JP2010010204A - Ebullient cooling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ebullient cooling device capable of accelerating efficient circulation of cooling media including a liquid cooling medium and a vapor cooling medium and improving cooling efficiency. <P>SOLUTION: The ebullient cooling device has a condenser provided with a storage chamber (20) for storing the vapor cooling medium and cooling sections (C1-C3) inside which cooling fluid flows, and a liquid cooling medium tank provided with evaporation paths (B1, B2) for evaporating the liquid cooling medium by heat received from a heating element and a reflow path (R) for making condensed liquid condensed in the condenser flow back to the evaporation paths, and the storage chamber includes vapor introducing paths (D1, D2) for introducing the vapor cooling medium to the cooling sections in a reflow direction from the evaporation path to the reflow path for the cooling sections. Since the vapor cooling medium is exposed to the cooling sections from a transverse direction or an oblique direction, a liquid film on the surface of the cooling sections is easily removed, the condensed liquid is easily guided from the evaporation path to the reflow path, and heat exchange efficiency on the surface of the cooling sections and the circulation efficiency of the cooling medium are improved. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a boiling cooling device that cools a semiconductor element and a heating element such as a power module including the semiconductor element.

  A boiling cooling device capable of efficiently cooling a heating element such as a semiconductor element having a large calorific value and making the entire cooling device relatively compact is being put into practical use. This boiling cooling device can transfer the heat generated by the heating element to the liquid refrigerant having a relatively low boiling point, and boil and evaporate the liquid refrigerant by the heat transfer, thereby efficiently moving the heat generated by the heating element. it can.

Then, the refrigerant vapor evaporated by the boiling of the liquid refrigerant is cooled by the condenser which is one of the heat exchangers and returned to the liquid refrigerant again, and the heat generated by the heating element moves outside the boiling cooling device through the condenser ( Radiate heat). By repeatedly performing such heat exchange using the latent heat of the refrigerant, heat dissipation from the heating element is efficiently continued.
However, in order to reduce the size of the boiling cooling device, it is necessary to further increase the cooling efficiency (operation coefficient, coefficient of performance) of the boiling cooling device that is a heat pump. Examples of such a boiling cooling device include those described in the following patent documents.
JP-A-3-229493 JP-A-10-173115

  Patent Document 1 discloses a boiling cooling device that forcibly sends a vapor refrigerant by a fan to a condenser with a cooling unit. However, in this boiling cooling device, the heating element is simply immersed in the liquid refrigerant tank, and it is not considered to increase the cooling efficiency by promoting the boiling and flow of the liquid refrigerant in the liquid refrigerant tank. .

In Patent Document 2, an evaporating passage for boiling and evaporating liquid refrigerant by receiving heat from a heating element is provided on both sides of the liquid refrigerant tank, and reflux for cooling the vapor refrigerant and condensing the condensed liquid to the liquid refrigerant tank. A boiling cooling device is disclosed in which a passage is arranged at the center of both evaporation passages.
However, the condenser of this boiling cooling device has a configuration like a radiator in which a condensing portion for condensing vapor refrigerant and a fin portion for air-cooling the condensing portion from the outside are alternately stacked. Therefore, due to the structure, the condensate easily adheres to the inner wall surface of the condensing part, and the condensate easily flows back to the evaporation passage by gravity through the adhering inner wall surface. Therefore, the flow of the condensate from the inner wall surface to the center as assumed in Patent Document 2 hardly occurs.

  The present invention has been made in view of such circumstances, and provides a boiling cooling apparatus capable of enhancing cooling efficiency while promoting efficient circulation of refrigerants including liquid refrigerant and vapor refrigerant. For the purpose.

  As a result of extensive research and trial and error, the inventor has devised the direction of the vapor refrigerant to be introduced into the cooling section on the premise that the condenser has the cooling section. Came up with good circulation and increased cooling efficiency. By developing this knowledge, the present inventor has completed various inventions described below.

<Boiling cooler>
(1) The boiling cooling device of the present invention includes a liquid refrigerant tank that contains a liquid refrigerant that can be boiled by receiving heat from a heating element that generates heat, and a heat receiving unit that receives air from the heating element that is airtightly connected above the liquid refrigerant tank. And a condenser that cools and condenses the vapor refrigerant that has flowed up and flows into the liquid refrigerant and returns the liquid refrigerant to the liquid refrigerant, and generates heat from the heating element through repeated evaporation of the liquid refrigerant and condensation of the vapor refrigerant. A boiling cooling device that moves the outside through the condenser,
The condenser has a storage chamber that stores the vapor refrigerant, and a cooling unit that is disposed in the storage chamber and in which a cooling fluid flows.
The liquid refrigerant tank includes an evaporating passage extending in the vertical direction for evaporating the liquid refrigerant by receiving heat from the heating element, and a condensate condensed by the condenser while being partially separated from the evaporating passage. A reflux passage for refluxing the evaporation passage to the evaporation passage,
Further, the storage chamber has an inner wall surface inclined toward the cooling portion at a position where the steam generated in the steam passage passes.

(2) According to the boiling cooling device of the present invention, first, the liquid refrigerant tank is partitioned into the evaporation passage and the reflux passage, and the circulation of the liquid refrigerant tends to be in one direction from the reflux passage to the evaporation passage.
Next, the vapor refrigerant hits the cooling part of the condenser and is cooled and condensed to become a condensed liquid. At this time, the vapor refrigerant hits the cooling part from a specific direction. In other words, the vapor refrigerant does not naturally rise from the vertically lower side to the upper side and hits the cooling part, but is guided to the inner wall surface inclined toward the cooling part. For example, the recirculation flow from the evaporation passage of the liquid refrigerant tank to the reflux passage Hit in the direction. In addition, when it hits in this recirculation | circulation direction, since a recirculation | circulation direction has a horizontal direction component with respect to a vertical direction component, so to speak, a vapor | steam refrigerant | coolant will hit a cooling part in a horizontal direction or a diagonal direction.

In any case, according to the present invention, the condensate adhering to the cooling part is likely to flow slightly in the recirculation direction from the vertically lower area of the cooling part. Further, the liquid is dropped from the vicinity thereof and is easily collected into the reflux passage of the liquid refrigerant tank. As a result, at least on the surface of the cooling unit where the vapor refrigerant hits, formation of a liquid film of condensate that inhibits heat exchange is suppressed, and continuous and stable heat exchange is possible between the cooling unit and the vapor refrigerant. Become.
Moreover, since the vapor refrigerant is flowing toward the cooling part, the condensate dripped from the cooling part is likely to flow into the reflux passage of the liquid refrigerant tank. For example, in the case where the vapor refrigerant flows in the recirculation direction, it becomes easier to promote an appropriate refrigerant flow between the liquid refrigerant tank and the condenser, that is, the evaporation passage → cooling portion → reflux passage → evaporation passage. Is also prevented from flowing back into the evaporation passage.
In addition, the direction (for example, recirculation | circulation direction) which goes to a cooling part as used in this specification does not need to be a horizontal direction, and can also include the up-down direction which goes to a downward diagonal direction, an upward diagonal direction, and also from the top to the bottom.

  The present invention will be described in more detail with reference to embodiments of the invention. In addition to the above-described configuration, the boiling cooling device of the present invention may further include one or more configurations arbitrarily selected from the following list. Further, the configuration to be selected can be added in a superimposed manner and arbitrarily. It should be noted that which embodiment described in the present specification is the best depends on the target, required performance, and the like.

<Liquid refrigerant tank>
The liquid refrigerant tank of the present invention is a container that contains the liquid refrigerant, and an evaporation passage and a reflux passage are formed by partitioning the inside of the container.
(1) The liquid refrigerant according to the present invention is not particularly limited, and examples thereof include water, alcohol, fluorocarbon, and chlorofluorocarbon. Depending on the amount of heat generated by the heating element, the size of the boiling cooling device, the cooling efficiency, etc., those that are likely to cause boiling, vaporization and liquefaction are selected.

(2) The evaporating passage is a part for transferring the heat generated by the heating element attached to the outside or the inside of the outer wall of the liquid refrigerant tank to the liquid refrigerant to boil and evaporate (vaporize) the liquid refrigerant. The bubble path (vapor refrigerant) generated in the boiled liquid refrigerant substantially consists of a vapor passage through which the bubbles move upward from below.

(3) The recirculation passage is a portion for recirculating the condensed liquid, which is condensed from the vapor refrigerant evaporated from the upper surface of the liquid refrigerant in the evaporating passage, to the evaporating passage. It is a passage that moves downward from
The lower portion of the reflux passage and the lower portion of the evaporation passage communicate with each other through a communication passage. For this reason, the liquid refrigerant heated in the evaporating passage rises and the liquid refrigerant (condensate) cooled in the recirculating passage descends, so that a flow from the recirculating passage to the evaporating passage naturally occurs.

(4) In the boiling cooling device of the present invention, there is at least one evaporating passage and one recirculating passage. The arrangement may be such that the evaporation passage and the reflux passage are arranged in a layered manner, or may be arranged so that the evaporation passage surrounds the reflux passage provided in the center, or the reflux provided in one corner. The evaporating passage may be arranged in a hook shape (L-shape) around the periphery of the passage.

In this case, for example, the liquid refrigerant tank has at least a first attachment part and a second attachment part for attaching the heating element to the outside or the inside of the outer wall, and the evaporation passage of the liquid refrigerant tank is connected to the first attachment part. At least a first evaporating passage for receiving heat from the attached heating element and a second evaporating passage for receiving heat from the heating element attached to the second attachment portion, and the reflux passage is between the first attachment portion and It is preferable that the first evaporation passage is interposed and the second evaporation passage is interposed between the second attachment portion and the second attachment portion.
By arranging the inside of the liquid refrigerant tank in this manner, an evaporation passage is interposed between the heating element and the reflux passage, and the evaporation passage serves as a heat transfer buffer region, so that the liquid in the reflux passage can be obtained. The refrigerant is suppressed from being heated by the heating element.
For example, between the evaporation passage and the reflux passage, there is a partition portion that extends in the vertical direction and partitions the evaporation passage and the reflux passage, and the lower portion of the recovery plate and the upper portion of the partition portion are It is preferable that they are connected.

More specifically, the liquid refrigerant tank divides the first evaporation path and the second evaporation path on the opposite outer wall side of the liquid refrigerant tank, and the first evaporating path and the second evaporating path It is preferable that the reflux passage be partitioned in between, and a partition portion that communicates from the reflux passage to the first evaporation passage and to communicate from the reflux passage to the second evaporation passage at a lower portion.
In this case, simply by providing a partition portion (for example, a plate material) of an appropriate length for partitioning the inside of the liquid refrigerant tank according to the form of the first evaporation passage, the second evaporation passage, and the reflux passage, the cooling efficiency can be easily improved. A liquid refrigerant tank can be formed.

<Condenser>
The condenser of the present invention exchanges heat with the refrigerant by condensing the vapor refrigerant formed by evaporating the liquid refrigerant by receiving heat from the heating element into a condensed liquid (liquid refrigerant). More specifically, the condenser of the present invention includes a storage chamber in which the vapor refrigerant that has flowed up from the evaporation passage of the liquid refrigerant tank is stored, and a cooling unit that cools the vapor refrigerant.

(1) The storage chamber is air-tightly connected above the liquid refrigerant tank and forms a space for storing the vapor refrigerant.
The storage chamber of the present invention has a vapor introduction path for introducing a vapor refrigerant into the cooling unit in which the storage chamber is arranged. The operational effect of this steam introduction path is as described above, and it is preferable that the opening area of the outlet of the steam introduction path is further narrowed than the opening area of the inlet.
Thereby, the flow rate of the vapor refrigerant flowing toward the cooling unit is increased, and the heat exchange efficiency between the cooling unit and the vapor refrigerant per unit time is increased. In addition, a liquid film of the condensate is hardly formed by the vapor flow on the surface of the cooling unit, and heat transfer between the vapor refrigerant and the cooling unit is improved.

  The shape of the inlet and the shape of the outlet are not limited, but the shape of the inlet is preferably adapted to the shape of the upper opening of the evaporation passage of the liquid refrigerant tank. In addition, since the flow rate of the vapor refrigerant is increased at the outlet portion, a rounded shape with a smooth periphery is preferable to an angular shape. As a result, the vapor refrigerant can easily flow smoothly from the evaporation passage to the cooling section, and the flow velocity of the vapor refrigerant at the outlet portion of the vapor introduction path is also likely to increase. Similarly, in order to form a smooth flow of the vapor refrigerant, it is preferable that the cross-sectional shape of the vapor introduction path from the inlet to the outlet changes smoothly.

  From such a viewpoint, it is preferable that the storage chamber has a soot suppressing portion that suppresses stagnation of the steam refrigerant flowing through the steam introduction path in the middle from the evaporation path to the outlet of the steam introduction path. If there is a portion where the cross section or direction changes suddenly in the steam introduction path, the vapor refrigerant will generate a vortex, and stagnation is likely to be formed in that portion. In such a situation, it becomes difficult for the vapor refrigerant to flow smoothly in the vapor introduction path, and as a result, generation and condensation of the vapor refrigerant can be affected. Therefore, it is preferable that a wrinkle suppression portion that suppresses stagnation of the vapor refrigerant is formed in the storage chamber. This wrinkle suppression portion may be provided separately in the storage chamber, but the outer shape of the storage chamber itself may be devised so that the outer wall also serves as the wrinkle suppression portion.

The same applies to the flow of the vapor refrigerant that has exited the vapor introduction path. However, it is important that the vapor refrigerant after it exits the vapor introduction path appropriately hits the cooling section rather than simply flowing smoothly. For example, if a plurality of cooling units are arranged in parallel, it is preferable that the vapor refrigerant is diffused so as to be distributed as evenly as possible to each cooling unit.
Therefore, the storage chamber not only simply suppresses the stagnation of the vapor refrigerant that has exited from the outlet of the steam introduction path, but also has a diffusion guide section that diffuses and induces the vapor refrigerant that has exited from the outlet of the steam introduction path to the cooling section. It is preferable. This diffusion guide part may be provided separately in the storage chamber as well as the soot suppression part, but it is efficient if the housing shape of the storage chamber is devised so that its outer wall also serves as the diffusion guide part. .

(2) It suffices if the cooling unit is disposed in the storage chamber. The cooling fluid flowing inside the cooling unit may be gas or liquid. The atmosphere (air) may be used as long as it is a gas. If it is a liquid, a coolant such as water can be used.
The cooling part may have a structure in which the ceiling part of the storage chamber is recessed to form a cooling passage. However, a typical example of the cooling unit is a cooling pipe. This cooling pipe is, for example, a pipe that penetrates the storage chamber in an airtight manner and that circulates a cooling fluid that is different from the liquid refrigerant. There may be one or a plurality of cooling pipes penetrating such a storage chamber, they may be meandering on a straight line, they may be thick or thin, and the thickness of the cooling pipe may be increased depending on the arrangement. May be different. Further, fins may be provided around the cooling pipe accommodated in the storage chamber.
The type of the cooling fluid flowing inside the cooling pipe is not limited, but water and the like are typical. The cooling fluid does not need to flow in a state in which the inside of the cooling pipe is filled, and may be in a state where a gas phase and a liquid phase are mixed like an expansion chamber (evaporator) of a refrigerator.

(3) The condenser of the present invention preferably has a recovery unit that recovers the condensate dripped from the cooling pipe and guides it to the reflux passage of the liquid refrigerant tank. By providing this recovery unit, the refrigerant efficiently circulates in the form of the evaporation passage → condenser → reflux passage, and is greatly affected by the size of the liquid refrigerant tank and the arrangement of the evaporation passage and the return passage. Therefore, it is possible to determine the size of the condenser, the form of piping, and the like, and the degree of freedom in designing the whole boiling cooling device is increased. For this reason, it becomes possible to set it as a compact and highly efficient boiling cooling device, according to the form of the heat generating apparatus which attaches a boiling cooling device.

The recovery unit includes, for example, an upper opening that opens below the cooling pipe according to the size of the cooling pipe, and a guiding part that is squeezed into a funnel shape or a mortar shape and guides the condensed liquid that has dropped to the reflux passage. And a lower opening that opens above the reflux passage.
Here, by connecting the lower part of the recovery part formed in the condenser (especially in the storage chamber) and the upper part of the partition part formed in the liquid refrigerant tank, and further integrating them, the vapor refrigerant is allowed to evaporate. The condensate is guided to the recirculation passage without leakage while being guided to the cooling pipe without leakage. Further, when the boiling cooling device is manufactured by integrating the collection unit and the partitioning unit and brazing one member, the manufacturing cost can be reduced.

  In addition, by using this recovery unit also as a component for forming the steam introduction path, a compact and highly efficient boiling cooling device can be manufactured at low cost. Therefore, it is preferable that at least a part of the steam introduction path is formed by the recovery part (for example, the outer wall surface of the guide part) and the soot suppressing part.

  More specifically, the boiling cooling device according to the present invention is disposed in the condenser, is inclined toward the reflux passage, and recovers the condensed liquid dripping from the cooling section to the reflux passage of the liquid refrigerant tank. A plate and a lower guide wall formed at a position facing the recovery plate on the wall surface of the storage chamber and inclined in the same direction as the recovery plate, and steam between the recovery plate and the lower guide wall Preferably, an introduction path is formed, the steam introduction path communicates with the evaporation passage, and the steam generated in the evaporation passage is introduced into the steam introduction passage.

The present invention will be described more specifically with reference to examples.
<Basic example>
FIG. 1 shows a boiling cooling device F according to an embodiment of the present invention. The boiling cooling device F includes a liquid refrigerant tank 1 and a condenser 2.
The liquid refrigerant tank 1 includes a substantially rectangular parallelepiped metal case 10 and partition plates 15 and 16 (partition portions) provided in the case 10 in parallel in the vertical direction. Mounting portions 11 (first mounting portions) and mounting portions 12 (second mounting portions) are respectively provided on the outer wall surfaces on both sides of the housing 10, and power modules H1 and H2 (heating elements) each including a semiconductor element. Are attached to the attachment portions 11 and 12, respectively.

The inside of the housing 10 is partitioned into three thin rectangular parallelepiped regions by the partition plates 15 and 16, and evaporation passages B1 and B2 (first evaporation passage and second evaporation passage) are formed on both sides. R is formed. The partition plates 15 and 16 are fixed to the side wall of the housing 10 by brazing, but are not joined to the bottom wall of the housing 10. For this reason, the evaporation passages B1 and B2 and the reflux passage R can communicate with each other.
The condenser 2 includes a bottomed substantially hexagonal columnar metal casing 20 (storage chamber), a pair of recovery plates 25 and 26 (collection section) widened in the casing 20 from the bottom to the top, and a casing. It consists of three cooling pipes C1-3 penetrating the body 20 in the direction from the front to the back of the page. In the cooling pipes C1 to C3, cooling water cooled by a radiator (such as a radiator) is continuously circulated by a circulation pump.

  The internal space of the housing 20 serves as a storage chamber in which the vapor refrigerant evaporated from the evaporation passages B1 and B2 is stored. The casing 20 includes lower guide walls 21 and 22, and steam introduction paths D <b> 1 and D <b> 2 for steam refrigerant are formed by cooperation of the lower guide walls 21 and 22 and the recovery plates 25 and 26. Note that the opening area of the outlets of the steam introduction paths D1 and D2 is narrower than the opening area of the inlet (the upper opening area of the evaporation passages B1 and B2).

  The vapor refrigerant whose flow velocity is increased at the outlets of the vapor introduction paths D1 and D2 is guided to the substantially straight intermediate guiding walls 27 and 28, and obliquely enters the cooling pipes C1 to C3 provided above the housing 20 from below. It is cooled by hit. In addition, since the housing 20 has the upper guide walls 23 and 24 (diffusion guide portions), the vapor refrigerant is further guided also above the cooling pipes C1 to C3. Thus, the vapor refrigerant can be diffused and distributed not only to the nearest cooling pipe but also to other adjacent cooling pipes. For example, the vapor refrigerant having an increased flow velocity exiting the outlet of the steam introduction path D1 hits the cooling pipe C1 from the oblique lower side by the intermediate guide wall 27 and the upper guide wall 23 and is also distributed and diffused to the cooling pipes C2 and C3. The In this way, the vapor refrigerant smoothly flows in the recirculation direction (the direction from the evaporation passages B1 and B2 to the recirculation passage R through the condensing unit 2), whereby a good refrigerant circulation is obtained, and the vapor refrigerant having a high flow velocity is obtained. The liquid film of the condensate adhering to the surface of the cooling pipe is removed by hitting at least the nearest cooling pipe, and the vapor refrigerant and the cooling pipes C1 to C1 are dispersed by being dispersed to other cooling pipes. Smooth heat exchange with C3 is performed.

  The steam introduction paths D1 and D2 of the present embodiment can be formed by the lower guide walls 21 and 22 and the recovery plates 25 and 26, but in addition to the intermediate guide walls 27 and 28 and the upper guide walls 23 and 24, It may be considered that the steam introduction paths D1 and D2 are formed.

<Modification>
3 to 6 show modified embodiments in which the basic embodiment described above is partially changed. In addition, about the modified example shown in FIGS. 3-6, the same code | symbol as FIG. 1 was attached | subjected to the part which is not changed from the basic example shown in FIG.
(1) The boiling cooling device F2 shown in FIG. 3 is obtained by changing the condenser 2 of the boiling cooling device F to a condenser 220. The change of the condenser 220 with respect to the condenser 2 is that the intermediate guide walls 27 and 28 of the condenser 2 are omitted.

(2) The boiling cooling device F3 shown in FIG. 4 is obtained by changing the condenser 2 of the boiling cooling device F to a condenser 320. The change point of the condenser 320 with respect to the condenser 2 is that the shape of the upper guide walls 23 and 24 of the condenser 2 is changed from a flat shape to a curved shape.

(3) The boiling cooling device F4 shown in FIG. 5 is obtained by changing the condenser 2 of the boiling cooling device F to a condenser 420. The change of the condenser 420 with respect to the condenser 2 is that the lower guide walls 21 and 22 of the condenser 2 are omitted.

(4) The boiling cooling device F5 shown in FIG. 6 is obtained by changing the condenser 2 of the boiling cooling device F to a condenser 520. The change point of the condenser 520 relative to the condenser 2 is that the recovery plates 25 and 26 provided inside the condenser 2 are omitted, and the outer wall of the casing 10 of the liquid refrigerant tank 1 and the casing 20 of the condenser 2 are omitted. The outer wall is configured in a continuous plane.

It is a longitudinal cross-sectional view of the boiling cooling device which is a basic Example of this invention. It is a front view of the boiling cooling device. It is a longitudinal cross-sectional view of the boiling cooling device which is the 1st modification of this invention. It is a longitudinal cross-sectional view of the boiling cooling device which is the 2nd modification of this invention. It is a longitudinal cross-sectional view of the boiling cooling device which is the 3rd modification of this invention. It is a longitudinal cross-sectional view of the boiling cooling device which is the 4th modification of this invention.

Explanation of symbols

1 Liquid refrigerant tank 2 Condensers 15 and 16 Partition plate (partition part)
25, 26 Collection board (collection part)
B1, B2 Evaporation passage C1-C3 Cooling pipe (cooling part)
D1, D2 Steam introduction path H1, H2 Power module (heating element)
F Boiling cooling device R Reflux passage M Liquid refrigerant

Claims (5)

A liquid refrigerant tank containing a liquid refrigerant that can boil by receiving heat from a heating element with heat generation;
A condenser that is airtightly connected above the liquid refrigerant tank and includes a condenser that cools, condenses, and returns the liquid refrigerant to the liquid refrigerant that evaporates and rises due to heat received from the heating element.
A boiling cooling device for moving heat generated from the heating element to the outside through the condenser by repeating evaporation of the liquid refrigerant and condensation of the vapor refrigerant,
The condenser has a storage chamber that stores the vapor refrigerant, and a cooling unit that is disposed in the storage chamber and in which a cooling fluid flows.
The liquid refrigerant tank includes an evaporating passage extending in the vertical direction for evaporating the liquid refrigerant by receiving heat from the heating element, and a condensate condensed by the condenser while being partially separated from the evaporating passage. A reflux passage for refluxing the evaporation passage to the evaporation passage,
Furthermore, the said storage chamber has an inner wall surface which inclines toward the said cooling part in the position where the vapor | steam generate | occur | produced in the said vapor | steam passage passes, The boiling cooling device characterized by the above-mentioned. A recovery plate disposed in the condenser, inclined toward the reflux passage, and leading the condensate dripping from the cooling section to the reflux passage of the liquid refrigerant tank;
A lower guide wall that is formed at a position facing the recovery plate on the wall surface of the storage chamber and is inclined in the same direction as the recovery plate;
A steam introduction path is formed between the recovery plate and the lower guide wall;
The boiling cooling apparatus according to claim 1, wherein the steam introduction path communicates with the evaporation passage, and steam generated in the evaporation passage is introduced into the steam introduction path.   The boiling cooling apparatus according to claim 2, wherein an opening area of the outlet of the steam introduction path is narrower than an opening area of the inlet.   Between the evaporation passage and the reflux passage, there is a partition portion that extends in the vertical direction and partitions the evaporation passage and the reflux passage, and the lower portion of the recovery plate and the upper portion of the partition portion are connected. The boiling cooling device according to claim 3. The liquid refrigerant tank has at least a first attachment portion that attaches the heating element to the outside or the inside of an outer wall, and a second attachment portion that faces the first attachment portion,
The evaporation passage of the liquid refrigerant tank has at least a first evaporation passage that receives heat from the heating element attached to the first attachment portion and a second evaporation passage that receives heat from the heating element attached to the second attachment portion. And
The boiling cooling device according to any one of claims 1 to 4, wherein the reflux passage of the liquid refrigerant tank is interposed between the first evaporation passage and the second evaporation passage.

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