CN106445037A - Partial immersion type liquid cooling server cooling system - Google Patents

Partial immersion type liquid cooling server cooling system Download PDF

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Publication number
CN106445037A
CN106445037A CN201611072263.9A CN201611072263A CN106445037A CN 106445037 A CN106445037 A CN 106445037A CN 201611072263 A CN201611072263 A CN 201611072263A CN 106445037 A CN106445037 A CN 106445037A
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CN
China
Prior art keywords
oil
liquid
cooling system
chip
cooling
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Granted
Application number
CN201611072263.9A
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Chinese (zh)
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CN106445037B (en
Inventor
王伟
吕松浩
黎汉华
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Guangdong Xijiang Data Technology Co ltd
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Guangdong Heyi New Material Institute Co Ltd
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Priority to CN201611072263.9A priority Critical patent/CN106445037B/en
Publication of CN106445037A publication Critical patent/CN106445037A/en
Priority to PCT/CN2017/074712 priority patent/WO2018098911A1/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a partial immersion type liquid cooling server cooling system which comprises a server case, a case cover, cooling set fins, a heat radiator, an oil collecting tank and an oil pump. The case cover covers the case to form a sealed cavity. A main board connected with a chip is arranged in the cavity; an oil inlet and an oil outlet communicated with the cavity are formed in the two sides of the case respectively; a liquid dividing box is arranged on the side, close to the oil inlet, in the case; the oil outlet is sequentially communicated with the heat radiator, the oil collecting tank and the oil pump through an oil pipeline, and the other end opening of the oil pipeline is communicated with the oil inlet to form a circulating closed loop. The case is filled with a liquid medium, and the main board, the chip and the cooling set fins are immersed in the liquid medium. The oil outlet is located below the liquid level of the liquid medium. The partial immersion type liquid cooling server cooling system is high in heat transfer efficiency, the effects of energy saving and environmental protection are achieved, local flowing cooling on the chip and other heating elements can be effectively achieved, cooling is easy, the heating chip can be cooled more effectively, and meanwhile cost is reduced.

Description

A kind of partially submerged liquid-cooled suit business device cooling system
Technical field
The present invention relates to the cooling field of electronic device, more particularly, to a kind of partially submerged liquid-cooled suit business device cooling System.
Background technology
At present in server component a large amount of using integrated circuit it is well known that high temperature is the formidable enemy of integrated circuit, not only can Lead to system operation unstable, service life shortens, it could even be possible to making some parts burn.The radiating of integrated chip is main at present By arranging radiator on integrated chip top, radiator contacts absorption heat with heat generating components surface, then passes through fan strong Cross-ventilation processed, heat is delivered at a distance by air, to complete the radiating of server.Current heat dissipating method exists following Shortcoming:
1st, the heat that in server, heater element produces mainly is taken away by cross-ventilation, and the heat-conducting effect of air is relatively Difference, wants to reach the preference temperature of server work, the ambient temperature that server is placed requires at 25 DEG C about;Due to electronics device Part needs insulation protection, and in order to prevent electronic device surface sweating, the humidity of air needs to control in optimum range, thus leading Cause the utilization rate of air-conditioning high, greatly, effects of energy conservation and environmental protection is poor for energy consumption.
2nd, server internal radiator needs to carry out forced air convection cooling using fan, not only increases fan work( Consumption, and noise raising, the use environment of impact server.Because the use environment requirement of electronic device is dustless, using air Cooling requires very high to the cleannes of air.
3rd, in order to ensure insulating electronic device, simultaneously non-direct contact between server internal radiator and heater, but Connected by heat-conducting silicone grease or directly hanging, so considerably increase thermal contact resistance, weaken heat-transfer effect.
Content of the invention
The device cooling system it is an object of the invention to provide a kind of partially submerged liquid-cooled suit is engaged in, solves existing radiating mode The problem that energy consumption is big, radiating effect is bad.
For solving above-mentioned technical problem, the present invention adopts the following technical scheme that:
A kind of present invention partially submerged liquid-cooled suit be engaged in device cooling system, include machine box for server, case lid, radiate pack, Radiator, oil sump tank and oil pump;Described case lid covers the cavity forming a closing on described cabinet;It is connected with chip Mainboard is arranged in described cavity;Described radiating pack is arranged on above described chip;Described cabinet both sides offer respectively with The oil-in of described cavity connection and oil-out;In described cabinet, described oil-in side is provided with a point liquid box;Described go out Hydraulic fluid port is sequentially communicated described radiator, oil sump tank and oil pump, another port in described oil pipe road and institute by oil pipe road State oil-in connection, form circulation closed circuit;It is filled with liquid working substance, described liquid working substance is by described mainboard, core in described cabinet Piece and radiating pack submergence;Described oil-out is located at below described liquid working substance liquid level.
Further, described mainboard is arranged on described cabinet bottom by support, has gap and cabinet bottom between.
Further, it is provided with filter between described oil sump tank and described oil pump.
Further, fitted with described chip in the connection end of described radiating pack, and the radiating end of radiating pack is radiating Raised.
Further, the material of described radiating pack is metal.
Further, described radiator is air-cooled radiator.
Further, described radiator is water-filled radiator.
Further, described liquid working substance is fluid.
Compared with prior art, the Advantageous Effects of the present invention are as follows:
The cooling system of the present invention, because the specific heat capacity of the specific heat ratio air of cooling working medium is big, liquid-cooling heat radiation efficiency high In air-cooled, and based on cooling working medium and the heater element directly contacts such as chip, thermal resistance almost goes to zero, and heat transfer efficiency is high;Whole Only have the power consumption of oil pump and oil cooling radiator in system system, substantially reduce compared with the air conditioning energy consumption of traditional heat sinks, realize section The effect of energy environmental protection;Using half immersion liquid cooling system, one side cooling working medium and euthermic chip are fully contacted, can be effective For the local flow cooling of the heater elements such as chip, and easy samming, compared with non-immersion, cooling working medium and heat generating core Piece extends time of contact, is conducive to euthermic chip more efficiently to radiate, compared with overall immersion, the consumption of cooling working medium is bright Aobvious minimizing, advantageously reduces overall weight, simultaneously cost-effective.
Brief description
The invention will be further described for explanation below in conjunction with the accompanying drawings.
Fig. 1 is partially submerged liquid-cooled suit business device cooling system structure schematic diagram of the present invention;
Fig. 2 is cabinet inside structural representation;
Description of reference numerals:1st, cabinet;101st, case lid;102nd, oil-in;103rd, divide liquid box;104th, mainboard;105th, chip; 106th, radiate pack;107th, oil-out;2nd, oil pipe road;3rd, radiator;4th, oil sump tank;5th, filter;6th, oil pump;7th, cavity; 8th, liquid working substance;9th, support.
Specific embodiment
As shown in Figure 1-2, a kind of partially submerged liquid-cooled suit is engaged in device cooling system, including machine box for server 1, case lid 101, Radiating pack 106, radiator 3, oil sump tank 4 and oil pump 6.Described case lid 101 covers on described cabinet 1, forms a closing Cavity 7.The mainboard 104 being connected with chip 105 is heater element, and lower end mounting bracket 9 is fixed on cabinet bottom, with cabinet 1 Between bottom, there is gap, so that chip 105 is all surrounded by fluid with mainboard 104, endothermic effect is more preferable.Described radiating pack 106 Connection end be fitted in above described chip 105 by heat-conducting silicone grease, radiating pack radiating end be projection, described radiating pack 106 material can be metal, increase thermal conductivity, and this specific embodiment protrusions are strip, equidistantly arrange, increase and lead The area of dissipation of the contact of deep fat liquid;Annular protrusion can certainly be adopted, by circumferential array.Described cabinet 1 both sides are opened respectively It is provided with the oil-in 102 connecting with described cavity 7 and oil-out 107, near described oil-in 102 side peace in described cabinet 1 Equipped with a point liquid box 103, make to enter in cabinet 1 from the heat conduction fluid that oil-in 102 is come in by point liquid of point liquid box 103, this reality Applying the liquid working substance 8 that example adopted is heat conduction fluid, and described mainboard 104, chip 105 and radiating pack 106 are soaked by heat conduction fluid Not yet, described oil-out 107 is located at below described liquid working substance 8 liquid level, and oil-out 107 is specifically located at the non-top of case side wall End, can be the middle part of case side wall, to ensure that heat conduction fluid will not be full of whole cabinet, the use of minimizing heat conduction fluid Amount, advantageously reduces overall weight, simultaneously cost-effective.Described oil-out 107 is sequentially communicated described radiating by oil pipe road 2 Device 3, oil sump tank 4, filter 5 and oil pump 6, another port in described oil pipe road 2 is connected with described oil-in 102, is formed Circulation is closed circuit, after heat conduction fluid absorbs heat, flows out from oil-out 107, radiates through radiator 3, flows in oil sump tank 4, oil pump 6 Heat conduction fluid is drawn through filter 5 impurity screening, leads back in cabinet 1 and continue heat absorption, thus completing a radiating circulation.
Described radiator 3 in above-described embodiment can be air-cooled radiator or water-filled radiator.
The cooling system of the present invention can do cabinet and case lid, to server enclosure using light weight, the material of low cost Part is changed little, so rack assembling also has the advantage of compatibility, the oil circuit feed system of employing is than air-conditioning (or cooler Group) simply it is easy to changing and keeping in repair.
The course of action of the present invention is as follows:
When cooling system does not work, heat conduction fluid is stored in oil sump tank;After start-up of cooling system, leading in oil sump tank Deep fat liquid is transported in point liquid box through oil-in by the suction of oil pump, and after undue liquid box, conduction oil collection coalescence is diverted to machine In case, until oil mass being capable of radiating pack in submergence server enclosure, mainboard, chip and other heater element;Here During, heat conduction fluid produces heat exchange with heater element, completes diabatic process, subsequently, the heat conduction fluid after heating is through going out Hydraulic fluid port flows into oil pipe road, is again back to oil sump tank, so circulates after radiator cooling.
Embodiment described above is only that the optimal way to the present invention is described, and not the scope of the present invention is carried out Limit, on the premise of without departing from design spirit of the present invention, those of ordinary skill in the art make to technical scheme Various modifications and improvement, all should fall into claims of the present invention determination protection domain in.

Claims (8)

1. a kind of partially submerged liquid-cooled suit business device cooling system it is characterised in that:Including machine box for server (1), case lid (101), radiating pack (106), radiator (3), oil sump tank (4) and oil pump (6);Described case lid (101) covers in described cabinet (1) on, form the cavity (7) of a closing;The mainboard (104) being connected with chip (105) is arranged in described cavity (7);Institute State radiating pack (106) to be arranged on above described chip (105);Described cabinet (1) both sides offer and described cavity (7) respectively The oil-in (102) of connection and oil-out (107);In described cabinet (1), described oil-in (102) side is provided with a point liquid Box (103);Described oil-out (107) is sequentially communicated described radiator (3), oil sump tank (4) and oil pump by oil pipe road (2) (6), another port of described oil pipe road (2) is connected with described oil-in (102), forms circulation closed circuit;Described cabinet (1) Inside it is filled with liquid working substance (8), described mainboard (104), chip (105) and radiating pack (106) are soaked by described liquid working substance (8) Not yet;Described oil-out (107) is located at below described liquid working substance (8) liquid level.
2. partially submerged liquid-cooled suit according to claim 1 business device cooling system it is characterised in that:Described mainboard (104) described cabinet (1) bottom is arranged on by support (9), and cabinet (1) bottom between, there is gap.
3. partially submerged liquid-cooled suit according to claim 1 business device cooling system it is characterised in that:Described oil sump tank (4) it is provided with filter (5) and described oil pump (6) between.
4. partially submerged liquid-cooled suit according to claim 1 business device cooling system it is characterised in that:Described radiating pack (106) fitted with described chip (105) in connection end, the radiating end of radiating pack is projection.
5. partially submerged liquid-cooled suit according to claim 4 business device cooling system it is characterised in that:Described radiating pack (106) material is metal.
6. according to claim 1-5 partially submerged liquid-cooled suit business device cooling system it is characterised in that:Described radiator (3) it is air-cooled radiator.
7. according to claim 1-5 partially submerged liquid-cooled suit business device cooling system it is characterised in that:Described radiator (3) it is water-filled radiator.
8. according to claim 1-5 partially submerged liquid-cooled suit business device cooling system it is characterised in that:Described liquid work Matter (8) is fluid.
CN201611072263.9A 2016-11-29 2016-11-29 Partial immersion type liquid cooling server cooling system Active CN106445037B (en)

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PCT/CN2017/074712 WO2018098911A1 (en) 2016-11-29 2017-02-24 Partial immersion liquid-cooling system for cooling server

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Application Number Priority Date Filing Date Title
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CN107203253A (en) * 2017-06-30 2017-09-26 广东合新材料研究院有限公司 A kind of contact active Phase cooling structure and passive Phase cooling structure
CN107577314A (en) * 2017-09-25 2018-01-12 北京丰联奥睿科技有限公司 A kind of liquid immersion type server cooling system
CN107748609A (en) * 2017-11-26 2018-03-02 湖南匡楚科技有限公司 Main frame oil injection type radiator
CN108089682A (en) * 2018-01-08 2018-05-29 北京荷云达世科技有限公司 A kind of efficiently integrated cloud computer cooling system
WO2018098911A1 (en) * 2016-11-29 2018-06-07 广东合一新材料研究院有限公司 Partial immersion liquid-cooling system for cooling server
CN108323118A (en) * 2018-03-06 2018-07-24 北京中热能源科技有限公司 The liquid cooling system of a kind of electronic equipment
CN108845658A (en) * 2018-06-01 2018-11-20 曙光信息产业(北京)有限公司 Power supply power supply plate for liquid cooled server
CN108966603A (en) * 2018-08-15 2018-12-07 南京佳力图机房环境技术股份有限公司 A kind of cooling immersion liquid cooling combination unit of server
CN108966611A (en) * 2018-09-11 2018-12-07 广东合新材料研究院有限公司 A kind of liquid-immersed cooled interchanger and group of switches
CN109365382A (en) * 2018-10-25 2019-02-22 广东合新材料研究院有限公司 A kind of server cleaning equipment and its cleaning method
CN109850168A (en) * 2018-12-31 2019-06-07 北京航空航天大学 The fuel tank cooling subsystem of aircraft heat management system
CN111324189A (en) * 2018-12-15 2020-06-23 鸿富锦精密电子(天津)有限公司 Heat dissipation device and server using same
CN112020265A (en) * 2019-05-31 2020-12-01 华为技术有限公司 Heat dissipation device and processor
CN112051912A (en) * 2020-09-30 2020-12-08 兰洋(宁波)科技有限公司 Single-phase immersed liquid heat exchange system and heat exchange method
CN113093879A (en) * 2021-04-08 2021-07-09 大连理工大学 Blade type server heat dissipation cover plate for two-phase immersion type liquid cooling
CN113099694A (en) * 2021-04-06 2021-07-09 龚晶晶 Terminal equipment for industrial equipment information management based on big data
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WO2022151763A1 (en) * 2021-01-18 2022-07-21 兰洋(宁波)科技有限公司 Immersed heat dissipation system and heat exchange method
CN115568190A (en) * 2022-11-09 2023-01-03 兰洋(宁波)科技有限公司 Sealed cooling box and cabinet for IDC server

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CN110891404A (en) * 2019-11-22 2020-03-17 河南省无线发射传输管理中心 Novel high-power digital transmitter submergence formula high-efficient oil cooling heat dissipation of radio and television device
CN112545176A (en) * 2020-11-28 2021-03-26 西安熊福芳电子科技有限公司 Big data filter for scientific and technological achievement research
CN112506320A (en) * 2020-12-10 2021-03-16 浪潮电子信息产业股份有限公司 Anti-scouring immersed liquid cooling device for heat dissipation paste and server
CN112764505B (en) * 2021-01-25 2024-03-26 兰洋(宁波)科技有限公司 Cooling device for immersed type heat dissipation liquid and heat dissipation control method
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US10512192B2 (en) * 2015-08-28 2019-12-17 Mark Miyoshi Immersion cooling system with low fluid loss
US20170064862A1 (en) * 2015-08-28 2017-03-02 Mark Miyoshi Immersion cooling system with low fluid loss
WO2018098911A1 (en) * 2016-11-29 2018-06-07 广东合一新材料研究院有限公司 Partial immersion liquid-cooling system for cooling server
CN107203253A (en) * 2017-06-30 2017-09-26 广东合新材料研究院有限公司 A kind of contact active Phase cooling structure and passive Phase cooling structure
CN107577314A (en) * 2017-09-25 2018-01-12 北京丰联奥睿科技有限公司 A kind of liquid immersion type server cooling system
CN107748609A (en) * 2017-11-26 2018-03-02 湖南匡楚科技有限公司 Main frame oil injection type radiator
CN107748609B (en) * 2017-11-26 2024-04-19 东莞市硕泰电子科技有限公司 Oil-cooled radiator for computer host
CN108089682A (en) * 2018-01-08 2018-05-29 北京荷云达世科技有限公司 A kind of efficiently integrated cloud computer cooling system
CN108323118A (en) * 2018-03-06 2018-07-24 北京中热能源科技有限公司 The liquid cooling system of a kind of electronic equipment
CN108845658A (en) * 2018-06-01 2018-11-20 曙光信息产业(北京)有限公司 Power supply power supply plate for liquid cooled server
CN108966603A (en) * 2018-08-15 2018-12-07 南京佳力图机房环境技术股份有限公司 A kind of cooling immersion liquid cooling combination unit of server
CN108966611A (en) * 2018-09-11 2018-12-07 广东合新材料研究院有限公司 A kind of liquid-immersed cooled interchanger and group of switches
CN108966611B (en) * 2018-09-11 2024-05-28 广东西江数据科技有限公司 Liquid immersion cooling type exchanger and exchanger unit
CN109365382A (en) * 2018-10-25 2019-02-22 广东合新材料研究院有限公司 A kind of server cleaning equipment and its cleaning method
CN109365382B (en) * 2018-10-25 2024-03-12 广东西江数据科技有限公司 Server cleaning equipment and cleaning method thereof
CN111324189A (en) * 2018-12-15 2020-06-23 鸿富锦精密电子(天津)有限公司 Heat dissipation device and server using same
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