CN112601424B

CN112601424B - Heat dissipation back splint

Info

Publication number: CN112601424B
Application number: CN202011472528.0A
Authority: CN
Inventors: 麦碧权; 高志稳
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2020-12-15
Filing date: 2020-12-15
Publication date: 2022-11-18
Anticipated expiration: 2040-12-15
Also published as: CN112601424A

Abstract

The application discloses a heat dissipation back splint, which comprises a back splint main body (100) and a heat dissipation mechanism (200), wherein the heat dissipation mechanism (200) is arranged on a first side of the back splint main body (100), and a second side of the back splint main body (100) is provided with an installation space (110) for accommodating electronic equipment; the heat dissipation mechanism (200) comprises a cover body (210), a fan (220), an air volume adjusting mechanism (230) and a first driving mechanism, the cover body (210) is arranged on the first side of the back splint main body (100), the cover body (210) and the back splint main body (100) form an accommodating space, the fan (220) is arranged in the accommodating space, a vent hole is formed in the cover body (210), the air volume adjusting mechanism (230) is arranged on the vent hole, the first driving mechanism is connected with the air volume adjusting mechanism (230), and the first driving mechanism can drive the air volume adjusting mechanism (230) to move so as to adjust the opening degree of the vent hole. The scheme can solve the problem that foreign matters are easy to invade to cause the unsatisfactory heat dissipation efficiency of the heat dissipation back clip.

Description

Heat dissipation back splint

Technical Field

The application relates to the technical field of heat dissipation back splint, in particular to a heat dissipation back splint.

Background

As user demands increase, the performance of electronic devices continues to optimize. The current electronic devices have gradually developed from communication tools to tools for realizing social entertainment, and accordingly, the electronic devices also take on the responsibility of more scene applications, such as charging, games, videos, photos, and the like.

Due to the optimization of the performance and the increase of the functions of the electronic equipment, the electronic equipment can generate more heat in the working process, and further the electronic equipment can be overheated.

To address the problem of overheating, users often configure a heat dissipation back clip for the electronic device. In the use process of the electronic equipment, the heat dissipation back clamp can timely dissipate heat generated by the electronic equipment. Current heat-dissipating back clips are typically configured with a heat-dissipating fan. However, in order to protect the fan, the heat dissipation back clip is provided with a ventilation retaining wall, and the ventilation retaining wall can cause more foreign matters such as dust to enter, which not only causes poor ventilation performance and influences heat dissipation efficiency, but also causes difficulty in cleaning the heat dissipation back clip.

Disclosure of Invention

The application discloses heat dissipation back splint can solve the heat dissipation back splint among the correlation technique and have the foreign matter and invade more easily and lead to the unsatisfactory problem of radiating efficiency of heat dissipation back splint.

In order to solve the above technical problem, the present application is implemented as follows:

the application discloses heat dissipation back splint, the disclosed heat dissipation back splint is applied to electronic equipment, heat dissipation back splint includes back splint main part and heat dissipation mechanism, wherein, heat dissipation mechanism sets up the first side of back splint main part, the second side of back splint main part is seted up and is used for holding electronic equipment's installation space, heat dissipation mechanism is including the cover body, fan, air regulation mechanism and a actuating mechanism, the cover body sets up the back splint main part first side, just the cover body with the back splint main part forms accommodation space, the fan sets up within the accommodation space, the ventilation hole has been seted up to the cover body, air regulation mechanism sets up on the ventilation hole, a actuating mechanism with air regulation mechanism links to each other, a actuating mechanism can drive air regulation mechanism moves, in order to adjust the aperture in ventilation hole.

The technical scheme adopted by the application can achieve the following beneficial effects:

in the use of heat dissipation back splint, electronic equipment generates heat and blows air through the fan to cool down, and simultaneously, to the difference of the temperature that generates heat of electronic equipment, first actuating mechanism can drive air regulation mechanism motion, thereby make the size of the draught area of air regulation mechanism control vent, if electronic equipment stop operation, electronic equipment can not generate heat this moment promptly, first actuating mechanism can drive air regulation mechanism motion, thereby make the vent sealed, and then make in the difficult entering accommodation space of foreign matter such as more dust, thereby ensure that the operation of fan can not receive the influence of foreign matter, and then guarantee heat dissipation mechanism's radiating efficiency.

In addition, when the heating temperature of the electronic equipment is a first temperature, the first driving mechanism drives the air volume adjusting mechanism to move, and the air volume adjusting mechanism controls the ventilation area of the ventilation opening to be a first ventilation area; when the heating temperature of the electronic equipment is the second temperature, the first driving mechanism drives the air volume adjusting mechanism to move, the ventilation area of the air volume adjusting mechanism control vent is the second ventilation area, wherein the first temperature is greater than the second temperature, the first ventilation area is greater than the second ventilation area, so that under the condition that the heating temperature of the electronic equipment is higher and higher, the ventilation area of the air volume adjusting mechanism control vent is larger and larger, the air volume flowing speed in the accommodating space is higher, and the heat dissipation efficiency of the heat dissipation back clamp is finally improved.

Drawings

Fig. 1 is an exploded view of a heat-dissipating back clip disclosed in an embodiment of the present application;

fig. 2 is a schematic structural diagram of a heat dissipation mechanism disclosed in an embodiment of the present application;

fig. 3 is a schematic structural diagram of an air volume adjusting mechanism disclosed in the embodiment of the present application in a second state;

fig. 4 is a schematic structural diagram of an air volume adjusting mechanism disclosed in the embodiment of the present application in a first state;

FIG. 5 is a schematic structural diagram of a driving sub-mechanism disclosed in an embodiment of the present application;

fig. 6 is a schematic structural view of a heat dissipation mechanism disclosed in an embodiment of the present application in a state of reducing air volume;

fig. 7 is a schematic structural diagram of a heat dissipation mechanism disclosed in the embodiment of the present application in a state of increasing air volume;

fig. 8 is a schematic partial structure diagram of an electronic control module disclosed in the embodiment of the present application.

Description of the reference numerals:

100-back clip body, 110-installation space;

200-a heat dissipation mechanism, 210-a cover body, 220-a fan, 221-fan blades, 222-a second rotating shaft, 223-a first meshing part, 224-a second gear ring, 230-an air volume adjusting mechanism, 231-an air volume adjusting blade, 232-an avoiding hole and 240-a semiconductor refrigerating sheet;

300-flexible thermal pad, 310-primary thermal conductive area, 320-deformation area;

400-an electronic control module, 410-a temperature acquisition module, 420-a control module, 430-a battery, 440-a first charging interface and 450-a second charging interface;

500-drive sub-mechanism, 510-first ring gear, 520-gear transmission mechanism.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. The objects distinguished by "first", "second", and the like are usually a class, and the number of the objects is not limited, and for example, the first object may be one or a plurality of objects. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The technical solutions disclosed in the embodiments of the present application are described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.

Referring to fig. 1 to 8, an embodiment of the present application discloses a heat dissipation back clip, which can be applied to an electronic device, and includes a back clip main body 100 and a heat dissipation mechanism 200.

The back splint main body 100 can provide a mounting base for the heat dissipation mechanism 200, and at the same time, the electronic apparatus can be assembled with the back splint main body 100.

The heat dissipation mechanism 200 is a main heat dissipation device of the heat dissipation back clip, and the heat dissipation mechanism 200 can dissipate heat of the electronic device.

Specifically, the heat dissipation mechanism 200 is disposed on a first side of the back splint main body 100, and the mounting space 110 for accommodating the electronic device is disposed on a second side of the back splint main body 100, so that the electronic device can be mounted in the mounting space 110, and the back splint main body 100 can provide protection for the electronic device. Alternatively, the first side and the second side may be opposite sides of the clip body 100.

The heat dissipation mechanism 200 may include a housing 210, a fan 220, an air volume adjustment mechanism 230, and a first driving mechanism. Specifically, the cover 210 may be disposed on a first side of the back splint main body 100, and the cover 210 and the back splint main body 100 may form an accommodating space, and the fan 220 may be disposed within the accommodating space, so that the cover 210 may provide protection for the fan 220, the cover 210 may be provided with a vent, the air volume adjusting mechanism 230 may be disposed on the vent, in the accommodating space, the first driving mechanism may be connected to the air volume adjusting mechanism 230, and the first driving mechanism may drive the air volume adjusting mechanism 230 to move so as to adjust an opening degree of the vent.

In the use of heat dissipation back splint, electronic equipment generates heat and blows air through fan 220 to cool, and simultaneously, to the difference of the temperature that generates heat of electronic equipment, first actuating mechanism can drive air regulation mechanism 230 motion, thereby make air regulation mechanism 230 can control the size of the draught area in ventilation hole, if electronic equipment stop operation, electronic equipment can not generate heat this moment promptly, first actuating mechanism can drive air regulation mechanism 230 motion, thereby make the ventilation hole sealed, and then make in the difficult entering accommodation space of foreign matter such as more dust, thereby ensure that the operation of fan 220 can not receive the influence of foreign matter, and then guarantee heat dissipation mechanism 200's radiating efficiency.

Specifically, when the heating temperature of the electronic device is a first temperature, the first driving mechanism drives the air volume adjusting mechanism 230 to move, and the air volume adjusting mechanism 230 controls the ventilation area of the ventilation hole to be a first ventilation area; when the heating temperature of the electronic device is the second temperature, the first driving mechanism drives the air volume adjusting mechanism 230 to move, and the air volume adjusting mechanism 230 controls the ventilation area of the ventilation hole to be the second ventilation area. Wherein, first temperature is greater than the second temperature, and first draught area is greater than the second draught area to under the temperature condition more and more that makes electronic equipment generate heat, the draught area of air regulation mechanism 230 control ventilation hole can be bigger and bigger, and then makes the speed that the amount of wind in the accommodation space flows faster, finally improves the radiating efficiency of heat dissipation back splint. Of course, when the temperature of the electronic device is not high, the air volume adjusting mechanism 230 can control the ventilation area of the ventilation hole to be small, and can adjust the ventilation area adaptively.

In this application embodiment, heat dissipation mechanism 200 can also include semiconductor refrigeration piece 240, specifically, semiconductor refrigeration piece 240 can set up the first side at back splint main part 100, semiconductor refrigeration piece 240 can include hot junction and cold junction, the cold junction can contact with back splint main part 100, thereby make electronic equipment can dispel the heat the cooling through the cold junction fast, the hot junction can be towards accommodation space, the cold junction can be with heat transfer to the hot junction, fan 220 can set up with the hot junction relatively, cool down the hot junction through blowing, thereby further improve the radiating efficiency of heat dissipation back splint.

In further technical scheme, fan 220 can be axial fan, and in the equipment process of heat dissipation mechanism 200, hot junction, fan 220 and ventilation hole can set gradually, and axial air-out can be realized to axial fan to make fan 220 can cool down the hot junction surface sooner, and the ventilation hole sets up with fan 220 relatively, and then makes the flow rate of amount of wind accelerate, effectively improves fan 220's rate of heat dissipation.

In this embodiment, the heat dissipation back splint may further include an electronic control module 400, specifically, the electronic control module 400 may include a temperature acquisition module 410 and a control module 420, the temperature acquisition module 410 is used for detecting the temperature of the electronic device, the temperature acquisition module 410 may be a temperature sensor, the temperature acquisition module 410 may be disposed close to the electronic device, the control module 420 may be electrically connected to the temperature acquisition module 410, and the temperature acquisition module 410 may transmit the acquired temperature to the control module 420, the control module 420 is respectively connected to the fan 220 and the semiconductor chilling plate 240, and the control module 420 is used for controlling at least one of the fan 220 and the semiconductor chilling plate 240 according to the temperature.

In the use of heat dissipation back splint, the temperature transmission to control module 420 of temperature acquisition module 410 will gathering, control module 420 controls the cold junction of semiconductor refrigeration piece 240 according to the temperature and conducts heat, and control module 420 controls fan 220 and blows the hot junction and cool down, thereby realize more intelligent temperature regulation, a more excellent scheme, control module 420 can also control the motion of first actuating mechanism drive air regulation mechanism 230, and then adjust the aperture in ventilation hole, thereby realize the regulation of the heat dissipation amount of wind, and then can further adjust the heat-sinking capability.

In this embodiment, the heat dissipation back splint may further include an electronic control module 400, the electronic control module 400 may include a battery 430 and a first charging interface 440, firstly, the battery 430 may provide electric energy for the temperature acquisition module 410 and the control module 420, secondly, when the electric quantity of the electronic device is small, the battery 430 may be in charge cooperation with the electronic device through the first charging interface 440, thereby realizing that the heat dissipation back splint charges the electronic device, and the heat dissipation back splint may have a second charging interface 450, thereby charging the heat dissipation back splint through the second charging interface 450 under the condition that the electric quantity of the battery 430 is small or the electric quantity is exhausted. Optionally, both the first charging interface 440 and the second charging interface 450 may be USB interfaces.

In this application embodiment, can be provided with flexible heat conduction pad 300 in installation space 110, specifically, flexible heat conduction pad 300 is used for contacting with electronic equipment, flexible heat conduction pad 300 can be comparatively quick with electronic equipment's heat transfer to cold junction, thereby make electronic equipment can dispel the heat through the cold junction more fast and cool down, then, the cold junction can be with heat transfer to hot junction, fan 220 can set up with the hot junction relatively, cool down the hot junction through blowing, thereby further improve the radiating efficiency that the back of the body pressed from both sides dispels the heat.

In a further technical solution, the flexible thermal pad 300 may include a plurality of main thermal conductive areas 310 distributed in an array and a deformation area 320 connected between two adjacent main thermal conductive areas 310, the electronic device is installed in the installation space 110 of the back clip main body 100, the deformation area 320 can be better deformed, so that the electronic device is better contacted with the flexible thermal pad 300, and the deformation area 320 is pressed to cause the plurality of main thermal conductive areas 310 to be better contacted with the electronic device, so as to facilitate improving the thermal conductive efficiency, so that the heat generated by the electronic device is more quickly conducted to the heat dissipation back clip.

In the embodiment of the present application, the air volume adjusting mechanism 230 may include at least two air volume adjusting blades 231, specifically, the at least two air volume adjusting blades 231 may be both rotatably disposed on the cover 210, and the first driving mechanism may be connected to the at least two air volume adjusting blades 231 and drive the air volume adjusting blades 231 to rotate, so as to switch the air volume adjusting mechanism 230 between the first state and the second state.

In the first state, the at least two air volume adjusting blades 231 are spliced and cover the vent holes, so that the vent holes are closed, more foreign matters such as dust and the like are difficult to enter the accommodating space, and the operation of the fan 220 is not influenced by the foreign matters; under the second state, two at least air regulation leaf 231 forms dodge hole 232, dodges hole 232 and ventilation hole intercommunication to make dodge hole 232 and can control the air output, the heat dissipation back splint can control the size of dodging hole 232 according to the temperature height that electronic equipment generates heat, thereby indirectly adjusts the aperture in ventilation hole. The structure controls the opening degree of the air vent by controlling the rotation angle of the air volume adjusting blade 231, and compared with the existing valve product on the market, the air volume adjusting mechanism 230 has the advantage of simple structure.

Of course, the air volume adjusting mechanism 230 may also be an air volume valve installed on the vent hole, and during the operation process, the first driving mechanism may drive the air volume valve, so as to adjust the opening degree of the vent hole. The air volume adjusting mechanism 230 has various structures, and the embodiment of the present application does not limit the specific type of the air volume adjusting mechanism 230.

In this embodiment, the first driving mechanism may include at least two driving sub-mechanisms 500, and specifically, each driving sub-mechanism 500 may be connected to one air volume adjusting vane 231, so that if one air volume adjusting vane 231 is damaged, a maintenance worker only needs to replace the corresponding air volume adjusting vane 231 and driving sub-mechanism 500, which is beneficial to reducing maintenance cost.

The air volume adjusting blades 231 can be rotatably mounted on the cover body 210 through a first rotating shaft, the driving sub-mechanism 500 can comprise a first gear ring 510, a gear transmission mechanism 520 and a driving motor, the first gear ring 510 can be fixed on the first rotating shaft, and the driving motor is connected with the first gear ring 510 through the gear transmission mechanism 520, so that the driving motor can synchronously drive at least two driving sub-mechanisms 500, at least two air volume adjusting blades 231 can synchronously move, and the size of the avoiding hole 232 can be adjusted more quickly.

In the embodiment of the present application, the fan 220 may include a supporting portion, a third driving mechanism, and at least two fan blades 221, at least two second rotating shafts 222, at least two first engaging portions 223, a second gear ring 224, and a second driving mechanism disposed on the supporting portion.

Specifically, the first end of the fan blade 221 may be rotatably disposed on the supporting portion by the second rotating shaft 222, the first end of the fan blade 221 may be fixed with the first engaging portion 223, and the second end of the fan blade 221 is a free end, so that the fan blade 221 may rotate with the first end as an axis.

At least two first meshing portions 223 can distribute around second ring gear 224, and all mesh with second ring gear 224, thereby make second ring gear 224 can rotate through meshing cooperation drive at least two first meshing portions 223, second actuating mechanism links to each other with second ring gear 224, second actuating mechanism drives the second end of fan blade 221 through the meshing of second ring gear 224 with first meshing portion 223 and rotates for first end, with the distance between regulation second end and second ring gear 224, thereby make the expansion degree that fan blade 221 can be controlled to the back splint that dispels the heat, and then can adjust the size of air output comparatively fast.

The third driving mechanism is connected to the supporting portion, and the third driving mechanism drives the supporting portion to drive the at least two fan blades 221 to rotate, so that the at least two fan blades 221 cool the hot end by rotating the blowing fan.

In further technical scheme, first meshing portion 223 can be first fan-shaped meshing portion, and the overall dimension of first fan-shaped meshing portion is little, and meshing cooperation in-process, first fan-shaped meshing portion is less to blockking of air current, and then guarantees fan 220's air output more easily.

The electronic device related to the embodiments of the present application may be a mobile phone, a tablet computer, an electronic book reader, a wearable device (e.g., smart glasses, a smart watch), a game machine, a medical apparatus, and the like, and the embodiments of the present application do not limit the specific kind of the electronic device.

In the embodiments of the present application, the difference between the embodiments is described in detail, and different optimization features between the embodiments can be combined to form a better embodiment as long as the differences are not contradictory, and further description is omitted here in view of brevity of the text.

The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A heat dissipation back clip applied to an electronic device, the heat dissipation back clip comprising a back clip main body (100) and a heat dissipation mechanism (200), wherein:

the heat dissipation mechanism (200) is arranged on a first side of the back clip main body (100), and a second side of the back clip main body (100) is provided with an installation space (110) for accommodating the electronic equipment;

the heat dissipation mechanism (200) comprises a cover body (210), a fan (220), an air volume adjusting mechanism (230) and a first driving mechanism, wherein the cover body (210) is arranged on the first side of the back splint main body (100), the cover body (210) and the back splint main body (100) form an accommodating space, the fan (220) is arranged in the accommodating space, the cover body (210) is provided with a vent hole, the air volume adjusting mechanism (230) is arranged on the vent hole, the first driving mechanism is connected with the air volume adjusting mechanism (230), and the first driving mechanism can drive at least part of the air volume adjusting mechanism (230) to move so as to adjust the opening degree of the vent hole;

the fan (220) comprises a supporting part, a third driving mechanism, at least two fan blades (221), at least two second rotating shafts (222), at least two first meshing parts (223), a second gear ring (224) and a second driving mechanism, wherein the fan blades are arranged on the supporting part:

the first end of the fan blade (221) is rotatably arranged on the supporting part through the second rotating shaft (222), the first engaging part (223) is fixed at the first end of the fan blade (221), and the second end of the fan blade (221) is a free end;

the at least two first meshing parts (223) are distributed around the second gear ring (224) and are meshed with the second gear ring (224), the second driving mechanism is connected with the second gear ring (224), and the second driving mechanism drives the second end of the fan blade (221) to rotate relative to the first end through the meshing of the second gear ring (224) and the first meshing parts (223) so as to adjust the distance between the second end and the second gear ring (224);

the third driving mechanism is connected with the supporting part, and the third driving mechanism drives the supporting part to drive the at least two fan blades (221) to rotate.

2. The heat dissipating clip of claim 1, wherein the heat dissipating mechanism (200) further comprises a semiconductor chilling plate (240), the semiconductor chilling plate (240) being disposed on the first side of the clip body (100), the semiconductor chilling plate (240) comprising a hot end and a cold end, the cold end being in contact with the clip body (100), the hot end facing the receiving space.

3. The heat dissipating back clip of claim 2, wherein the fan (220) is an axial fan, and the hot end, the fan (220), and the vent are sequentially disposed.

4. The heat dissipation back clamp of claim 2, further comprising an electronic control module (400), wherein the electronic control module (400) comprises a temperature acquisition module (410) and a control module (420), the temperature acquisition module (410) is configured to detect a temperature of the electronic device, the control module (420) is connected to the temperature acquisition module (410), the control module (420) is respectively connected to the fan (220) and the semiconductor chilling plate (240), and the control module (420) is configured to control at least one of the fan (220) and the semiconductor chilling plate (240) according to the temperature.

5. The heat dissipation back clip of claim 1, further comprising an electronic control module (400), wherein the electronic control module (400) comprises a battery (430) and a first charging interface (440), and wherein the battery (430) is electrically coupled to the electronic device via the first charging interface (440).

6. The heat spreading clip according to claim 1, wherein a flexible thermal pad (300) is disposed within the mounting space (110), the flexible thermal pad (300) being configured to contact the electronic device.

7. The heat sink clip as recited in claim 6, wherein the flexible thermal pad (300) comprises a plurality of primary heat conducting areas (310) distributed in an array and a deformation area (320) connected between two adjacent primary heat conducting areas (310).

8. The heat dissipation back clip of claim 1, wherein the air volume adjusting mechanism (230) comprises at least two air volume adjusting blades (231), each of the at least two air volume adjusting blades (231) is rotatably disposed on the housing (210), the first driving mechanism is connected to the at least two air volume adjusting blades (231) and drives the air volume adjusting blades (231) to rotate, so as to switch the air volume adjusting mechanism (230) between a first state and a second state, wherein:

under the condition of the first state, the at least two air volume adjusting blades (231) are spliced and cover the vent hole;

under the condition of the second state, the at least two air volume adjusting blades (231) form avoiding holes (232), and the avoiding holes (232) are communicated with the vent holes.

9. The heat-dissipating back clip according to claim 8, wherein the first driving mechanism comprises at least two driving sub-mechanisms (500), each driving sub-mechanism (500) is connected to one of the air volume adjusting vanes (231), the air volume adjusting vanes (231) are rotatably mounted to the housing (210) through a first rotating shaft, the driving sub-mechanisms (500) comprise a first gear ring (510), a gear transmission mechanism (520), and a driving motor, the first gear ring (510) is fixed to the first rotating shaft, and the driving motor is connected to the first gear ring (510) through the gear transmission mechanism (520).