CN106445037A - Partial immersion type liquid cooling server cooling system - Google Patents
Partial immersion type liquid cooling server cooling system Download PDFInfo
- Publication number
- CN106445037A CN106445037A CN201611072263.9A CN201611072263A CN106445037A CN 106445037 A CN106445037 A CN 106445037A CN 201611072263 A CN201611072263 A CN 201611072263A CN 106445037 A CN106445037 A CN 106445037A
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- CN
- China
- Prior art keywords
- oil
- liquid
- cooling system
- chip
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 41
- 239000007788 liquid Substances 0.000 title claims abstract description 33
- 238000007654 immersion Methods 0.000 title abstract description 6
- 239000012530 fluid Substances 0.000 claims description 15
- 239000000126 substance Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 238000012546 transfer Methods 0.000 abstract description 3
- 238000004378 air conditioning Methods 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 230000035900 sweating Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a partial immersion type liquid cooling server cooling system which comprises a server case, a case cover, cooling set fins, a heat radiator, an oil collecting tank and an oil pump. The case cover covers the case to form a sealed cavity. A main board connected with a chip is arranged in the cavity; an oil inlet and an oil outlet communicated with the cavity are formed in the two sides of the case respectively; a liquid dividing box is arranged on the side, close to the oil inlet, in the case; the oil outlet is sequentially communicated with the heat radiator, the oil collecting tank and the oil pump through an oil pipeline, and the other end opening of the oil pipeline is communicated with the oil inlet to form a circulating closed loop. The case is filled with a liquid medium, and the main board, the chip and the cooling set fins are immersed in the liquid medium. The oil outlet is located below the liquid level of the liquid medium. The partial immersion type liquid cooling server cooling system is high in heat transfer efficiency, the effects of energy saving and environmental protection are achieved, local flowing cooling on the chip and other heating elements can be effectively achieved, cooling is easy, the heating chip can be cooled more effectively, and meanwhile cost is reduced.
Description
Technical field
The present invention relates to the cooling field of electronic device, more particularly, to a kind of partially submerged liquid-cooled suit business device cooling
System.
Background technology
At present in server component a large amount of using integrated circuit it is well known that high temperature is the formidable enemy of integrated circuit, not only can
Lead to system operation unstable, service life shortens, it could even be possible to making some parts burn.The radiating of integrated chip is main at present
By arranging radiator on integrated chip top, radiator contacts absorption heat with heat generating components surface, then passes through fan strong
Cross-ventilation processed, heat is delivered at a distance by air, to complete the radiating of server.Current heat dissipating method exists following
Shortcoming：
1st, the heat that in server, heater element produces mainly is taken away by cross-ventilation, and the heat-conducting effect of air is relatively
Difference, wants to reach the preference temperature of server work, the ambient temperature that server is placed requires at 25 DEG C about；Due to electronics device
Part needs insulation protection, and in order to prevent electronic device surface sweating, the humidity of air needs to control in optimum range, thus leading
Cause the utilization rate of air-conditioning high, greatly, effects of energy conservation and environmental protection is poor for energy consumption.
2nd, server internal radiator needs to carry out forced air convection cooling using fan, not only increases fan work(
Consumption, and noise raising, the use environment of impact server.Because the use environment requirement of electronic device is dustless, using air
Cooling requires very high to the cleannes of air.
3rd, in order to ensure insulating electronic device, simultaneously non-direct contact between server internal radiator and heater, but
Connected by heat-conducting silicone grease or directly hanging, so considerably increase thermal contact resistance, weaken heat-transfer effect.
Content of the invention
The device cooling system it is an object of the invention to provide a kind of partially submerged liquid-cooled suit is engaged in, solves existing radiating mode
The problem that energy consumption is big, radiating effect is bad.
For solving above-mentioned technical problem, the present invention adopts the following technical scheme that：
A kind of present invention partially submerged liquid-cooled suit be engaged in device cooling system, include machine box for server, case lid, radiate pack,
Radiator, oil sump tank and oil pump；Described case lid covers the cavity forming a closing on described cabinet；It is connected with chip
Mainboard is arranged in described cavity；Described radiating pack is arranged on above described chip；Described cabinet both sides offer respectively with
The oil-in of described cavity connection and oil-out；In described cabinet, described oil-in side is provided with a point liquid box；Described go out
Hydraulic fluid port is sequentially communicated described radiator, oil sump tank and oil pump, another port in described oil pipe road and institute by oil pipe road
State oil-in connection, form circulation closed circuit；It is filled with liquid working substance, described liquid working substance is by described mainboard, core in described cabinet
Piece and radiating pack submergence；Described oil-out is located at below described liquid working substance liquid level.
Further, described mainboard is arranged on described cabinet bottom by support, has gap and cabinet bottom between.
Further, it is provided with filter between described oil sump tank and described oil pump.
Further, fitted with described chip in the connection end of described radiating pack, and the radiating end of radiating pack is radiating
Raised.
Further, the material of described radiating pack is metal.
Further, described radiator is air-cooled radiator.
Further, described radiator is water-filled radiator.
Further, described liquid working substance is fluid.
Compared with prior art, the Advantageous Effects of the present invention are as follows：
The cooling system of the present invention, because the specific heat capacity of the specific heat ratio air of cooling working medium is big, liquid-cooling heat radiation efficiency high
In air-cooled, and based on cooling working medium and the heater element directly contacts such as chip, thermal resistance almost goes to zero, and heat transfer efficiency is high；Whole
Only have the power consumption of oil pump and oil cooling radiator in system system, substantially reduce compared with the air conditioning energy consumption of traditional heat sinks, realize section
The effect of energy environmental protection；Using half immersion liquid cooling system, one side cooling working medium and euthermic chip are fully contacted, can be effective
For the local flow cooling of the heater elements such as chip, and easy samming, compared with non-immersion, cooling working medium and heat generating core
Piece extends time of contact, is conducive to euthermic chip more efficiently to radiate, compared with overall immersion, the consumption of cooling working medium is bright
Aobvious minimizing, advantageously reduces overall weight, simultaneously cost-effective.
Brief description
The invention will be further described for explanation below in conjunction with the accompanying drawings.
Fig. 1 is partially submerged liquid-cooled suit business device cooling system structure schematic diagram of the present invention；
Fig. 2 is cabinet inside structural representation；
Description of reference numerals：1st, cabinet；101st, case lid；102nd, oil-in；103rd, divide liquid box；104th, mainboard；105th, chip；
106th, radiate pack；107th, oil-out；2nd, oil pipe road；3rd, radiator；4th, oil sump tank；5th, filter；6th, oil pump；7th, cavity；
8th, liquid working substance；9th, support.
Specific embodiment
As shown in Figure 1-2, a kind of partially submerged liquid-cooled suit is engaged in device cooling system, including machine box for server 1, case lid 101,
Radiating pack 106, radiator 3, oil sump tank 4 and oil pump 6.Described case lid 101 covers on described cabinet 1, forms a closing
Cavity 7.The mainboard 104 being connected with chip 105 is heater element, and lower end mounting bracket 9 is fixed on cabinet bottom, with cabinet 1
Between bottom, there is gap, so that chip 105 is all surrounded by fluid with mainboard 104, endothermic effect is more preferable.Described radiating pack 106
Connection end be fitted in above described chip 105 by heat-conducting silicone grease, radiating pack radiating end be projection, described radiating pack
106 material can be metal, increase thermal conductivity, and this specific embodiment protrusions are strip, equidistantly arrange, increase and lead
The area of dissipation of the contact of deep fat liquid；Annular protrusion can certainly be adopted, by circumferential array.Described cabinet 1 both sides are opened respectively
It is provided with the oil-in 102 connecting with described cavity 7 and oil-out 107, near described oil-in 102 side peace in described cabinet 1
Equipped with a point liquid box 103, make to enter in cabinet 1 from the heat conduction fluid that oil-in 102 is come in by point liquid of point liquid box 103, this reality
Applying the liquid working substance 8 that example adopted is heat conduction fluid, and described mainboard 104, chip 105 and radiating pack 106 are soaked by heat conduction fluid
Not yet, described oil-out 107 is located at below described liquid working substance 8 liquid level, and oil-out 107 is specifically located at the non-top of case side wall
End, can be the middle part of case side wall, to ensure that heat conduction fluid will not be full of whole cabinet, the use of minimizing heat conduction fluid
Amount, advantageously reduces overall weight, simultaneously cost-effective.Described oil-out 107 is sequentially communicated described radiating by oil pipe road 2
Device 3, oil sump tank 4, filter 5 and oil pump 6, another port in described oil pipe road 2 is connected with described oil-in 102, is formed
Circulation is closed circuit, after heat conduction fluid absorbs heat, flows out from oil-out 107, radiates through radiator 3, flows in oil sump tank 4, oil pump 6
Heat conduction fluid is drawn through filter 5 impurity screening, leads back in cabinet 1 and continue heat absorption, thus completing a radiating circulation.
Described radiator 3 in above-described embodiment can be air-cooled radiator or water-filled radiator.
The cooling system of the present invention can do cabinet and case lid, to server enclosure using light weight, the material of low cost
Part is changed little, so rack assembling also has the advantage of compatibility, the oil circuit feed system of employing is than air-conditioning (or cooler
Group) simply it is easy to changing and keeping in repair.
The course of action of the present invention is as follows：
When cooling system does not work, heat conduction fluid is stored in oil sump tank；After start-up of cooling system, leading in oil sump tank
Deep fat liquid is transported in point liquid box through oil-in by the suction of oil pump, and after undue liquid box, conduction oil collection coalescence is diverted to machine
In case, until oil mass being capable of radiating pack in submergence server enclosure, mainboard, chip and other heater element；Here
During, heat conduction fluid produces heat exchange with heater element, completes diabatic process, subsequently, the heat conduction fluid after heating is through going out
Hydraulic fluid port flows into oil pipe road, is again back to oil sump tank, so circulates after radiator cooling.
Embodiment described above is only that the optimal way to the present invention is described, and not the scope of the present invention is carried out
Limit, on the premise of without departing from design spirit of the present invention, those of ordinary skill in the art make to technical scheme
Various modifications and improvement, all should fall into claims of the present invention determination protection domain in.
Claims (8)
1. a kind of partially submerged liquid-cooled suit business device cooling system it is characterised in that：Including machine box for server (1), case lid
(101), radiating pack (106), radiator (3), oil sump tank (4) and oil pump (6)；Described case lid (101) covers in described cabinet
(1) on, form the cavity (7) of a closing；The mainboard (104) being connected with chip (105) is arranged in described cavity (7)；Institute
State radiating pack (106) to be arranged on above described chip (105)；Described cabinet (1) both sides offer and described cavity (7) respectively
The oil-in (102) of connection and oil-out (107)；In described cabinet (1), described oil-in (102) side is provided with a point liquid
Box (103)；Described oil-out (107) is sequentially communicated described radiator (3), oil sump tank (4) and oil pump by oil pipe road (2)
(6), another port of described oil pipe road (2) is connected with described oil-in (102), forms circulation closed circuit；Described cabinet (1)
Inside it is filled with liquid working substance (8), described mainboard (104), chip (105) and radiating pack (106) are soaked by described liquid working substance (8)
Not yet；Described oil-out (107) is located at below described liquid working substance (8) liquid level.
2. partially submerged liquid-cooled suit according to claim 1 business device cooling system it is characterised in that：Described mainboard
(104) described cabinet (1) bottom is arranged on by support (9), and cabinet (1) bottom between, there is gap.
3. partially submerged liquid-cooled suit according to claim 1 business device cooling system it is characterised in that：Described oil sump tank
(4) it is provided with filter (5) and described oil pump (6) between.
4. partially submerged liquid-cooled suit according to claim 1 business device cooling system it is characterised in that：Described radiating pack
(106) fitted with described chip (105) in connection end, the radiating end of radiating pack is projection.
5. partially submerged liquid-cooled suit according to claim 4 business device cooling system it is characterised in that：Described radiating pack
(106) material is metal.
6. according to claim 1-5 partially submerged liquid-cooled suit business device cooling system it is characterised in that：Described radiator
(3) it is air-cooled radiator.
7. according to claim 1-5 partially submerged liquid-cooled suit business device cooling system it is characterised in that：Described radiator
(3) it is water-filled radiator.
8. according to claim 1-5 partially submerged liquid-cooled suit business device cooling system it is characterised in that：Described liquid work
Matter (8) is fluid.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611072263.9A CN106445037B (en) | 2016-11-29 | 2016-11-29 | Partial immersion type liquid cooling server cooling system |
| PCT/CN2017/074712 WO2018098911A1 (en) | 2016-11-29 | 2017-02-24 | Partial immersion liquid-cooling system for cooling server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611072263.9A CN106445037B (en) | 2016-11-29 | 2016-11-29 | Partial immersion type liquid cooling server cooling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106445037A true CN106445037A (en) | 2017-02-22 |
| CN106445037B CN106445037B (en) | 2023-10-24 |
Family
ID=58219922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611072263.9A Active CN106445037B (en) | 2016-11-29 | 2016-11-29 | Partial immersion type liquid cooling server cooling system |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106445037B (en) |
| WO (1) | WO2018098911A1 (en) |
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| US20170064862A1 (en) * | 2015-08-28 | 2017-03-02 | Mark Miyoshi | Immersion cooling system with low fluid loss |
| CN107203253A (en) * | 2017-06-30 | 2017-09-26 | 广东合新材料研究院有限公司 | A kind of contact active Phase cooling structure and passive Phase cooling structure |
| CN107577314A (en) * | 2017-09-25 | 2018-01-12 | 北京丰联奥睿科技有限公司 | A kind of liquid immersion type server cooling system |
| CN107748609A (en) * | 2017-11-26 | 2018-03-02 | 湖南匡楚科技有限公司 | Main frame oil injection type radiator |
| CN108089682A (en) * | 2018-01-08 | 2018-05-29 | 北京荷云达世科技有限公司 | A kind of efficiently integrated cloud computer cooling system |
| WO2018098911A1 (en) * | 2016-11-29 | 2018-06-07 | 广东合一新材料研究院有限公司 | Partial immersion liquid-cooling system for cooling server |
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| CN106445037B (en) | 2023-10-24 |
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