JP2013069740A - Flat plate type cooling device and usage of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that the improvement of cooling performance leads to the size increase of a cooling device, which uses a vapor cooling method.SOLUTION: A flat plate type cooling device of the invention has: a first flat plate; a second flat plate facing the first flat plate; a flat plate like container including a frame body part for connecting the first flat plate with the second flat plate; a coolant enclosed in the flat plate like container; and a passage wall which connects the first flat plate with the second flat plate and controls a coolant passage in the flat plate container. The flat plate like container includes: a heat reception region which is thermally connected to a heating body disposed on at least one of the first flat plate and the second flat plate; and a heat radiation region which is thermally connected to a heat radiation part disposed on at least one of the first flat plate and the second flat plate. The heat radiation region has multiple passage plates forming the coolant passage in the heat radiation region.

Description

  The present invention relates to a cooling device such as a semiconductor device or an electronic device, and more particularly, to a flat plate cooling device using a boiling cooling system that transports and dissipates heat by a vaporization and condensation cycle of a refrigerant and a method of using the same.

  In recent years, the amount of heat generated by semiconductor devices and electronic devices has been increased with higher performance and higher functionality. On the other hand, downsizing of semiconductor devices and electronic devices is progressing due to the spread of portable devices. From such a background, a highly efficient and small cooling device is demanded. A cooling device using a boiling cooling method that transports and dissipates heat by a cycle of vaporization and condensation of the refrigerant does not require a drive unit such as a pump. Therefore, since it is suitable for downsizing, it is expected as a cooling device for semiconductor devices and electronic devices.

  An example of a cooling device using such a boiling cooling system (hereinafter also referred to as “boiling cooling device”) is described in Patent Document 1. A related boiling cooling device described in Patent Document 1 includes a refrigerant storage unit that stores therein a liquid refrigerant that receives heat from a heating element, and a condensation unit that is connected to the refrigerant storage unit and condenses evaporated refrigerant vapor. Have. Each of the refrigerant storage unit and the condensing unit is composed of a metallic casing having a rectangular parallelepiped shape. The related boiling cooling device includes a pair of passage forming plates that divide the inside of the refrigerant reservoir and the condenser into a plurality of passages, whereby the first refrigerant passage and the second refrigerant passage are provided in the condenser in the refrigerant reservoir. A third refrigerant passage and a fourth refrigerant passage are formed. Further, the condensing unit includes a hollow plate-like condensing pipe through which a cooling fluid flows, and the condensing pipe is arranged to be inclined with respect to the flow direction of the refrigerant vapor.

  In addition, according to the related boiling cooling device, the condenser pipe is inclined, so that the refrigerant vapor can smoothly flow on the surface of the condenser pipe, and the condensation capacity of the refrigerant vapor by the condenser pipe is improved. It can be made to.

JP 2010-236792 (paragraphs “0025” to “0042”)

  As described above, in the related boiling cooling device, the passage forming plate causes the refrigerant bubbles generated by the boiling of the liquid refrigerant and the refrigerant vapor to flow, and the refrigerant condensed in the condenser pipe to flow. Second and fourth refrigerant passages are formed. Then, the first refrigerant passage and the second refrigerant passage, and the third refrigerant passage and the fourth refrigerant passage are respectively laminated in parallel with the outer wall surface of the housing. For this reason, there is a problem that the thickness of the related boiling cooling device increases and the device becomes large.

  Thus, the related boiling cooling device has a problem that the size of the device increases when the cooling performance is improved.

  The object of the present invention is a flat plate cooling apparatus and its use which solve the problem that the apparatus becomes large when the cooling performance is improved in the cooling apparatus using the boiling cooling system, which is the problem described above. It is to provide a method.

  A flat plate cooling device according to the present invention includes a flat plate container including a first flat plate, a second flat plate facing the first flat plate, and a frame body portion connecting the first flat plate and the second flat plate. And a refrigerant sealed in the flat container, a flow path wall for connecting the first flat plate and the second flat plate and controlling the flow path of the refrigerant in the flat container, , A heat receiving region thermally connected to a heating element disposed on at least one of the first flat plate and the second flat plate, and a heat dissipating portion disposed on at least one of the first flat plate and the second flat plate A heat dissipation area connected to the heat dissipation area, and the heat dissipation area includes a plurality of flow path plates constituting a flow path of the refrigerant in the heat dissipation area.

  The method of using the flat plate cooling device of the present invention includes the flat plate cooling device of the present invention, a first arrangement state in which a linear axis connecting the heat receiving region and the heat radiating region is perpendicular to the vertical direction, and the heat receiving region and the heat radiating region. Are used by switching between the second arrangement state in which the linear axis connecting the two is parallel to the vertical direction.

  According to the flat plate type cooling device of the present invention, a boiling cooling type flat plate type cooling device having a small size and improved cooling performance can be obtained.

It is a perspective view which shows typically the use condition of the flat type cooling device which concerns on the 1st Embodiment of this invention. It is a figure which shows the structure of the flat type cooling device which concerns on the 1st Embodiment of this invention, (a) is a top perspective view, (b) is the BB sectional drawing in (a), (c) is It is CC sectional view taken on the line in (b). It is sectional drawing which shows the structure of the flat type cooling device which concerns on the 1st Embodiment of this invention. It is typical sectional drawing of the flat plate cooling device for demonstrating the usage method of the flat plate cooling device which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows the structure of the flat type cooling device which concerns on the 2nd Embodiment of this invention. It is sectional drawing which shows the structure of the flat type cooling device which concerns on the 3rd Embodiment of this invention. It is a figure which shows the structure of the flat type cooling device which concerns on the 4th Embodiment of this invention, (a) is a top surface perspective view, (b) is the BB sectional drawing in (a), (c) is It is CC sectional view taken on the line in (a).

  Embodiments of the present invention will be described below with reference to the drawings.

[First Embodiment]
FIG. 1 is a perspective view schematically showing a usage state of the flat plate cooling device 100 according to the first embodiment of the present invention. The flat plate cooling device 100 has a flat container in which a refrigerant is sealed. By using a low-boiling-point material for the refrigerant and injecting the refrigerant into the flat container and then evacuating it, the inside of the flat container can always be maintained at the saturated vapor pressure of the refrigerant. The dotted line in FIG. 1 schematically shows the interface between the liquid phase and the gas phase of the refrigerant.

  A heat radiating part 600 including a heating element 500 and heat radiating fins is thermally connected to the outer surface of a flat container constituting the flat plate cooling device 100 for use. The amount of heat from the heating element 500 is transmitted to the refrigerant through the flat container, and the refrigerant is vaporized. At this time, since the amount of heat from the heating element 500 is lost to the refrigerant as heat of vaporization, the temperature rise of the heating element 500 is suppressed. The vaporized refrigerant diffuses inside the flat container toward the heat dissipating part 600, dissipates heat using the heat dissipating fins of the heat dissipating part 600, and condenses. As described above, the flat plate cooling device 100 has a configuration using a boiling cooling system in which heat is transported and released by a refrigerant vaporization and condensation cycle.

  1 shows a case where both the heating element 500 and the heat radiating unit 600 are arranged on one surface of the flat plate cooling device 100, but the present invention is not limited to this. Good. Further, the direction of the heat dissipating fins constituting the heat dissipating unit 600 is not limited to that shown in FIG.

  The configuration of the flat plate cooling device 100 will be described in more detail with reference to FIG. 2A and 2B are diagrams showing a configuration of the flat plate cooling device 100 according to the first embodiment of the present invention, where FIG. 2A is a top perspective view, and FIG. 2B is a cross-sectional view taken along line BB in FIG. (C) is the CC sectional view taken on the line in (b). The flat plate cooling device 100 includes a first flat plate 111, a second flat plate 112 that faces the first flat plate 111, and a frame body portion 113 that connects the first flat plate 111 and the second flat plate 112. A flat plate container 110 is provided. A refrigerant 120 is sealed in the flat container 110. In addition, a flow path wall 130 that connects the first flat plate 111 and the second flat plate 112 and controls the flow path of the refrigerant 120 in the flat container 110 is provided inside the flat container 110.

  As shown in FIG. 2B, the flat container 110 has a heat receiving region 140 that is thermally connected to the heating element 500 disposed on at least one of the first flat plate 111 and the second flat plate 112. In addition, the flat container 110 has a heat dissipation region 150 that is thermally connected to the heat dissipation portion 600 disposed on at least one of the first flat plate 111 and the second flat plate 112. The heat radiation area 150 includes a plurality of flow path plates 160 that constitute the groove-shaped flow paths 162 that are the flow paths of the refrigerant 120 in the heat radiation area 150. As a material constituting these members, a metal having excellent thermal conductivity, such as aluminum, can be used. Moreover, as the refrigerant | coolant 120, hydrofluorocarbon, hydrofluoroether, etc. which are insulating and inactive materials can be used, for example.

  Next, the operation of the flat plate cooling device 100 according to the present embodiment will be described with reference to FIG. In the figure, the interface between the gas phase and the liquid phase of the refrigerant 120 is indicated by a dotted line. That is, the vertical direction in the drawing is the vertical direction. The refrigerant present in the heat receiving area 140 takes the heat amount from the heating element 500 and vaporizes, and flows inside the flat container 110 toward the heat radiating area 150 along the flow path wall 130. The gas-phase refrigerant that has reached the heat radiation region 150 passes through the groove-like channel 162 having an open end formed between the plurality of channel plates 160, and is cooled and condensed in the groove-like channel 162. . The condensed refrigerant descends in the groove-like channel 162 due to gravity and flows into the liquid phase refrigerant. The condensed refrigerant (condensed refrigerant) is further cooled and settled in the heat radiating region 150, and is returned to the heat receiving region 140 again in a sufficiently cooled state. As a result, the condensed refrigerant that is insufficiently cooled and the condensed refrigerant that is sufficiently cooled can be separated.

  Here, the cooling performance in the heat radiation region 150 is mainly determined by condensation heat transfer when the refrigerant changes phase from the gas phase to the liquid phase. This is because the amount of heat transfer due to latent heat generated during the phase change is several times larger than the amount of heat transfer due to sensible heat that dissipates heat due to the temperature difference of the refrigerant in the liquid phase. Therefore, a plate-type cooling device using a boiling cooling system (also referred to as a “plate-type boiling cooling device”) is a method in which the surface area of the heat radiation region 150 is effectively used to condense a refrigerant in a gas phase state (gas phase refrigerant). The cooling performance can be improved.

  As described above, in the flat plate cooling device 100 according to the present embodiment, the flow path of the refrigerant (groove-shaped flow path 162) is configured by the plurality of flow path plates 160 in the heat dissipation area 150. For this reason, the flow resistance to the gas-phase refrigerant in the heat radiation region 150 increases, so that the gas-phase refrigerant can flow uniformly into each groove-like channel 162. Furthermore, the flow rate of the gas-phase refrigerant flowing in each groove-like channel 162 can be reduced by branching the gas-phase refrigerant into the plurality of groove-like channels 162. Accordingly, it is possible to improve the heat exchange efficiency between the refrigerant 120 and the heat radiating unit 600. As described above, according to the flat plate cooling device 100 according to the present embodiment, the gas phase refrigerant can be condensed by effectively using the surface area of the heat radiation region 150, so that the cooling performance of the flat plate cooling device can be improved. it can.

  Furthermore, in the present embodiment, by providing the flow path wall 130, in the plane parallel to the first flat plate 111 and the second flat plate 112 constituting the flat plate container 110, a condensed refrigerant that is insufficiently cooled, It is set as the structure which isolate | separates the fully cooled condensed refrigerant | coolant. Therefore, unlike the related boiling cooling device described in the background art, it is not necessary to form a flow path laminated in parallel with the outer wall surface, so that the flat plate cooling device 100 can be reduced in size and thickness.

  Thus, according to the present embodiment, a boil cooling type flat plate cooling device having a small size and improved cooling performance can be obtained.

  Next, the configuration of the flat plate cooling device 100 will be described in more detail with reference to FIG. FIG. 3 is a cross-sectional view showing the configuration of the flat plate cooling device 100 according to the first embodiment of the present invention, and shows the same cross section as FIG.

  As shown in FIG. 3, the heat dissipation area 150 includes a refrigerant introduction area 152 that is an area between the end of the flow path plate 160 in the extending direction and the frame body section 113. Here, the refrigerant introduction region 152 functions as a header or a footer for each groove-like channel 162. The cross-sectional area perpendicular to the extending direction of the refrigerant introduction region 152 may be configured to be larger than the sum of the cross-sectional areas perpendicular to the extending direction of the groove-shaped flow paths 162 formed by the flow path plate 160. it can. In this case, the flow resistance with respect to the gas-phase refrigerant flowing through the groove-like channel 162 can be increased more than the flow resistance with respect to the gas-phase refrigerant flowing through the refrigerant introduction region 152. As a result, the above-described effect of allowing the gas-phase refrigerant to uniformly flow into each groove-like channel 162 and reducing the flow rate of the gas-phase refrigerant flowing to each groove-like channel 162 can be obtained more remarkably. . Here, the total cross-sectional area perpendicular to the extending direction of each groove-like channel 162 is, for example, 30% or less of the cross-sectional area perpendicular to the extending direction of the coolant introduction region 152, and the width of each groove-like channel 162 is Can be about 2 mm to 5 mm.

  Further, the flow path wall 130 is desirably disposed between the heat receiving area 140 and the heat radiating area 150. A cross-sectional shape by a plane parallel to the first flat plate 111 (or the second flat plate 112) connects the heat receiving region 140 and the heat radiating region 150 and is a straight line parallel to one side of the first flat plate 111 (in FIG. 3). It can be set as the structure which has the inclination wall part 132 inclined and arrange | positioned with respect to the straight line DD). Thereby, the gaseous-phase refrigerant | coolant which generate | occur | produced in the heat receiving area | region 140 can be smoothly flowed toward the thermal radiation area | region 150 (arrow A in FIG. 3). That is, in the circulation system of the gas-phase refrigerant in the flat plate type cooling apparatus, the flow resistance increases when there is a sudden change in the cross-sectional area of the flow path. As a result, since the internal pressure increases, the boiling point of the liquid-phase refrigerant increases, causing a decrease in cooling performance. On the other hand, by using the flow path wall 130 having the tapered inclined wall portion 132, a rapid change in the flow area in the flow path of the gas-phase refrigerant does not occur, so that a decrease in cooling performance can be avoided. it can.

  Next, a method for using the flat plate cooling device 100 according to the present embodiment will be described. FIG. 4 is a schematic cross-sectional view of the flat plate cooling device 100 for explaining a method of using the flat plate cooling device 100 according to the present embodiment. In the description so far, as shown in FIG. 4A, the flat plate cooling device 100 in the arrangement state (first arrangement state) in which the linear axis DD connecting the heat receiving region 140 and the heat radiation region 150 is perpendicular to the vertical direction. Shown about using. However, in the flat plate cooling device 100 of the present embodiment, as shown in FIG. 4B, the linear axis DD connecting the heat receiving area 140 and the heat radiating area 150 is parallel to the vertical direction (second arrangement). (State). That is, the flat plate cooling device 100 of the present embodiment can be used by switching between the first arrangement state and the second arrangement state. Moreover, as shown in FIG.4 (c), it can use also in the arrangement | positioning state rotated 180 degree | times with the case shown to Fig.4 (a).

  In the second arrangement state (FIG. 4B) and the arrangement state of FIG. 4C, the flow path 170 in which the refrigerant circulates is formed by the flow path wall 130 and the flow path plate 160 being disposed. Because it is done. That is, even in this case, the heat receiving region 140 is always supplied with the sufficiently cooled refrigerant after condensation, so that the cooling performance of the flat plate cooling device 100 can be improved.

  At this time, it is desirable that the flow path plate 160 be disposed to be inclined with respect to a direction perpendicular to a straight line connecting the heat receiving region 140 and the heat radiating region 150 and parallel to one side of the first flat plate 111. The flow path wall 130 has a cross-sectional shape parallel to the first flat plate 111 and an asymmetric structure with respect to a straight line connecting the heat receiving region 140 and the heat radiating region 150 and parallel to one side of the first flat plate 111. It is desirable to have. By adopting such a configuration, the liquid-phase refrigerant descends along the flow path plate 160, and the difference in the flow resistance of the refrigerant is caused by the difference in the length of the flow path wall 130. Therefore, the circulation of the refrigerant is promoted. The cooling performance of the flat plate cooling device 100 can be further improved.

[Second Embodiment]
Next, a second embodiment of the present invention will be described. FIG. 5 is a cross-sectional view showing a configuration of a flat plate cooling device 200 according to the second embodiment of the present invention, and shows the same cross section as FIG. The flat plate cooling device 200 includes a first flat plate 111, a second flat plate 112 that faces the first flat plate 111, and a frame body portion 113 that connects the first flat plate 111 and the second flat plate 112. A flat plate container 110 is provided. A refrigerant 120 is sealed in the flat container 110. In addition, a flow path wall 130 that connects the first flat plate 111 and the second flat plate 112 and controls the flow path of the refrigerant 120 in the flat container 110 is provided inside the flat container 110.

  The flat container 110 has a heat receiving region 140 that is thermally connected to the heating element 500 disposed on at least one of the first flat plate 111 and the second flat plate 112. In addition, the flat container 110 has a heat dissipation region 150 that is thermally connected to the heat dissipation portion 600 disposed on at least one of the first flat plate 111 and the second flat plate 112. The heat radiation area 150 includes a plurality of flow path plates 160 that constitute the groove-shaped flow paths 162 that are the flow paths of the refrigerant 120 in the heat radiation area 150.

  The configuration so far is the same as the flat plate cooling device 100 according to the first embodiment. The flat plate cooling device 200 according to the present embodiment is different from the flat plate cooling device 100 according to the first embodiment in that the heat receiving region 140 or the heat radiating region 150 includes a rough surface region 240 (250) having an uneven structure. .

  Here, the rough surface region 240 (250) has a concavo-convex structure formed on the inner surface of the plate-like container 110, and this concavo-convex structure serves as a bubble generation nucleus of the refrigerant in the heat receiving region 140, and in the heat radiating region 150, It becomes a condensation nucleus. Therefore, the phase change of the refrigerant is activated and the cooling performance can be further increased.

  The size of the concavo-convex structure is determined by an optimum value depending on physical properties such as the surface tension of the refrigerant and the amount of heat generated by the heating element. For example, when hydrofluorocarbon or hydrofluoroether, which is an insulative and inert material, is used as a refrigerant, the optimum bubble nucleus size is in the range of submicron to about 100 μm in centerline average roughness. . Therefore, an uneven structure having the same size can be formed by performing machining using abrasive grains or sand blasting, or chemical treatment such as plating.

  In FIG. 5, the heat receiving region 140 and its peripheral region and the heat dissipation region 150 are provided with the rough surface region 240 (250). However, by forming the rough surface region 240 at least in the region including the heat receiving region 140, The effect of increasing the cooling performance is obtained. In addition, it is desirable that the region where the flow path wall 130 between the heat receiving region 140 and the heat radiation region 150 is formed does not form a rough surface region. The reason is that if a rough surface region exists in the region where the flow path wall 130 is formed, the gas-phase refrigerant may be condensed and liquefied before reaching the heat radiation region 150, and the heat radiation region 150 is efficiently used. This is because there is a risk of hindering heat dissipation.

[Third Embodiment]
Next, a third embodiment of the present invention will be described. FIG. 6 is a cross-sectional view showing a configuration of a flat plate cooling device 300 according to the third embodiment of the present invention, and shows the same cross section as FIG. The flat plate cooling apparatus 300 includes a first flat plate 111, a second flat plate 112 that faces the first flat plate 111, and a frame body portion 113 that connects the first flat plate 111 and the second flat plate 112. A flat plate container 110 is provided. A refrigerant 120 is sealed in the flat container 110. In addition, a flow path wall 130 that connects the first flat plate 111 and the second flat plate 112 and controls the flow path of the refrigerant 120 in the flat container 110 is provided inside the flat container 110.

  The flat container 110 has a heat receiving region 140 that is thermally connected to the heating element 500 disposed on at least one of the first flat plate 111 and the second flat plate 112. In addition, the flat container 110 has a heat dissipation region 150 that is thermally connected to the heat dissipation portion 600 disposed on at least one of the first flat plate 111 and the second flat plate 112. The heat radiation area 150 is configured to include a plurality of flow path plates 160 that constitute the groove-shaped flow path 162 that is the flow path of the refrigerant 120 in the heat radiation area 150.

  The configuration so far is the same as the flat plate cooling device 100 according to the first embodiment. The flat plate cooling device 300 according to the present embodiment is configured such that the heat receiving area 140 includes a plurality of plate-like portions 340 that promote circulation of the refrigerant 120 in the heat receiving area 140. Different from the device 100.

  The plate-like portion 340 can be formed in, for example, a fin shape, and has an effect of promoting convective heat transfer when the refrigerant bubbles generated in the heat receiving region 140 move to the heat radiating region 150 by buoyancy. Further, since the gas-liquid two-phase flow of the refrigerant is easily generated by the plate-like portion 340, the heat transport amount per volume can be increased. Here, the gas-liquid two-phase flow means that the gas phase and the liquid phase flow in a mixed state. Thus, according to the flat plate cooling device 300 of the present embodiment, the cooling performance can be further improved.

[Fourth Embodiment]
Next, a fourth embodiment of the present invention will be described. 7A and 7B are diagrams showing a configuration of a flat plate cooling device 400 according to the fourth embodiment of the present invention, in which FIG. 7A is a top perspective view, and FIG. (C) is the CC sectional view taken on the line in (a). The flat plate cooling device 400 according to the first embodiment in that the flat plate cooling device 400 further includes a heat dissipation container 450 disposed on at least one of the first flat plate 111 and the second flat plate 112 constituting the flat plate container 110. Different from the flat plate cooling device 100.

  The heat radiating container 450 includes a heat radiating part flow path 460 that constitutes a flow path for the refrigerant, and a heat radiating part introduction region 452 for introducing the refrigerant into the heat radiating part flow path 460. Here, the heat radiating portion introduction region 452 functions as a header or a footer with respect to the heat radiating portion flow path 460. Moreover, as shown in FIG.7 (c), it is good also as arrange | positioning the thermal radiation fin part 462 between the thermal radiation part flow paths 460. As shown in FIG. The heat radiation of the refrigerant flowing through the heat radiation portion flow path 460 can be further promoted by the heat radiation fin portion 462.

  In the flat plate cooling device 400, the heat radiating part introduction region 452 is provided not in the flat container 110 but in the heat radiating container 450. Therefore, the internal volume of the flat container 110 can be increased. As a result, since the saturated vapor pressure in the flat container 110 is reduced, the boiling point of the refrigerant can be lowered, and the cooling performance of the flat-type boiling cooling device can be further improved.

  As shown in FIG. 7B, the two heat radiating portion introduction regions 452 functioning as a header and a footer are formed on a straight line connecting the heat receiving region 140 and the heat radiating region 150 (straight line DD in FIG. 7B). Alternatively, they may be arranged at positions that are asymmetric with respect to each other. In this case, a flow path through which the refrigerant circulates is formed by the heat radiation part flow path 460 and the flow path wall 130 between the heat radiation part introduction regions 452. As a result, the straight line DD connecting the heat receiving area 140 and the heat radiating area 150 is in an arrangement state that is perpendicular to the vertical direction (first arrangement state), in an arrangement state that is parallel to the vertical direction (second arrangement state), and It can also be used in an arrangement state of 1 and an arrangement state rotated by 180 degrees.

  The present invention is not limited to the above-described embodiment, and various modifications are possible within the scope of the invention described in the claims, and it is also included within the scope of the present invention. Not too long.

100, 200, 300, 400 Flat plate cooling device 110 Flat container 111 First flat plate 112 Second flat plate 113 Frame body portion 120 Refrigerant 130 Channel wall 132 Inclined wall portion 140 Heat receiving region 150 Heat radiation region 152 Refrigerant introduction region 160 Flow path plate 162 Grooved flow path 170 Flow path 240, 250 Rough surface area 340 Plate-shaped part 450 Radiation container 452 Heat radiation part introduction area 460 Heat radiation part flow path 462 Heat radiation fin part 500 Heating element 600 Heat radiation part

Claims (10)

A flat plate container comprising: a first flat plate; a second flat plate facing the first flat plate; and a frame body portion connecting the first flat plate and the second flat plate;
A refrigerant sealed in the flat container;
A flow path wall for connecting the first flat plate and the second flat plate and controlling the flow path of the refrigerant in the flat container,
The flat container includes a heat receiving region thermally connected to a heating element disposed on at least one of the first flat plate and the second flat plate, and at least one of the first flat plate and the second flat plate. A heat dissipating region that is thermally connected to the heat dissipating part disposed in the
The heat dissipation area has a plurality of flow path plates constituting flow paths of the refrigerant in the heat dissipation area. The heat dissipation area includes a refrigerant introduction area that is an area between an end portion in the extending direction of the flow path plate and the frame body portion,
The flat plate cooling device according to claim 1, wherein a cross-sectional area perpendicular to the extending direction of the refrigerant introduction region is larger than a sum of cross-sectional areas perpendicular to the extending direction of each flow path constituted by the flow path plates. The flat plate type according to claim 1, wherein the flow path plate is disposed to be inclined with respect to a direction perpendicular to a straight line that connects the heat receiving region and the heat radiating region and is parallel to one side of the first flat plate. Cooling system. The flow path wall is disposed between the heat receiving area and the heat radiating area,
The cross-sectional shape by a plane parallel to the first flat plate has an inclined wall portion that is arranged to be inclined with respect to a straight line that connects the heat receiving region and the heat dissipation region and is parallel to one side of the first flat plate. The flat plate cooling device according to any one of 1 to 3. The flow path wall has a structure in which a cross-sectional shape by a plane parallel to the first flat plate is asymmetric with respect to a straight line connecting the heat receiving region and the heat radiating region and parallel to one side of the first flat plate. Item 5. The flat plate cooling device according to any one of items 1 to 4. The flat plate cooling device according to any one of claims 1 to 5, wherein the flat container includes a rough surface region having an uneven structure in the heat receiving region. The flat plate type cooling device according to any one of claims 1 to 6, wherein the flat container includes a rough surface region having an uneven structure in the heat dissipation region. The flat plate cooling device according to any one of claims 1 to 7, wherein the heat receiving region includes a plurality of plate-like portions that promote circulation of the refrigerant in the heat receiving region. A heat dissipation container disposed on at least one of the first flat plate and the second flat plate;
The heat dissipation container includes a heat dissipating part flow path constituting the flow path of the refrigerant,
The flat plate type cooling device according to any one of claims 1 to 8, further comprising a heat dissipating part introduction region that introduces the refrigerant into the heat dissipating part flow path. The flat plate cooling device according to claim 1,
A first arrangement state in which a linear axis connecting the heat receiving area and the heat radiating area is perpendicular to a vertical direction;
A method of using a flat plate type cooling apparatus, wherein the linear axis connecting the heat receiving area and the heat radiating area is switched between a second arrangement state parallel to the vertical direction.

Images