CN106445037A - Partial immersion type liquid cooling server cooling system - Google Patents
Partial immersion type liquid cooling server cooling system Download PDFInfo
- Publication number
- CN106445037A CN106445037A CN201611072263.9A CN201611072263A CN106445037A CN 106445037 A CN106445037 A CN 106445037A CN 201611072263 A CN201611072263 A CN 201611072263A CN 106445037 A CN106445037 A CN 106445037A
- Authority
- CN
- China
- Prior art keywords
- oil
- liquid
- cooling system
- chip
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 41
- 239000007788 liquid Substances 0.000 title claims abstract description 33
- 238000007654 immersion Methods 0.000 title abstract description 6
- 239000012530 fluid Substances 0.000 claims description 15
- 239000000126 substance Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 238000012546 transfer Methods 0.000 abstract description 3
- 238000004378 air conditioning Methods 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 230000035900 sweating Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a partial immersion type liquid cooling server cooling system which comprises a server case, a case cover, cooling set fins, a heat radiator, an oil collecting tank and an oil pump. The case cover covers the case to form a sealed cavity. A main board connected with a chip is arranged in the cavity; an oil inlet and an oil outlet communicated with the cavity are formed in the two sides of the case respectively; a liquid dividing box is arranged on the side, close to the oil inlet, in the case; the oil outlet is sequentially communicated with the heat radiator, the oil collecting tank and the oil pump through an oil pipeline, and the other end opening of the oil pipeline is communicated with the oil inlet to form a circulating closed loop. The case is filled with a liquid medium, and the main board, the chip and the cooling set fins are immersed in the liquid medium. The oil outlet is located below the liquid level of the liquid medium. The partial immersion type liquid cooling server cooling system is high in heat transfer efficiency, the effects of energy saving and environmental protection are achieved, local flowing cooling on the chip and other heating elements can be effectively achieved, cooling is easy, the heating chip can be cooled more effectively, and meanwhile cost is reduced.
Description
Technical field
The present invention relates to the cooling field of electronic device, more particularly, to a kind of partially submerged liquid-cooled suit business device cooling
System.
Background technology
At present in server component a large amount of using integrated circuit it is well known that high temperature is the formidable enemy of integrated circuit, not only can
Lead to system operation unstable, service life shortens, it could even be possible to making some parts burn.The radiating of integrated chip is main at present
By arranging radiator on integrated chip top, radiator contacts absorption heat with heat generating components surface, then passes through fan strong
Cross-ventilation processed, heat is delivered at a distance by air, to complete the radiating of server.Current heat dissipating method exists following
Shortcoming:
1st, the heat that in server, heater element produces mainly is taken away by cross-ventilation, and the heat-conducting effect of air is relatively
Difference, wants to reach the preference temperature of server work, the ambient temperature that server is placed requires at 25 DEG C about;Due to electronics device
Part needs insulation protection, and in order to prevent electronic device surface sweating, the humidity of air needs to control in optimum range, thus leading
Cause the utilization rate of air-conditioning high, greatly, effects of energy conservation and environmental protection is poor for energy consumption.
2nd, server internal radiator needs to carry out forced air convection cooling using fan, not only increases fan work(
Consumption, and noise raising, the use environment of impact server.Because the use environment requirement of electronic device is dustless, using air
Cooling requires very high to the cleannes of air.
3rd, in order to ensure insulating electronic device, simultaneously non-direct contact between server internal radiator and heater, but
Connected by heat-conducting silicone grease or directly hanging, so considerably increase thermal contact resistance, weaken heat-transfer effect.
Content of the invention
The device cooling system it is an object of the invention to provide a kind of partially submerged liquid-cooled suit is engaged in, solves existing radiating mode
The problem that energy consumption is big, radiating effect is bad.
For solving above-mentioned technical problem, the present invention adopts the following technical scheme that:
A kind of present invention partially submerged liquid-cooled suit be engaged in device cooling system, include machine box for server, case lid, radiate pack,
Radiator, oil sump tank and oil pump;Described case lid covers the cavity forming a closing on described cabinet;It is connected with chip
Mainboard is arranged in described cavity;Described radiating pack is arranged on above described chip;Described cabinet both sides offer respectively with
The oil-in of described cavity connection and oil-out;In described cabinet, described oil-in side is provided with a point liquid box;Described go out
Hydraulic fluid port is sequentially communicated described radiator, oil sump tank and oil pump, another port in described oil pipe road and institute by oil pipe road
State oil-in connection, form circulation closed circuit;It is filled with liquid working substance, described liquid working substance is by described mainboard, core in described cabinet
Piece and radiating pack submergence;Described oil-out is located at below described liquid working substance liquid level.
Further, described mainboard is arranged on described cabinet bottom by support, has gap and cabinet bottom between.
Further, it is provided with filter between described oil sump tank and described oil pump.
Further, fitted with described chip in the connection end of described radiating pack, and the radiating end of radiating pack is radiating
Raised.
Further, the material of described radiating pack is metal.
Further, described radiator is air-cooled radiator.
Further, described radiator is water-filled radiator.
Further, described liquid working substance is fluid.
Compared with prior art, the Advantageous Effects of the present invention are as follows:
The cooling system of the present invention, because the specific heat capacity of the specific heat ratio air of cooling working medium is big, liquid-cooling heat radiation efficiency high
In air-cooled, and based on cooling working medium and the heater element directly contacts such as chip, thermal resistance almost goes to zero, and heat transfer efficiency is high;Whole
Only have the power consumption of oil pump and oil cooling radiator in system system, substantially reduce compared with the air conditioning energy consumption of traditional heat sinks, realize section
The effect of energy environmental protection;Using half immersion liquid cooling system, one side cooling working medium and euthermic chip are fully contacted, can be effective
For the local flow cooling of the heater elements such as chip, and easy samming, compared with non-immersion, cooling working medium and heat generating core
Piece extends time of contact, is conducive to euthermic chip more efficiently to radiate, compared with overall immersion, the consumption of cooling working medium is bright
Aobvious minimizing, advantageously reduces overall weight, simultaneously cost-effective.
Brief description
The invention will be further described for explanation below in conjunction with the accompanying drawings.
Fig. 1 is partially submerged liquid-cooled suit business device cooling system structure schematic diagram of the present invention;
Fig. 2 is cabinet inside structural representation;
Description of reference numerals:1st, cabinet;101st, case lid;102nd, oil-in;103rd, divide liquid box;104th, mainboard;105th, chip;
106th, radiate pack;107th, oil-out;2nd, oil pipe road;3rd, radiator;4th, oil sump tank;5th, filter;6th, oil pump;7th, cavity;
8th, liquid working substance;9th, support.
Specific embodiment
As shown in Figure 1-2, a kind of partially submerged liquid-cooled suit is engaged in device cooling system, including machine box for server 1, case lid 101,
Radiating pack 106, radiator 3, oil sump tank 4 and oil pump 6.Described case lid 101 covers on described cabinet 1, forms a closing
Cavity 7.The mainboard 104 being connected with chip 105 is heater element, and lower end mounting bracket 9 is fixed on cabinet bottom, with cabinet 1
Between bottom, there is gap, so that chip 105 is all surrounded by fluid with mainboard 104, endothermic effect is more preferable.Described radiating pack 106
Connection end be fitted in above described chip 105 by heat-conducting silicone grease, radiating pack radiating end be projection, described radiating pack
106 material can be metal, increase thermal conductivity, and this specific embodiment protrusions are strip, equidistantly arrange, increase and lead
The area of dissipation of the contact of deep fat liquid;Annular protrusion can certainly be adopted, by circumferential array.Described cabinet 1 both sides are opened respectively
It is provided with the oil-in 102 connecting with described cavity 7 and oil-out 107, near described oil-in 102 side peace in described cabinet 1
Equipped with a point liquid box 103, make to enter in cabinet 1 from the heat conduction fluid that oil-in 102 is come in by point liquid of point liquid box 103, this reality
Applying the liquid working substance 8 that example adopted is heat conduction fluid, and described mainboard 104, chip 105 and radiating pack 106 are soaked by heat conduction fluid
Not yet, described oil-out 107 is located at below described liquid working substance 8 liquid level, and oil-out 107 is specifically located at the non-top of case side wall
End, can be the middle part of case side wall, to ensure that heat conduction fluid will not be full of whole cabinet, the use of minimizing heat conduction fluid
Amount, advantageously reduces overall weight, simultaneously cost-effective.Described oil-out 107 is sequentially communicated described radiating by oil pipe road 2
Device 3, oil sump tank 4, filter 5 and oil pump 6, another port in described oil pipe road 2 is connected with described oil-in 102, is formed
Circulation is closed circuit, after heat conduction fluid absorbs heat, flows out from oil-out 107, radiates through radiator 3, flows in oil sump tank 4, oil pump 6
Heat conduction fluid is drawn through filter 5 impurity screening, leads back in cabinet 1 and continue heat absorption, thus completing a radiating circulation.
Described radiator 3 in above-described embodiment can be air-cooled radiator or water-filled radiator.
The cooling system of the present invention can do cabinet and case lid, to server enclosure using light weight, the material of low cost
Part is changed little, so rack assembling also has the advantage of compatibility, the oil circuit feed system of employing is than air-conditioning (or cooler
Group) simply it is easy to changing and keeping in repair.
The course of action of the present invention is as follows:
When cooling system does not work, heat conduction fluid is stored in oil sump tank;After start-up of cooling system, leading in oil sump tank
Deep fat liquid is transported in point liquid box through oil-in by the suction of oil pump, and after undue liquid box, conduction oil collection coalescence is diverted to machine
In case, until oil mass being capable of radiating pack in submergence server enclosure, mainboard, chip and other heater element;Here
During, heat conduction fluid produces heat exchange with heater element, completes diabatic process, subsequently, the heat conduction fluid after heating is through going out
Hydraulic fluid port flows into oil pipe road, is again back to oil sump tank, so circulates after radiator cooling.
Embodiment described above is only that the optimal way to the present invention is described, and not the scope of the present invention is carried out
Limit, on the premise of without departing from design spirit of the present invention, those of ordinary skill in the art make to technical scheme
Various modifications and improvement, all should fall into claims of the present invention determination protection domain in.
Claims (8)
1. a kind of partially submerged liquid-cooled suit business device cooling system it is characterised in that:Including machine box for server (1), case lid
(101), radiating pack (106), radiator (3), oil sump tank (4) and oil pump (6);Described case lid (101) covers in described cabinet
(1) on, form the cavity (7) of a closing;The mainboard (104) being connected with chip (105) is arranged in described cavity (7);Institute
State radiating pack (106) to be arranged on above described chip (105);Described cabinet (1) both sides offer and described cavity (7) respectively
The oil-in (102) of connection and oil-out (107);In described cabinet (1), described oil-in (102) side is provided with a point liquid
Box (103);Described oil-out (107) is sequentially communicated described radiator (3), oil sump tank (4) and oil pump by oil pipe road (2)
(6), another port of described oil pipe road (2) is connected with described oil-in (102), forms circulation closed circuit;Described cabinet (1)
Inside it is filled with liquid working substance (8), described mainboard (104), chip (105) and radiating pack (106) are soaked by described liquid working substance (8)
Not yet;Described oil-out (107) is located at below described liquid working substance (8) liquid level.
2. partially submerged liquid-cooled suit according to claim 1 business device cooling system it is characterised in that:Described mainboard
(104) described cabinet (1) bottom is arranged on by support (9), and cabinet (1) bottom between, there is gap.
3. partially submerged liquid-cooled suit according to claim 1 business device cooling system it is characterised in that:Described oil sump tank
(4) it is provided with filter (5) and described oil pump (6) between.
4. partially submerged liquid-cooled suit according to claim 1 business device cooling system it is characterised in that:Described radiating pack
(106) fitted with described chip (105) in connection end, the radiating end of radiating pack is projection.
5. partially submerged liquid-cooled suit according to claim 4 business device cooling system it is characterised in that:Described radiating pack
(106) material is metal.
6. according to claim 1-5 partially submerged liquid-cooled suit business device cooling system it is characterised in that:Described radiator
(3) it is air-cooled radiator.
7. according to claim 1-5 partially submerged liquid-cooled suit business device cooling system it is characterised in that:Described radiator
(3) it is water-filled radiator.
8. according to claim 1-5 partially submerged liquid-cooled suit business device cooling system it is characterised in that:Described liquid work
Matter (8) is fluid.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611072263.9A CN106445037B (en) | 2016-11-29 | 2016-11-29 | Partial immersion type liquid cooling server cooling system |
PCT/CN2017/074712 WO2018098911A1 (en) | 2016-11-29 | 2017-02-24 | Partial immersion liquid-cooling system for cooling server |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611072263.9A CN106445037B (en) | 2016-11-29 | 2016-11-29 | Partial immersion type liquid cooling server cooling system |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106445037A true CN106445037A (en) | 2017-02-22 |
CN106445037B CN106445037B (en) | 2023-10-24 |
Family
ID=58219922
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201611072263.9A Active CN106445037B (en) | 2016-11-29 | 2016-11-29 | Partial immersion type liquid cooling server cooling system |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN106445037B (en) |
WO (1) | WO2018098911A1 (en) |
Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170064862A1 (en) * | 2015-08-28 | 2017-03-02 | Mark Miyoshi | Immersion cooling system with low fluid loss |
CN107203253A (en) * | 2017-06-30 | 2017-09-26 | 广东合新材料研究院有限公司 | A kind of contact active Phase cooling structure and passive Phase cooling structure |
CN107577314A (en) * | 2017-09-25 | 2018-01-12 | 北京丰联奥睿科技有限公司 | A kind of liquid immersion type server cooling system |
CN107748609A (en) * | 2017-11-26 | 2018-03-02 | 湖南匡楚科技有限公司 | Main frame oil injection type radiator |
CN108089682A (en) * | 2018-01-08 | 2018-05-29 | 北京荷云达世科技有限公司 | A kind of efficiently integrated cloud computer cooling system |
WO2018098911A1 (en) * | 2016-11-29 | 2018-06-07 | 广东合一新材料研究院有限公司 | Partial immersion liquid-cooling system for cooling server |
CN108323118A (en) * | 2018-03-06 | 2018-07-24 | 北京中热能源科技有限公司 | The liquid cooling system of a kind of electronic equipment |
CN108845658A (en) * | 2018-06-01 | 2018-11-20 | 曙光信息产业(北京)有限公司 | Power supply power supply plate for liquid cooled server |
CN108966603A (en) * | 2018-08-15 | 2018-12-07 | 南京佳力图机房环境技术股份有限公司 | A kind of cooling immersion liquid cooling combination unit of server |
CN108966611A (en) * | 2018-09-11 | 2018-12-07 | 广东合新材料研究院有限公司 | A kind of liquid-immersed cooled interchanger and group of switches |
CN109365382A (en) * | 2018-10-25 | 2019-02-22 | 广东合新材料研究院有限公司 | A kind of server cleaning equipment and its cleaning method |
CN109850168A (en) * | 2018-12-31 | 2019-06-07 | 北京航空航天大学 | The fuel tank cooling subsystem of aircraft heat management system |
CN111324189A (en) * | 2018-12-15 | 2020-06-23 | 鸿富锦精密电子(天津)有限公司 | Heat dissipation device and server using same |
CN112020265A (en) * | 2019-05-31 | 2020-12-01 | 华为技术有限公司 | Heat dissipation device and processor |
CN112051912A (en) * | 2020-09-30 | 2020-12-08 | 兰洋(宁波)科技有限公司 | Single-phase immersed liquid heat exchange system and heat exchange method |
CN113093879A (en) * | 2021-04-08 | 2021-07-09 | 大连理工大学 | Blade type server heat dissipation cover plate for two-phase immersion type liquid cooling |
CN113099694A (en) * | 2021-04-06 | 2021-07-09 | 龚晶晶 | Terminal equipment for industrial equipment information management based on big data |
CN113873849A (en) * | 2021-10-12 | 2021-12-31 | 西北工业大学 | Self-adaptive adjustment semi-immersed liquid cooling heat dissipation cavity, circulation system and application |
CN114206078A (en) * | 2021-12-15 | 2022-03-18 | 上海宇航系统工程研究所 | Environment protection method for lunar data center |
CN114430642A (en) * | 2020-10-29 | 2022-05-03 | 春鸿电子科技(重庆)有限公司 | Liquid cooling heat radiator |
WO2022151763A1 (en) * | 2021-01-18 | 2022-07-21 | 兰洋(宁波)科技有限公司 | Immersed heat dissipation system and heat exchange method |
CN115568190A (en) * | 2022-11-09 | 2023-01-03 | 兰洋(宁波)科技有限公司 | Sealed cooling box and cabinet for IDC server |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109841918A (en) * | 2019-03-01 | 2019-06-04 | 华南理工大学 | Utilize the electric automobile power battery group radiator structure of the cooling heat dissipation of immersion |
CN110062297A (en) * | 2019-04-09 | 2019-07-26 | 广东合一新材料研究院有限公司 | A kind of base station 5G cooling system |
CN110891404A (en) * | 2019-11-22 | 2020-03-17 | 河南省无线发射传输管理中心 | Novel high-power digital transmitter submergence formula high-efficient oil cooling heat dissipation of radio and television device |
CN112545176A (en) * | 2020-11-28 | 2021-03-26 | 西安熊福芳电子科技有限公司 | Big data filter for scientific and technological achievement research |
CN112506320A (en) * | 2020-12-10 | 2021-03-16 | 浪潮电子信息产业股份有限公司 | Anti-scouring immersed liquid cooling device for heat dissipation paste and server |
CN112764505B (en) * | 2021-01-25 | 2024-03-26 | 兰洋(宁波)科技有限公司 | Cooling device for immersed type heat dissipation liquid and heat dissipation control method |
CN113093875A (en) * | 2021-03-31 | 2021-07-09 | 深圳市智微智能科技股份有限公司 | Totally-enclosed server water cooling structure and method |
CN113075984B (en) * | 2021-04-01 | 2023-05-23 | 山东英信计算机技术有限公司 | Immersed liquid cooling system |
CN113703550A (en) * | 2021-07-23 | 2021-11-26 | 苏州浪潮智能科技有限公司 | Hybrid liquid cooling device |
CN113849054B (en) * | 2021-08-31 | 2024-03-26 | 兰洋(宁波)科技有限公司 | Submerged liquid cooling heat dissipation system applied to data center |
CN114916192A (en) * | 2022-04-18 | 2022-08-16 | 西安华为数字能源技术有限公司 | Capsule heat exchanger, liquid cooling tank and liquid cooling system |
CN116321934B (en) * | 2022-12-30 | 2023-12-22 | 比赫电气(太仓)有限公司 | 5U rack-type immersion liquid cooling system |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103593017A (en) * | 2013-10-29 | 2014-02-19 | 大连生容享科技有限公司 | Oil-cooling computer mainframe case |
CN103616939A (en) * | 2013-10-29 | 2014-03-05 | 大连生容享科技有限公司 | Oil cooling circulation computer mainframe box |
CN203882259U (en) * | 2014-04-30 | 2014-10-15 | 华北电力大学(保定) | Immersed host oil cooling circulation and heat dissipation system |
CN104216492A (en) * | 2014-09-29 | 2014-12-17 | 上海交通大学 | Liquid-state cooling immersion type structure heat dissipation system for computer chip |
CN104571420A (en) * | 2014-12-31 | 2015-04-29 | 曙光信息产业(北京)有限公司 | Submersible liquid-cooling server and submersible liquid cooling method for server |
US20160286688A1 (en) * | 2015-03-26 | 2016-09-29 | Banqiu Wu | Cooling Method for Computer System |
CN206312061U (en) * | 2016-11-29 | 2017-07-07 | 广东合一新材料研究院有限公司 | A kind of partially submerged liquid-cooled suit business device cooling system |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101640998A (en) * | 2008-07-31 | 2010-02-03 | 尹全权 | Liquid-cooled heat dissipation method for electronic element and computer and heat dissipation device thereof |
CN106445037B (en) * | 2016-11-29 | 2023-10-24 | 广东西江数据科技有限公司 | Partial immersion type liquid cooling server cooling system |
-
2016
- 2016-11-29 CN CN201611072263.9A patent/CN106445037B/en active Active
-
2017
- 2017-02-24 WO PCT/CN2017/074712 patent/WO2018098911A1/en active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103593017A (en) * | 2013-10-29 | 2014-02-19 | 大连生容享科技有限公司 | Oil-cooling computer mainframe case |
CN103616939A (en) * | 2013-10-29 | 2014-03-05 | 大连生容享科技有限公司 | Oil cooling circulation computer mainframe box |
CN203882259U (en) * | 2014-04-30 | 2014-10-15 | 华北电力大学(保定) | Immersed host oil cooling circulation and heat dissipation system |
CN104216492A (en) * | 2014-09-29 | 2014-12-17 | 上海交通大学 | Liquid-state cooling immersion type structure heat dissipation system for computer chip |
CN104571420A (en) * | 2014-12-31 | 2015-04-29 | 曙光信息产业(北京)有限公司 | Submersible liquid-cooling server and submersible liquid cooling method for server |
US20160286688A1 (en) * | 2015-03-26 | 2016-09-29 | Banqiu Wu | Cooling Method for Computer System |
CN206312061U (en) * | 2016-11-29 | 2017-07-07 | 广东合一新材料研究院有限公司 | A kind of partially submerged liquid-cooled suit business device cooling system |
Non-Patent Citations (1)
Title |
---|
刘汉涛;仝志辉;王艳华;王婵娟;饶文姬;: "密封机箱内电子元器件及热管冷却的热设计", 流体机械, no. 06 * |
Cited By (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10512192B2 (en) * | 2015-08-28 | 2019-12-17 | Mark Miyoshi | Immersion cooling system with low fluid loss |
US20170064862A1 (en) * | 2015-08-28 | 2017-03-02 | Mark Miyoshi | Immersion cooling system with low fluid loss |
WO2018098911A1 (en) * | 2016-11-29 | 2018-06-07 | 广东合一新材料研究院有限公司 | Partial immersion liquid-cooling system for cooling server |
CN107203253A (en) * | 2017-06-30 | 2017-09-26 | 广东合新材料研究院有限公司 | A kind of contact active Phase cooling structure and passive Phase cooling structure |
CN107577314A (en) * | 2017-09-25 | 2018-01-12 | 北京丰联奥睿科技有限公司 | A kind of liquid immersion type server cooling system |
CN107748609A (en) * | 2017-11-26 | 2018-03-02 | 湖南匡楚科技有限公司 | Main frame oil injection type radiator |
CN107748609B (en) * | 2017-11-26 | 2024-04-19 | 东莞市硕泰电子科技有限公司 | Oil-cooled radiator for computer host |
CN108089682A (en) * | 2018-01-08 | 2018-05-29 | 北京荷云达世科技有限公司 | A kind of efficiently integrated cloud computer cooling system |
CN108323118A (en) * | 2018-03-06 | 2018-07-24 | 北京中热能源科技有限公司 | The liquid cooling system of a kind of electronic equipment |
CN108845658A (en) * | 2018-06-01 | 2018-11-20 | 曙光信息产业(北京)有限公司 | Power supply power supply plate for liquid cooled server |
CN108966603A (en) * | 2018-08-15 | 2018-12-07 | 南京佳力图机房环境技术股份有限公司 | A kind of cooling immersion liquid cooling combination unit of server |
CN108966611A (en) * | 2018-09-11 | 2018-12-07 | 广东合新材料研究院有限公司 | A kind of liquid-immersed cooled interchanger and group of switches |
CN108966611B (en) * | 2018-09-11 | 2024-05-28 | 广东西江数据科技有限公司 | Liquid immersion cooling type exchanger and exchanger unit |
CN109365382A (en) * | 2018-10-25 | 2019-02-22 | 广东合新材料研究院有限公司 | A kind of server cleaning equipment and its cleaning method |
CN109365382B (en) * | 2018-10-25 | 2024-03-12 | 广东西江数据科技有限公司 | Server cleaning equipment and cleaning method thereof |
CN111324189A (en) * | 2018-12-15 | 2020-06-23 | 鸿富锦精密电子(天津)有限公司 | Heat dissipation device and server using same |
CN109850168A (en) * | 2018-12-31 | 2019-06-07 | 北京航空航天大学 | The fuel tank cooling subsystem of aircraft heat management system |
CN109850168B (en) * | 2018-12-31 | 2020-12-01 | 北京航空航天大学 | Oil tank cooling subsystem of aircraft thermal management system |
CN112020265A (en) * | 2019-05-31 | 2020-12-01 | 华为技术有限公司 | Heat dissipation device and processor |
CN112051912A (en) * | 2020-09-30 | 2020-12-08 | 兰洋(宁波)科技有限公司 | Single-phase immersed liquid heat exchange system and heat exchange method |
CN114430642A (en) * | 2020-10-29 | 2022-05-03 | 春鸿电子科技(重庆)有限公司 | Liquid cooling heat radiator |
WO2022151763A1 (en) * | 2021-01-18 | 2022-07-21 | 兰洋(宁波)科技有限公司 | Immersed heat dissipation system and heat exchange method |
CN113099694A (en) * | 2021-04-06 | 2021-07-09 | 龚晶晶 | Terminal equipment for industrial equipment information management based on big data |
CN113093879B (en) * | 2021-04-08 | 2023-11-24 | 大连理工大学 | Blade type server heat radiation cover plate for two-phase immersion liquid cooling |
CN113093879A (en) * | 2021-04-08 | 2021-07-09 | 大连理工大学 | Blade type server heat dissipation cover plate for two-phase immersion type liquid cooling |
CN113873849A (en) * | 2021-10-12 | 2021-12-31 | 西北工业大学 | Self-adaptive adjustment semi-immersed liquid cooling heat dissipation cavity, circulation system and application |
CN113873849B (en) * | 2021-10-12 | 2022-10-11 | 西北工业大学 | Self-adaptive adjustment semi-immersed liquid cooling heat dissipation cavity, circulation system and application |
CN114206078A (en) * | 2021-12-15 | 2022-03-18 | 上海宇航系统工程研究所 | Environment protection method for lunar data center |
CN115568190A (en) * | 2022-11-09 | 2023-01-03 | 兰洋(宁波)科技有限公司 | Sealed cooling box and cabinet for IDC server |
Also Published As
Publication number | Publication date |
---|---|
WO2018098911A1 (en) | 2018-06-07 |
CN106445037B (en) | 2023-10-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106445037A (en) | Partial immersion type liquid cooling server cooling system | |
CN206312061U (en) | A kind of partially submerged liquid-cooled suit business device cooling system | |
CN213694613U (en) | Immersion cooling device and electronic equipment with same | |
CN204272576U (en) | Control device of liquid cooling and there is the server of this device | |
CN110456893A (en) | A kind of cooling cabinet of enhanced immersion type | |
CN207783397U (en) | A kind of liquid immersion type cabinet | |
CN106711545B (en) | A kind of high power battery group lug floating immersion type temperature-controlling system and method | |
CN202310445U (en) | Water-cooled radiator | |
CN101640998A (en) | Liquid-cooled heat dissipation method for electronic element and computer and heat dissipation device thereof | |
CN107509362A (en) | A kind of Phase cooling type electronic cabinet | |
CN217591420U (en) | Immersed liquid cooling system for server | |
CN110913658B (en) | Cabinet based on coupling of pulsating heat pipe and phase-change material | |
CN206323733U (en) | A kind of working fluid submerges cooled power amplifier in transmitter unit entirely | |
CN109152314B (en) | Heat abstractor, control radiating component and washing machine | |
CN207249599U (en) | A kind of liquid immersion type server cooling system | |
CN109729704A (en) | A kind of multimedium liquid cooling heat radiation system | |
CN114340332A (en) | Submerged cooling system | |
CN204131372U (en) | A kind of mine-used frequency-converter cooling device | |
CN116156830A (en) | Cooling device and electronic equipment | |
CN107045382A (en) | A kind of liquid immersion type data center | |
CN205993056U (en) | Novel liquid-phase conversion evaporation cooling natural circulation device | |
CN211090400U (en) | Liquid immersion type server cabinet and cooling system thereof | |
CN219016926U (en) | Case for computer | |
CN210109732U (en) | Server CPU water-cooling radiator | |
CN206775902U (en) | A kind of heat abstractor for rack server chip |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20211117 Address after: 526070 room 142, plant (Building B) of Zhaoqing New Area Investment Development Co., Ltd., Beiba District, Guicheng new town, Dinghu District, Zhaoqing City, Guangdong Province Applicant after: Guangdong Xijiang Data Technology Co.,Ltd. Address before: Room 2006, building 2, No. 8, Fenghuang Third Road, Zhongxin Guangzhou Knowledge City, Guangzhou, Guangdong 510000 Applicant before: GUANGDONG HI-1 NEW MATERIALS TECHNOLOGY RESEARCH INSTITUTE Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant |