TWM509511U - Fluid refrigeration module - Google Patents

Description

Fluid cooling module

This creation is a fluid cooling module, especially suitable for small water storage devices such as aquariums or water dispensers, and can be selectively cooled in multiple stages in accordance with the ambient temperature to save operating power.

Temperature control devices are often used in various types of products, such as small water storage devices such as aquariums and water dispensers. Taking aquariums as an example, different types of ornamental fish require different farming conditions. Especially most ornamental fish require stable water temperature, but in summer high temperature environment, small aquariums are susceptible to room temperature and circulatory system operation. As the water temperature rises and affects the survival rate of the fish, the aquarium usually installs a temperature control device to maintain the water temperature stability.

The temperature control device of the water dispenser generally uses a compressor and a refrigerant to cool the water for the user to drink cold water, but the water dispenser discharges the cold water immediately, and the aquarium is a circulating water that needs to maintain a stable water temperature for a long time, so the compressor and the refrigerant are used. The cooling of the aquarium is not only too large, but also makes the overall cost of the aquarium too high, which is not economical.

Cooling the aquaculture water using a cryogenic wafer on the aquarium's refrigeration system is a more economical and viable option. However, the cooling chip is a single power, and the cooling speed cannot be adjusted according to the water temperature; for example, the summer ambient temperature is high, and the fluid needs to be heated faster, and the cold wafer must be operated for a long time to reach a predetermined low temperature; If the ambient temperature is low in spring and autumn, the single consistent cold wafer is at the same power. Although it is easy to cool the fluid to a predetermined temperature, the cooled wafer will always be on and off, which is easy to cause damage.

In addition, it is well known that when the cooled wafer is in operation, its back heating surface It will generate waste heat. If multiple sets of cryogenic wafers are used to switch the operation to achieve the effect of multi-stage cooling of the fluid, the adjustment effect may be achieved in the cooling effect, but in this case, it is necessary to consider the operation of the two-cold wafer. The problem of heat dissipation.

In order to solve the above-mentioned heat dissipation problem caused by using two sets of cryogenic wafers, the present inventors further studied the existing heat sinks and found that the structure of the conventional heat sinks is mostly designed for a single heat source, such as a computer heat sink. Among them, there are also some advanced radiators that can dissipate heat from two adjacent electronic components, for example, the heat sink of No. I422315. However, after research, the above heat sink is not suitable and cannot be used as a fluid for realization. The heat dissipation component in the cooling module.

The reason is that the design feature of the heat sink of No. I422315 is as described in the specification: it is used for dissipating heat of the first and second heating elements arranged side by side on a circuit board, and the heat dissipating device further comprises side by side arranged on the first and second heating elements. Two sets of heat sinks, and a heat pipe connected between the two heat sinks. The problem with this design is:

1. The first and second heating elements and the two heat sinks must be arranged side by side, which greatly limits their installation and use.

2. Although the two heat sinks are provided with heat conduction between the heat pipes, the two heat sinks respectively dissipate heat to the two heat-generating components, which is essentially equivalent to setting two sets of heat sinks, which still does not meet the requirements of the creation in terms of installation volume and cost.

3. It is well known that the heat pipe structure rapidly conducts the heat source by the heated evaporation section and the heat dissipation condensation section. However, when the heat pipe is disposed between the two heat sinks, when the two heat generating components operate at the same time, the waste heat is respectively transmitted to the two sets of heat sinks. The heated evaporating section of the heat pipe and the heat dissipating section will be heated at the same time, which will undoubtedly interfere with the heat conduction effect of the heat pipe.

Based on the various issues considered in the above design process, including how to use two pieces of cryogenic wafers for cooling and cooling, and the heat dissipation problem caused by using two-cold wafers, the creator has accumulated many years of research and practice in related fields. Experience has created a fluid cooling module to improve the lack of temperature regulation of conventionally cooled wafers that cannot be adjusted with ambient temperature.

The purpose of the present invention is to provide a fluid cooling module, which is particularly suitable for use in a small water storage device such as an aquarium or a water dispenser, capable of performing selective multi-stage cooling with ambient temperature, saving operating power, and avoiding frequent switching of the cooling wafer. Cause damage.

In order to achieve the above object, the fluid cooling module of the present invention comprises: two pieces of refrigerated wafers disposed oppositely back to back, the two refrigerating wafers respectively having a cooling surface facing outward and an heating surface facing inward; a cavity through which the fluid flows, the two cavities respectively abut against the cooling surface outside the two refrigerating wafers, so that the fluid flowing through the two cavities can respectively receive the cooling of the cooling surface outside the two refrigerating wafers; and a setting a heat conducting seat between the two refrigerating wafers, wherein the heat generating surfaces of the two cooling fins respectively abut against the front and back sides of the heat conducting seat, and the heat conducting seat is provided with a plurality of heat pipes to conduct waste heat to a heat sink fin group For the purpose of heat dissipation; thereby, the two-cold wafer can simultaneously or select one of the operations to selectively cool the fluid with the ambient temperature, and the waste heat generated when any one or two of the cooled wafers are operated can be shared. The same heat conducting seat effectively dissipates heat without interfering with each other.

The embodiments of the components are further described below. In the implementation, the two chambers are respectively provided with a water inlet and a water outlet, and the water outlet of one of the chambers communicates with the water inlet of the other chamber through a connecting tube to enable fluid energy. After cooling by one of the cavities in sequence, the water outlet of the cavity and the connecting pipe flow to the other cavity for re-cooling, thereby achieving the effect of fluid cooling.

In implementation, the fluid cooling module can use different power of the cooling chip, and the two cooling chips can operate simultaneously or select one of them to generate different cooling speeds for the cavity, for example, in the summer season The cold wafer operates at the same time to speed up the cooling of the fluid; if it is in the spring and autumn, only one of the cooled wafers can be operated, the fluid cooling speed is slowed down, and the fluid is effectively selected according to the ambient temperature. Multi-stage cooling.

In practice, the plurality of heat pipes respectively have an evaporation section and a condensation section, and the heat conduction seat is provided with a groove for embedding the evaporation section of the plurality of heat pipes, and the heat dissipation fin set is provided for the condensation section of the plurality of heat pipes The perforations are easy to position and assemble.

In implementation, the plurality of grooves are arranged in a staggered parallel manner on the thickness of the heat conducting seat, thereby increasing the number of the heat conducting blocks available for the plurality of heat pipes and improving the heat dissipation speed.

During implementation, the plurality of perforations are staggered on the heat dissipation fin group, so that the condensation section of the heat pipe is evenly distributed on the heat dissipation fin group, thereby reducing the wind field resistance during heat exchange and speeding up the heat dissipation.

In implementation, a fan is further disposed on a side of the heat dissipation fin group to accelerate heat dissipation.

Compared with the prior art, the two cryogenic wafers of the present invention can operate simultaneously or select one of them to generate different cooling rates for the cavity, and the waste heat generated when any one or two pieces of the cooled wafer are operated, Through the same piece of heat conduction seat, it can be effectively radiated to the heat pipe and the heat dissipation fin group, which can not only reduce the temperature of the fluid in combination with the ambient temperature, but also save operating power and assembly cost, and prolong the service life.

In the following, according to the technical means of the creation, the implementation method suitable for the creation is listed, and the description is as follows:

100‧‧‧Water storage device

101‧‧‧Outlet

102‧‧‧ water inlet

200‧‧‧ fluid cooling module

10A, 10B‧‧‧ Cooling wafer

11A, 11B‧‧‧Chill noodles

12A, 12B‧‧‧Face

20A, 20B‧‧‧ cavity

21A, 21B‧‧ ‧ water inlet

22A, 22B‧‧ ‧ water outlet

23‧‧‧Connected pipe

30‧‧‧heating seat

31‧‧‧ trench

40‧‧‧heat pipe

41‧‧‧Evaporation section

42‧‧‧Condensation section

50‧‧‧Fixing fin set

51‧‧‧Perforation

60‧‧‧fan

The first picture: the system diagram of this creation.

The second picture: a schematic diagram of the structure of the creation.

The third picture: the three-dimensional appearance of the creation.

The fourth picture: the exploded view of the creation.

Figure 5: The look-up of the creation.

As shown in the first and second figures, the fluid cooling module of the present invention is suitable for use in a small water storage device 100 such as an aquarium or a water dispenser, the water storage device 100 having an outlet pipe 101 and an inlet pipe 102, and the creation The fluid cooling module 200 is disposed between the water outlet pipe 101 of the water storage device 100 and the water inlet pipe 102. When the water storage in the water storage device 100 flows through the water outlet pipe 101 through the fluid cooling module 200 of the present invention, The water pipe 102 is returned to the water storage device 100, and can be cooled by the fluid cooling module 200 of the present invention to achieve the purpose of circulating cooling. Of course, the flow of the water flow of the water storage device 100 can be operated by a general commercial product such as a pump. This is a general technique and will not be described here.

The cooling module of the present invention is mainly composed of two refrigerating wafers 10A, 10B, two cavities 20A, 20B, and a heat conducting seat 30, wherein: the two refrigerating wafers 10A, 10B are disposed back to back, and The two-cold wafers 10A, 10B respectively have an outwardly facing cooling surface 11A, 11B and an inwardly facing heat generating surface 12A, 12B; in the illustration, the two cooled wafers 10A, 10B are arranged in a vertical direction Moreover, the left and right sides are arranged in parallel, and in actual implementation, they can also be arranged horizontally and vertically in parallel depending on space requirements.

The two cavities 20A, 20B are disposed adjacent to the cooling surfaces 11A, 11B of the two-cold wafers 10A, 10B facing outward, and the two cavities 20A, 20B are respectively provided with a water inlet 21A, 21B and a water outlet 22A. 22B, wherein the water inlet 21A of one cavity 20A communicates with the water outlet pipe 101 of the water storage device 100, and the water outlet 22A communicates with the water inlet 21B of the other cavity 20B through a communication pipe 23, and the other cavity The water outlet 22B of the body 20B communicates with the water inlet pipe 102 of the water storage device 100 described above. The fluid in the water storage device 100 can be sequentially introduced from the water outlet pipe 101 through the water inlet 21A of one of the cavities 20A, and discharged from the water outlet 22A of the cavity 20A, and then flows through the communication pipe 23 to the other. After the water inlet 21B of the cavity 20B flows through the cavity 20B, the water outlet 22B of the cavity 20B is returned to the water storage device 100 through the inlet pipe 102 to achieve a water circulation.

During the circulation of the above fluid, since the two cavities 20A, 20B are respectively pressed against the cooling of the two refrigerating wafers 10A, 10B toward the outside, The faces 11A, 11B, so that when either of the two cooled wafers 10A, 10B is operated, or both are operated simultaneously, the fluid passing through the two cavities 20A, 20B can receive the cooling of the cooled wafer.

Based on the arrangement design of the above-mentioned two-cold wafers 10A, 10B and the two cavities 20A, 20B, in the implementation of the present invention, the two refrigerating wafers 10A, 10B can be of different powers, and can operate simultaneously or select one of them to operate. The demand produces different cooling rates for the two chambers 20A, 20B and the fluid to achieve a selective multi-stage cooling. For example, in the summer, the user can let the two cryogenic wafers 10A, 10B operate at the same time to speed up the cooling rate of the fluid; if in spring and autumn, only one of the cooled wafers can be operated to slow down the cooling rate of the fluid, effectively Selecting multi-stage cooling with ambient temperature saves operating power. In addition, the above-mentioned method of selecting multiple stages of temperature reduction can be automatically operated by using a temperature sensor, a processor, and an electronic control module. This is a conventional technique and will not be further described herein.

The aforementioned heat conducting seat 30 is mainly for eliminating the waste heat generated when the two cooling chips 10A, 10B operate. As described above, the two refrigerating wafers 10A, 10B are disposed back to back, and the heat generating faces 12A, 12B of the two refrigerating wafers 10A, 10B are respectively directed toward the inner side, and therefore, the heat conducting seat 30 is disposed on the two refrigerating wafer 10A. Between the heat generating faces 12A and 12B of the 10B, and the two heat generating faces 12A and 12B are respectively abutted on the front and back sides of the heat conducting seat 30, so that the two cooling chips 10A and 10B can share the same heat conducting seat 30. The heat is dissipated, and waste heat can be conducted to the heat conducting seat 30 regardless of whether any of the two cooled wafers 10A, 10B is operated or both are operated at the same time.

Similarly, the heat conducting seat 30 can be disposed in a horizontal or vertical direction with the two-cold wafers 10A, 10B, as an example in the vertical direction. In addition, a plurality of heat pipes 40 are further disposed on the thickness of the heat conducting seat 30, and the waste heat can be conducted to a heat sink fin set 50 for heat dissipation. Therefore, when the fluid sequentially passes through the two cavities 20A, 20B, any of the cold surfaces 11A, 11B of the uniform cold wafers 10A, 10B can cool down the fluid, and the waste heat generated when the cold wafer 10 is operated uniformly All of them can be quickly conducted to the heat dissipation fin group 50 through the same heat conducting seat 30 and the heat pipe 40, and then radiated by heat exchange between the heat dissipation fin group 50 and the air.

As shown in the third to fifth figures, the thickness of the heat conducting base 30 is provided with a groove 31 for the plurality of heat pipes 40 to be embedded, and the plurality of grooves 31 are arranged in a staggered parallel manner to increase the heat pipe 40 on the heat conducting seat 30. The number of settings. Each heat pipe 40 has an evaporation section 41 and a condensation section 42, respectively, and the evaporation section 41 is embedded in the corresponding groove 31 of the heat conducting seat 30 to be in contact with the inner wall surface to conduct waste heat generated by any of the uniformly cooled wafers 10A, 10B. The increase in the number of heat pipes 40 can increase the heat transfer rate.

Moreover, the heat dissipation fin group 50 is provided with a through hole 51 for the condensation section 42 of the plurality of heat pipes 40, and the plurality of holes 51 are also staggered on the heat dissipation fin group 50, so that the condensation section 42 of the plurality of heat pipes 40 is on the heat dissipation fins. The average distribution on the group 50 reduces the wind field resistance during heat exchange and accelerates the heat dissipation rate. Therefore, the waste heat generated by the uniform cold wafers 10A, 10B can be sequentially conducted to the heat dissipation fin set 50 through the same set of heat conducting blocks 30 and the plurality of heat pipes 40, and then the heat radiating fin group 50 is heat exchanged with the air. Dissipate heat. In implementation, a fan 60 may be further disposed on the side of the heat dissipation fin set 50 to increase the heat exchange speed of the heat dissipation fin set 50 with the air, thereby accelerating heat dissipation.

It is worth mentioning that since the front and back sides of the heat conducting seat 30 can conduct waste heat to the evaporation section 41 of the heat pipe 40 and quickly conduct to the condensation section 42 of the heat pipe 40, the heat pipe 40 conducts waste heat regardless of the two-cold wafer. When 10A and 10B are operated at the same time, or one of them operates, the conduction efficiency of the heat pipe 40 is not affected, so that the working efficiency of the two-cold wafers 10A and 10B can be effectively improved, and the cooling function of the creation is further improved.

Compared with the prior art, the present invention utilizes the back-to-back design of the two-cold wafers 10A, 10B, which can not only operate simultaneously or select one of the operations, but also generate different cooling speeds for the two chambers 20A, 20B, and any one of them The waste heat generated by the operation of the cold wafers 10A, 10B can be effectively dissipated through the same set of heat conducting blocks 30, heat pipes 40 and heat sink fins 50 without interfering with each other, and can selectively perform multiple selective cooling of the fluids in accordance with the ambient temperature. It also has the effect of saving operating power and assembly costs, as well as extending the service life.

The above description of the embodiments and the drawings are merely illustrative of the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention; The approximation or similarity of creation, installation, characteristics, etc. shall be within the creation purpose of the creation and the scope of patent application.

101‧‧‧Outlet

102‧‧‧ water inlet

200‧‧‧ fluid cooling module

10A, 10B‧‧‧ Cooling wafer

11A, 11B‧‧‧Chill noodles

12A, 12B‧‧‧Face

20A, 20B‧‧‧ cavity

21A, 21B‧‧ ‧ water inlet

22A, 22B‧‧ ‧ water outlet

23‧‧‧Connected pipe

30‧‧‧heating seat

40‧‧‧heat pipe

50‧‧‧Fixing fin set

60‧‧‧fan

Claims (6)

A fluid cooling module comprising: two sheets of refrigerated wafers disposed opposite to back, the two refrigerating wafers respectively having a cooling surface facing outward and an inwardly facing heating surface; and a cavity for fluid circulation The two cavities respectively abut the cooling surface outside the two refrigerating wafers, so that the fluid flowing through the two cavities can respectively receive the cooling of the outer cooling surface of the two refrigerating wafers; and one of the two refrigerating wafers a heat conducting seat, the inner heating surface of the two refrigerating wafers respectively abut against the front and back sides of the heat conducting seat, and the heat conducting seat is provided with a plurality of heat pipes to conduct waste heat to a heat dissipating fin set for heat dissipation; Thereby, the two refrigerating wafers can simultaneously or select one of the operations to selectively select a plurality of stages of cooling of the fluid in accordance with the ambient temperature, and the waste heat generated when any one or two of the refrigerating wafers are operated can share the same heat dissipating block for effective heat dissipation. . The fluid cooling module of claim 1, wherein the two chambers are respectively provided with a water inlet and a water outlet, wherein a water inlet of a cavity is connected with an outlet pipe of a water storage device, the cavity The water outlet of the body is connected to the water inlet of the other cavity through a connecting pipe, and the water outlet of the other cavity is returned to the water storage device through a water supply pipe of the inlet pipe. The fluid cooling module of claim 1, wherein the plurality of heat pipes respectively have an evaporation section and a condensation section, and the heat conduction seat is provided with a groove for embedding the plurality of heat pipe evaporation sections, the heat dissipation. The fin set is provided with perforations for the condensation section of the plurality of heat pipes. The fluid cooling module of claim 3, wherein the plurality of grooves are staggered in parallel across the thickness of the heat conducting seat. The fluid cooling module of claim 3, wherein the plurality of perforations are staggered on the heat dissipating fin set. A fluid cooling mold according to any one of claims 1 to 5 The group, wherein the side of the heat dissipation fin group is further provided with a fan for accelerating heat dissipation.