JP7398428B2 - heat dissipation system - Google Patents

Description

The present disclosure relates to a heat dissipation system that uses a change between two phases of a cooling fluid for heat dissipation.

In general, a conventional liquid immersion heat dissipation system for a server basically consists of an immersion tank body, an intermediate heat exchanger, a circulating water pump and an environment cooling device. The server host is directly immersed in the insulated working fluid. The heat generated by the chips on the motherboard is conducted to the working fluid, then the heat received by the working fluid is transferred to the external water cooling device through the cooling distribution unit and pump, and then the heat is transferred to the external water cooling device. Dissipated into the environment by equipment.

However, the conventional immersion heat dissipation system needs to include a cooling distribution unit and a pump, which increases the power consumption of the entire system and makes the overall system structure more complex.

The present disclosure provides a heat dissipation system that can reduce total power usage and has a simplified structure.

One embodiment of the present disclosure provides a heat dissipation system configured to cool at least one heat source. The heat dissipation system includes an immersion tank and a radiator. The dipping tank has an airtight space. A part of the airtight space is configured to store a cooling fluid, and the airtight space is divided into a liquid storage part and a liquid-gas coexistence part. The liquid reservoir is configured to store a cooling fluid and at least one heat source, and the liquid-vapor coexistence portion is configured to be located above a free surface of the cooling fluid. The radiator includes at least one communication chamber, at least one piping, a plurality of internal fins, and a plurality of external fins. The at least one piping is connected to the at least one transmission chamber, and the at least one transmission chamber and the at least one piping together form a circulation channel. A portion of the at least one piping is located in the liquid-gas coexistence section, and another portion of the at least one piping is located outside the airtight space. The plurality of internal fins are located in the liquid-gas coexistence section and are thermally coupled to at least one pipe, and the plurality of external fins are located outside the airtight space and are thermally coupled to at least one pipe. Furthermore, the pipe diameter of the at least one transfer chamber is larger than the pipe diameter of the at least one pipe.

According to the heat dissipation system as described above, a part of the radiator having a transfer chamber is provided inside the immersion tank, and another part of the radiator is provided outside the immersion tank, thereby providing a cooling distribution section and a pump in the heat dissipation system. There will be no need. Therefore, power consumption can be reduced and the structure of the device can be simplified. Furthermore, the power usage effectiveness of the heat dissipation system has been optimized from 1.3 to less than 1.1, significantly increasing the heat transfer capacity per unit volume by 40%, reducing the size and manufacturing cost of the heat dissipation system. .

In addition, the radiator will still function even when placed horizontally, since the pipe diameter of the transfer chamber is larger than that of the pipe, and the heat causes a change in temperature. That is, even if the radiator is placed in a minus 90 degree position (i.e., the heat absorbing side is located above the heat dissipating side), the radiator will still operate, thereby having a wider range of applications.

The present disclosure will be more fully understood from the detailed description and accompanying drawings provided below, which are given by way of example only and therefore not as a limitation on the present disclosure.

1 is a schematic diagram of a heat dissipation system and heat source according to a first embodiment of the present disclosure; FIG. FIG. 2 is a perspective view of a radiator of the heat dissipation system of FIG. 1; FIG. 2 is a schematic diagram of a heat dissipation system and heat source according to a second embodiment of the present disclosure. FIG. 4 is a perspective view of a radiator of the heat dissipation system of FIG. 3; FIG. 3 is a schematic diagram of a heat dissipation system and heat source according to a third embodiment of the present disclosure.

Please refer to FIGS. 1 and 2. FIG. 1 is a schematic diagram of a heat dissipation system 10 and a heat source according to a first embodiment of the present disclosure. FIG. 2 is a perspective view of the radiator 200 of the heat dissipation system 10 of FIG.

In this embodiment, the heat dissipation system 10 is, for example, an immersion heat dissipation system configured to cool at least one heat source. For example, there is a cooling fluid L1 stored in the heat dissipation system 10. The cooling fluid L1 is electrically insulated, the heat source is immersed in the cooling fluid L1, and the heat source can be cooled by two-phase cooling circulation of the cooling fluid L1. . In this embodiment, the heat source is, for example, a server, but is not limited thereto.

Heat dissipation system 10 includes an immersion tank 100 and a radiator 200. Immersion tank 100 includes a bottom plate 110, a plurality of side plates 120, 130, and a top plate 140. The bottom plate 110, the side plates 120, 130, and the top plate 140 are connected to each other and surround an airtight space S, and a part of the airtight space S is divided into a liquid storage section S1 and a liquid-air coexistence section S2 for cooling. It is configured to store fluid L1. Further, the liquid storage section S1 is configured to store the cooling fluid L1 and a heat source, and the liquid-vapor coexistence section S2 is configured to be located above the free surface X of the cooling fluid L1.

Radiator 200 includes a transmission chamber 210, a plurality of piping 220, a plurality of internal fins 230, and a plurality of external fins 240.

Piping 220 is connected to transmission chamber 210 such that transmission chamber 210 and piping 220 together form a plurality of circulation channels. The circulation channel is at least partially filled with cooling fluid (not shown). Note that the direction of circulation of the cooling fluid may be clockwise or counterclockwise, and is shown by arrows A and B in this embodiment, but is not limited thereto. Furthermore, the cooling fluid in the circulation channel is different from the cooling fluid L1 in the airtight space S, for example.

In one aspect, each of the pipes 220 includes a heat absorption section 221 and a heat radiation section 222 that are connected to each other. The heat absorbing part 221 of the pipe 220 is located within the liquid-gas coexistence part S2, and the heat radiating part 222 of the pipe 220 is located outside the airtight space S. The heat absorption part 221 of the pipe 220 is configured to absorb the heat of the cooling fluid L1 in the liquid-vapor coexistence part S2, and the heat absorbed by the heat absorption part 221 is transferred through the pipe 220 and the cooling fluid inside it. The heat is transmitted to the heat radiation section 222 of the piping 220. The heat radiating section 222 of the pipe 220 radiates heat to the environment outside the immersion tank 100.

In one aspect, the pipe diameter D1 of the transfer chamber 210 is larger than the pipe diameter D2 of each of the pipes 220. The transmission chamber 210 is, for example, cylindrical. The pipe diameter D1 of the transfer chamber 210 is larger than the pipe diameter D2 of each of the pipes 220, and as heat causes a change in temperature, there will be a pressure difference generated between the transfer chamber 210 and the pipes 220. Therefore, the radiator 200 can not only be arranged vertically, but also horizontally (as shown in FIG. 1) to accommodate a variety of applications. Note that the radiator 200 being "arranged vertically" means that the extending direction of the piping is substantially parallel to the direction of gravity G, and it does not mean that one element is "substantially parallel" to another element. Being parallel refers to one element being parallel or nearly parallel to another element. When the radiator 200 is "horizontally arranged", it means that the direction of extension E of the piping 220 is substantially perpendicular to the direction of gravity G, and one element is "substantially perpendicular" to another element. means that one element is perpendicular or nearly perpendicular to another element. Note that in this embodiment, the radiator 200 is arranged vertically or horizontally, but this is merely an example, and the present disclosure is not limited thereto. Radiator 200 may be placed in any angular position.

The internal fins 230 are located in the liquid-vapor coexistence section S2, and are thermally coupled to the heat absorption section 221 of the piping 220 to increase the heat exchange area of the radiator 200 in the heat absorption section 221, thereby increasing the heat absorption efficiency of the radiator 200. It's increasing. The external fins 240 are located outside S of the airtight space and are thermally coupled to the heat radiation section 222 of the piping 220 so as to increase the heat exchange area of the radiator 200 in the heat radiation section 222, thereby increasing the heat radiation efficiency of the radiator 200. is increasing.

In one embodiment, both the heat absorption part 221 and the heat radiation part 222 of the radiator 200 can be arranged horizontally, so that the internal fins 230 arranged in the heat absorption part 221 are substantially parallel to the direction of gravity G. In other words, the normal direction N of the internal fins 230 is substantially perpendicular to the gravity direction G, and the gap between two adjacent internal fins 230 extends in the gravity direction G. As a result, the steam L2 in the liquid-vapor coexistence part S2 can flow into the gap between two adjacent internal fins 230 along the gravity direction G, so that the steam L2 in the liquid-vapor coexistence part S2 and the heat absorption part 221 of the radiator 200 It is possible to increase the heat exchange efficiency with. Although in this embodiment the internal fins 230 are substantially parallel to the gravity direction G, this is merely an example and the present disclosure is not limited thereto. The internal fins 230 only need to be able to output the steam L2 after it flows inside and absorbs heat, and can be arranged at any angular position.

In one aspect, the spacing G1 between two adjacent internal fins 230 is equal to the spacing G1 between two adjacent external fins 240, although the present disclosure is not limited thereto. In other embodiments, the spacing between any two adjacent interior fins can be greater than the spacing between any two adjacent exterior fins, such that steam more easily fills the gaps between the interior fins. can flow.

In one embodiment, the number of piping 220 is plural, but the present disclosure is not limited thereto. In other embodiments, there may be only one quantity of tubing.

In one aspect, heat dissipation system 10 may further include plate 300. The plate 300 includes, for example, a first slope portion 310, a second slope portion 320, and a third slope portion 330. The second inclined part 320 is connected between the first inclined part 310 and the third inclined part 330, and the first inclined part 310 and the third inclined part 330 are more inclined than the second inclined part 320. Plate 300 is located within liquid-vapor coexistence region S2, and plate 300 is positioned adjacent internal fin 230 to receive droplets.

Specifically, the first inclined portion 310 of the plate 300 is arranged adjacent to the internal fin 230 so as to divide the liquid/gas coexistence region S2 into a high temperature region where the radiator 200 is not located and a low temperature region where the radiator 200 is located. has been done. Further, an inlet O1 is provided between the first inclined portion 310 of the plate 300 and the top plate 140, and the high temperature region is in fluid communication with the low temperature region via the inlet O1. The second sloped part 320 and the third sloped part 330 of the plate 300 are located on one side of the internal fin 230 in a position close to the liquid storage part S1, and are located between the third sloped part 330 of the plate 300 and the side plate 120. An outlet O2 is provided. The cold region communicates with the liquid storage S1 via the outlet O2. When the heat source operates, the heat generated from the heat source can evaporate the cooling fluid L1 into high-temperature vapor L2, and the high-temperature vapor L2 rises in the F1 direction from the liquid storage section S1 toward the liquid-vapor coexistence section S2. do. After flowing into the inlet O1 along the direction F2, the high temperature steam L2 is cooled by the heat absorption part 221 of the radiator 200 and condensed into low temperature condensed droplets L3. Then, after the condensed droplet L3 falls on the plate 300 in the direction F3, it either returns to the liquid reservoir S1 along the plate 300 or flows directly to the liquid reservoir S1 through the outlet O2. Furthermore, the second sloped part 320 and the third sloped part 330 of the plate 300 function as drainage slopes, and the condensed droplets L3 flow back to the liquid storage part S1 along the second sloped part 320 and the third sloped part 330. do. The cold condensed droplets then flow in direction F4 towards the heat source to be cooled. According to the above circulation flow path, natural convection is formed due to the temperature change of the cooling fluid L1 in the airtight space S, and the heat radiation performance of the heat radiation system 10 can be improved.

In one embodiment, the plate 300 consists of three sloped sections, although the present disclosure is not so limited. In other embodiments, the plate can be formed in various configurations, such as a single sloped plate or an arcuate plate.

In one aspect, the cooling fluid L1 in the airtight space S performs cooling circulation by natural convection, but the present disclosure is not limited thereto. In other embodiments, the heat dissipation system may further include a fluid driver, such as a fan or pump, to drive and move cooling fluid within the airtight space. As a result, the cooling fluid in the airtight space can be circulated for cooling by forced convection.

In one embodiment, the heat radiation system 10 may further include an airflow generating device 400 located outside the airtight space S and disposed on the heat radiation part 222 of the piping 220, for example. The airflow generation device 400 is, for example, an axial fan, and when the airflow generation device 400 operates, the airflow generation device 400 releases the heat of the heat radiation section 222 of the piping 220 to the outside together with the external fins 240. As a result, the external airflow generated by the airflow generation device 400 can improve the heat radiation efficiency of the piping 220 and the heat radiation part 222 of the external fin 240.

In one embodiment, the diameters of the piping 220 are the same, but the present disclosure is not limited thereto. In other embodiments, at least two diameters of the tubing may be different from each other.

See FIGS. 3 and 4. FIG. 3 is a schematic diagram of a heat dissipation system 10A and a heat source according to a second disclosed embodiment. FIG. 4 is a perspective view of the radiator 200A of the heat dissipation system 10A of FIG. 3.

In this embodiment, the heat dissipation system 10A includes an immersion tank 100A and a radiator 200A. The immersion tank 100A includes a bottom plate 110A, a plurality of side plates 120A and 130A, and a top plate 140A. The bottom plate 110A, the side plates 120A, 130A, and the top plate 140A are connected to each other and surround an airtight space S. A part of the airtight space S is configured to store the cooling fluid L1, and the airtight space S is configured to store the cooling fluid L1. It is divided into a storage section S1 and a liquid/vapor coexistence section S2. Further, the liquid storage section S1 is configured to store the cooling fluid L1 and a heat source, and the liquid-vapor coexistence section S2 is configured to be located above the free surface X of the cooling fluid L1.

The radiator 200A includes a first transmission chamber 211A, a second transmission chamber 213A, a third transmission chamber 215A, a fourth transmission chamber 217A, a first pipe 212A, a plurality of second pipes 214A, and a third pipe. 216A, a plurality of fourth pipes 218A, a plurality of internal fins 230A, and a plurality of external fins 240A. The first pipe 212A is connected to the first transmission chamber 211A and the second transmission chamber 213A. The number of second pipes 214A is, for example, three, and the second pipes 214A are connected to the second transmission chamber 213A and the third transmission chamber 215A. The third pipe 216A is connected to the third transmission chamber 215A and the fourth transmission chamber 217A. The number of the fourth piping 218A is, for example, three, and the fourth piping 218A is connected to the fourth transmission chamber 217A and the first transmission chamber 211A. The transmission chamber and the piping thus together form a circulation flow path. The circulation channel is at least partially filled with cooling fluid (not shown). The circulation direction of the cooling fluid may be clockwise or counterclockwise, and in this embodiment, the cooling fluid circulates in, for example, directions A, B, C, and D, but the present disclosure is limited thereto. Not done. Furthermore, the cooling fluid in the circulation channel is different from the cooling fluid L1 in the airtight space S, for example.

In this embodiment, the number of second pipes 214A is three, and the number of fourth pipes 218A is three, but the present disclosure is not limited thereto. In other embodiments, the quantity of each of the second pipe and the fourth pipe may be one, two, or more than two.

In one embodiment, the first transmission chamber 211A, the fourth transmission chamber 217A, a portion of the first piping 212A, a portion of the third piping 216A, and the fourth piping 218A are located in the liquid-gas coexistence section S2. ing. The second transmission chamber 213A, the third transmission chamber 215A, the second piping 214A, other parts of the first piping 212A, and other parts of the third piping 216A are located outside the airtight space S. One side of the radiator 200A located in the liquid-vapor coexistence section S2 is the endothermic side. The other side of the radiator 200A located outside the airtight space S is a heat radiation side. Further, the endothermic side is configured to absorb the heat of the cooling fluid L1 in the liquid-vapor coexistence section S2, and the heat absorbed on the endothermic side is transferred to the heat radiation side by the piping and the cooling fluid in the piping. Ru. The heat radiation side radiates heat to the environment outside the immersion tank 100A.

In one aspect, the pipe diameter of the first pipe 212A for guiding air is equal to the pipe diameter of the third pipe 216A for guiding liquid, but the present disclosure is not limited thereto. In other embodiments, the diameter of the first pipe for guiding air is larger than the diameter of the third pipe for guiding liquid, so as to improve the smoothness of cooling circulation. Good too.

In one aspect, the piping diameter D1 of each transfer chamber is greater than the piping diameter D2 of the respective piping. For example, the pipe diameter D1 of each of the transfer chambers 211A, 213A, 215A, and 217A is larger than the pipe diameter D2 of each of the pipes 212A, 214A, 216A, and 218A. 217A and the pipes 212A, 214A, 216A, and 218A. Therefore, the endothermic side of the radiator 200A can be arranged not only vertically, but also horizontally (as shown in Figure 3). ), it can be used for a wider range of applications. When the heat absorption surface of the radiator 200A is "arranged vertically", it means that the extending direction of the piping is substantially parallel to the direction of gravity G, and one element is "substantially parallel to another". '' means that one element is parallel or nearly parallel to another element. The heat absorption surface of the radiator is "horizontally arranged" means that the direction of extension of the piping is substantially perpendicular to the direction of gravity G, and one element is "substantially perpendicular" to another element. is refers to one element being perpendicular or nearly perpendicular to another element. Note that in this embodiment, the heat absorption side of the radiator is arranged vertically or horizontally, which is merely an example, and the present disclosure is not limited thereto. Radiator 200A can be placed at any angular position.

The internal fins 230A are located in the liquid-vapor coexistence section S2, and are thermally coupled to the heat absorption side so as to increase the heat exchange area of the radiator 200A on the heat absorption side, thereby increasing the heat absorption efficiency of the radiator 200A. . Further, the external fins 240A are located outside the airtight space S, and are thermally coupled to the heat radiation side so as to increase the heat exchange area of the radiator 200A on the heat radiation side, thereby increasing the heat radiation efficiency of the radiator 200A.

In one aspect, the first transfer chamber 211A, the fourth pipe 218A, and the fourth transfer chamber 217A can be arranged horizontally on the heat absorption side of the radiator 200A, so that the internal fins 230A arranged on the heat absorption side are oriented in the direction of gravity. It is approximately parallel to G. In other words, the normal direction of the internal fins 230A is substantially perpendicular to the gravity direction G, and the gap between two adjacent internal fins 230A extends in the gravity direction G. As a result, the steam L2 in the liquid-vapor coexistence section S2 can flow into the gap between the two adjacent internal fins 230A along the gravity direction G, so that the steam L2 in the liquid-vapor coexistence section S2 and the heat absorption side of the radiator 200A heat exchange efficiency can be increased. Although the internal fins 230A are substantially parallel to the gravity direction G in this embodiment, this is merely an example and the present disclosure is not limited thereto. The internal fins 230A only need to be able to output the steam L2 after it flows inside and absorbs heat, and can be arranged at any angular position.

In one aspect, the spacing between two adjacent internal fins 230A is equal to the spacing between two adjacent external fins 240A, although the present disclosure is not limited thereto. In other embodiments, the spacing between any two adjacent interior fins can be greater than the spacing between any two adjacent exterior fins, such that steam more easily fills the gaps between the interior fins. can flow.

In one aspect, the heat dissipation system 10A may further include a plate 300A. The plate 300A includes, for example, a first slope portion 310A, a second slope portion 320A, and a third slope portion 330A. The second inclined part 320A is connected between the first inclined part 310A and the third inclined part 330A, and the first inclined part 310A and the third inclined part 330A are inclined more than the second inclined part 320A. There is. Plate 300A is located within liquid-vapor coexistence region S2, and plate 300A is positioned adjacent internal fin 230A to receive droplets.

Specifically, the first inclined portion 310A of the plate 300A is arranged adjacent to the internal fin 230A so as to divide the liquid/gas coexistence portion S2 into a high temperature region where the radiator 200A is not located and a low temperature region where the radiator 200A is located. has been done. Further, an inlet O1 is provided between the first inclined portion 310A of the plate 300A and the top plate 140A, and the high temperature region is in fluid communication with the low temperature region via the inlet O1. The second sloped portion 320A and the third sloped portion 330A of the plate 300A are located on one side of the internal fin 230A located close to the liquid storage portion S1, and there is an outlet between the third sloped portion 330A of the plate 300A and the side plate 120A. O2 is provided. The cold region communicates with the liquid storage S1 via the outlet O2. When the heat source operates, the heat generated from the heat source can evaporate the cooling fluid L1 into high-temperature vapor L2, and the high-temperature vapor L2 rises in the F1 direction from the liquid storage section S1 toward the liquid-vapor coexistence section S2. do. The high-temperature steam L2 then flows toward the inlet O1 along the direction F2, and is then cooled on the endothermic side of the radiator 200A and condensed into low-temperature condensed droplets L3. Then, the condensed droplet L3 falls on the plate 300A in the direction F3, and then either returns to the liquid reservoir S1 along the plate 300A or flows directly to the liquid reservoir S1 through the outlet O2. Further, the second slope 320A and the third slope 330A of the plate 300A function as drainage slopes, and the condensed droplets L3 flow back to the liquid reservoir S1 along the second slope 320A and the third slope 330A. do. The cold condensed droplets then flow in direction F4 towards the heat source to be cooled. According to the above circulation flow path, natural convection is formed due to the temperature change of the cooling fluid L1 in the airtight space S, and the heat radiation performance of the heat radiation system 10A can be improved.

In one embodiment, the plate 300A is comprised of three sloped sections, although the present disclosure is not so limited. In other embodiments, the plate can be formed in various configurations, such as a single sloped plate or an arcuate plate.

In one embodiment, the cooling fluid L1 in the airtight space S performs cooling circulation by natural convection, but the present disclosure is not limited thereto. In other embodiments, the heat dissipation system may further include a fluid driver, such as a fan or pump, to drive and move cooling fluid within the airtight space. As a result, the cooling fluid in the airtight space can be circulated for cooling by forced convection.

In one embodiment, the heat radiation system 10A may further include, for example, an airflow generation device 400A located outside the airtight space S and disposed on the heat radiation side. The airflow generation device 400A is, for example, an axial fan, and when the airflow generation device 400A operates, the airflow generation device 400A releases heat to the outside together with the external fins 240A. As a result, the external airflow generated by the airflow generation device 400A can improve the heat radiation efficiency of the heat radiation side and the external fins 240A.

Please refer to FIG. 5. FIG. 5 is a schematic diagram of a heat dissipation system 10B and a heat source according to a third disclosed embodiment.

In this embodiment, the heat dissipation system 10B includes an immersion tank 100B and a radiator 200B. The immersion tank 100B includes a bottom plate 110B, a plurality of side plates 120B and 130B, and a top plate 140B. The bottom plate 110B, the side plates 120B, 130B, and the top plate 140B are connected to each other and surround an airtight space S, and a part of the airtight space S is configured to store the cooling fluid L1, and a part of the airtight space S is configured to store the cooling fluid L1. It is divided into a liquid-vapor coexistence section S2. Further, the liquid storage section S1 is configured to store the cooling fluid L1 and a heat source, and the liquid-vapor coexistence section S2 is configured to be located above the free surface X of the cooling fluid L1.

Radiator 200B has a transmission chamber 210B, a plurality of first pipes 220B, a plurality of second pipes 230B, a plurality of internal fins 240B, and a plurality of external fins 250B. The first pipe 220B is located in the liquid/gas coexistence region S2 and is connected to the transfer chamber 210B, such that the first pipe 220B and the transfer chamber 210B are both at least partially filled with a cooling fluid (not shown). Form a filled circulation channel. The direction of circulation of the cooling fluid may be clockwise or counterclockwise; for example, in this embodiment, the cooling fluid circulates in direction A and direction B, but the present disclosure is not limited thereto. A portion of the second pipe 230B is located within the liquid-gas coexistence section S2. The other part of the second piping 230B is located outside the airtight space S, the second piping 230B is connected to the transmission chamber 210B, and the second piping 230B and the transmission chamber 210B are at least partially connected to each other. Another circulation channel is formed which is filled with cooling fluid (not shown). The direction of circulation of the cooling fluid may be clockwise or counterclockwise; in this embodiment, the cooling fluid circulates in directions C and D, for example, but the present disclosure is not limited thereto. Furthermore, the cooling fluid in the circulation channel is different from the cooling fluid L1 in the airtight space S, for example.

In one embodiment, the first pipe 220B of the radiator 200B located in the liquid-gas coexistence section S2 is on the endothermic side. Further, the second pipe 230B of the radiator 200B located outside the airtight space S is on the heat radiation side. In addition, the endothermic side is configured to absorb the heat of the cooling fluid L1 in the liquid-vapor coexistence section S2, and the heat absorbed on the endothermic side is transferred to the heat radiating side by the piping in the piping and the cooling fluid L1. be done. The heat radiation side radiates heat to the environment outside the immersion tank 100B.

In one embodiment, the pipe diameter D1 of the transfer chamber 210B is larger than the pipe diameter D2 of the pipe. For example, since the pipe diameter D1 of the transfer chamber 210B is larger than the pipe diameter D2 of each of the pipes 220B and 230B, a pressure difference is created between the transfer chamber 210B and the pipes 220B and 230B, which causes the One pipe 220B can be arranged not only vertically but also horizontally (as shown in FIG. 5), and can be used for a wider range of applications. The first pipe 220B of the radiator 200B is "arranged vertically" means that the extending direction of the first pipe is substantially parallel to the direction of gravity G, and one element is connected to another element. "Substantially parallel" refers to one element being parallel or nearly parallel to another element. The expression that the first pipe 220B of the radiator 200B is "horizontally arranged" means that the extending direction E1 of the first pipe 220B is substantially perpendicular to the direction of gravity G, and a certain element is "Substantially perpendicular" to elements of refers to one element being perpendicular or nearly perpendicular to another element. In this embodiment, the first pipe 220B of the radiator 200B is placed vertically or horizontally, but this is merely an example and is not limited thereto. Radiator 200B can be placed at any angular position.

The internal fins 240B are located in the liquid-gas coexistence part S2, and are thermally coupled to the first pipe 220B to increase the heat exchange area of the radiator 200B on the heat absorption side, thereby increasing the heat absorption efficiency of the radiator 200B. There is. Further, the external fins 250B are located outside the airtight space S, and are thermally coupled to the heat radiation side so as to increase the heat exchange area of the radiator 200B on the heat radiation side, thereby increasing the heat radiation efficiency of the radiator 200B.

In one embodiment, the endothermic side of the radiator 200B can be arranged horizontally, so that the internal fins 240B arranged on the endothermic side are substantially parallel to the gravity direction G. In other words, the normal direction of the internal fins 240B is substantially perpendicular to the gravity direction G, and the gap between two adjacent internal fins 240B extends in the gravity direction G. As a result, the steam L2 in the liquid-vapor coexistence section S2 can flow into the gap between the two adjacent internal fins 240B along the gravity direction G, so that the steam L2 in the liquid-vapor coexistence section S2 and the heat absorption side of the radiator 200B heat exchange efficiency can be increased. Although in this embodiment the internal fins 240B are substantially parallel to the gravity direction G, this is merely an example and the present disclosure is not limited thereto. The internal fins 240B only need to be able to output the steam L2 after it flows inside and absorbs heat, and can be arranged at any angular position.

In one aspect, the spacing G1 between two adjacent internal fins 240B is greater than the spacing G2 between two adjacent external fins 250B, although the present disclosure is not limited thereto. In other embodiments, the spacing between any two adjacent interior fins can be equal to the spacing between any two adjacent exterior fins, such that steam flows more easily through the gaps between the interior fins. be able to.

In one aspect, the number of first pipes 220B is plural, and the number of second pipes 230B is plural, but the present disclosure is not limited thereto. In other embodiments, there may be only one quantity of the first piping and there may be only one quantity of the second piping.

In one aspect, the heat dissipation system 10B may further include a plate 300B. The plate 300B includes, for example, a first slope portion 310B, a second slope portion 320B, and a third slope portion 330B. The second slope part 320B is connected between the first slope part 310B and the third slope part 330B, and the first slope part 310B and the third slope part 330B are sloped more than the second slope part 320B. Plate 300B is located within liquid-vapor coexistence region S2, and plate 300B is positioned adjacent internal fin 240B to receive droplets.

Specifically, the first inclined portion 310B of the plate 300B is arranged adjacent to the internal fin 240B so as to divide the liquid-gas coexistence region S2 into a high temperature region where the radiator 200B is not located and a low temperature region where the radiator 200B is located. has been done. Furthermore, an inlet O1 is provided between the first inclined portion 310B of the plate 300B and the top plate 140B, and the high temperature region is in fluid communication with the low temperature region via the inlet O1. The second sloped portion 320B and the third sloped portion 330B of the plate 300B are located on one side of the internal fin 240B located closer to the liquid storage portion S1, and are located between the third sloped portion 330B of the plate 300B and the side plate 120B. An outlet O2 is provided. The cold region communicates with the liquid storage S1 via the outlet O2. When the heat source operates, the heat generated from the heat source can evaporate the cooling fluid L1 into high-temperature vapor L2, and the high-temperature vapor L2 rises in the F1 direction from the liquid storage section S1 toward the liquid-vapor coexistence section S2. do. After flowing into the inlet O1 along the direction F2, the high temperature steam L2 is cooled on the endothermic side of the radiator 200B and condensed into low temperature condensed droplets L3. Then, the condensed droplet L3 falls on the plate 300B in the direction F3, and then either returns to the liquid reservoir S1 along the plate 300B or directly flows to the liquid reservoir S1 through the outlet O2. In addition, the second inclined part 320B and the third inclined part 330B of the plate 300B function as a drainage slope, and the condensed droplets L3 flow back to the liquid storage part S1 along the second inclined part 320B and the third inclined part 330B. can do. The cold condensed droplets then flow in direction F4 towards the heat source to be cooled. According to the above circulation flow path, natural convection is formed due to temperature changes of the cooling fluid L1 in the airtight space S, and the heat radiation performance of the heat radiation system 10B can be improved.

In one aspect, plate 300B consists of three sloped sections, but the present disclosure is not so limited. In other embodiments, the plate can be formed in various configurations, such as a single sloped plate or an arcuate plate.

In one embodiment, the cooling fluid L1 in the airtight space S performs cooling circulation by natural convection, but the present disclosure is not limited thereto. In other embodiments, the heat dissipation system may further include a fluid driver, such as a fan or pump, to drive and move cooling fluid within the airtight space. As a result, the cooling fluid in the airtight space can be circulated for cooling by forced convection.

In one embodiment, the heat radiation system 10B may further include, for example, an airflow generation device 400B located outside the airtight space S and disposed on the heat radiation side. The airflow generation device 400B is, for example, an axial fan, and when the airflow generation device 400B operates, the airflow generation device 400B releases heat to the outside together with the external fins 250B. As a result, the external airflow generated by the airflow generation device 400B can improve the heat radiation efficiency of the heat radiation side and the external fins 250B.

In view of the above description, the present specification proposes that it is necessary to provide a cooling distribution part and a pump in the heat dissipation system by providing a part of the radiator with a transfer chamber inside the immersion tank and another part of the radiator outside the immersion tank. There is no. Therefore, power consumption can be reduced and the structure of the device can be simplified. Furthermore, the power usage effectiveness of the heat dissipation system is optimized from 1.3 to less than 1.1, significantly increasing the heat transfer capacity per unit volume by 40%, reducing the size and manufacturing cost of the heat dissipation system. .

In addition, the pipe diameter of the transfer chamber is larger than that of the pipe, and the heat causes a change in temperature, so the radiator can still function when placed horizontally. That is, even if the radiator is placed in a minus 90 degree position (i.e., the heat absorbing side is located above the heat dissipating side), the radiator will still operate, thereby having a wider range of applications.

Furthermore, since the plate divides the liquid-vapor coexistence area into a high-temperature region and a low-temperature region, the cooling fluid in the airtight space forms natural convection due to fluid temperature changes, improving the heat dissipation performance of the heat dissipation system.

Furthermore, since the heat absorbing and heat dissipating parts of the radiator piping can be placed horizontally during operation, the interior fins placed in the heat absorbing part can be placed approximately parallel to the direction of gravity, allowing the steam in the liquid-vapor coexistence part to be placed approximately parallel to the direction of gravity. can flow into the gap between the interior fins in the direction of gravity, increasing the heat exchange efficiency between the steam in the liquid-vapor coexistence part and the heat-absorbing part of the radiator piping.

Additionally, the spacing between any two adjacent internal fins is greater than the spacing between any two adjacent external fins, so that steam can more easily flow through the gaps between the internal fins.

The embodiments best explain the principles of the present disclosure and its practical applications, so that others skilled in the art may understand the present disclosure and the various embodiments with various modifications suitable for the particular intended use. have been selected and described to enable you to make best use of them. It is intended that the scope of the disclosure be defined by the following claims and their equivalents.

10, 10A, 10B: Heat dissipation system 100, 100A, 100B: Immersion tank 110, 110A, 110B: Bottom plate 120, 130, 120A, 130A, 120B, 130B: Side plate 140, 140A, 140B: Top plate 200, 200A, 200B: Radiator 210: Transfer chamber 220: Piping 221: Heat absorption part 222: Heat radiation part 230: Internal fin 240: External fin 211A: First transmission chamber 212A: First piping 213A: Second transmission chamber 214A: Second piping 215A: Third Transmission chamber 216A: Third piping 217A: Fourth transmission chamber 218A: Fourth piping 230A: Internal fin 240A: External fin 210B: Transmission chamber 220B: First piping 230B: Second piping 240B: Internal fin 250B: External fin 300, 300A, 300B: Plate 310, 310A, 310B: First inclined part 320, 320A, 320B: Second inclined part 330, 330A, 330B: Third inclined part 400, 400A, 400B: Air flow generation device D1, D2: Piping diameter S: Airtight space S1: Liquid storage section S2: Liquid-gas coexistence section L1: Cooling fluid L2: Steam L3: Droplet X: Free surface G: Direction of gravity E, E1, E2: Extending direction N: Normal direction F1 ～F4, A～D: Direction G1, G2: Interval O1: Entrance O2: Exit

Claims (9)

A heat dissipation system configured to cool at least one heat source, the system comprising:
It has an immersion tank having an airtight space, a part of the airtight space is divided into a liquid storage part and a liquid-air coexistence part to store a cooling fluid, and the liquid storage part is configured to store a cooling fluid. at least one heat source, and the liquid-vapor coexistence portion is configured to be located above the free surface of the cooling fluid,
a radiator comprising at least one transmission chamber, at least one piping, a plurality of internal fins, and a plurality of external fins, the at least one piping being connected to the at least one transmission chamber and the at least one piping; is connected to the at least one transmission chamber so as to form a circulation flow path, a part of the at least one piping is located in the liquid-gas coexistence part, and another part of the at least one piping is connected to the at least one transmission chamber so as to form a circulation flow path. The plurality of internal fins are located outside the airtight space, and the plurality of internal fins are located in the liquid-gas coexistence part and are thermally coupled to the at least one pipe, and the plurality of external fins are located outside the airtight space, and the plurality of external fins are located outside the airtight space, and the plurality of external fins are located outside the airtight space. thermally coupled to at least one piping;
A heat dissipation system characterized in that a pipe diameter of the at least one transfer chamber is larger than a pipe diameter of the at least one pipe. The heat dissipation according to claim 1, wherein a distance between any two adjacent internal fins of the plurality of internal fins is greater than a distance between any two adjacent external fins of the plurality of external fins. system. The heat dissipation system according to claim 1, further comprising a plate located in the liquid-vapor coexistence region, the plate being disposed adjacent to the plurality of internal fins. The at least one transmission chamber includes a first transmission chamber, a second transmission chamber, a third transmission chamber and a fourth transmission chamber, and the at least one piping includes a first piping, a second piping, third piping and fourth piping, the first piping is connected to the first transmission chamber and the second transmission chamber, and the second piping is connected to the second transmission chamber and the second transmission chamber. 3 transmission chambers, the third piping is connected to the third transmission chamber and the fourth transmission chamber, and the fourth piping is connected to the fourth transmission chamber and the first transmission chamber. The heat dissipation system according to claim 1, connected to. The heat dissipation system according to claim 4, wherein a pipe diameter of the first pipe is larger than a pipe diameter of the third pipe. The heat dissipation system according to claim 1, further comprising an airflow generating device located outside the airtight space and disposed on the at least one pipe. The heat dissipation system of claim 1, wherein the number of the at least one piping is plural, and the piping is connected to the at least one transfer chamber. The heat dissipation system according to claim 7, wherein the pipe diameters of at least two of the pipes are different from each other. The heat dissipation system according to claim 7, wherein the pipe diameters of the pipes are the same.

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