comprises the following steps: the intelligent equipment comprises a cooling plate, a heat dissipation module, a semiconductor refrigeration assembly, a circuit board, a power interface and a temperature sensor, wherein the semiconductor refrigeration assembly is used for refrigerating intelligent equipment, and the heat dissipation module is used for dissipating heat of the semiconductor refrigeration assembly; one surface of the cooling plate covers the semiconductor refrigeration assembly, and the other surface of the cooling plate is used for being attached to the intelligent equipment; the circuit board is respectively coupled with the semiconductor refrigeration assembly, the power interface and the temperature sensor; when the power interface is electrified, the circuit board controls the working state of the semiconductor refrigeration assembly according to the temperature monitored by the temperature sensor.

Description

Intelligent device radiator

Technical Field

The embodiment of the application relates to the field of intelligent equipment accessories, in particular to an intelligent equipment radiator.

Background

With the continuous progress of science and technology, the intelligent equipment is updated faster and faster, the processing performance is stronger and stronger, higher processing performance also means higher power, higher power will produce bigger calorific capacity, and for the heat dissipation of auxiliary intelligent equipment, the external radiator of intelligent equipment has been derived.

The radiator module in the external radiator of smart machine generally is forced air cooling or water-cooled, and among the prior art's the scheme, the radiator mainly carries out the heat exchange through semiconductor refrigeration subassembly, and semiconductor refrigeration subassembly cold junction absorbs the heat to smart machine, and the hot junction is then through radiator fan or coolant liquid among the radiator module heat removal heat.

However, since the heat generation amount of the smart device depends on the operating state of a Core Processing Unit (CPU), for example: when the smart phone runs a large-scale network game, in order to meet smooth experience and high-definition image quality, the core processor needs to perform high-load calculation, at the moment, the heat productivity is high, and when the smart phone runs common application software or is in a standby state, the core processor is low in load and low in heat productivity. When the smart machine is in operation under the low-power consumption, calorific capacity is lower, uses the radiator that prior art provided to dispel the heat to the smart machine, will make the inside temperature of smart machine continuously reduce, and the temperature is crossed lowly and can be made the inside condensation that produces of smart machine. When the core processor is used for high-load calculation, if the cooling liquid fails, the cooling fan is damaged or the cooling assembly stops working due to other reasons, the cold end of the semiconductor refrigeration assembly still continues to absorb heat to the intelligent equipment, and the heat of the hot end cannot be discharged, so that the temperature is continuously increased, and then the heat is transferred to the intelligent equipment to cause damage. In summary, the radiator in the prior art may cause damage to the radiator or the mobile phone or even serious safety accidents due to too high or too low temperature, and the safety is poor.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides an intelligent device radiator, can reduce effectively because of the high temperature or the low damage that causes intelligent device or radiator itself of temperature, greatly degree has improved the security.

The embodiment of the application provides a smart machine radiator, includes: the intelligent equipment comprises a cooling plate, a heat dissipation module, a semiconductor refrigeration assembly, a circuit board, a power interface and a temperature sensor, wherein the semiconductor refrigeration assembly is used for refrigerating intelligent equipment, and the heat dissipation module is used for dissipating heat of the semiconductor refrigeration assembly; one surface of the cooling plate covers the semiconductor refrigeration assembly, and the other surface of the cooling plate is used for being attached to the intelligent equipment; the circuit board is respectively coupled with the semiconductor refrigeration assembly, the power interface and the temperature sensor;

when the power interface is electrified, the circuit board controls the working state of the semiconductor refrigeration assembly according to the temperature monitored by the temperature sensor.

Optionally, the controlling, by the circuit board, the operating state of the semiconductor refrigeration assembly according to the temperature monitored by the temperature sensor includes:

when the temperature sensor monitors that the temperature of the intelligent equipment is lower than a first preset value or higher than a second preset value, the circuit board controls the semiconductor refrigeration assembly to be closed.

Optionally, the smart device heat sink further includes: the warning device is coupled with the circuit board and used for sending a first warning signal when the temperature sensor monitors that the temperature of the intelligent equipment is higher than the second preset value, wherein the first warning signal is used for indicating that the temperature is too high; the alarm is further used for sending a second alarm signal when the temperature sensor monitors that the temperature of the intelligent device is lower than the first preset value, and the second alarm signal is used for indicating that the temperature is too low.

Optionally, the smart device heat sink further includes: the temperature display is coupled with the circuit board and used for displaying the temperature of the intelligent device monitored by the temperature sensor.

Optionally, the heat dissipation module includes: the heat dissipation structure comprises a shell, heat dissipation fins and a heat dissipation fan; the heat radiating fins are accommodated in the shell, and the heat radiating fan is fixed on the shell; the heat dissipation fan is matched with the heat dissipation fins to carry out heat diffusion on the semiconductor refrigeration assembly; the degree range of an included angle formed by the rotation axis of the heat radiation fan and the surface of the cooling plate is 0-45 degrees.

Optionally, the heat dissipation fan is coupled to the circuit board, and when the power interface is powered on, the circuit board controls a working state of the heat dissipation fan.

Optionally, the heat dissipation fins are vertically connected with the semiconductor refrigeration assembly.

Optionally, the circuit board controls a working state of the cooling fan, including:

the number of the temperature sensors is at least 2.

Optionally, the cooling plate is extended to two sides in a preset shape to increase the coverage area of the smart device.

Optionally, the cooling plate is provided with a nanometer connecting component, and the nanometer connecting component is used for detachably connecting the smart device radiator with the smart device.

According to the technical scheme, the embodiment of the application has the following advantages:

the embodiment of the application provides an intelligent device radiator with circuit board and temperature sensor, the circuit board will control the operating condition of semiconductor refrigeration subassembly according to the temperature that temperature sensor monitored, and when the temperature that temperature sensor monitored was too high or crossed low, circuit board control semiconductor refrigeration subassembly was closed, and then made semiconductor refrigeration subassembly no longer produce new heat, perhaps can stop to continue to refrigerate the intelligent device. The damage of the intelligent device or the radiator caused by overhigh temperature or overlow temperature is effectively reduced, and the safety is greatly improved.

Drawings

Fig. 1 is a schematic diagram of a smart device heat sink in an embodiment of the present application;

fig. 2 is a schematic structural diagram of a smart device heat sink in an embodiment of the present application;

fig. 3 is another schematic structural diagram of a smart device heat sink in the embodiment of the present application;

fig. 4 is another schematic structural diagram of a smart device heat sink in the embodiment of the present application;

fig. 5 is another schematic structural diagram of a smart device heat sink in the embodiment of the present application.

Detailed Description

In the present application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used only for explaining relative positional relationships between the respective members or components, and do not particularly limit specific mounting orientations of the respective members or components.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.

Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In addition, the structures, the proportions, the sizes, and the like, which are illustrated in the accompanying drawings and described in the present application, are intended to be considered illustrative and not restrictive, and therefore, not limiting, since those skilled in the art will understand and read the present application, it is understood that any modifications of the structures, changes in the proportions, or adjustments in the sizes, which are not necessarily essential to the practice of the present application, are intended to be within the scope of the present disclosure without affecting the efficacy and attainment of the same.

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The embodiment of the application provides a smart machine radiator for effectively reduced because of the damage that the high temperature or the temperature crossed and caused smart machine or radiator itself, the very big degree improves the security. The following detailed description is made with reference to the accompanying drawings.

Referring to fig. 1, an embodiment of a smart device heat sink provided by the present application includes:

the intelligent cooling system comprises a cooling plate 1, a heat dissipation module 2, a semiconductor refrigeration component 3, a circuit board 4, a power interface 5 and a temperature sensor 6, wherein the semiconductor refrigeration component 3 is used for refrigerating intelligent equipment, and the heat dissipation module 2 is used for dissipating heat of the semiconductor refrigeration component 3; one side of the cooling plate 1 covers the semiconductor refrigeration assembly 3, and the other side is used for attaching intelligent equipment; the circuit board 4 is respectively coupled with the semiconductor refrigeration component 3, the power interface 5 and the temperature sensor 6; when the power interface 5 is powered on, the circuit board 4 controls the working state of the semiconductor refrigeration component 3 according to the temperature monitored by the temperature sensor 6.

In practical application, the temperature sensor 6 may be a contact sensor, and is disposed at a position between the edge of the cooling plate 1 and the semiconductor refrigeration component 3, and the circuit board 4 has a control circuit for controlling the operating state of each component. When the power interface 5 is electrified, the circuit board 4 controls the semiconductor refrigeration component 3 to be opened, the cold end of the semiconductor refrigeration component 3 absorbs heat of the intelligent equipment through the heat transfer of the cooling plate 1, the hot end discharges the heat through the heat dissipation component 2, when the intelligent device radiator works, the temperature sensor 6 monitors the temperature of the intelligent device in real time and feeds the monitored temperature back to the circuit board 4, and the circuit board 4 controls the working state of the semiconductor refrigeration component according to the feedback temperature, specifically, if the feedback temperature is too high or too low, the circuit board 4 controls the semiconductor refrigeration component 3 to be closed, so that the semiconductor refrigeration component does not generate new heat, or the intelligent equipment can be stopped from being continuously refrigerated, so that the damage to the intelligent equipment or the radiator caused by overhigh or overlow temperature is effectively reduced, and the safety is greatly improved.

Optionally, when the temperature detected by the temperature sensor 6 is lower than a first preset value or higher than a second preset value, the circuit board 4 will control the semiconductor cooling module 3 to turn off, for example: in an environment with the room temperature of 25 ℃, condensation can be generated when the temperature of the mobile phone is lower than the room temperature by 15 ℃, and the first preset value can be set to 10 ℃; and when the temperature of the mobile phone exceeds 30 ℃, it is described that the possibility that the heat dissipation module 2 is damaged or normal heat diffusion cannot be performed due to other factors exists, the second preset value can be set to 30 ℃, and when the temperature sensor 6 monitors that the temperature is lower than 15 ℃ or higher than 30 ℃, the circuit board controls the semiconductor refrigeration component 3 to be closed, and further stops the continuous heat absorption of the cold end of the semiconductor refrigeration component 3.

The specific values of the first preset value and the second preset value may be set according to specific ambient temperature and heat generation and dissipation characteristics of different smart devices, and the setting mode may be set by a user or may be automatically set by the circuit board 4, which is not limited herein.

Optionally, referring to fig. 2, the smart device heat sink may further include: and the warning indicator 7 is coupled with the circuit board 4 and used for sending a warning signal when the temperature sensor 6 monitors that the temperature of the intelligent equipment is higher than a second preset value, and the warning signal is used for indicating that the temperature is too high.

For example: the user is at the in-process that uses the supplementary cell-phone heat dissipation of radiator, and the cell-phone can be kept flat on the desktop frequently or the heat dissipation module has inhaled the foreign matter and all can cause the work efficiency of heat dissipation module to reduce or even stop work, and under this condition, semiconductor refrigeration subassembly hot junction can cause the temperature to constantly rise and then transmit the heat to the cell-phone because the heat can't be discharged, if not discover in time, will cause the damage of cell-phone or smart machine radiator, serious incident even. Based on this, the smart machine radiator that this embodiment provided is provided with attention device 7, and when the temperature that temperature sensor 6 monitored was higher than the second default, attention device 7 can send out warning signal to remind the user in time to make corresponding processing. The specific warning signal may be a flashing light signal emitted by an LED lamp, or may be a warning sound signal emitted by a speaker, which is not limited herein.

The monitoring of the temperature by the temperature sensor 6 may be intermittent, for example: the temperature sensor 6 collects the temperature once every 3 seconds, so that the power consumption of the radiator can be reduced; the number of the temperature sensors 6 can be two or more, the positions of the temperature sensors 6 can be located below the semiconductor refrigeration assembly 3, and also can be located on the cooling plate 1, the circuit board 4 can control the working state of the semiconductor refrigeration assembly 3 according to the temperature fed back by any one temperature sensor, and can also perform comprehensive calculation according to the temperatures fed back by a plurality of temperature sensors, so that the working state of the semiconductor refrigeration assembly 3 is controlled, the temperature fed back by the temperature sensors 6 is more accurate, and the temperature of the intelligent device can be more accurately controlled by the circuit board 4.

The smart machine radiator that this embodiment provided is provided with attention device 7, and when the temperature that temperature sensor 6 monitored was higher than the second default, attention device 7 sent warning signal to remind the user to make corresponding processing, greatly reduced because of the damage that the high temperature caused smart machine or radiator itself, improved the security, the user's of being more convenient for timely operating condition who knows the smart machine radiator.

Further, please refer to fig. 3, in the smart device heat sink provided in the present application, the smart device heat sink may further include: and the temperature display 8 is coupled with the circuit board 4, and the temperature display 8 is used for displaying the temperature of the intelligent device monitored by the temperature sensor 6.

In an actual application scenario, the core processor of the smart device has different heating values due to different workloads, for example: when the mobile phone runs a large-scale network game, in order to meet smooth experience and high-definition image quality, the core processor needs to perform high-load calculation, the heating value is increased, the mobile phone can reduce the screen brightness or refresh frequency after the temperature is too high, or the frequency of the core processor is reduced to protect equipment, so that the image quality of the large-scale network game is lowered or animation is jammed, and the temperature has great influence on the running of the game. Based on this, the smart machine radiator that this embodiment provided is provided with temperature display 8, can show the temperature of the smart machine that temperature sensor 6 monitored in real time, and then show to the user, can let the user select to experience the recreation at more reasonable temperature range to, the user can know the temperature of smart machine and the operating condition of smart machine radiator in real time through temperature display 8, has improved user's experience to a great extent.

Optionally, referring to fig. 4, in the heat sink for smart device provided in the present application, the heat dissipation module 2 includes: a housing 21, heat dissipating fins 22, and a heat dissipating fan 23; the heat dissipation fins 22 are accommodated in the housing 21, and the heat dissipation fan 23 is fixed to the housing 21; the heat dissipation fan 23 is matched with the heat dissipation fins 22 to dissipate heat of the semiconductor refrigeration component 3; the degree of the angle formed by the rotation axis of the heat radiation fan 23 and the surface of the cooling plate 1 is in the range of 0 ° to 45 °.

In practical application, the cold end of semiconductor refrigeration component 3 absorbs heat to the smart machine through the heat transfer of cooling plate 1, the hot end then releases heat, and carry out thermal discharge through heat dissipation component 2, in this embodiment, heat dissipation component 2 is provided with radiator fan 23 and heat radiation fins 22 and casing 21, casing 21 mainly plays the effect of fixing and holding, after heat radiation fins 22 absorbed the heat that semiconductor refrigeration component 3 hot end emitted, the temperature rose, and with in heat transfer to the air around, radiator fan 23 can strengthen the air flow near heat radiation fins 22, make the air constantly flow through the heat radiation fins surface with higher velocity of flow, and then accelerate thermal diffusion, the radiating efficiency is higher.

In this embodiment, the degree range of the included angle formed by the rotation axis of the heat dissipation fan 23 and the cooling plate is 0 ° to 45 °, so that the sucked air can flow in from one end of the heat dissipation fins 22 and flow out from the other end, the heat dissipation area is increased, and then the heat can be diffused to the surrounding air with higher efficiency, and the heat dissipation effect is further improved. In the case where the angle range of 0 ° to 45 ° is satisfied, the orientation of the fan may be various, for example, upward or downward. The cooling fan 23 can be powered by the circuit board 4 or can be provided with an independent power supply module, the cooling fan 23 can be coupled with the circuit board 4 and works under the control of the circuit board 4, when the temperature monitored by the temperature sensor 6 of the circuit board 4 is too high, the rotating speed of the cooling fan 23 can be increased to enhance the cooling effect, and when the temperature monitored by the temperature sensor 6 is too low, the rotating speed of the cooling fan 23 can be reduced to reduce the power consumption.

Optionally, the surface of the heat dissipation fins 22 may be perpendicular to the surface of the cooling plate 1, and in practical applications, the smart device heat sink occupies a certain space on the back of the smart device when assisting the smart device to dissipate heat, for example: the radiator needs to be attached to the back of the mobile phone when the mobile phone is assisted to radiate heat, the radiator occupies a certain space on the back, if a user plays games with the mobile phone, the user needs to flexibly control a screen by fingers, at the moment, the holding hand feeling requirement on the mobile phone is extremely high, in the intelligent device radiator provided by the embodiment, the radiating fins 22 are perpendicular to the cooling plate 1, the transverse space occupied by the radiating assembly 2 can be reduced, the holding hand feeling is improved, the radiating area can be increased through the longitudinal extension of the radiating fins 22, and the radiating efficiency is improved to a greater extent while the holding hand feeling is kept.

Optionally, in the heat sink for a smart device provided in this embodiment, the cooling plate 1 may extend to both sides in a preset shape to increase a contact area with the smart device, and in order to further improve a hand feeling of holding, the cooling plate 1 may have a smaller thickness, for example, a thickness less than 3 mm. Specifically, the cooling plate 1 may extend to both sides in an airfoil shape, and may better cover a heat generating portion of the smart device, for example: when the auxiliary core processor and the battery are used for radiating the heat of the mobile phone in an up-and-down distributed mode, the cooling plate 1 extends towards two sides to better cover the position corresponding to the core processor and the position corresponding to the battery, so that the heat exchange area is increased, and the heat radiation efficiency is improved. In this application embodiment, the effect of cooling plate 1 is heat transfer to semiconductor refrigeration subassembly 3 that sends the cell-phone, and semiconductor refrigeration subassembly 3 refrigerates smart machine through the heat that constantly absorbs cooling plate 1, therefore cooling plate 1 need have certain heat conductivity, and is specific, and the material of cooling plate 1 can glass, also can be graphite alkene, does not do the restriction here specifically.

Optionally, referring to fig. 5, in the smart device heat sink provided in this embodiment, the cooling plate 1 may further be provided with a nanometer connecting component 11, where the nanometer connecting component 11 is used to connect the smart device heat sink and the smart device. Specifically, ten thousand times of nanometer glue can be arranged on two sides of the cooling plate 1, certain differences exist between the core processors of intelligent equipment of various types and the arrangement mode of the positions of the batteries, the heating positions are also different, ten thousand times of nanometer glue can be arranged on two sides of the cooling plate and can be directed to specific heating positions, the intelligent equipment radiator is pasted on the position corresponding to the intelligent equipment, the intelligent equipment is radiated in a targeted mode, the intelligent equipment radiator can adapt to intelligent equipment of different sizes by applying the mode of directly pasting the ten thousand times of nanometer glue 11, the ten thousand times of nanometer glue is thinner, the laminating degree of the cooling plate 1 and the intelligent equipment can be improved, and the radiating efficiency is further improved.

The intelligent device in the application can be a mobile phone, a tablet computer, a notebook computer or a multimedia player, and is not limited in the specific description.

It is intended that the foregoing description of the disclosed embodiments enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A smart device heat sink, comprising: the intelligent equipment comprises a cooling plate, a heat dissipation module, a semiconductor refrigeration assembly, a circuit board, a power interface and a temperature sensor, wherein the semiconductor refrigeration assembly is used for refrigerating intelligent equipment, and the heat dissipation module is used for dissipating heat of the semiconductor refrigeration assembly; one surface of the cooling plate covers the semiconductor refrigeration assembly, and the other surface of the cooling plate is used for being attached to the intelligent equipment; the circuit board is respectively coupled with the semiconductor refrigeration assembly, the power interface and the temperature sensor;

2. The smart device heat sink of claim 1, wherein the circuit board controls the operating state of the semiconductor cooling assembly based on the temperature monitored by the temperature sensor, comprising:

3. The smart device heat sink of claim 2, further comprising: the warning device is coupled with the circuit board and used for sending a first warning signal when the temperature sensor monitors that the temperature of the intelligent equipment is higher than the second preset value, wherein the first warning signal is used for indicating that the temperature is too high; the alarm is further used for sending a second alarm signal when the temperature sensor monitors that the temperature of the intelligent device is lower than the first preset value, and the second alarm signal is used for indicating that the temperature is too low.

4. The smart device heat sink of claim 1, further comprising: the temperature display is coupled with the circuit board and used for displaying the temperature of the intelligent device monitored by the temperature sensor.

5. The smart device heat sink of claim 1, wherein the heat sink module comprises: the heat dissipation structure comprises a shell, heat dissipation fins and a heat dissipation fan; the heat radiating fins are accommodated in the shell, and the heat radiating fan is fixed on the shell; the heat dissipation fan is matched with the heat dissipation fins to carry out heat diffusion on the semiconductor refrigeration assembly; the degree range of an included angle formed by the rotation axis of the heat radiation fan and the surface of the cooling plate is 0-45 degrees.

6. The smart device heat sink of claim 5, wherein the heat dissipation fan is coupled to the circuit board, and wherein the circuit board controls an operating state of the heat dissipation fan when the power interface is powered on.

7. The smart device heat sink of claim 5, wherein the heat fins are vertically connected to the semiconductor cooling assembly.

8. The smart device heat sink of any one of claims 1 to 7, wherein the number of temperature sensors is at least 2.

9. The smart device heat sink as claimed in any one of claims 1 to 7, wherein the cooling plate extends to both sides in a predetermined shape to increase a coverage area of the smart device.

10. The smart device heat sink as claimed in any one of claims 1 to 7, wherein the cooling plate is provided with a nano-connection component for detachably connecting the smart device heat sink with the smart device.