CN219592955U - Embedded communication manager capable of rapidly radiating - Google Patents

Embedded communication manager capable of rapidly radiating Download PDF

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Publication number
CN219592955U
CN219592955U CN202320665835.3U CN202320665835U CN219592955U CN 219592955 U CN219592955 U CN 219592955U CN 202320665835 U CN202320665835 U CN 202320665835U CN 219592955 U CN219592955 U CN 219592955U
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China
Prior art keywords
heat
heat transfer
fan
transfer base
communication manager
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Active
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CN202320665835.3U
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Chinese (zh)
Inventor
魏福道
魏智晓
吕彦忠
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Anhui Quanmeng Electric Polytron Technologies Inc
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Anhui Quanmeng Electric Polytron Technologies Inc
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Priority to CN202320665835.3U priority Critical patent/CN219592955U/en
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model provides an embedded communication manager capable of rapidly radiating heat, which comprises: the novel heat-dissipation management machine comprises a management machine body and a radiator, wherein one side of the management machine body is inwards recessed to form an inner cavity, a side plate is arranged on one end surface of the inner cavity, and a heat-dissipation hole and a through hole are formed in the surface of the side plate. The temperature generated by the main control chip is absorbed by the soaking plate of the heat transfer base, after the temperature is absorbed, the heat transfer liquid is thermally evaporated to transfer heat to the heat dissipation fins, the fins are used for evenly dispersing the heat, and then the fans are used for blowing away the heat, so that the main control chip is cooled, and a pump body can be arranged on the heat transfer copper pipe for accelerating the flow of the heat transfer liquid, so that the flow of the heat transfer liquid is accelerated.

Description

Embedded communication manager capable of rapidly radiating
Technical Field
The utility model belongs to the technical field of heat dissipation of embedded communication management machines, and particularly relates to an embedded communication management machine capable of rapidly dissipating heat.
Background
Embedded communication managers typically need to process large amounts of data and operations, and therefore generate large amounts of heat. If heat is not effectively dissipated, it may cause the device to overheat, thereby affecting the performance and lifetime of the device. Therefore, heat dissipation is one of the important issues to be considered in the design of embedded communication management machines.
The following problems exist in the heat dissipation structure of the embedded communication manager in the prior art:
the heat dissipation area is not enough: if the area of the heat sink is too small to effectively dissipate heat, the device may overheat.
The radiator is improper in structure: some radiators are directly provided with a fan, so that the fan drives external air to enter the embedded communication manager and then blow out, the whole temperature inside the embedded communication manager can be improved, but the heat dissipation effect of a main control chip on a printed circuit board inside the embedded communication manager is poor.
Radiator design is unreasonable: the design of the radiator also affects the heat dissipation effect. If the radiator is unreasonable in design, such as improper arrangement of radiating fins, insufficient radiating fans, etc., the radiating effect is poor, thereby affecting the performance of the device.
Therefore, it is desirable to design a new heat dissipation structure to help the heat dissipation of the master control chip in the embedded communication manager.
Disclosure of Invention
Aiming at the defects existing in the prior art, the utility model aims to provide an embedded communication manager capable of rapidly radiating heat, and solves the problems in the prior art.
The utility model is realized by the following technical scheme: an embedded communication manager capable of fast heat dissipation, comprising: the management machine comprises a management machine body and a radiator, wherein one side of the management machine body is inwards recessed to form an inner cavity, a side plate is arranged on one end surface of the inner cavity, and a radiating hole and a through hole are formed in the surface of the side plate;
a printed circuit board is welded in the inner cavity, and a main control chip is welded on the printed circuit board;
the radiator consists of a heat transfer base and radiating fins, the bottom of the heat transfer base is in contact with the main control chip, the two ends of the heat transfer base are connected with heat conduction copper pipes, the heat conduction copper pipes penetrate through the radiating fins to jack up the radiating fins, a fan is arranged below the radiating fins, and the fan is connected with a transmission shaft of the motor;
one end of the radiating fin is provided with a gap with the fan, and the other end of the radiating fin passes through the through hole to the outside of the side plate.
As a preferred implementation mode, the upper and lower both sides of supervisor main part outwards extend and form the installation foot, the installation foot is equipped with four groups, and four groups of installation feet symmetrical arrangement are all opened on supervisor main part all around, and four groups of installation foot surfaces all have the mounting hole, through mounting hole cooperation installation foot, can embedded install in the all-in-one, also can install at the wall, and rethread data line is connected with the all-in-one.
As a preferred embodiment, the heat dissipation holes are provided with a plurality of side plates, the surfaces of the side plates are evenly distributed on the plurality of heat dissipation holes, the side surface of the management machine main body is also provided with an air inlet, when the fan of the radiator works, external air is introduced into the inner cavity to absorb heat of the air, the air is blown to the heat dissipation fins through the heat dissipation holes under the action of the fan, the heat is evenly dispersed through the heat dissipation fins, and then high-temperature air on the surfaces of the heat dissipation fins is blown away under the action of the fan.
As a preferred embodiment, the plurality of through holes are symmetrically and equidistantly formed on the surface of the side plate, one end of each radiating fin passes through the corresponding through hole to the outside of the side plate by 8-15mm with the fan gap, and the other end of each radiating fin passes through the corresponding through hole, so that the heat of the radiating fin cannot be effectively dissipated because the radiating fins of the main body of the multi-management machine are arranged inside the machine body, and the radiating fins can be better contacted with the outside air due to the design, so that the radiating effect is enhanced.
As a preferred implementation mode, the heat transfer base is stored with heat conducting liquid, the bottom of the heat transfer base is provided with a vapor chamber, the material of the heat transfer base is the same as that of the heat conducting copper pipe, and two ends of the heat conducting copper pipe are communicated with two ends of the heat transfer base.
As a preferred implementation mode, the heat conduction copper pipe has six groups, and six groups of heat conduction copper pipes are equidistantly arranged on two sides of the heat transfer base, the surface of the heat conduction copper pipe is plated with nickel, and the nickel-plated heat conduction copper pipe is bright and shiny silver and has the functions of rust prevention and corrosion prevention, so that the heat conduction copper pipe can be used for a long time efficiently, and the heat conduction copper pipe and the heat dissipation fins are welded together in a reflow soldering mode, so that the heat conduction copper pipe is firm and durable.
After the technical scheme is adopted, the utility model has the beneficial effects that: the temperature generated by the main control chip is absorbed by the soaking plate of the heat transfer base, after the temperature is absorbed, the heat transfer liquid is thermally evaporated to transfer heat to the heat dissipation fins, the fins are used for evenly dispersing the heat, and then the fans are used for blowing away the heat, so that the main control chip is cooled, and a pump body can be arranged on the heat transfer copper pipe for accelerating the flow of the heat transfer liquid, so that the flow of the heat transfer liquid is accelerated.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
Fig. 1 is a schematic diagram of an overall structure of an embedded communication manager capable of fast heat dissipation according to the present utility model.
Fig. 2 is a schematic diagram of an inner cavity of an embedded communication manager capable of rapidly dissipating heat.
Fig. 3 is a schematic diagram of a heat sink of an embedded communication manager capable of fast heat dissipation according to the present utility model.
Fig. 4 is a right side view of fig. 1.
In the figure, a management machine main body 100-a mounting pin 110-a mounting hole 120-a side plate 130-a side plate 140-an inner cavity 150-a printed circuit board and a main control chip 151-are arranged;
131-heat dissipation holes and 132-through holes;
200-radiator, 210-heat transfer base, 220-heat conduction copper pipe, 230-motor, 240-fan, 250-heat radiation fin.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1 to 4, the present utility model provides a technical solution: an embedded communication manager capable of fast heat dissipation, comprising: the management machine comprises a management machine body 100 and a radiator 200, wherein one side of the management machine body 100 is inwards recessed to form an inner cavity 140, a side plate 130 is arranged on one end surface of the inner cavity 140, and a radiating hole 131 and a through hole 132 are formed on the surface of the side plate 130;
a printed circuit board 150 is welded in the inner cavity 140, and a main control chip 151 is welded on the printed circuit board 150;
the radiator 200 is composed of a heat transfer base 210 and radiating fins 240, the bottom of the heat transfer base 210 is in contact with the main control chip 151, the two ends of the heat transfer base 210 are connected with heat conduction copper pipes 220, the heat conduction copper pipes 220 penetrate through the radiating fins 240 to jack up the radiating fins 240, a fan 240 is arranged below the radiating fins 240, and the fan 240 is connected with a transmission shaft of the motor 230;
one end of the heat radiation fin 240 has a gap with the blower 240, and the other end passes through the through hole 132 to the outside of the side plate 130.
As an embodiment of the utility model, the upper and lower sides of the management machine body 100 extend outwards to form the mounting feet 110, the mounting feet 110 are provided with four groups, the four groups of mounting feet 110 are symmetrically arranged around the management machine body 100, the surfaces of the four groups of mounting feet 110 are provided with the mounting holes 120, the mounting holes 120 are matched with the mounting feet 110, and the management machine can be embedded in an integrated machine, can also be installed on a wall surface, and is connected with the integrated machine through data wires.
As an embodiment of the present utility model, the heat dissipation holes 131 are provided with a plurality of side plates 130, the surfaces of the side plates 130 are evenly distributed with the plurality of heat dissipation holes 131, and the side surface of the management machine main body 100 is also provided with an air inlet, when the fan 240 of the heat sink 200 works, external air is introduced into the inner cavity 140 to absorb heat of air, under the action of the fan 240, the air is blown to the heat dissipation fins 240 through the heat dissipation holes 131, the heat is evenly dispersed through the heat dissipation fins 240, and then under the action of the fan 240, high temperature air on the surfaces of the heat dissipation fins 240 is blown away.
The through holes 132 are arranged in a plurality, the through holes 132 are symmetrically and equidistantly formed on the surface of the side plate 130, one end of each radiating fin 240 is 8-15mm away from the fan 240, and the other end of each radiating fin 132 passes through the through holes 132 to the outside of the side plate 130, so that heat of the radiating fins 240 cannot be effectively dissipated because the radiating fins 240 of the main body 100 of the multi-management machine are arranged inside the machine body, and the radiating fins 240 can be better contacted with the outside air due to the design, so that the radiating effect is enhanced.
The heat transfer base 210 stores heat conducting liquid, the bottom of the heat transfer base 210 is provided with a vapor chamber, the material of the heat transfer base 210 is the same as that of the heat conducting copper pipe 220, two ends of the heat conducting copper pipe 220 are communicated with two ends of the heat transfer base 210, the heat conducting liquid flows in the heat transfer base 210 and the heat conducting copper pipe 220 and evaporates when encountering heat, the heat is transferred to the heat radiating fins 240, the fins are used for evenly dispersing the heat, the heat is blown away by a fan, specifically, the temperature generated by the main control chip 151 is absorbed by the vapor chamber of the heat transfer base 210, the heat conducting liquid is thermally evaporated after being absorbed, the heat is transferred to the heat radiating fins 240, the fins are used for evenly dispersing the heat, and then the fan is used for blowing away the heat, so that the main control chip 151 is cooled, and a pump body can be arranged on the heat conducting copper pipe 220 for accelerating the flow of the heat conducting liquid.
The heat conduction copper pipe 220 has six groups, and six groups of heat conduction copper pipes 220 are equidistantly arranged on two sides of the heat transfer base 210, nickel is plated on the surface of the heat conduction copper pipe 220, and the nickel-plated heat conduction copper pipe 220 is bright and shiny silver and has the functions of rust prevention and corrosion prevention, so that the heat conduction copper pipe 220 can be used for a long time efficiently, and the heat conduction copper pipe 220 and the heat dissipation fins 240 are welded together in a reflow soldering mode, so that the heat conduction copper pipe is firm and durable.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.

Claims (6)

1. An embedded communication manager capable of fast heat dissipation, comprising: the management machine comprises a management machine body and a radiator, and is characterized in that one side of the management machine body is inwards recessed to form an inner cavity, a side plate is arranged on one end surface of the inner cavity, and a radiating hole and a through hole are formed in the surface of the side plate;
a printed circuit board is welded in the inner cavity, and a main control chip is welded on the printed circuit board;
the radiator consists of a heat transfer base and radiating fins, the bottom of the heat transfer base is in contact with the main control chip, the two ends of the heat transfer base are connected with heat conduction copper pipes, the heat conduction copper pipes penetrate through the radiating fins to jack up the radiating fins, a fan is arranged below the radiating fins, and the fan is connected with a transmission shaft of the motor;
one end of the radiating fin is provided with a gap with the fan, and the other end of the radiating fin passes through the through hole to the outside of the side plate.
2. The embedded communication manager capable of rapidly dissipating heat according to claim 1, wherein: the upper and lower both sides of supervisor main part outwards extend and form the installation foot, the installation foot is equipped with four sets of, and four sets of installation feet symmetrical arrangement are all around the supervisor main part, and four sets of installation foot surfaces all open the mounting hole.
3. The embedded communication manager capable of rapidly dissipating heat according to claim 1, wherein: the side face of the management machine main body is also provided with an air inlet through the plurality of radiating holes.
4. A fast cooling embedded communication manager as claimed in claim 3, wherein: the heat dissipation device comprises a side plate, a fan, a plurality of through holes, a heat dissipation fin, a fan gap, a fan and a fan, wherein the plurality of through holes are symmetrically and equidistantly formed in the surface of the side plate, and the other end of the through hole penetrates through the through holes to the outside of the side plate through the gap between one end of the heat dissipation fin and the fan by 8-15 mm.
5. A fast cooling embedded communication manager as claimed in claim 3, wherein: the heat transfer base is internally provided with heat conduction liquid, the bottom of the heat transfer base is provided with a vapor chamber, the material of the heat transfer base is the same as that of the heat conduction copper pipe, and two ends of the heat conduction copper pipe are communicated with two ends of the heat transfer base.
6. A fast cooling embedded communication manager according to claim 4 or 5, wherein: the heat conduction copper pipes are provided with six groups, the six groups of heat conduction copper pipes are equidistantly distributed on two sides of the heat transfer base, the surfaces of the heat conduction copper pipes are plated with nickel, and the heat conduction copper pipes and the heat dissipation fins are welded together in a reflow soldering mode.
CN202320665835.3U 2023-03-29 2023-03-29 Embedded communication manager capable of rapidly radiating Active CN219592955U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320665835.3U CN219592955U (en) 2023-03-29 2023-03-29 Embedded communication manager capable of rapidly radiating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320665835.3U CN219592955U (en) 2023-03-29 2023-03-29 Embedded communication manager capable of rapidly radiating

Publications (1)

Publication Number Publication Date
CN219592955U true CN219592955U (en) 2023-08-25

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ID=87688546

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320665835.3U Active CN219592955U (en) 2023-03-29 2023-03-29 Embedded communication manager capable of rapidly radiating

Country Status (1)

Country Link
CN (1) CN219592955U (en)

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