CN206118280U - Mobile terminal's heat radiation structure - Google Patents
Mobile terminal's heat radiation structure Download PDFInfo
- Publication number
- CN206118280U CN206118280U CN201621116625.5U CN201621116625U CN206118280U CN 206118280 U CN206118280 U CN 206118280U CN 201621116625 U CN201621116625 U CN 201621116625U CN 206118280 U CN206118280 U CN 206118280U
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- CN
- China
- Prior art keywords
- mobile terminal
- pcba board
- heat
- heat radiation
- radiator structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model relates to a heat abstractor. And more particularly, the utility model relates to a mobile terminal's heat radiation structure includes: thermal -insulated membrane, it is installed between mobile terminal's the touch panel and PCBA board, thermal film, it is installed between mobile terminal's the PCBA board and backshell, wherein, PCBA board facing is with the heat dissipation chip, touch panel, thermal -insulated membrane, PCBA board, heat dissipation chip, thermal film and backshell from the top down arrange in proper order. The utility model discloses mobile terminal's radiating effect has been improved for the temperature control of mobile terminal during operation is at the acceptable within range.
Description
Technical field
The utility model is related to a kind of heat abstractor.More specifically, the utility model is related to a kind of dissipating for mobile terminal
Heat structure.
Background technology
Mobile phone, flat board are increasingly popularized in the life of people, and mobile terminal client is to the performance of product, outward appearance and body-sensing
Require also more and more higher.In this case, due to needing to meet the high request of consumer, such as game, quick charge etc., that
(PCBA is the abbreviation of English Printed Circuit Board+Assembly to PCBA, that is to say, that PCB hollow plates are through SMT
Upper part, then through the whole processing procedure of DIP plug-in units, abbreviation PCBA) very high integrated level is needed exist for, various power consumptions are acted on simultaneously
Under, being accomplished by using temperature of product is controlled in certain scope by radiating.At present design conventional on product is
Add heat sink material on euthermic chip, the temperature for making chip lowers, so if platform temperature itself is very high, shed and
Heat can be transferred to Surface Appearance, such as mobile phone surface, if temperature is transferred directly to TP (contact panel)/LCD (liquid crystals
Show device) on (generally glass material), sendible temperature will be higher, and user can be difficult to receive.
Utility model content
A purpose of the present utility model is to solve at least the above, and provides the advantage that at least will be described later.
The utility model is it is also an object that improve the radiating effect of mobile terminal so that temperature when mobile terminal works
Degree control is within the acceptable range.
In order to realize according to these purposes of the present utility model and further advantage, there is provided a kind of radiating knot of mobile terminal
Structure, including：
Thermal isolation film, it is arranged between the contact panel of the mobile terminal and PCBA board；
Heat dissipation film, it is arranged between the PCBA board of the mobile terminal and back cover；
Wherein, be pasted with heat radiation chip in the PCBA board, the contact panel, thermal isolation film, PCBA board, heat radiation chip,
Heat dissipation film and back cover are arranged successively from top to bottom.
Substantial amounts of heat is produced when the PCBA board of mobile terminal works, due to the presence of thermal isolation film, PCBA board is to upload
The heat led is prevented from, so as to control the temperature of contact panel in certain scope；The heat that simultaneously PCBA board is produced passes through
Heat dissipation film outwards sheds, and improves the radiating effect of mobile terminal so that the temperature of mobile terminal is in controlled range.
Preferably, in the radiator structure of described mobile terminal, the thermal isolation film is completely covered the upper of the PCBA board
Surface, with the path that complete intercept heat is conducted upwards.
Preferably, in the radiator structure of described mobile terminal, the thickness of the thermal isolation film is 1～2mm, both be can guarantee that
Effect of heat insulation, the thickness of mobile terminal will not be caused again increases excessive.
Preferably, in the radiator structure of described mobile terminal, the heat radiation chip is arranged under the PCBA board
Surface, and positioned at the central authorities of the PCBA board, the heat for producing that PCBA board is worked is derived in time.
Preferably, in the radiator structure of described mobile terminal, the area of the heat radiation chip is less than the PCBA board
Area so that the heat that PCBA board work is produced is respectively by heat radiation chip and air transmitted to heat dissipation film, multipath enters
Row radiating.
Preferably, in the radiator structure of described mobile terminal, the heat dissipation film is completely covered under the PCBA board
Surface and the heat radiation chip, to ensure that the heat that PCBA board work is produced timely and effectively outwards is shed by heat dissipation film.
Preferably, in the radiator structure of described mobile terminal, the thickness of the heat dissipation film is 1～2mm, both be can guarantee that
Radiating effect, the thickness of mobile terminal will not be caused again increases excessive.
The utility model at least includes following beneficial effect：Substantial amounts of heat is produced when the PCBA board of mobile terminal works
Amount, due to the presence of thermal isolation film, the heat that PCBA board is conducted upwards is prevented from, so as to control the temperature of contact panel certain
In the range of, reduce sendible temperature.The heat that simultaneously PCBA board is produced outwards is shed by heat dissipation film so that the back cover of mobile terminal
Temperature be also in controlled range, improve the radiating effect of mobile terminal, it is ensured that the temperature of whole mobile terminal is unlikely to
It is too high.
Further advantage of the present utility model, target and feature embody part by description below, and part will also pass through
Research of the present utility model and practice are understood by the person skilled in the art.
Description of the drawings
Fig. 1 is the schematic diagram of the radiator structure of described mobile terminal.
Specific embodiment
The utility model is described in further detail below in conjunction with the accompanying drawings, to make those skilled in the art with reference to explanation
Book word can be implemented according to this.
It should be appreciated that it is used herein such as " have ", "comprising" and " including " term are not precluded from one or many
The presence or addition of individual other elements or its combination.
As shown in figure 1, the utility model provides a kind of radiator structure of mobile terminal, the mobile terminal includes mobile phone peace
Plate computer etc., including：
Thermal isolation film 102, it is arranged between the contact panel 101 of the mobile terminal and PCBA board 103, can pass through glue
Glutinous agent simultaneously fixes thermal isolation film 102 and contact panel 101 and PCBA board 103.
Heat dissipation film 105, it is arranged between the PCBA board 103 of the mobile terminal and back cover 106, can pass through adhesive
Heat dissipation film 105 and PCBA board 103 and back cover 106 is simultaneously fixed, need the amount of radiating by the area of change heat dissipation film 105 and
Material is controlling.
Wherein, heat radiation chip 104, the contact panel 101, thermal isolation film 102, PCBA are pasted with the PCBA board 103
Plate 103, heat radiation chip 104, heat dissipation film 105 and back cover 106 are arranged successively from top to bottom, form layer structure, contact panel 101
Outermost layer is respectively distributed to back cover 106, other Rotating fields are coated on into inside.
In the radiator structure of described mobile terminal, the thermal isolation film 102 is completely covered the upper table of the PCBA board 103
Face, the i.e. size of thermal isolation film 102 are in the same size with the upper surface of PCBA board 103, to block the heat of the generation of PCBA board 103 completely
Transmit to the contact panel 101 on upper strata.Because user is using mobile terminal, especially during mobile phone, Jing is often by contact panel 101
One facing to oneself, or it is close to face, such heat will be directly transferred to face location, and design of the present utility model then has
Effect prevents heat towards the transmission of contact panel 101, reduces the temperature of contact panel 101.
In the radiator structure of described mobile terminal, the thickness of the thermal isolation film 102 is 1～2mm, it is also possible to according to reality
Need to improve, the area of such as panel computer is much larger than mobile phone, and the heat produced during work is also more, can suitably increase heat-insulated
The thickness of film 102, to ensure effect of heat insulation.
In the radiator structure of described mobile terminal, the heat radiation chip 104 is arranged on the following table of the PCBA board 103
Face, and positioned at the central authorities of the PCBA board 103, form convex.This is due to the integrated component number in the central authorities of PCBA board 103
More, power consumption is larger, and the heat of generation is more, and by the once radiating of heat radiation chip 104 heat dissipation film 105 is resent to, it is ensured that
Radiating effect.
In the radiator structure of described mobile terminal, the area of the heat radiation chip 104 is less than the face of the PCBA board 103
Product.The central authorities of PCBA board 103 for only more concentrating in components and parts attach heat radiation chip 104, and other positions are autonomous by air transmitted
Radiating, on the premise of radiating effect is ensured, reduces cost.
In the radiator structure of described mobile terminal, the heat dissipation film 105 is completely covered the lower surface of the PCBA board 103
With the heat radiation chip 104, shorten the distance between PCBA board 103 and heat dissipation film 105 to try one's best so that heat gives out as early as possible
Go.
In the radiator structure of described mobile terminal, the thickness of the heat dissipation film 105 is 1～2mm, it is also possible to according to reality
Need to improve, the area of such as panel computer is much larger than mobile phone, and the heat produced during work is also more, can suitably increase radiating
The thickness of film 105, to ensure radiating effect.
Although embodiment of the present utility model is disclosed as above, it is not restricted in specification and embodiment
Listed utilization, it can be applied to completely various suitable fields of the present utility model, for those skilled in the art,
Other modification is easily achieved, therefore under the universal limited without departing substantially from claim and equivalency range, this reality
Specific details is not limited to new and shown here as the legend with description.
Claims (7)
1. a kind of radiator structure of mobile terminal, it is characterised in that include：
Thermal isolation film, it is arranged between the contact panel of the mobile terminal and PCBA board；
Heat dissipation film, it is arranged between the PCBA board of the mobile terminal and back cover；
Wherein, heat radiation chip, the contact panel, thermal isolation film, PCBA board, heat radiation chip, radiating are pasted with the PCBA board
Film and back cover are arranged successively from top to bottom.
2. the radiator structure of mobile terminal as claimed in claim 1, it is characterised in that the thermal isolation film is completely covered described
The upper surface of PCBA board.
3. the radiator structure of mobile terminal as claimed in claim 2, it is characterised in that the thickness of the thermal isolation film is 1～
2mm。
4. the radiator structure of mobile terminal as claimed in claim 1, it is characterised in that the heat radiation chip is arranged on described
The lower surface of PCBA board, and positioned at the central authorities of the PCBA board.
5. the radiator structure of mobile terminal as claimed in claim 4, it is characterised in that the area of the heat radiation chip is less than institute
State the area of PCBA board.
6. the radiator structure of mobile terminal as claimed in claim 1, it is characterised in that the heat dissipation film is completely covered described
The lower surface of PCBA board and the heat radiation chip.
7. the radiator structure of mobile terminal as claimed in claim 6, it is characterised in that the thickness of the heat dissipation film is 1～
2mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621116625.5U CN206118280U (en) | 2016-10-12 | 2016-10-12 | Mobile terminal's heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621116625.5U CN206118280U (en) | 2016-10-12 | 2016-10-12 | Mobile terminal's heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206118280U true CN206118280U (en) | 2017-04-19 |
Family
ID=58529439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621116625.5U Active CN206118280U (en) | 2016-10-12 | 2016-10-12 | Mobile terminal's heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206118280U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107870659A (en) * | 2017-11-03 | 2018-04-03 | 河南智业科技发展有限公司 | A kind of visual type cloud computing desktop terminal |
-
2016
- 2016-10-12 CN CN201621116625.5U patent/CN206118280U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107870659A (en) * | 2017-11-03 | 2018-04-03 | 河南智业科技发展有限公司 | A kind of visual type cloud computing desktop terminal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: No. 16, cuixing Road, Hui Xing street, Yubei District, Chongqing Patentee after: Chongqing Lanan Technology Co.,Ltd. Address before: No. 13-2, Jiangying Road, Nanan District, Chongqing, Chongqing Patentee before: CHONGQING BLUEBANK COMMUNICATION TECHNOLOGY Co.,Ltd. |