CN108089682A - A kind of efficiently integrated cloud computer cooling system - Google Patents

A kind of efficiently integrated cloud computer cooling system Download PDF

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Publication number
CN108089682A
CN108089682A CN201810016394.8A CN201810016394A CN108089682A CN 108089682 A CN108089682 A CN 108089682A CN 201810016394 A CN201810016394 A CN 201810016394A CN 108089682 A CN108089682 A CN 108089682A
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CN
China
Prior art keywords
mainboard
coolant
cooling system
cloud computer
cooler
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CN201810016394.8A
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Chinese (zh)
Inventor
王威
艾力
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Beijing Ho Yun Da Shi Technology Co Ltd
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Beijing Ho Yun Da Shi Technology Co Ltd
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Priority to CN201810016394.8A priority Critical patent/CN108089682A/en
Publication of CN108089682A publication Critical patent/CN108089682A/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)

Abstract

The present invention relates to radiating device technical field more particularly to a kind of efficiently integrated cloud computer cooling systems.Cooling system provided by the invention, including controller, mainboard and efficient integral box, circulating pump, cooler that cooling closed circuit is formed after being sequentially connected by pipeline, controller be connected with circulating pump and cooler, cools down in closed circuit filled with coolant respectively;The quantity of mainboard is multiple, and multiple mainboards are at least partially submerged in the coolant in efficient integral box, control cooler that coolant is recycled to coolant cooling and circulating pump respectively by controller, heat transfer efficiency is high, cooling-down effect is apparent, beneficial to effectively improving mainboard arithmetic speed and computing capability, and without wind turbine, at least 50% is reduced compared to same size energy consumption, noiseless pollution;In addition, mainboard can be installed multiple, compared to single mainboard single chassis, volume is reduced;Suitable for mainframe computer center, floor space is small, low cost and failure rate are low.

Description

A kind of efficiently integrated cloud computer cooling system
Technical field
The present invention relates to radiating device technical field more particularly to a kind of efficiently integrated cloud computer cooling systems.
Background technology
Computer main board carries computer and runs required critical elements as the important component in cabinet, including CPU, Memory etc..And cores of the CPU as computer, substantial amounts of heat can be generated during the work time, these heats as distributed not in time It goes out or cools down that the normal use of CPU will be seriously affected, can notably burn out CPU.It is all mono- to CPU in computer housing at present Solely cool down equipped with fan.But it is air-cooled very high to environmental requirement, once environment temperature height (such as summer) is difficult to have preferably Cooling-down effect, it is low so as to cause CPU arithmetic speeds, influence work efficiency.Also, air-cooled is usually realized by wind turbine, Noise is big, high energy consumption, and failure rate is higher.
With the arrival of Internet era, many large-scale cloud computer centers are emerged.It accepts at these calculating centers Many important work, and the work efficiency of CPU will bring very big income.Thus it is possible in time to CPU cooling will play to Close important role.
Further, since the limitation in space, the component and size of design, the carrying of mainboard are all accordingly much limited, especially It is for large-scale computer Operation Centre, it is necessary to which these independent computers are stored in very big space.
The content of the invention
(1) technical problems to be solved
The purpose of the present invention is:There is provided it is a kind of it is simple in structure, cooling efficiency is high, noiseless and low failure rate efficiently integrated Cloud computer cooling system, with solve the existing computer main board type of cooling there are noise is big, high energy consumption, cooling effect difference and The problem of high failure rate.
(2) technical solution
In order to solve the above technical problem, the present invention provides a kind of efficiently integrated cloud computer cooling system, including Controller, mainboard and efficient integral box, circulating pump, cooler that cooling closed circuit is formed after being sequentially connected by pipeline, institute It states controller to be connected with the circulating pump and cooler respectively, coolant is filled in the cooling closed circuit;The mainboard Quantity to be multiple, and multiple mainboards are at least partially submerged in the coolant in the efficient integral box.
As the preferred of above-mentioned technical proposal, the mainboard is equipped with the first thermal detector, and first thermal detector is used to examine The temperature of the mainboard is surveyed, and first thermal detector is connected with the controller.
As the preferred of above-mentioned technical proposal, the entrance of the cooler is equipped with the second thermal detector, second thermometric Device is for detecting the temperature with the coolant after mainboard heat exchange, and second thermal detector is connected with the controller.
As the preferred of above-mentioned technical proposal, the efficient integral box includes case body and arranged on the intrinsic storage of the case Liquid bath, the import and export of the reservoir are connected with the cooler and circulating pump respectively by pipeline;The reservoir is used for The coolant is installed, and the mainboard is fixedly arranged in the reservoir.
As the preferred of above-mentioned technical proposal, the reservoir is equipped with slot, and the mainboard is equipped with chimb;The mainboard leads to Chimb and slot grafting are crossed, is fixedly connected with realizing with reservoir.
As the preferred of above-mentioned technical proposal, the quantity of the efficient integral box is multiple, multiple efficient integral boxes An efficient integral box group is formed after connecting in parallel or series.
As the preferred of above-mentioned technical proposal, the efficient integral box include be internally provided with coolant and its top have open The babinet of mouth, the opening of the babinet are equipped with the case lid that can be opened and closed;The babinet and case lid use resin or corrosion resistance Metal material is made.
As the preferred of above-mentioned technical proposal, the coolant includes cooling oil, liquid metal or cooling water.
As the preferred of above-mentioned technical proposal, multiple mainboards are according to longitudinally spaced distributions or the side being spaced laterally apart Formula is arranged in the coolant.
As the preferred of above-mentioned technical proposal, the cooling closed circuit is equipped with the adjusting being connected with the controller Valve, and the regulating valve is between the efficient integral box and cooler.
(3) advantageous effect
The above-mentioned technical proposal of the present invention has the following advantages that:
The present invention provides a kind of efficiently integrated cloud computer cooling systems, including controller, mainboard and pass through pipeline After being sequentially connected formed cooling closed circuit efficient integral box, circulating pump, cooler, controller respectively with circulating pump and cooling Device connects, and cools down and coolant is filled in closed circuit;The quantity of mainboard is multiple, and multiple mainboards are at least partially submerged in In the coolant in efficient integral box.The cloud computer cooling system provided using the application, it is only necessary to be immersed in mainboard In coolant, and pass through controller and control cooler that coolant is recycled to coolant cooling and circulating pump respectively, in this way, Heat transfer efficiency is high, and cooling-down effect is apparent, beneficial to effectively improving mainboard arithmetic speed and computing capability, and due to not using air-cooled drop Temperature eliminates wind turbine, and at least 50%, and noiseless pollution are reduced compared to same size energy consumption;In addition, mainboard can be as needed Multiple, endless number system is installed, compared to single mainboard single chassis, volume is reduced.The cooling system that thus the application provides Mainframe computer center is particularly suitable for, has that floor space is small, cooling efficiency is high, noiseless, low cost, low energy consumption, failure The low advantage of rate has good development prospect.
Description of the drawings
Fig. 1 is the structure diagram of the efficiently integrated cloud computer cooling system of the embodiment of the present invention one.
In figure:1:Mainboard;2:Efficient integral box;3:Circulating pump;4:Cooler.
Specific embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention In attached drawing, the technical solution in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is The part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill people Member's all other embodiments obtained on the premise of creative work is not made, belong to the scope of protection of the invention.
Embodiment one
As shown in Figure 1, an embodiment of the present invention provides a kind of efficiently integrated cloud computer cooling system, including control Device, mainboard 1 and efficient integral box 2, circulating pump 3, cooler 4 that cooling closed circuit is formed after being sequentially connected by pipeline, control Device processed is connected respectively with circulating pump 3 and cooler 4, cools down and coolant is filled in closed circuit;The quantity of mainboard 1 to be multiple, And multiple mainboards 1 are at least partially submerged in the coolant in efficient integral box 2.
Specifically, in the present embodiment, the cloud computer cooling system that the application provides, including controller and by efficiently collecting The cooling closed circuit formed into case 2, circulating pump 3 and cooler 4, by being at least partially submerged in each mainboard 1 arranged on height In the coolant for imitating integral box 2, effectively to be radiated to mainboard 1;Wherein, mainboard 1 is at least partially submerged in coolant Only needing to meet mainboard 1 and coolant has enough heat exchange areas, to safeguard condition that mainboard 1 can effectively work.
Further, the cooling system that the application provides, because equipped with the control being connected respectively with circulating pump 3 and cooler 4 Device then can adjust cooling by rotating speed, pump discharge and the operating power of controller control loop pump 3 according to actual needs Flow velocity, flow and heat dissipation effect to mainboard 1 of the liquid in closed circuit is cooled down;Meanwhile it can also be controlled and cooled down by controller The cooling effect of device 4, and then so that mainboard 1 can be in optimal operating temperature state always, transported beneficial to mainboard 1 is effectively improved Calculate rate and computing capability.
Also, the application is in a manner that coolant cools down mainboard 1, compared to traditional wind turbine wind cooling temperature lowering Because eliminating wind turbine, at least 50%, and noiseless pollution are reduced compared to same size energy consumption for mode;In addition, mainboard 1 can root According to needing to install multiple, endless number system, compared to single 1 single chassis of mainboard, volume is substantially reduced.
Thus, the application provide cooling system be particularly suitable for mainframe computer center, have floor space it is small, cooling Efficient, noiseless, low cost, the advantages such as low energy consumption, failure rate is low, have good development prospect.
Cooling medium in another attached drawing 1 into and cooling medium go out to refer to through other types of cooling in cooler 4 The mode that is cooled down of coolant.Other types of cooling can include water cooling, air-cooled or other rational cooling ways.
As the preferred of above-mentioned technical proposal, mainboard 1 is equipped with the first thermal detector, and the first thermal detector is used to detect mainboard 1 Temperature, and the first thermal detector is connected with controller.
In the present embodiment, the first thermal detector can be pasted in the outer surface of mainboard 1, for monitoring the temperature of mainboard 1 in real time Degree, and the real-time temperature values of mainboard 1 are sent to controller, controller then according to 1 temperature of mainboard detected when, to cooler 4 and circulating pump 3 effectively adjusted so that 1 temperature of mainboard can be in optimal operating temperature state always, beneficial to ensuring Mainboard 1 can carry out efficiently calculating operation.
Wherein, the quantity of the first thermal detector can be multiple that multiple first thermal detectors can be centered on the center of mainboard 1 It is symmetricly set on the outer surface of mainboard 1, controller then can optimize meter according to the temperature value that multiple first thermal detectors measure It calculates, most real 1 temperature value of mainboard can be obtained, accurate and effective control is carried out beneficial to cooler 4 and circulating pump 3, and Beneficial to the rate of pumping, flow and temperature of precision controlling cooling liquid, and then ensure that mainboard 1 can be in optimal operating temperature always State.Simple in structure, design is rationally and temperature control effect is good.
Preferably, temperature sensor can be selected in the first thermal detector, wherein, temperature sensor can be thermocouple, thermocouple Cheap, without power supply and temperature-measuring range is wide or thermistor, and thermistor volume is very small, and high sensitivity is right Also fast and temperature measurement accuracy is high for the response of temperature change, and the class of suitable thermal detector can be specifically selected according to actual implementation condition Type.
As the preferred of above-mentioned technical proposal, efficient integral box 2 includes case body and arranged on the intrinsic reservoir of case, storage The import and export of liquid bath is connected with cooler 4 and circulating pump 3 respectively by pipeline;Reservoir is used to install coolant, and mainboard 1 is fixedly arranged in reservoir.
In the present embodiment, efficient integral box 2 includes case body, and reservoir is equipped in case body, is filled in reservoir Coolant, mainboard 1 are located in reservoir.Reservoir, cooler 4 and circulating pump 3 constitute a cooling closed circuit as a result, Simple in structure and filled with coolant in cooling closed circuit, design is rationally and processing technology is easy, is ensuring cooling effect Simultaneously beneficial to production cost is reduced, economy is strong.
Separately it should be noted that, reservoir can be also not provided in efficient integral box 2, own as a liquid storage babinet knot Structure, and the import and export for connecting cooler 4 and circulating pump 3 is offered on babinet, it can also realize to the effective cold of mainboard 1 But, the structure type of efficient integral box 2 can be specifically selected according to actual implementation condition.
As the preferred of above-mentioned technical proposal, reservoir is equipped with slot, and mainboard 1 is equipped with chimb;Mainboard 1 is by chimb with inserting Slot grafting is fixedly connected with realizing with reservoir.
In the present embodiment, mainboard 1 uses the connection mode of grafting with reservoir, and specifically, reservoir is equipped with slot, main The edge of plate 1 is equipped with the chimb being connected with slot, chimb and slot grafting, and mainboard 1 is fixed in reservoir with realizing, Simple in structure, easy to operate, processing technology is easy and good fixing effect.
Apart from the above, chimb can be also equipped in reservoir, mainboard 1 is equipped with slot, chimb and slot grafting, to realize Mainboard 1 is fixed in reservoir, rational connection mode can be specifically selected according to actual implementation condition.
Need additional description, mainboard 1 and reservoir except using grafting be fixedly connected with mode in addition to, can also be in liquid storage Supporting rack is equipped in slot, mainboard 1 is located on supporting rack and so that mainboard 1 is contacted with coolant, so that mainboard 1 and coolant There can be enough heat exchange areas, and then to ensure cooling-down effect.
As the preferred of above-mentioned technical proposal, efficient integral box includes being internally provided with coolant and its top has opening Babinet, the opening of babinet are equipped with the case lid that can be opened and closed;Babinet and case lid are made of resin or corrosion-resistant metal material.
Specifically, in the present embodiment, efficient integral box includes the babinet of upper end opening and lid is located at box opening Case lid, the interior coolant for being equipped with to cool down mainboard of babinet, and case lid is set to energy open and close type, in order to pick and place mainboard and supplement Coolant, simple in structure, design is reasonable.
Wherein, case lid is set to energy open and close type, mode that both can be manually is opened or lid mould assembling lid;It can also pass through Automatic mode installs a drive rod such as between babinet and case lid, i.e., is opened or lid mould assembling lid by drive rod.
Preferably, babinet and case lid are made of resin material or some metal materials with corrosion resistance, in favor of Ensure effectively to cool down mainboard and extend the service life of efficient integral box.Wherein, such as some gold with corrosion resistance Belonging to material includes stainless steel, titanium or nichrome etc..
As the preferred of above-mentioned technical proposal, coolant includes cooling oil, liquid metal or cooling water.
Coolant includes one kind of cooling oil, liquid metal or cooling water.In the present embodiment, coolant preferably uses liquid State metal, and preferably using do not aoxidize and melting temperature close to the optimum working temperature of mainboard 1 liquid metal type, heat conduction effect Fruit is good and easy temperature control, thus can effectively cool down mainboard 1, and mainboard 1 is enabled to be in optimal operating temperature always.
Specifically, the type of rational coolant can be selected as needed in practical applications.
As the preferred of above-mentioned technical proposal, multiple mainboards 1 are by longitudinally spaced distributions or in the way of being spaced laterally apart In coolant.
In the present embodiment, when the quantity of mainboard 1 is multiple, multiple mainboards 1 can carry out longitudinal direction in integrated efficient case It is arranged at intervals or is horizontally arranged at interval, can also arrange according to regular shape or irregular shape, it is only necessary to meet each master Plate 1 can have the condition of enough heat exchange areas with coolant.Specifically, the arrangement of multiple mainboards 1 can be according to reality The needs of border implementation condition are reasonably set.
As the preferred of above-mentioned technical proposal, cooling closed circuit is equipped with the regulating valve being connected with controller, and adjusts Valve is between efficient integral box 2 and cooler 4.
In the present embodiment, cool down on closed circuit and be additionally provided with regulating valve, regulating valve is connected with controller, passes through controller Pressure and flow that valve effectively adjusts coolant are controlled to adjust, beneficial to the effective cooling carried out to mainboard 1.
Embodiment two
With differing only in for embodiment one:
As the preferred of above-mentioned technical proposal, the entrance of cooler is equipped with the second thermal detector, and the second thermal detector is used to examine The temperature with the coolant after mainboard heat exchange is surveyed, and the second thermal detector is connected with controller.
In the present embodiment, the second thermal detector can be equipped in the entrance of cooler, exchanged heat for monitoring in real time with mainboard The temperature of coolant afterwards, and the temperature of the coolant after exchanging heat with mainboard is sent to controller, controller is then according to detection The coolant temperature arrived effectively adjusts cooler and circulating pump, so that mainboard temperature can be always in most preferably Operating temperature state, beneficial to ensuring that mainboard can carry out efficiently calculating operation.
Wherein, the quantity of the second thermal detector can be multiple that multiple second thermal detectors can be using the import of cooler in The heart is symmetricly set on the input end of cooler, and controller then can optimize meter according to the temperature value that multiple second thermal detectors measure It calculates, it is accurate beneficial to being carried out to cooler and circulating pump the temperature value of the coolant after most really exchanging heat with mainboard can be obtained And effective control, and beneficial to rate of pumping, flow and the temperature of precision controlling cooling liquid, and then ensure that mainboard can be in always Optimal operating temperature state.Simple in structure, design is rationally and temperature control effect is good.
Preferably, similar with the first thermal detector, temperature sensor can be selected in the second thermal detector, wherein, temperature sensor can To be thermocouple, thermocouple is cheap, and without power supply and temperature-measuring range is wide or thermistor, thermistor volume Very small, high sensitivity is high to the response of temperature change also fast and temperature measurement accuracy, can specifically be selected according to actual implementation condition The type of suitable thermal detector.
It should be noted that in the present embodiment, by the way that the first thermal detector will be equipped on mainboard, with by cooler into It is combined at mouthful equipped with the second thermal detector, so that controller can obtain the real-time temperature values of mainboard and simultaneously through exchanging heat with mainboard The real-time temperature values of coolant afterwards carry out cooler and circulating pump accurate and effective control beneficial to controller, and are beneficial to Rate of pumping, flow and the temperature of precision controlling cooling liquid, finally to ensure that mainboard can be in optimal operating temperature shape always State.
Other technologies scheme is identical with embodiment one, to avoid repeating, repeats no more.
Embodiment three
With differing only in for embodiment one:
As the preferred of above-mentioned technical proposal, the quantity of efficient integral box is multiple, and multiple efficient integral boxes are in parallel or go here and there An efficient integral box group is formed after connection connection.
In the present embodiment, the quantity of efficient integral box is two or more, and multiple efficient integral boxes pass through pipeline Both it can be connected in series to, can also connect in parallel, an efficient integral box group is formed after connection;Efficiently Integral box group is sequentially connected with circulating pump and cooler by pipeline, and forms cooling closed circuit.
By being equipped with multiple efficient integral boxes, also effectively to be cooled down for greater number of mainboard simultaneously, it is suitable for Large-scale computer center.Specifically, the connection mode between multiple efficient integral boxes can be carried out according to actual implementation condition It is rational to set.
It is further to be pointed out that when the quantity of efficient integral box is multiple, multiple efficient integral boxes, which can also be concentrated, to be set In in a big babinet, in this way, integration degree is high, also it is beneficial to improve aesthetic appearance.
Other technologies scheme is identical with embodiment one, to avoid repeating, repeats no more.
In conclusion the present invention provides a kind of efficiently integrated cloud computer cooling system, including controller, mainboard and After being sequentially connected by pipeline formed cooling closed circuit efficient integral box, circulating pump, cooler, controller respectively with cycling Pump and cooler connection, cool down and coolant are filled in closed circuit;The quantity of mainboard is multiple, and multiple mainboards at least portion Divide and be immersed in the coolant in efficient integral box.The cloud computer cooling system provided using the application, it is only necessary to by master Plate is immersed in coolant, and is passed through controller and controlled cooler that coolant Xun Huan is made to coolant cooling and circulating pump respectively With in this way, heat transfer efficiency is high, cooling-down effect is apparent, beneficial to effectively improving mainboard arithmetic speed and computing capability, and due to not adopting With wind cooling temperature lowering, wind turbine is eliminated, at least 50%, and noiseless pollution are reduced compared to same size energy consumption;In addition, mainboard can Multiple, endless number system is installed as needed, compared to single mainboard single chassis, volume is reduced.Thus the application provides Cooling system is particularly suitable for mainframe computer center, with floor space is small, cooling efficiency is high, noiseless, low cost, energy consumption The low, advantages such as failure rate is low, have good development prospect.
Finally it should be noted that:The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations;Although The present invention is described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that:It still may be used To modify to the technical solution recorded in foregoing embodiments or carry out equivalent substitution to which part technical characteristic; And these modification or replace, do not make appropriate technical solution essence depart from various embodiments of the present invention technical solution spirit and Scope.

Claims (10)

1. a kind of efficiently integrated cloud computer cooling system, it is characterised in that:Including controller, mainboard and by pipeline successively After connection formed cooling closed circuit efficient integral box, circulating pump, cooler, the controller respectively with the circulating pump and Cooler connects, and coolant is filled in the cooling closed circuit;The quantity of the mainboard is multiple, and multiple mainboards It is at least partially submerged in the coolant in the efficient integral box.
2. efficiently integrated cloud computer cooling system according to claim 1, it is characterised in that:The mainboard is equipped with First thermal detector, first thermal detector are used to detect the temperature of the mainboard, and first thermal detector and the controller Connection.
3. efficiently integrated cloud computer cooling system according to claim 1 or 2, it is characterised in that:The cooler Entrance be equipped with the second thermal detector, second thermal detector for detect with the mainboard heat exchange after coolant temperature, And second thermal detector is connected with the controller.
4. efficiently integrated cloud computer cooling system according to claim 1, it is characterised in that:The efficient integral box Including case body and arranged on the intrinsic reservoir of the case, the import and export of the reservoir by pipeline respectively with it is described Cooler and circulating pump connection;The reservoir is for installing the coolant, and the mainboard is fixedly arranged in the reservoir.
5. efficiently integrated cloud computer cooling system according to claim 4, it is characterised in that:The reservoir is equipped with Slot, the mainboard are equipped with chimb;The mainboard is fixedly connected by chimb and slot grafting with realizing with reservoir.
6. efficiently integrated cloud computer cooling system according to claim 1, it is characterised in that:The efficient integral box Quantity to be multiple, multiple efficient integral boxes form an efficient integral box group after connecting in parallel or series.
7. efficiently integrated cloud computer cooling system according to claim 1, it is characterised in that:The efficient integral box Including being internally provided with coolant and its babinet of top with opening, the opening of the babinet is equipped with the case lid that can be opened and closed;Institute Babinet and case lid is stated to be made of resin or corrosion-resistant metal material.
8. efficiently integrated cloud computer cooling system according to claim 1, it is characterised in that:The coolant includes Cooling oil, liquid metal or cooling water.
9. efficiently integrated cloud computer cooling system according to claim 1, it is characterised in that:Multiple mainboards are pressed It is arranged on according to longitudinally spaced distributions or the mode being spaced laterally apart in the coolant.
10. efficiently integrated cloud computer cooling system according to claim 1, it is characterised in that:The cooling is closed Circuit is equipped with the regulating valve that be connected with the controller, and the regulating valve be located at the efficient integral box and cooler it Between.
CN201810016394.8A 2018-01-08 2018-01-08 A kind of efficiently integrated cloud computer cooling system Pending CN108089682A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109588018A (en) * 2018-12-28 2019-04-05 成都中讯创新科技股份有限公司 A kind of full immersed type data center architecture
CN111225543A (en) * 2019-10-31 2020-06-02 苏州浪潮智能科技有限公司 Immersed liquid cooling server management system and server
CN113710057A (en) * 2021-08-12 2021-11-26 中国电子科技集团公司电子科学研究院 Airborne single-phase immersed comprehensive circulating heat management system and airborne integrated comprehensive rack
US20230229209A1 (en) * 2020-09-08 2023-07-20 Inspur Suzhou Intelligent Technology Co., Ltd. Heat dissipation control method, apparatus and device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103336566A (en) * 2013-07-17 2013-10-02 曙光信息产业(北京)有限公司 Server
CN103616940A (en) * 2013-11-12 2014-03-05 曙光信息产业(北京)有限公司 Blade server
CN104216492A (en) * 2014-09-29 2014-12-17 上海交通大学 Liquid-state cooling immersion type structure heat dissipation system for computer chip
CN105652993A (en) * 2016-03-18 2016-06-08 苏州大景能源科技有限公司 Integrated liquid-cooled heat dissipation computer case
CN106445037A (en) * 2016-11-29 2017-02-22 广东合新材料研究院有限公司 Partial immersion type liquid cooling server cooling system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103336566A (en) * 2013-07-17 2013-10-02 曙光信息产业(北京)有限公司 Server
CN103616940A (en) * 2013-11-12 2014-03-05 曙光信息产业(北京)有限公司 Blade server
CN104216492A (en) * 2014-09-29 2014-12-17 上海交通大学 Liquid-state cooling immersion type structure heat dissipation system for computer chip
CN105652993A (en) * 2016-03-18 2016-06-08 苏州大景能源科技有限公司 Integrated liquid-cooled heat dissipation computer case
CN106445037A (en) * 2016-11-29 2017-02-22 广东合新材料研究院有限公司 Partial immersion type liquid cooling server cooling system

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109588018A (en) * 2018-12-28 2019-04-05 成都中讯创新科技股份有限公司 A kind of full immersed type data center architecture
CN111225543A (en) * 2019-10-31 2020-06-02 苏州浪潮智能科技有限公司 Immersed liquid cooling server management system and server
CN111225543B (en) * 2019-10-31 2022-04-26 苏州浪潮智能科技有限公司 Immersed liquid cooling server management system and server
US20230229209A1 (en) * 2020-09-08 2023-07-20 Inspur Suzhou Intelligent Technology Co., Ltd. Heat dissipation control method, apparatus and device
US11853135B2 (en) * 2020-09-08 2023-12-26 Inspur Suzhou Intelligent Technology Co., Ltd. Heat dissipation control method, apparatus and device
CN113710057A (en) * 2021-08-12 2021-11-26 中国电子科技集团公司电子科学研究院 Airborne single-phase immersed comprehensive circulating heat management system and airborne integrated comprehensive rack
CN113710057B (en) * 2021-08-12 2024-05-24 中国电子科技集团公司电子科学研究院 Airborne single-phase immersed comprehensive circulation heat management system and airborne integrated comprehensive rack

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Application publication date: 20180529