CN108323113B - Liquid cooling heat radiation structure of two-way exerting pressure - Google Patents
Liquid cooling heat radiation structure of two-way exerting pressure Download PDFInfo
- Publication number
- CN108323113B CN108323113B CN201810143463.1A CN201810143463A CN108323113B CN 108323113 B CN108323113 B CN 108323113B CN 201810143463 A CN201810143463 A CN 201810143463A CN 108323113 B CN108323113 B CN 108323113B
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- Prior art keywords
- impeller
- heat
- cooling liquid
- groove
- water inlet
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- 238000001816 cooling Methods 0.000 title claims abstract description 17
- 239000007788 liquid Substances 0.000 title claims abstract description 13
- 230000005855 radiation Effects 0.000 title claims description 5
- 239000000110 cooling liquid Substances 0.000 claims abstract description 45
- 239000006096 absorbing agent Substances 0.000 claims abstract description 30
- 230000017525 heat dissipation Effects 0.000 claims abstract description 17
- 238000007789 sealing Methods 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 230000002457 bidirectional effect Effects 0.000 claims abstract description 11
- 238000010521 absorption reaction Methods 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 89
- 238000005086 pumping Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 6
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005465 channeling Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Abstract
The invention aims to provide a liquid cooling heat dissipation structure with bidirectional pressure, which comprises: the heat absorber consists of a metal piece, one surface of the metal piece is provided with a groove space structure for cooling liquid to move, the cooling liquid flows along the groove, and the other surface of the metal piece is attached to the heating device and performs heat conduction with the heating device; the sealing device is a rubber sealing piece and is used for preventing cooling liquid from leaking; the heat exchange device comprises a heat absorption device, a sealing device, a pump casing, a motor, an impeller and a rotary bearing system, wherein the pump casing, the heat absorption device and the sealing device form a single pressure cavity, the impeller rotates in the single pressure cavity to generate vertical and parallel bidirectional pressure on cooling liquid in the heat absorption device, and heat exchange efficiency is improved. The heat dissipation effect is improved, and the requirements of the market on heat dissipation products are met. The service life is prolonged, and the cost is saved.
Description
Technical Field
The invention relates to the field of heat dissipation of electronic products, in particular to a liquid cooling heat dissipation structure capable of realizing bidirectional pressure.
Background
The liquid cooling radiator is applied to electronic equipment (such as a computer) until now, the product style is various, the water cooling head structure is different, and the internal structure of the water cooling head has important influence on the radiating effect because the water cooling head is directly contacted with a heating source of the equipment. Today, consumers are more and more familiar with such heat dissipation products, and the requirements are higher and higher, and the appearance, materials, vision and lamplight become very important while the performance is being hidden. The current technology is still further improved.
Disclosure of Invention
The invention aims to provide a liquid cooling heat dissipation structure capable of realizing bidirectional pressure application, which has the advantages of saving cost, improving processing efficiency and the like, so as to solve the problems in the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the liquid cooling heat radiation structure of two-way exerting pressure is characterized by comprising: the heat absorber consists of a metal piece, one surface of the metal piece is provided with a groove space structure for cooling liquid to move, two sides of the groove space structure are correspondingly provided with a water inlet groove and a water outlet groove, the cooling liquid flows along the groove, and the other surface of the metal piece is attached to the heating device and performs heat conduction with the heating device; the sealing device is a rubber sealing piece and is used for preventing cooling liquid from leaking; the pumping device consists of a pump shell, a motor, an impeller and a rotating bearing system, wherein the pump shell and the heat absorption
The device and the sealing device form a single cavity, and the impeller rotates in the single cavity to generate parallel and vertical bidirectional pressure on cooling liquid in the heat absorbing device.
The pump shell is provided with a water inlet structure which penetrates through the center of the motor, the center of the impeller is correspondingly provided with an impeller water inlet area, the impeller is provided with N radial blade shapes, the middle channel is an impeller radial pressure water outlet, and the axial bottom of the impeller is provided with N blade type grooves; (N > =2, N being an integer).
The pump shell is provided with a water collecting hole, the impeller enables the cooling liquid to enter the water inlet groove of the heat absorption device through the water collecting hole, and the cooling liquid in the heat absorption device generates thrust in a parallel direction along with rotation of the impeller.
The axial bottom of the impeller of the pumping device is provided with N fan blade grooves, and pressure in the vertical direction is generated to cooling liquid in the heat absorbing device along with rotation of the impeller.
The heat absorber is internally provided with a heat conduction unit structure with a certain height drop, such as fin-shaped, columnar, countersunk and the like.
A water inlet structure is arranged on the pump shell, and the structure is connected with two or more water inlet pipes in series so as to be used for multi-channel heat conduction requirements.
Compared with the prior art, the invention has the following beneficial effects: the improved structure of the water cooling head provided by the invention has the advantages of simple structure and convenience in installation, thereby achieving cost optimization and improving heat dissipation efficiency. The heat dissipation effect is improved, and the requirements of the market on heat dissipation products are met.
Drawings
FIG. 1 is a schematic cross-sectional view of the overall structure of the present invention;
FIG. 2 is a schematic diagram of an exploded structure of the present invention;
FIG. 3 is a schematic view of the reverse structure of the impeller;
FIG. 4 is a radial blade profile cross-sectional view of the impeller interior;
FIG. 5 is a schematic diagram of coolant force;
FIG. 6 is a schematic view of a section A-A of FIG. 5 and a portion of an impingement jet;
FIG. 7 is a schematic view of a section A-A of FIG. 5 and a cooling liquid turbulence;
FIG. 8 is a schematic view of a single inlet pipe connected with a water inlet channel;
FIG. 9 is a schematic view of a four port inlet pipe connected to the water inlet channel;
FIG. 10 is a schematic view of the reverse construction of the pump housing;
in the figure: the water pump comprises an impeller 1, a pump shell 2, a motor 3, a sealing device 4, a heat absorber 5, a screw 6, an impeller radial pressure water outlet 7, a blade type groove 8, a water collecting hole 9, a water inlet structure 10, an impeller water inlet area 11, a single-port water inlet pipe 12, a four-port water inlet pipe 13, a water inlet tank 14, a groove 15, a water outlet tank 16 and a pump shell water outlet 17.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention discloses a bidirectional-pressure efficient liquid cooling heat radiation structure which mainly comprises a pumping device, a heat absorption device 5 and a sealing device 4. The heat sink 5 is a high thermal conductivity metallic structure such as copper/aluminum/silver. The sealing means 4 is a rubber-like seal. The heat dissipation structure is mainly characterized in that: high heat exchange efficiency, fast heat transfer, simple structure and convenient installation.
Referring to fig. 1 and 2, the metal structural member is a flat metal member, in this embodiment, one side of the metal structural member is provided with a groove space structure for cooling liquid to move, and the other side of the metal structural member is attached to the heat generating device and is a square flat metal member for conducting heat with the heat generating device; two ends of the space structure of the groove 15 are respectively connected with a water inlet groove 14 and a water outlet groove 16, and cooling liquid flows from the water inlet groove 14 to the water outlet groove 16 along the groove 15; the pumping device consists of a pump shell 2, a motor 3, an impeller 1 and a rotating bearing system, wherein the pump shell 2, a heat absorber 5 and a sealing device 4 form a single cavity (screwed and fixed by a screw 6), and the impeller rotates in the single cavity to generate parallel and vertical bidirectional pressure on cooling liquid in the heat absorber 5. The sealing device 4 is a rubber sealing member, and is arranged between the pump shell 2 and the square flat metal member to prevent the cooling liquid from leaking, and is a four-sided rubber sealing ring in the embodiment.
A groove 15 for cooling liquid to move is concavely formed in the bottom of the inner side of the heat absorber 5, a water inlet groove 14 and a water outlet groove 16 are correspondingly formed in two sides of the groove 15, cooling liquid flows along the groove 15, and the heat absorber 5 is attached to a heating device and conducts heat with the heating device; a water inlet structure 10 of a single pressure cavity is formed between a rotating bearing of the impeller 1 and the pump shell 2, and the impeller 1 is of a circular cavity structure provided with a corresponding impeller water inlet area 11; referring to fig. 4, the impeller 1 is externally provided with two or more radial blade profiles from inside to outside, the radial blade profiles are parabolic, and the middle channel is an impeller radial pressure water outlet 7.
Fig. 3 is a schematic diagram of the reverse structure of the impeller, the axial bottom of the impeller 1 is provided with N fan blade grooves 8 (N > =2, N integer), and the N fan blade grooves and the impeller radial pressure water outlet 7 of the radial blade middle channel form a key innovative structure of the invention, when the motor 3 is electrified, the cooling liquid generates two groups of thrust in vertical directions along with the rotation of the impeller 1; the corresponding impeller radial pressure water outlet 7 on the pump shell 2 is provided with a water collecting hole 9 along the water flow direction, and the cooling liquid thrown out along the impeller radial pressure water outlet 7 can directly lead to a water inlet groove 14 on one side of a groove 15 on the heat absorber 5 along the water collecting hole 9. The other side of the groove 15 is provided with a water outlet groove 16, and the cooling liquid flows along the channel of the groove 15, finally is gathered into the water outlet groove 16 and flows out from a pump shell water outlet 17 connected with the water outlet groove 16.
Referring to fig. 6, when the impeller structure rotates, two pressures in the parallel direction and the vertical direction can be simultaneously provided for the cooling liquid in the heat absorber device, so as to improve the heat exchange efficiency of the heat absorber device 5. The vertical pressure produced by the pumping device can form the impact jet effect on the bottom groove 15 of the heat absorber, namely the part nearest to the heat source, so as to generate a strong heat exchange effect and improve the total heat conductivity of the heat absorber.
Referring to fig. 7, in the two sets of flow channels with the vertical directions formed by the impellers, driving pressures in two directions are generated on the cooling liquid, so that turbulence of the flowing cooling liquid in the heat absorber 5 is increased sharply, and heat exchange efficiency is improved greatly.
The impeller water inlet area 11 is in butt joint with a water inlet on the pump shell 2 and is arranged at the upper part of the periphery of the bearing of the impeller 1.
The water inlet structure 10 arranged on the pump shell 2 penetrates through the center of the motor 3, so that the cooling liquid directly reaches the impeller water inlet area 11, and the water inlet efficiency is effectively improved. Or the water inlet structure 10 is connected with 2 or more water inlets in series for meeting the requirement of multi-channel heat conduction, and fig. 8 is a schematic diagram of a single-port water inlet pipe 12 connected with the water inlets in a channeling manner; see FIG. 9 for a schematic view of a four port inlet tube 13 connected in series with the inlet port; the number of the external water inlet pipes can be set according to the needs.
The cooling liquid enters through the water inlet structure 10 on the pump shell 2 and then enters the impeller space through the impeller water inlet area 11, the cooling liquid is thrown out along with the impeller radial pressure water outlet 7 after the impeller rotates, the cooling liquid is collected along the rotation direction of the cooling liquid in the water collecting hole 9 (see figure 10) on the pump shell 2, then enters the water inlet groove 14 of the heat absorber device, flows into the groove 15 space on the heat absorber device 5 after passing through the water inlet groove 14, and generates vertical pressure to the cooling liquid in the heat absorber device 5 along with the rotation of the impeller 1, so that the cooling liquid flows into the water outlet groove 16 under bidirectional pressure and simultaneously flows out from the pump shell water outlet 17 under bidirectional pressure; in the whole process, the cooling liquid takes away the heat on the heat absorber 5, so that the heat dissipation effect is improved, and the requirements of the market on heat dissipation products are met. The service life is prolonged, and the cost is saved.
The space structure of the groove arranged in the heat absorber 5 can adopt other schemes, for example, a heat conduction unit structure with a certain height drop is arranged, such as fin-shaped, columnar, countersunk and the like.
When the impeller structure in the structural device rotates, two pressures in the parallel direction and the vertical direction can be provided for cooling liquid in the heat absorber 5 at the same time, so that the heat exchange efficiency of the heat absorber 5 is improved.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The liquid cooling heat radiation structure of two-way exerting pressure is characterized by comprising:
the heat absorber (5) is formed by a metal piece, one surface of the metal piece is provided with a groove (15) for cooling liquid to move, the cooling liquid flows along the groove (15), and the other surface of the metal piece is attached to the heating device and performs heat conduction with the heating device;
a sealing device (4) which is a rubber sealing piece and prevents the leakage of cooling liquid;
the pumping device consists of a pump shell (2), a motor (3), an impeller (1) and a rotating bearing system, wherein the pump shell (2), a heat absorption device (5) and a sealing device (4) form a single cavity, the impeller (1) rotates in the single cavity to generate parallel and vertical bidirectional pressure on cooling liquid in the heat absorption device, a water inlet structure (10) and a pump shell water outlet (17) are arranged on the pump shell (2), the structure penetrates through the center of the motor (3), an impeller water inlet area (11) is correspondingly arranged at the center of the impeller (1), at least two radial blade shapes are arranged on the impeller (1), an intermediate channel is an impeller radial pressure water outlet (7), cooling liquid enters through the water inlet structure (10) on the pump shell (2) and then enters the space in the impeller (1) through the impeller water inlet area (11), the cooling liquid is thrown out along with the impeller radial pressure water outlet (7) after the impeller (1) rotates, and the cooling liquid generates pressure in the horizontal direction; at least two fan blade grooves (8) are formed in the axial bottom of the impeller (1), the rotation of the impeller (1) generates pressure in the vertical direction to cooling liquid in the heat absorber (5), and the cooling liquid flows out of the water outlet (17) of the pump shell under bidirectional pressure after entering the grooves (15) of the heat absorber (5).
2. The liquid cooling heat dissipation structure of two-way pressure application according to claim 1, wherein: the pump shell (2) is provided with a water collecting hole (9), and the impeller is used for enabling cooling liquid to enter the groove (15) of the heat absorber (5) through the water collecting hole (9).
3. The liquid cooling heat dissipation structure of two-way pressure application according to claim 2, wherein: the heat absorber is characterized in that the heat absorber (5) is further provided with a water inlet groove (14) and a water outlet groove (16), the water inlet groove (14) and the water outlet groove (16) are positioned at two ends of the flow direction of the groove (15), the water inlet groove (14) is communicated with the water collecting hole (9), the water outlet groove (16) is communicated with the water outlet (17) of the pump shell, the cooling liquid is thrown out along with the radial pressure water outlet (7) of the impeller after the impeller (1) rotates, and is converged to the water collecting hole (9) on the pump shell (2), then enters the water inlet groove (14) of the heat absorber (5) and flows to the groove (15) on the heat absorber (5), so that the cooling liquid flows to the water outlet groove (16) under bidirectional pressure and flows out of the water outlet (17).
4. A liquid cooling heat dissipation structure with bi-directional pressure application according to any one of claims 1 to 3, wherein: the heat absorber (5) is internally provided with a heat conduction unit structure with a certain height drop, and the heat conduction unit structure is any one of fin-shaped, columnar and counter bore-shaped.
5. A liquid cooling heat dissipation structure with bi-directional pressure application according to any one of claims 1 to 3, wherein: a water inlet structure (10) is arranged on the pump shell (2), and the structure is connected with two or more water inlet pipes in series so as to be used for multi-channel heat conduction.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810143463.1A CN108323113B (en) | 2018-02-12 | 2018-02-12 | Liquid cooling heat radiation structure of two-way exerting pressure |
| PCT/CN2018/087786 WO2019153571A1 (en) | 2018-02-12 | 2018-05-22 | Bidirectional pressurization liquid cooling heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810143463.1A CN108323113B (en) | 2018-02-12 | 2018-02-12 | Liquid cooling heat radiation structure of two-way exerting pressure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108323113A CN108323113A (en) | 2018-07-24 |
| CN108323113B true CN108323113B (en) | 2024-03-29 |
Family
ID=62904010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810143463.1A Active CN108323113B (en) | 2018-02-12 | 2018-02-12 | Liquid cooling heat radiation structure of two-way exerting pressure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108323113B (en) |
| WO (1) | WO2019153571A1 (en) |
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| JP2004134423A (en) * | 2002-10-08 | 2004-04-30 | Hitachi Ltd | Electronic apparatus cooling device |
| CN2884529Y (en) * | 2005-12-23 | 2007-03-28 | 中国科学院理化技术研究所 | Liquid cooling chip radiator driven by external moving magnet |
| CN201119216Y (en) * | 2007-10-10 | 2008-09-17 | 元山科技工业股份有限公司 | Water cooling header structure for water cooling heat radiation system |
| CN101808839A (en) * | 2007-07-23 | 2010-08-18 | 阿美里根公司 | Radial thermoelectric device assembly |
| CN103984399A (en) * | 2014-06-04 | 2014-08-13 | 深圳市鑫全盛工贸有限公司 | Water-cooled radiator |
| CN105263301A (en) * | 2015-11-12 | 2016-01-20 | 深圳市研派科技有限公司 | Liquid cooling system and liquid cooling row |
| CN105652993A (en) * | 2016-03-18 | 2016-06-08 | 苏州大景能源科技有限公司 | Integrated liquid-cooled heat dissipation computer case |
| CN205566946U (en) * | 2016-02-22 | 2016-09-07 | 深圳市研派科技有限公司 | Water -cooling head improvement structure |
| CN107091467A (en) * | 2017-06-29 | 2017-08-25 | 湖南明和光电设备有限公司 | A kind of great power LED light path heat radiation combination system |
| CN208128724U (en) * | 2018-02-12 | 2018-11-20 | 东莞昂湃实业有限公司 | A kind of liquid-cooling heat radiation structure of bidirectional pressing |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6408937B1 (en) * | 2000-11-15 | 2002-06-25 | Sanjay K. Roy | Active cold plate/heat sink |
| TWM503078U (en) * | 2015-01-09 | 2015-06-11 | Micro Star Int Co Ltd | Liquid-cooling heat dissipation device |
| CN204425872U (en) * | 2015-01-27 | 2015-06-24 | 肖启能 | A kind of water-cooling head structure of liquid cooling heat radiator |
| CN204945929U (en) * | 2015-09-17 | 2016-01-06 | 深圳市鑫全盛工贸有限公司 | A kind of integrated water-cooling device |
| CN206206191U (en) * | 2016-10-31 | 2017-05-31 | 惠州市讯硕科技有限公司 | A kind of separate assembling water pump for water-filled radiator |
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2018
- 2018-02-12 CN CN201810143463.1A patent/CN108323113B/en active Active
- 2018-05-22 WO PCT/CN2018/087786 patent/WO2019153571A1/en active Application Filing
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004134423A (en) * | 2002-10-08 | 2004-04-30 | Hitachi Ltd | Electronic apparatus cooling device |
| CN2884529Y (en) * | 2005-12-23 | 2007-03-28 | 中国科学院理化技术研究所 | Liquid cooling chip radiator driven by external moving magnet |
| CN101808839A (en) * | 2007-07-23 | 2010-08-18 | 阿美里根公司 | Radial thermoelectric device assembly |
| CN201119216Y (en) * | 2007-10-10 | 2008-09-17 | 元山科技工业股份有限公司 | Water cooling header structure for water cooling heat radiation system |
| CN103984399A (en) * | 2014-06-04 | 2014-08-13 | 深圳市鑫全盛工贸有限公司 | Water-cooled radiator |
| CN105263301A (en) * | 2015-11-12 | 2016-01-20 | 深圳市研派科技有限公司 | Liquid cooling system and liquid cooling row |
| CN205566946U (en) * | 2016-02-22 | 2016-09-07 | 深圳市研派科技有限公司 | Water -cooling head improvement structure |
| CN105652993A (en) * | 2016-03-18 | 2016-06-08 | 苏州大景能源科技有限公司 | Integrated liquid-cooled heat dissipation computer case |
| CN107091467A (en) * | 2017-06-29 | 2017-08-25 | 湖南明和光电设备有限公司 | A kind of great power LED light path heat radiation combination system |
| CN208128724U (en) * | 2018-02-12 | 2018-11-20 | 东莞昂湃实业有限公司 | A kind of liquid-cooling heat radiation structure of bidirectional pressing |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108323113A (en) | 2018-07-24 |
| WO2019153571A1 (en) | 2019-08-15 |
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Address after: 523000 No.12, West Lane 2, Shenzhen Zizi Road, Qingxi Town, Dongguan City, Guangdong Province Applicant after: Guangdong angpai liquid cooling technology Co.,Ltd. Address before: 523711 2nd floor, building a, zone 2, West Lake Industrial Park, Lin village, Tangxia Town, Dongguan City, Guangdong Province Applicant before: Apaltek (DongGuan) Co.,Ltd. |
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