JP2010007893A - Evaporative cooling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an evaporative cooling device enabling successful heat transfer with boiling. <P>SOLUTION: The evaporative cooling device 10 includes a storage part 1 which has a heat receiving face 50 extended vertically and receiving heat of a heating element Z by a liquid refrigerant and stores the liquid refrigerant inside. The storage part 1 includes: a heat receiving passage 100 in which the liquid refrigerant passes from the lower side to the upper side and the heat receiving face 50 is arranged; a supply passage 110 to which the liquid refrigerant is supplied; and a partition part 400 for partitioning the inner space of the storage part 1 into the heat receiving passage 100 and the supply passage 110. The width on the upper side of a clearance between the face of the partition part 400 facing the heat receiving face 50 and the heat receiving face 50 is expanded. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a boiling cooling device using a refrigerant.

  The boiling cooling device is a device that cools a heating element using latent heat when a liquid refrigerant boils. For example, in a boiling cooling device disclosed in Japanese Patent Application Laid-Open No. 2003-42672 (Patent Document 1), a refrigerant container that stores a refrigerant therein and a heating element is attached to one surface thereof is assembled to the other surface of the refrigerant container. And a heat dissipation part. Further, the boiling cooling device includes a barrier section that partitions the inside of the refrigerant container into a heating element side flow path and a heat radiation section side flow path. The boiling cooling device realizes good refrigerant circulation on the assumption that both surfaces of the refrigerant container are used in an upright state.

In addition, the boiling cooling device disclosed in Japanese Patent Application Laid-Open No. 8-29041 (Patent Document 2) has a structure in which there is no barrier portion and the width of the cooling container increases toward the top. Since the width of the cooling container becomes wider toward the upper part, the generated bubbles do not interfere with the bubbles generated by the upper heating element.
JP 2003-42672 A JP-A-8-29041

  In the boiling cooling device, cooling is performed using boiling heat transfer. As shown in FIG. 5, boiling heat transfer has been confirmed to improve boiling heat conduction when the sense of the heat receiving surface 500 and the barrier portion 600 is narrow (for example, about 1 mm to 5 mm). This is because the bubble 700 is temporarily held by the barrier portion 600, and heat transfer in the portion of the microlayer 900 between the held bubble 700 and the heat receiving surface 500 is good, so that boiling heat conduction is improved. Has been speculated. However, if bubbles 700 generated by boiling of the refrigerant accumulate on upper heat receiving surface 500, there are too many upper air bubbles 700 and heat transfer failure of heat receiving surface 500 occurs.

  The boiling cooling device described in Patent Document 1 is provided with a barrier portion, which is provided only to separate the heating element side flow path and the heat dissipation section side flow path, and the distance between the heat receiving surface and the barrier section. It is not intended to improve the boiling heat transfer by reducing.

  Further, in Patent Document 2, the width of the refrigerant container is increased as it goes upward in order to suppress the interference of bubbles, but only the idea of increasing the width of the upper portion so as not to fill the bubbles is disclosed. There is no disclosure of how much distance between the heat receiving surface and the barrier portion should be.

  This invention is made | formed in view of such a situation, and it aims at providing the boiling cooling device in which favorable boiling heat transfer is performed.

  The boiling cooling device of the present invention has a heat receiving surface that extends in the vertical direction and receives the heat of the heating element by the liquid refrigerant, and includes an accommodating portion that accommodates the liquid refrigerant therein. And boil cooling having a heat receiving passage in which the heat receiving surface is disposed, a supply passage to which liquid refrigerant is supplied, and a partition that partitions the internal space of the housing portion into the heat receiving passage and the supply passage. It is an apparatus, Comprising: The upper side is widened by the clearance gap between the surface facing the heat receiving surface of a partition part, and a heat receiving surface, It is characterized by the above-mentioned.

  Due to the heat generated by the heating element, the refrigerant in the heat receiving passage boils and bubbles are generated. Bubbles generated on the lower side of the heat receiving surface rise upward in the refrigerant. The boiling cooling device of the present invention has a partition portion in the housing portion, and the gap between the surface facing the heat receiving surface of the partition portion and the heat receiving surface is widened on the upper side. It is possible to suppress coalescence with bubbles generated on the part side, and therefore, it is possible to suppress deterioration of heat conduction between the upper portion of the heat receiving surface and the refrigerant. In addition, by utilizing the fact that the flow of the refrigerant is formed by bubble buoyancy and bubble growth, a refrigerant flow path is formed in the refrigerant by natural convection flowing in one direction along the partitioning section along the heat receiving passage, the supply passage, and the heat receiving passage. I can do it.

  By forming such a refrigerant flow path, heat transfer of the entire heating element can be promoted regardless of whether it is above or below the heating element. Thereby, a favorable refrigerant circulation is realizable.

  At this time, the heating element may be attached with the heat conductive member interposed therebetween without being directly attached to the accommodating portion. Further, the liquid refrigerant may flow from the lower side to the upper side, the refrigerant boiling at the upper side may be opened to the atmosphere, and a new refrigerant may be supplied to the supply passage. It is good also as a structure which attaches a part and condenses the boiled refrigerant in a condensation part, and supplies it to a supply channel.

  Here, it is preferable that the surface facing the heat receiving surface of the partition portion is inclined so that the gap with the heat receiving surface is widened on the upper side. According to this, since a flow path can be formed along the inclined surface of a partition part, a refrigerant | coolant circulation can be performed more smoothly. It is not included in the present invention that only the surface of the partition portion that does not oppose the heat receiving surface is inclined so that the gap with the heat receiving surface widens on the upper side.

  Further, instead of the partition portion, the side wall portion of the housing portion where the heat receiving surface is formed may be inclined so that the gap between the surface facing the heat receiving surface of the partition portion and the heat receiving surface is widened on the upper side.

  Further, the heating element may be arranged in the heat receiving passage of the housing part. In that case, a heat receiving surface is formed on the surface of the heating element in the housing part. Therefore, the shape of the side surface of the heating element itself may be inclined such that the gap between the surface facing the heat receiving surface of the partition and the heat receiving surface is widened on the upper side.

  The heating element includes a first heating element attached to one side wall portion of the housing portion and a second heating element attached to the opposite side wall portion, and the housing portion heats the first heating body. A first partition that partitions the first heat receiving surface that receives the liquid refrigerant and the supply passage; and a second partition that separates the second heat receiving surface and the supply passage from which the liquid refrigerant receives heat from the second heating element. The upper side of the gap between the first heat receiving surface of the first partition portion and the first heat receiving surface and the gap between the second heat receiving surface of the second partition portion and the second heat receiving surface are widened on the upper side. It is preferable that

  There are heating elements on the opposite side walls of the housing part, and the upper side of the gap between each heat receiving surface where the liquid refrigerant receives the heat of each heating element and the surface facing the heat receiving surface of each partition is widened. Therefore, heat transfer can be further improved and heat transfer can be promoted. This is because boiling heat transfer is improved when boiling heat transfer is performed in a narrow gap. Further, since the heating elements are attached to both side walls, more heating elements can be cooled, and the efficiency is good.

  A plurality of heating elements may be attached to the side wall portion of the housing portion in the vertical direction. Even if a plurality of heating elements are attached to the side wall portion of the housing portion in the vertical direction, the heating elements can be cooled efficiently regardless of whether the heating element is above or below. It is also possible to mount heating elements with different heating densities side by side.

  Moreover, it is preferable that the clearance gap between the surface facing the heat receiving surface of a partition part, and a heat receiving surface is 5 mm or less in width. Boiling heat transfer is preferably performed in a narrow gap because heat transfer can be efficiently performed by boiling and vaporizing a small volume of refrigerant. The gap between the heat receiving surface and the surface facing the heat receiving surface of the partitioning portion is preferably 5 mm or less, more preferably 3 mm or less, in the widened area on the upper side. Moreover, it is preferable that it is 1-2 mm on the downward side.

  According to the boiling cooling device of the present invention, good boiling heat transfer can be performed.

Next, the present invention will be described in more detail with reference to embodiments. In the embodiment shown below, a condensing part is attached above the accommodating part, and the liquid refrigerant condensed in the condensing part is supplied to the supply passage. However, the present invention is not limited to this.
(First embodiment)
In the first embodiment, the boiling cooling device 10 is taken as an example. Hereinafter, the boiling cooling apparatus 10 will be described with reference to FIG. FIG. 1 is a schematic cross-sectional view of the boiling cooling device 10.

  As shown in FIG. 1, the boiling cooling device 10 includes a storage unit 1 and a condensing unit 2.

  The accommodating part 1 is a metal container having a rectangular parallelepiped cross section, in which refrigerant (for example, water, chlorofluorocarbons, etc.) is stored. The accommodating portion 1 includes a heat receiving passage 100, a supply passage 110, and a partition portion 400.

  The condensing part 2 is a metal container having a rectangular parallelepiped section, and includes a condensing pipe part 3 inside. The condensing part 2 is continued in the vertical direction of the accommodating part 1. A heating element Z is attached to the housing 1 on the outer surface of the vertical side wall. In FIG. 1, the heating element Z is attached to the outside of the housing portion 1, but may be attached to the inside of the housing portion 1.

  The refrigerant circulation is as follows. The refrigerant vapor boiled by receiving heat from the heating element Z on the heat receiving surface 50 flows upward in the heat receiving passage 100, is condensed in the condensing unit 2, and the condensed liquid flows into the supply passage 110, and the supply passage 110 receives heat. The refrigerant is returned to the passage 100.

  In the first embodiment, as shown in FIG. 1, the heat receiving passage 100 is surrounded by a side wall surface (four surfaces) including a vertical side wall surface to which the heating element Z of the housing portion 1 is attached and a partition portion 400. It is a part that was. The heating element Z is, for example, a semiconductor element.

  Here, the state shown in FIG. 1 is referred to as an upright state. That is, the vertical side wall surface to which the heating element Z of the housing part 1 is attached is perpendicular to the horizontal plane in the upright state. Note that the mounting position of the heating element Z is higher than the bottom surface of the housing portion 1. Hereinafter, a description will be given based on FIG.

  The partition part 400 provided inside the housing part 1 forms the side surface of the heat receiving passage 100 and partitions the internal space of the housing part 1 into the heat receiving passage 100 and the supply passage 110. The partition part 400 will be described later.

  The heat receiving passage 100 receives heat from the heating element Z, and the heat causes the refrigerant in the heat receiving passage 100 to boil. The boiling refrigerant vapor rises as shown by an arrow Y1 shown in FIG. The condensation unit 2 will be described later.

  The supply passage 110 is one side partitioned by the partition portion 400 inside the housing portion 1 and is located on the opposite side to the side wall surface to which the heating element Z is attached. The supply passage 110 is connected to the heat receiving passage 100 and arranged in parallel. The supply passage 110 communicates with the heat receiving passage 100 at the bottom. According to this, when the liquid level of the heat receiving passage 100 decreases due to boiling, the refrigerant in the supply passage 110 is supplied to the heat receiving passage 100 due to the pressure difference. Accordingly, the refrigerant flows in the direction of the arrow Y2 in the supply passage 110.

  The condensing part 2 is above the accommodating part 1 in the vertical direction. In FIG. 1, the inside of the condensing unit 2 communicates with the heat receiving passage 100 of the housing unit 1 on the right side and the supply passage 110 on the left side. In the first embodiment, the condensing part 2 has a rectangular parallelepiped shape that is wider than the rectangular parallelepiped shape of the accommodating part 1 above the accommodating part 1, and the accommodating part 1 is below the center in the width direction of the condensing part 2. Although it is located in, it is not restricted to this.

  The condensing pipe part 3 penetrates the condensing part 2, and the site | part located inside the condensing part 2 is comprised by the aggregate | assembly of several flat tubes. A refrigerant flows through the inside of the condensing pipe portion 3, and a refrigerant (cooling water or the like) flows through each flat tube via a header (not shown). That is, the condensing pipe unit 3 is accommodated in the condensing unit 2 and condenses the refrigerant vapor boiled in the heat receiving passage 100.

The condensing pipe part 3 is located above the accommodating part 1. The refrigerant condensed in the condensing pipe part 3 flows downward due to gravity and therefore flows into the inner bottom surface of the condensing part 2 or directly into the accommodating part 1.
The refrigerant that has fallen on the inner bottom surface then flows into the accommodating portion 1.

  The partition 400 is plate-shaped and has an upper partition that extends in parallel to the vertical side wall surface of the housing 1 and a constant portion that is perpendicular to the vertical side of the housing 1 from the lower end of the upper partition. It consists of a lower partition portion protruding at a distance and further bent downward at a right angle and extending parallel to the side surface in the vertical direction.

  In the first embodiment, the width a1 of the gap between the heat receiving surface 50 and the surface facing the heat receiving surface 50 of the upper partition portion of the partition portion 400 is the surface and the heat receiving surface facing the heat receiving surface 50 of the lower partition portion of the partition 400. The surface of the partition 400 facing the heat receiving surface 50 is wider than the width b1 of the gap between the heat receiving surface 50 and the upper side of the heat receiving surface 50. The width a1 is preferably 5 mm or less. In particular, the width a1 is preferably about 2 to 3 mm, and the width b1 is preferably about 1 to 2 mm.

  The gap between the heat receiving surface 50 and the surface facing the heat receiving surface 50 of the partition portion 400 is widened on the upper side of the heat receiving surface 50, so that bubbles generated below the heat receiving surface 50 are expanded above the partition portion 400. Since it can rise along the partition surface, it becomes difficult to interfere with bubbles generated above the heat receiving surface 50, and heat transfer failure of the upper portion of the heat receiving surface 50 occurs due to the generated bubbles collecting on the upper portion of the heat receiving surface 50. Can be suppressed. As a result, it is possible to suppress burnout (rapid increase in temperature) of the heating element.

  Burnout is considered to be caused by hydrodynamic instability between the movement of bubbles that separate and merge and the liquid flow toward the heat generating surface or the heat receiving surface in contact with the heat generating body instead of the bubbles. Further, it is empirically required that burnout is less likely to occur as the acceleration applied to the heating element surface or the heat receiving surface increases. Therefore, the gap between the heat receiving surface 50 and the surface of the partition 400 facing the heat receiving surface 50 should be narrowed to increase the pressure of the liquid flow and increase the acceleration of the liquid flow toward the heat receiving surface.

  Furthermore, according to the amount of bubbles, the distance between the surface opposite to the heat receiving surface of the partition and the heat receiving surface is set to an appropriate distance that can appropriately hold the bubbles on both the upper side and the lower side. Heat can be improved.

  Thus, according to the boiling cooling device 10 described in the first embodiment, good boiling heat transfer can be performed.

(Second Embodiment)
In the second embodiment, the boiling cooling device 11 is taken as an example. Hereinafter, the boiling cooling device 11 will be described with reference to FIG. FIG. 2 is a schematic cross-sectional view of the boiling cooling device 11. The boiling cooling device 11 is the same as the boiling cooling device 10 described in the first embodiment except that the shape of the partition 401 is different. Therefore, the description of the same components as those described in the first embodiment will be omitted, and different portions will be described below.

  As shown in FIG. 2, the boiling cooling device 11 includes a storage unit 1 and a condensing unit 2. The accommodating portion 1 includes a heat receiving passage 101, a supply passage 111, and a partition portion 401.

  The partition part 401 is plate-shaped and is inclined with respect to the vertical direction. Although the inclination angle is not particularly limited, the surface of the partitioning portion 401 facing the heat receiving surface 51 is inclined such that the gap with the heat receiving surface 51 is widened on the upper side of the heat receiving surface 51. In the second embodiment, the gap width a2 between the upper side of the surface of the partition 401 facing the heat receiving surface 51 and the heat receiving surface 51 is the lower side of the surface of the partition 401 facing the heat receiving surface 51 and the heat receiving surface 51. The width a2 is preferably 5 mm or less. In particular, the width a2 is preferably about 2 to 3 mm, and the width b2 is preferably about 1 to 2 mm.

  The gap between the heat receiving surface 51 and the surface of the partition portion 401 facing the heat receiving surface 51 is inclined so that the upper side of the heat receiving surface 51 is widened, so that bubbles generated below the heat receiving surface 51 are separated from the partition portion 401. Since it can rise along the inclined surface, it becomes difficult to interfere with bubbles generated above the heat receiving surface 51, and the generated bubbles accumulate on the upper surface of the heat receiving surface 51, resulting in poor heat transfer on the upper surface of the heat receiving surface 51. Can be suppressed. As a result, it is possible to suppress burnout (rapid increase in temperature) of the heating element.

  Thus, according to the boiling cooling device 11 described in the second embodiment, good boiling heat transfer can be performed.

  Moreover, in this 2nd Embodiment, although the partition part 401 inclines, the side wall part of the accommodating part 1 in which a heat receiving surface is formed, the clearance gap between the surface facing a heat receiving surface of a partition part, and a heat receiving surface is an upper side. It may be inclined so as to widen. Further, the heating element Z may be arranged inside the side wall surface of the housing portion 1, and in this case, a heat receiving surface is formed on the surface of the heating element Z. At that time, the shape of the heat receiving surface of the heat generating element Z may be a shape that is inclined so that the gap between the surface facing the heat receiving surface of the partitioning portion and the heat receiving surface is widened on the upper side.

(Third embodiment)
In the third embodiment, the boiling cooling device 12 is taken as an example. Hereinafter, the boiling cooling device 12 will be described with reference to FIG. FIG. 3 is a schematic cross-sectional view of the boiling cooling device 12. In the boiling cooling device 12, the first heating element Z <b> 1 and the second heating element Z <b> 2 are respectively attached to the opposing side wall surfaces of the housing portion 1.

  As shown in FIG. 3, the boiling cooling device 12 includes a storage unit 1 and a condensing unit 2. The accommodating portion 1 includes a first heat receiving passage 102, a second heat receiving passage 103, a supply passage 112, a first partition portion 410 and a second partition portion 420.

  The first heating element Z1 and the second heating element Z2 are attached to the housing portion 1 on one side wall surface and the surface facing the side wall surface. In FIG. 3, the first heating element Z <b> 1 and the second heating element Z <b> 2 are attached to the outside of the housing part 1, but may be attached to the inside of the housing part 1.

  The refrigerant circulation is as follows. The refrigerant vapor boiled by receiving heat from the first heating element Z1 in the first heat receiving passage 102 and the refrigerant vapor boiled by receiving heat from the second heating element Z2 in the second heat receiving passage 103 are condensed in the condensing unit 2 and condensed. The liquid flows into the supply passage 112, and the supply passage 112 returns the refrigerant to the first heat receiving passage 102 and the second heat receiving passage 103.

  In the third embodiment, as shown in FIG. 3, the first heat receiving passage 102 is a side surface (four surfaces) including a side wall surface to which the first heating element Z <b> 1 of the housing portion 1 is attached and the first partition portion 410. ), And the second heat receiving passage 103 includes, as shown in FIG. 3, a side surface including a side wall surface to which the second heating element Z2 of the housing portion 1 is attached and the second partition portion 420 ( It is a part surrounded by (4 sides).

  The first partition 410 provided inside the housing 1 forms a side surface of the first heat receiving passage 102 and partitions the internal space of the housing 1 into the first heat receiving passage 102 and the supply passage 112. The second partition 420 forms a side surface of the second heat receiving passage 103 and partitions the internal space of the housing portion 1 into the second heat receiving passage 103 and the supply passage 112. The partitions 410 and 420 will be described later.

  The first heat receiving passage 102 receives the heat of the first heat generating element Z1, and the refrigerant in the first heat receiving passage 102 boils due to the heat. The boiling refrigerant vapor rises as shown by an arrow Y1 shown in FIG. The second heat receiving passage 103 receives the heat of the second heating element Z2, and the heat causes the refrigerant in the second heat receiving passage 103 to boil. The boiling refrigerant vapor rises as shown by an arrow Y3 shown in FIG.

  The supply passage 112 is partitioned by the first partitioning portion 410 and the second partitioning portion 420 inside the accommodating portion 1, and is connected to the first heat receiving passage 102 and the second heat receiving passage 103 and is arranged in parallel with each other. Yes. The inside of the supply passage 112 communicates with the inside of the first heat receiving passage 102 and the second heat receiving passage 103 at the bottom. According to this, when the liquid level of the first heat receiving passage 102 and the second heat receiving passage 103 decreases due to boiling, the refrigerant in the supply passage 112 is supplied to the first heat receiving passage 102 and the second heat receiving passage 103 due to the pressure difference. . Accordingly, the refrigerant flows in the direction of the arrow Y2 in the supply passage 112.

  Since the condensing part 2 and the condensing pipe 3 are the same as that of 1st Embodiment, description is abbreviate | omitted.

  The 1st partition part 410 and the 2nd partition part 420 are plate shape, and incline with respect to the perpendicular direction. Although the inclination angle is not particularly limited, the first partition 410 has a gap between the surface of the first partition 410 facing the first heat receiving surface 52 and the first heat receiving surface 52 widened above the first heat receiving surface 52. Inclined in the direction that is. The second partition 420 is inclined such that the gap between the surface of the second partition 420 facing the second heat receiving surface 53 and the second heat receiving surface 53 is widened on the upper side of the second heat receiving surface 53. The

  In the third embodiment, the width a3 of the gap between the upper side of the surface facing the first heat receiving surface 52 of the first partition 410 and the first heat receiving surface 52 is the first heat receiving surface 52 of the first partition 410. Is larger than the width b3 of the gap between the lower side of the surface opposite to the first heat receiving surface 52 and the width a3 is preferably 5 mm or less. In particular, the width a3 is preferably about 2 to 3 mm, and the width b3 is preferably about 1 to 2 mm. Although not illustrated in the figure, the positional relationship between the surface facing the second heat receiving surface 53 of the second partition 420 and the second heat receiving surface 53 is also the surface facing the first heat receiving surface 52 of the first partition 410. And the relationship between the first heat receiving surface 52 and the first heat receiving surface 52.

  The first heat receiving surface 52 is configured such that the gap between the surface of the first partition 410 facing the first heat receiving surface 52 and the first heat receiving surface 52 is inclined so that the upper side of the first heat receiving surface 52 is widened. Since the bubbles generated below the first partitioning portion 410 can rise along the inclined surface of the first partitioning portion 410, it is difficult to interfere with the bubbles generated above the first heat receiving surface 52, and the generated bubbles are located above the first heat receiving surface 52. It is possible to suppress the occurrence of poor heat transfer in the upper part of the first heat receiving surface 52 by accumulating in. As a result, it is possible to suppress burnout (rapid increase in temperature) of the heating element. The same applies to the second partition 420 and the second heat receiving surface 53.

  Thus, according to the boiling cooling device 12 described in the third embodiment, good boiling heat transfer can be performed even if the heating elements are attached to both surfaces of the housing portion.

(Fourth embodiment)
In the fourth embodiment, the boiling cooling device 13 is taken as an example. Hereinafter, the boiling cooling device 13 will be described with reference to FIG. FIG. 4 is a schematic cross-sectional view of the boiling cooling device 13. In the boiling cooling device 13, a third heating element Z11 and a fourth heating element Z12 are respectively attached to one side wall surface of the housing portion 1 with a vertical space therebetween, and a fifth heating element Z21 and a sixth heating element Z22. Are respectively attached to the other side wall surface of the accommodating portion 1 with an interval in the vertical direction.

  As shown in FIG. 4, the boiling cooling device 13 includes a housing unit 1 and a condensing unit 2. The accommodating portion 1 includes a third heat receiving passage 104, a fourth heat receiving passage 105, a supply passage 113, a third partition portion 411, and a fourth partition portion 421.

  In the accommodating portion 1, the third heat generating element Z11 and the fourth heat generating element Z12 are spaced apart vertically on one side of the vertical side surface, and the fifth heat generating element Z21 and the sixth heat generating element are spaced apart vertically on the other surface. The body Z22 is attached. In FIG. 4, each heating element is attached to the outside of the housing portion 1, but may be attached to the inside of the housing portion 1.

  The third partition 411 provided inside the housing part 1 forms a side surface of the third heat receiving passage 104 and partitions the internal space of the housing part 1 into the third heat receiving passage 104 and the supply passage 113. The fourth partition portion 421 forms a side surface of the fourth heat receiving passage 105 and partitions the internal space of the housing portion 1 into the fourth heat receiving passage 105 and the supply passage 113.

  The third partition portion 411 is plate-shaped, and the surfaces facing the third heat receiving surface 54 and the fourth heat receiving surface 56 are inclined with respect to the vertical direction, and the other portions are parallel to the side wall surface of the housing portion 1. ing. The angle of inclination is not particularly limited, but the surface of the third partition 411 facing the third heat receiving surface 54 is inclined such that the gap with the third heat receiving surface 54 is widened above the third heat receiving surface 54. . Further, the surface of the third partition 411 facing the fourth heat receiving surface 56 is inclined such that the gap with the fourth heat receiving surface 56 is widened on the upper side of the fourth heat receiving surface 56. The same applies to the fourth partition 421.

  In the fourth embodiment, the width a4 of the gap between the upper side of the third partition 411 facing the third heat receiving surface 54 and the third heat receiving surface 54 is opposed to the fourth heat receiving surface 56 of the third partition 411. It is larger than the width b4 of the gap between the lower side of the surface and the fourth heat receiving surface 56, and the width a4 is preferably 5 mm or less. In particular, the width a4 is preferably about 2 to 3 mm, and the width b4 is preferably about 1 to 2 mm. Although not shown in the drawing, the surface facing the fifth heat receiving surface 55 of the fourth partition portion 421, the surface facing the fifth heat receiving surface 55 and the sixth heat receiving surface 57 of the fourth partition portion 421, and the sixth heat receiving surface 57 The positional relationship between the surface of the third partition 411 facing the third heat receiving surface 54, the surface of the third heat receiving surface 54 and the surface of the third partition 411 facing the fourth heat receiving surface 56, and the fourth heat receiving surface 56. Same as relationship.

  The gap between the upper side of the surface of the third partitioning portion 411 facing the third heat receiving surface 54 and the third heat receiving surface 54 is inclined so that the upper side of the third heat receiving surface 54 is widened. Since the bubbles generated below the heat receiving surface 56 can rise along the inclined surface of the third partitioning portion 411, it is difficult to interfere with the bubbles generated above the third heat receiving surface 54, and the generated bubbles are the third heat receiving surface. It is possible to suppress the occurrence of heat transfer failure at the upper part of the third heating element Z11 due to the accumulation at the upper part of 54. As a result, it is possible to suppress burnout (rapid increase in temperature) of the heating element. The same applies to the fourth partition 421 and the fifth heating element Z21.

  In the fourth embodiment, a plurality of heating elements are attached in the vertical direction to the side wall of the housing. And the surface of the partition facing the heating element is inclined in the vertical direction, and the other partition surface is parallel to the side surface of the accommodating section in the vertical direction. Even if they are separated in the vertical direction, an appropriate inclination can be set for each heating element. As described above, according to the boiling cooling device 13 described in the fourth embodiment, good boiling heat transfer can be performed even when a plurality of heating elements are attached at intervals in the vertical direction.

  Moreover, it is good also as a structure which arrange | positions the heat generating body Z in a heat receiving path in each embodiment (immersion method). Even in this case, the same effect as described above can be obtained. In addition, when the heat generating body Z is an electronic component such as a semiconductor element, it is preferable to use an insulating refrigerant.

It is a schematic cross section of the boiling cooling device 10 which is 1st Embodiment of this invention. It is a schematic cross section of the boiling cooling device 11 which is 2nd Embodiment of this invention. It is a schematic cross section of the boiling cooling device 12 which is 3rd Embodiment of this invention. It is a schematic cross section of the boiling cooling device 13 which is 4th Embodiment of this invention. It is explanatory drawing of boiling heat transfer.

Explanation of symbols

1: accommodating part, 2: condensing part, 3: condensing pipe part,
100: heat receiving passage, 110: supply passage, 400: partition, Z: heating element

Claims (5)

It has a heat receiving surface that extends in the vertical direction and receives the heat of the heating element by the liquid refrigerant, and includes an accommodating portion that accommodates the liquid refrigerant inside,
The housing portion includes a heat receiving passage in which the liquid refrigerant flows from below to above and the heat receiving surface is disposed, a supply passage to which the liquid refrigerant is supplied, and an internal space of the housing portion through the heat receiving passage. A boiling cooling device having a partition section that partitions into the supply passage,
The boiling cooling device characterized in that the upper side of the gap between the surface of the partition portion facing the heat receiving surface and the heat receiving surface is widened.   2. The boiling cooling device according to claim 1, wherein a surface of the partition portion facing the heat receiving surface is inclined such that a gap with the heat receiving surface is widened on an upper side. The heating element consists of a first heating element attached to one side wall of the housing part and a second heating element attached to the other opposite side wall,
The accommodating portion includes a first partition for partitioning the supply passage from a first heat receiving surface where the liquid refrigerant receives heat from the first heating element, and a second heat receiving surface where the liquid refrigerant receives heat from the second heating element. And a second partition that partitions the supply passage,
The gap between the first heat receiving surface of the first partition part and the first heat receiving surface and the gap between the second heat receiving surface of the second partition part and the second heat receiving surface are as follows: The boiling cooling device according to claim 1 or 2, wherein both upper sides are widened.   The boiling cooling device according to any one of claims 1 to 3, wherein a plurality of the heating elements are attached to a side wall portion of the housing portion in a vertical direction.   The boiling cooling device according to any one of claims 1 to 4, wherein a gap between a surface of the partition portion facing the heat receiving surface and the heat receiving surface is 5 mm or less.

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