CN105652993A - Integrated liquid-cooled heat dissipation computer case - Google Patents
Integrated liquid-cooled heat dissipation computer case Download PDFInfo
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- CN105652993A CN105652993A CN201610157036.XA CN201610157036A CN105652993A CN 105652993 A CN105652993 A CN 105652993A CN 201610157036 A CN201610157036 A CN 201610157036A CN 105652993 A CN105652993 A CN 105652993A
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- heat radiation
- catheter
- integral type
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- 230000017525 heat dissipation Effects 0.000 title abstract description 12
- 238000001816 cooling Methods 0.000 claims abstract description 82
- 239000007788 liquid Substances 0.000 claims abstract description 62
- 238000005507 spraying Methods 0.000 claims abstract description 37
- 238000005086 pumping Methods 0.000 claims abstract description 10
- 230000005855 radiation Effects 0.000 claims description 48
- 239000012809 cooling fluid Substances 0.000 claims description 41
- 239000000463 material Substances 0.000 claims description 6
- 239000012535 impurity Substances 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims 1
- 239000000110 cooling liquid Substances 0.000 abstract description 12
- 238000013461 design Methods 0.000 abstract description 7
- 238000012545 processing Methods 0.000 abstract description 2
- 239000007921 spray Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 7
- 238000009833 condensation Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 239000002826 coolant Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 3
- UAJUXJSXCLUTNU-UHFFFAOYSA-N pranlukast Chemical compound C=1C=C(OCCCCC=2C=CC=CC=2)C=CC=1C(=O)NC(C=1)=CC=C(C(C=2)=O)C=1OC=2C=1N=NNN=1 UAJUXJSXCLUTNU-UHFFFAOYSA-N 0.000 description 3
- 229960004583 pranlukast Drugs 0.000 description 3
- 206010037660 Pyrexia Diseases 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000027950 fever generation Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000003116 impacting effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- LLBZPESJRQGYMB-UHFFFAOYSA-N 4-one Natural products O1C(C(=O)CC)CC(C)C11C2(C)CCC(C3(C)C(C(C)(CO)C(OC4C(C(O)C(O)C(COC5C(C(O)C(O)CO5)OC5C(C(OC6C(C(O)C(O)C(CO)O6)O)C(O)C(CO)O5)OC5C(C(O)C(O)C(C)O5)O)O4)O)CC3)CC3)=C3C2(C)CC1 LLBZPESJRQGYMB-UHFFFAOYSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Abstract
The invention relates to the field of liquid cooling, and provides an integrated liquid-cooled heat dissipation computer case. The integrated liquid-cooled heat dissipation computer case comprises a case body, a mainboard and a liquid-cooled heat dissipation system; the case body is a closed space formed by a plurality of wall boards; the mainboard is arranged in the case body; heat emitting devices are arranged on the mainboard; the heat emitting devices comprise a CPU (Central Processing Unit) and a display card; a liquid storage groove is formed at the bottom of the case body; the liquid storage groove is used for storing cooling liquid; the liquid-cooled heat dissipation system comprises a pipeline, a heat dissipation mechanism, a pumping mechanism and a spraying mechanism; the cooling liquid in the liquid storage groove is pumped into the pipeline by the pumping mechanism; one end of the pipeline is connected with the spraying mechanism; the cooling liquid is sprayed into the case body or directly sprayed to the heat emitting devices by the spraying mechanism; the heat dissipation mechanism is arranged on the pipeline in front of the spraying mechanism or is arranged on the wall board of the case body; and heat of the cooling liquid is transferred out of the case body by the heat dissipation mechanism. The integrated liquid-cooled heat dissipation computer case adopts an integrated structural design, and solves the problem of the condition of excessively high temperatures of the heat emitting devices in a computer. The integrated liquid-cooled heat dissipation computer case is convenient to carry, reasonable in design, light in weight, high in heat exchange capacity and low in cost.
Description
Technical field
The present invention relates to liquid cools field, relate in particular to integral type liquid-cooling heat radiation computer cabinet.
Background technology
Along with the fast development of modern computer science, computer integrated level is more and more higher, performance is become better and better,The difficulty of simultaneously dispelling the heat is also increasing. For ensureing the normal operation of equipment, heat need be derived from heater elementIn environment. For the little equipment of caloric value, conventionally adopt air-cooled heat radiation, increasing situationUnder, air-cooledly can not meet radiating requirements, liquid cools application increases. Compared with air-cooled, liquid cooling can be byThe cooling fluid thermal source that directly or indirectly leads, because the specific heat capacity of liquid is much larger than gas, unit volume can be transmittedHeat also far above air.
At present, the application process of liquid cooling is broadly divided into direct liquid cools and two kinds of indirect liquid cools. DirectlyConnect liquid cools, as the term suggests directly contact existing direct liquid cools side with heater members for cooling fluidIt is that immersion liquid cooling server, the U.S. Patent Publication No. of CN104597994 is that method application has patent publication No.A kind of integrated heat spreader of US7911782B2, pumping system are in the high-performance computer of one. Above-mentioned direct liquidBody is cooling all needs a large amount of cooling fluids, causes that system weight is large, complex structure. The meter of current computer chipCalculation ability improves rapidly, and caloric value is also continuing increase, and above-mentioned direct liquid cools technology adapts to this challengeLimited in one's ability.
Corresponding with direct liquid cools, the cooling fluid in liquid cools does not directly contact with heater members indirectly,If patent publication No. is evaporation-cooled device attached to surface of super computer, the patent that CN101751096B disclosesPublication No. is that the liquid cold plate adopting in CN102711414A contacts with heater members, indirectly takes away heatDevice. The heater members that this two schemes can only cooling processing CPU, GPU etc. possesses regular heat-delivery surface is looseThe heat sending, and as helpless in the parts such as internal memory, resistance to other heater members on circuit board,Therefore toward contact need to air-cooled combination. In addition because cooling fluid does not directly contact with heater members, deposit centreIn thermal contact resistance and thermal-conduction resistance, cause heat exchanger efficiency low. In equal heater members surface temperature situation,Coolant temperature that need to be lower than direct liquid cools.
In computer use procedure, computer heating seriously can cause computer corruption, blue screen, power-off etc.Fault, the basic structure of traditional computer wind-cooling heat dissipating comprises fan and fastener, and multiple wind need to be installed conventionallyFan, but the fan of installing too much can expend a large amount of electric energy, meanwhile, makes limited box house space narrowerLittle, radiating efficiency is lower, in addition, also has some computers to use immersion liquid-cooling heat radiation structure, conventionally needsAttach outer circulation device, complex structure, because cooling fluid is full of cabinet by needs, can exist cost high,The drawback that weight is large, therefore designs integral type liquid-cooling heat radiation computer cabinet computer internal heat generation element is carried outCooling down is necessary.
Summary of the invention
For overcoming the deficiencies in the prior art, the object of the invention is to provide integral type liquid-cooling heat radiation computer cabinet,Comprise casing, mainboard and liquid cooling heat radiation system, described casing is the confined space being made up of polylith wallboard, instituteState mainboard and be placed in described casing, on described mainboard, be provided with heater members, described heater members comprises CPUAnd video card, described bottom half forms reservoir, and described reservoir is used for storing cooling fluid, described cooling fluidFor non-electrically conductive liquid, described liquid cooling heat radiation system comprises pipeline, cooling mechanism, pumping mechanism and spraying mechanism,Described pumping mechanism pumps into the cooling fluid in described reservoir in described pipeline, and one end of described pipeline connectsHave described spraying mechanism, described spraying mechanism is injected in cooling fluid in described casing or described in injecting directly onOn heater members, described cooling mechanism is arranged on the pipeline before described spraying mechanism or is arranged on described caseOn body wall plate, described cooling mechanism is by extremely described casing outside of the heat delivery of cooling fluid.
Preferably, described reservoir is open-top reservoir, described in the other end of described pipeline is immersed inIn cooling fluid in reservoir.
Alternatively, the other end of described pipeline is connected with the described pumping mechanism being placed in described reservoir.
Preferably, described liquid cooling heat radiation system also comprises filter mechanism, and described filter mechanism can be by cooling fluidIn Impurity removal.
Particularly, described cooling mechanism is heat exchanger, and described pumping mechanism is pump, and described filter mechanism wasFilter, the quantity of described heat exchanger, described pump and described filter is one or more.
Preferably, the nozzle that described spraying mechanism comprises catheter and is communicated with described catheter, described drainPipe is connected with described pipeline.
Preferably, branch's catheter that described catheter comprises main catheter and/or is communicated with described main catheter,Described nozzle is arranged on described main catheter and/or branch's catheter, or described in being arranged on by adapterOn catheter.
At length, described nozzle is injected in cooling fluid on described heater members with Sprayable, to describedThermal device carries out cooling down.
Preferably, nozzle and described heater members on described branch catheter are oppositely arranged, for for instituteState heater members and carry out directly spraying cooling.
Further, on described casing, be provided with air-breather, in described air-breather, gas permeable material be installed,Described air-breather is used for maintaining described box house air pressure and atmospheric pressure balance.
Integral type liquid-cooling heat radiation computer cabinet provided by the invention, it has following beneficial effect:
1, integral type liquid-cooling heat radiation computer cabinet provided by the invention, with existing air-cooled or liquid cooling apparatus phaseRatio, adopted the form of spraying, and spray coolant, in case intracorporeal space, is utilized to droplet wide coverageAdvantage, forms thin liquid film on heater members surface, due to droplet ejection at a high speed, while impacting device surface stillThere is high flow velocities, therefore can promote liquid film flow at high speed, thereby enhanced heat exchange improves cooling heat dissipation efficiency.
2, the Spray Way that the present invention adopts forms in liquid film process, along with liquid on heater members surfaceDrip and clash into meeting generating portion bubble, these bubbles become liquid in the situation that heater members surface temperature is higherThe nucleus of boiling, can be than the immersion liquid cooling server evaporation in background technology faster, strengthening furtherHeat exchange, so just can allow to use higher coolant temperature, thereby expand application of installation scope.
3, integral type liquid-cooling heat radiation computer cabinet provided by the invention, owing to adopting spray pattern, does not needArrange as the structure of complexity so of liquid-cooling heat radiator in background technology, also do not need the cooling fluid that provides a large amount of,Thereby greatly reduce the weight of whole cabinet, because the cost of cooling fluid is higher, also reduced and established greatlyStandby cost, simultaneously because the cooling low discharge that only needs of spraying can obtain good radiating effect, the therefore consumption of pumpMerit further reduces.
4, integral type liquid-cooling heat radiation computer cabinet provided by the invention, for the large device of local pyrexia amount,As CPU and video card, be also provided with independent refrigerating module, adopt local spraying or swiftly flowing method withStrengthen its heat exchange.
5, integral type liquid-cooling heat radiation computer cabinet provided by the invention, the steam forming after cooling fluid evaporationDrip and mix with the supercooled fog of nozzle ejection, more can impel cooling liquid steam condensation.
6, the spraying mechanism that the present invention adopts, utilizes steam to drip and mix with the supercooled fog of nozzle ejection, cooling fluidSteam-condensation, does not need condenser is set separately, has alleviated construction weight, has expanded the application model of this deviceEnclose.
7, on integral type liquid-cooling heat radiation computer cabinet provided by the invention, be provided with air-breather, can maintainThereby box house pressure in approach or a little more than an atmospheric state under reduced cabinet to sealingRequirement.
8, integral type liquid-cooling heat radiation computer cabinet provided by the invention, adopts integral structure design, canThe efficient solution too high situation of computer cabinet internal heat generation device temperature of determining, this device is easy to carry, simple to operate,Reasonable in design, lightweight, exchange capability of heat is strong and cost is lower, has good marketing use value.
Brief description of the drawings
In order to be illustrated more clearly in technical scheme of the present invention, below will be in embodiment or description of the Prior ArtThe accompanying drawing of required use is briefly described, and apparently, the accompanying drawing in the following describes is only thisSome bright embodiment, for those of ordinary skill in the art, in the prerequisite of not paying creative workUnder, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of integral type liquid-cooling heat radiation computer cabinet in the embodiment of the present invention one;
Fig. 2 is structural representation Fig. 1 of integral type liquid-cooling heat radiation computer cabinet in the embodiment of the present invention two;
Fig. 3 is structural representation Fig. 2 of integral type liquid-cooling heat radiation computer cabinet in the embodiment of the present invention two.
In figure: 1-casing, 2-mainboard, 3-heater members, 4-pipeline, 5-nozzle, 6-filter, 7-pump, 8-Heat exchanger.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clearlyChu, intactly description, obviously, described embodiment is only the present invention's part embodiment, instead ofWhole embodiment. Based on the embodiment in the present invention, those of ordinary skill in the art are not making creationThe every other embodiment obtaining under the prerequisite of property work, belongs to the scope of protection of the invention.
Embodiment mono-
As shown in Figure 1, the invention provides integral type liquid-cooling heat radiation computer cabinet, comprise casing 1, mainboard2 and liquid cooling heat radiation system, described casing 1 is the confined space being made up of polylith wallboard, described casing 1 topBe provided with top cover, between described casing 1 and described top cover, be provided with openable dividing plate, described mainboard 2 is placed inIn described casing 1, on described mainboard 2, be provided with heater members 3, described heater members 3 comprise CPU andVideo card, after described dividing plate is opened, described mainboard 2 and described heater members 3 can put into by this opening orTake out, described top cover inside is placed with air-cooled radiator, adopts fan to force cooling mode to carry out heat exchange,On described top cover, be also provided with power switch and other electric interfaces for computer control, in addition, described casing 1Reservoir is formed on bottom, and described reservoir is used for storing cooling fluid, and described cooling fluid is non-electrically conductive liquid.
Described liquid cooling heat radiation system comprises pipeline 4, heat exchanger 8, pump 7, filter 6 and spraying mechanism, pump7 and filter 6 be all arranged on described pipeline 4, described filter 6 can be by the Impurity removal in cooling fluid,Described pump 7 pumps into the cooling fluid in described reservoir in described pipeline 4, and described pump 7 is arranged on described caseBody 1 inside, described heat exchanger 8 is arranged on the wallboard outside of described casing 1, for by the heat in casing 1Amount is delivered to casing 1 outside, and the two ends of described pipeline 4 are all arranged on described casing 1 inside, described pipeline 4One end be connected with described spraying mechanism, the other end of described pipeline 4 is immersed in cooling in described reservoirIn liquid, described reservoir is open-top reservoir, and cooling fluid enters after described liquid cooling heat radiation system, warpCross filter 6, pump 7 and heat exchanger 8, finally by spraying mechanism, cooling fluid is injected in described casing 1Or inject directly on described heater members 3, described heater members 3 is lowered the temperature.
Described spraying mechanism is arranged on described casing 1 inside, and described spraying mechanism comprises catheter and with describedThe nozzle 5 that catheter is communicated with, described catheter is connected with one end of described pipeline 4, and described catheter comprises masterCatheter and the branch's catheter being communicated with described main catheter, described nozzle 5 is arranged on described main catheterOn branch catheter, the nozzle on described main catheter sprays cooling fluid with Sprayable, due to dropletScattered band is large, and therefore the droplet of nozzle ejection can spread to confined space everywhere easily, simultaneously byLittle in droplet sizes, therefore also can arrive the unapproachable position of direct projection with air-flow, when droplet collidesOn plate after element, wall or other bars, sticky thereon, when being pooled to when a certain amount of, or shapeBecome large drop, or form liquid film, and flow downward under droplet impact and Action of Gravity Field, described branchNozzle on catheter and CPU or video card are oppositely arranged, for carrying out directly spraying and falling for CPU or video cardTemperature, described spraying mechanism can be injected in cooling fluid in the space that described casing 1 forms or inject directly onOn described heater members 3, described heater members 3 is lowered the temperature, the cooling liquid steam after heat exchange and sprayThe cooling fluid that mouth sprays is mixed makes cooling liquid steam condensation, and the heat sending on heater members 3, is delivered to liquidDrip or liquid film on, along with drop liquid film flow and take away, if heater members 3 surface temperatures are higher, also canImpel drop liquid film evaporation, thereby strengthened heat transfer effect.
In the present embodiment, described nozzle 5 is for being ejected into institute by described cooling liquid with discrete drop formState confined space, described nozzle 5 also has multiple injection direction, so that better scatter drop, nozzle 5The droplet typical case of ejection is conical distribution or fan-shaped distribution, is beneficial to drop space but do not get rid of with otherOther spray shapes of scattering.
In addition, on the described casing 1 of the present embodiment, be provided with air-breather, in described air-breather, be provided withGas permeable material, described gas permeable material molecular gap is little, can allow air molecule to pass through, but block water molecule andCooling liquid steam molecule passes through, in the time of described casing 1 interior variations in temperature, due to the temperature sky expanding that raisesGas molecule can be voluntarily sees through air-breather discharges, and can maintain box house pressure in approaching or a little more than oneThereby under individual atmospheric state, reduce the requirement of cabinet to sealing.
Embodiment bis-
As shown in Figures 2 and 3, the invention provides integral type liquid-cooling heat radiation computer cabinet, comprise casing 1,Mainboard 2 and liquid cooling heat radiation system, described casing 1 is the confined space being made up of polylith wallboard, described casing 1Top is provided with top cover, between described casing 1 and described top cover, is provided with openable dividing plate, described mainboard 2Be placed in described casing 1, on described mainboard 2, be provided with heater members 3, described heater members 3 comprises CPUAnd video card, after described dividing plate is opened, described mainboard 2 and described heater members 3 can put into by this opening orPerson takes out, and described top cover inside is placed with power supply and adapter plate for circuit, and in addition, described casing 1 bottom formsReservoir, described reservoir is used for storing cooling fluid, and described cooling fluid is non-electrically conductive liquid.
Described liquid cooling heat radiation system comprises pipeline 4, heat exchanger 8, pump 7, filter 6 and spraying mechanism, pump7 and filter 6 be all arranged on described pipeline 4, described filter 6 can be by the Impurity removal in cooling fluid,Described pump 7 pumps into the cooling fluid in described reservoir in described pipeline 4, and described pump 7 is arranged on described caseBody 1 outside, described heat exchanger 8 is arranged on the wallboard outside of described casing 1, for by the heat in casing 1Amount is delivered to casing 1 outside, and described heat exchanger 8 backward air-out is realized heat radiation, and the two ends of described pipeline 4 are equalBe arranged on described casing 1 inside, one end of described pipeline 4 is connected with described spraying mechanism, described pipeline 4The other end be immersed in the cooling fluid in described reservoir, described reservoir is open-top reservoir,Cooling fluid enters after described liquid cooling heat radiation system, through filter 6, pump 7 and heat exchanger 8, finally by spraySpilling mechanism is injected in cooling fluid in described casing 1 or injects directly on described heater members 3, to describedHeater members 3 is lowered the temperature.
Described spraying mechanism is arranged on described casing 1 inside, and described spraying mechanism comprises catheter and with describedThe nozzle 5 that catheter is communicated with, described catheter is connected with one end of described pipeline 4, and described catheter comprises masterCatheter and the branch's catheter being communicated with described main catheter, described nozzle 5 is arranged on described main catheterOn branch catheter, the nozzle on described main catheter sprays cooling fluid with Sprayable, due to dropletScattered band is large, and therefore the droplet of nozzle ejection can spread to confined space everywhere easily, simultaneously byLittle in droplet sizes, therefore also can arrive the unapproachable position of direct projection with air-flow, when droplet collidesOn plate after element, wall or other bars, sticky thereon, when being pooled to when a certain amount of, or shapeBecome large drop, or form liquid film, and flow downward under droplet impact and Action of Gravity Field, described branchNozzle on catheter and CPU or video card are oppositely arranged, for carrying out directly spraying and falling for CPU or video cardTemperature, described spraying mechanism can be injected in cooling fluid in the space that described casing 1 forms or inject directly onOn described heater members 3, described heater members 3 is lowered the temperature, the cooling liquid steam after heat exchange and sprayThe cooling fluid that mouth sprays is mixed makes cooling liquid steam condensation, and the heat sending on heater members 3, is delivered to liquidDrip or liquid film on, along with drop liquid film flow and take away, if heater members 3 surface temperatures are higher, also canImpel drop liquid film evaporation, thereby strengthened heat transfer effect.
In the present embodiment, described nozzle 5 is for being ejected into institute by described cooling liquid with discrete drop formState confined space, described nozzle 5 also has multiple injection direction, so that better scatter drop, nozzle 5The droplet typical case of ejection is conical distribution or fan-shaped distribution, is beneficial to drop space but do not get rid of with otherOther spray shapes of scattering.
In addition, on the described casing 1 of the present embodiment, be provided with air-breather, in described air-breather, be provided withGas permeable material, described gas permeable material molecular gap is little, can allow air molecule to pass through, but block water molecule andCooling liquid steam molecule passes through, in the time of described casing 1 interior variations in temperature, due to the temperature sky expanding that raisesGas molecule can be voluntarily sees through air-breather discharges, and can maintain box house pressure in approaching or a little more than oneThereby under individual atmospheric state, reduce the requirement of cabinet to sealing.
Integral type liquid-cooling heat radiation computer cabinet provided by the invention, it has following beneficial effect:
1, integral type liquid-cooling heat radiation computer cabinet provided by the invention, with existing air-cooled or liquid cooling apparatus phaseRatio, adopted the form of spraying, and spray coolant, in case intracorporeal space, is utilized to droplet wide coverageAdvantage, forms thin liquid film on heater members surface, due to droplet ejection at a high speed, while impacting device surface stillThere is high flow velocities, therefore can promote liquid film flow at high speed, thereby enhanced heat exchange improves cooling heat dissipation efficiency.
2, the Spray Way that the present invention adopts forms in liquid film process, along with liquid on heater members surfaceDrip and clash into meeting generating portion bubble, these bubbles become liquid in the situation that heater members surface temperature is higherThe nucleus of boiling, can be than the immersion liquid cooling server evaporation in background technology faster, strengthening furtherHeat exchange, so just can allow to use higher coolant temperature, thereby expand application of installation scope.
3, integral type liquid-cooling heat radiation computer cabinet provided by the invention, owing to adopting spray pattern, does not needArrange as the structure of complexity so of liquid-cooling heat radiator in background technology, also do not need the cooling fluid that provides a large amount of,Thereby greatly reduce the weight of whole cabinet, because the cost of cooling fluid is higher, also reduced and established greatlyStandby cost, simultaneously because the cooling low discharge that only needs of spraying can obtain good radiating effect, the therefore consumption of pumpMerit further reduces.
4, integral type liquid-cooling heat radiation computer cabinet provided by the invention, for the large device of local pyrexia amount,As CPU and video card, be also provided with independent refrigerating module, adopt local spraying or swiftly flowing method withStrengthen its heat exchange.
5, integral type liquid-cooling heat radiation computer cabinet provided by the invention, the steam forming after cooling fluid evaporationDrip and mix with the supercooled fog of nozzle ejection, more can impel cooling liquid steam condensation.
6, the spraying mechanism that the present invention adopts, utilizes steam to drip and mix with the supercooled fog of nozzle ejection, cooling fluidSteam-condensation, does not need condenser is set separately, has alleviated construction weight, has expanded the application model of this deviceEnclose.
7, on integral type liquid-cooling heat radiation computer cabinet provided by the invention, be provided with air-breather, can maintainThereby box house pressure in approach or a little more than an atmospheric state under reduced cabinet to sealingRequirement.
8, integral type liquid-cooling heat radiation computer cabinet provided by the invention, adopts integral structure design, canThe efficient solution too high situation of computer cabinet internal heat generation device temperature of determining, this device is easy to carry, simple to operate,Reasonable in design, lightweight, exchange capability of heat is strong and cost is lower, has good marketing use value.
Above disclosed is only several preferred embodiment of the present invention, certainly can not limit this with thisBright interest field, the equivalent variations of therefore doing according to the claims in the present invention, still belongs to that the present invention containsScope.
Claims (10)
1. integral type liquid-cooling heat radiation computer cabinet, is characterized in that, comprises casing (1), mainboard (2)And liquid cooling heat radiation system, described casing (1) is the confined space being made up of polylith wallboard, described mainboard (2)Be placed in described casing (1), on described mainboard (2), be provided with heater members (3), described heater members(3) comprise CPU and video card, reservoir is formed on described casing (1) bottom, and described reservoir is for storageCooling fluid, described cooling fluid is non-electrically conductive liquid,
Described liquid cooling heat radiation system comprises pipeline (4), cooling mechanism, pumping mechanism and spraying mechanism, described inPumping mechanism pumps into the cooling fluid in described reservoir in described pipeline (4), one of described pipeline (4)End is connected with described spraying mechanism, and it is interior or direct that cooling fluid is injected in described casing (1) by described spraying mechanismBe injected in described heater members (3) upper, described cooling mechanism is arranged on the pipeline (4) before described spraying mechanismGo up or be arranged on described casing (1) wallboard, described cooling mechanism is by extremely described case of the heat delivery of cooling fluidBody (1) outside.
2. integral type liquid-cooling heat radiation computer cabinet according to claim 1, is characterized in that described storageLiquid bath is open-top reservoir, and the other end of described pipeline (4) is immersed in cooling in described reservoirIn liquid.
3. integral type liquid-cooling heat radiation computer cabinet according to claim 1, is characterized in that described pipeThe other end on road (4) is connected with the described pumping mechanism being placed in described reservoir.
4. according to the integral type liquid-cooling heat radiation computer cabinet described in claim 2 or 3, it is characterized in that instituteState liquid cooling heat radiation system and also comprise filter mechanism, described filter mechanism can be by the Impurity removal in cooling fluid.
5. integral type liquid-cooling heat radiation computer cabinet according to claim 4, is characterized in that, described looseHeat engine structure is heat exchanger (8), and described pumping mechanism is pump (7), and described filter mechanism is filter (6),The quantity of described heat exchanger (8), described pump (7) and described filter (6) is one or more.
6. according to the integral type liquid-cooling heat radiation computer cabinet described in claim 1,2,3 or 5, its feature existsIn, the nozzle (5) that described spraying mechanism comprises catheter and is communicated with described catheter, described catheter withDescribed pipeline (4) is connected.
7. integral type liquid-cooling heat radiation computer cabinet according to claim 6, is characterized in that, described in leadBranch's catheter that liquid pipe comprises main catheter and/or is communicated with described main catheter, described nozzle (5) is installedOn described main catheter and/or branch's catheter, or be arranged on described catheter by adapter.
8. integral type liquid-cooling heat radiation computer cabinet according to claim 7, is characterized in that described sprayIt is upper that mouth (5) is injected in described heater members (3) by cooling fluid with Sprayable, to described heater members (3)Lower the temperature.
9. integral type liquid-cooling heat radiation computer cabinet according to claim 8, is characterized in that described pointNozzle and described heater members (3) on catheter are oppositely arranged, for for described heater members (3)Carry out directly spraying cooling.
10. integral type liquid-cooling heat radiation computer cabinet according to claim 9, is characterized in that, described inCasing is provided with air-breather on (1), in described air-breather, gas permeable material is installed, described air-breatherBe used for maintaining described casing (1) air pressure inside and atmospheric pressure balance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610157036.XA CN105652993A (en) | 2016-03-18 | 2016-03-18 | Integrated liquid-cooled heat dissipation computer case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610157036.XA CN105652993A (en) | 2016-03-18 | 2016-03-18 | Integrated liquid-cooled heat dissipation computer case |
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| Publication Number | Publication Date |
|---|---|
| CN105652993A true CN105652993A (en) | 2016-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610157036.XA Pending CN105652993A (en) | 2016-03-18 | 2016-03-18 | Integrated liquid-cooled heat dissipation computer case |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106332531A (en) * | 2016-10-31 | 2017-01-11 | 广东合新材料研究院有限公司 | Working-medium contact-type cooling system for server |
| CN106413350A (en) * | 2016-11-01 | 2017-02-15 | 广东合新材料研究院有限公司 | Liquid cooling spraying cabinet and liquid cooling spraying system thereof |
| CN106455439A (en) * | 2016-10-31 | 2017-02-22 | 广东合新材料研究院有限公司 | Data center machine room centralized cooling system |
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| CN106533459A (en) * | 2017-01-10 | 2017-03-22 | 广东合新材料研究院有限公司 | Cooling system and method for power amplifier unit of transmitter |
| CN106659092A (en) * | 2017-01-20 | 2017-05-10 | 广东合新材料研究院有限公司 | Data center cabinet and pressure spraying system thereof |
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| CN113296591A (en) * | 2021-05-26 | 2021-08-24 | 河南一禾电子科技有限公司 | Liquid cooling heat dissipation system of computer host |
| CN116449927A (en) * | 2023-03-24 | 2023-07-18 | 南方电网大数据服务有限公司 | Liquid cooling radiator of server |
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| CN106455433A (en) * | 2016-10-17 | 2017-02-22 | 广东合新材料研究院有限公司 | A liquid distribution system capable of cooling a cabinet in a direct contact manner |
| CN106455433B (en) * | 2016-10-17 | 2019-02-05 | 广东合一新材料研究院有限公司 | A kind of liquid distribution system of direct contact type cooling machine cabinet |
| CN106332531A (en) * | 2016-10-31 | 2017-01-11 | 广东合新材料研究院有限公司 | Working-medium contact-type cooling system for server |
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| CN106533459B (en) * | 2017-01-10 | 2019-06-25 | 广东合一新材料研究院有限公司 | A kind of power amplifier in transmitter unit cooling system and method |
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| US10433459B2 (en) | 2017-01-20 | 2019-10-01 | Guangdong Hi-1 New Materials Technology Research Institute Co., Ltd | Data centre cabinet and gravity spray system thereof |
| US10433460B2 (en) | 2017-01-20 | 2019-10-01 | Guangdong Hi-1 New Materials Technology Research Institute Co., Ltd | Data centre cabinet and pressure spray system thereof |
| WO2018133168A1 (en) * | 2017-01-20 | 2018-07-26 | 广东合一新材料研究院有限公司 | Cabinet in data centre, and gravity spraying system thereof |
| CN106659093A (en) * | 2017-01-20 | 2017-05-10 | 广东合新材料研究院有限公司 | Data center cabinet and gravity spraying system thereof |
| CN107122018A (en) * | 2017-04-24 | 2017-09-01 | 贵州省仁怀市西科电脑科技有限公司 | The manufacture method of fast radiating computer housing |
| CN107122018B (en) * | 2017-04-24 | 2020-05-01 | 贵州省仁怀市西科电脑科技有限公司 | Method for manufacturing quick-radiating computer case |
| CN108089682A (en) * | 2018-01-08 | 2018-05-29 | 北京荷云达世科技有限公司 | A kind of efficiently integrated cloud computer cooling system |
| CN108323113A (en) * | 2018-02-12 | 2018-07-24 | 东莞昂湃实业有限公司 | A kind of liquid-cooling heat radiation structure of bidirectional pressing |
| CN108323113B (en) * | 2018-02-12 | 2024-03-29 | 广东昂湃液冷技术有限公司 | Liquid cooling heat radiation structure of two-way exerting pressure |
| CN109062389A (en) * | 2018-10-25 | 2018-12-21 | 郑州莱兹电子科技有限公司 | A kind of CPU radiator |
| WO2020223806A1 (en) * | 2019-05-07 | 2020-11-12 | Stephane Gauthier | Cooling a computer processing unit |
| CN113296591A (en) * | 2021-05-26 | 2021-08-24 | 河南一禾电子科技有限公司 | Liquid cooling heat dissipation system of computer host |
| CN116449927A (en) * | 2023-03-24 | 2023-07-18 | 南方电网大数据服务有限公司 | Liquid cooling radiator of server |
| CN116449927B (en) * | 2023-03-24 | 2024-03-22 | 南方电网大数据服务有限公司 | Liquid cooling radiator of server |
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