CN219919518U - Power supply converter - Google Patents
Power supply converter Download PDFInfo
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- CN219919518U CN219919518U CN202223041029.3U CN202223041029U CN219919518U CN 219919518 U CN219919518 U CN 219919518U CN 202223041029 U CN202223041029 U CN 202223041029U CN 219919518 U CN219919518 U CN 219919518U
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- power converter
- pcb
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- 239000000919 ceramic Substances 0.000 claims abstract description 106
- 239000000463 material Substances 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 29
- 230000000694 effects Effects 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000009434 installation Methods 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 6
- 239000007787 solid Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 1
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a power converter, which relates to the field of power, and comprises: the PCB comprises a first surface; the at least one electronic device comprises a first surface and a second surface opposite to the first surface, and the first surface of the at least one electronic device is assembled on the first surface of the PCB; the at least one ceramic piece comprises a first surface and a second surface opposite to the first surface, and the first surface of each at least one ceramic piece is assembled on the second surface of an electronic device. The automatic installation and the assembly are convenient, the production efficiency is improved, the manual assembly cost is reduced, and the miniaturization design requirement of products is met while the insulation heat dissipation effect of electronic devices in the power converter is improved.
Description
Technical Field
The utility model relates to the field of power supplies, in particular to a power supply converter.
Background
In the new energy industry, power products generally operate at higher power. During normal operation, a temperature increase may occur, resulting in a temperature increase of the device. Therefore, heat dissipation is required to be carried out on the device so as to ensure the normal operation of the device.
The heat dissipation modes commonly used at present are as follows: 1. coating the heat conduction mud on the surface of the device by using the heat conduction mud, so as to conduct heat conduction and heat dissipation; 2. a thermally conductive silicone grease or a thermally conductive silicone pad; manual work and assembly are needed, and meanwhile, heat conduction and heat dissipation are needed by combining the radiating fins.
The heat conduction and dissipation modes such as the heat conduction mud, the heat conduction silica gel gasket and the like are low in efficiency, and high-efficiency operation is inconvenient in some specific products. The use of thermally conductive silicone gaskets also sometimes requires consideration of electrical insulation distances and the like.
In some products that are compact in design space, not only thermal conduction and dissipation but also electrical insulation need to be considered. However, the conventional heat dissipation measures cannot be adapted to the miniaturization trend of power supply products by considering electrical insulation while ensuring good heat dissipation effect.
Disclosure of Invention
The utility model proposes a power converter comprising: the PCB comprises a first surface; the at least one electronic device comprises a first surface and a second surface opposite to the first surface, and the first surface of the at least one electronic device is assembled on the first surface of the PCB; the at least one ceramic piece comprises a first surface and a second surface opposite to the first surface, and the first surface of each at least one ceramic piece is assembled on the second surface of an electronic device.
Further, the second faces of the at least one electronic device are identical in shape and identical in area.
Still further, the at least one electronic device is the same height.
Further, each of the at least one ceramic sheet covers a corresponding electronic device.
Still further, each of the at least one ceramic sheet covers a corresponding electronic device, and an area of each of the at least one ceramic sheet is greater than an area of a second face of the corresponding electronic device.
Further, the shape of the first face of each of the at least one ceramic sheet is the same as the shape of the second face of the corresponding electronic device.
Furthermore, the at least one electronic device is assembled on the PCB board through soldering tin, and the at least one ceramic chip is simultaneously assembled on the corresponding electronic device through soldering tin.
Still further, a housing is included, the second face of the at least one ceramic sheet being in contact with the housing.
Still further, the PCB board includes a plurality of mounting holes, and the casing includes a plurality of mounting holes, and a plurality of installed parts pass the mounting hole on the PCB board and the mounting hole on the casing to fix PCB board and casing.
Further, a heat dissipating material is included between the second face of the at least one ceramic sheet and the housing.
Drawings
Fig. 1 is a schematic diagram of a power converter according to an embodiment of the utility model.
Fig. 2 is an exploded view of a power converter according to an embodiment of the utility model.
Fig. 3 is a schematic diagram of a power converter according to an embodiment of the utility model.
Detailed Description
The following description of the embodiments of the present utility model will be made more apparent and fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
An embodiment of the present utility model provides a power converter, including: the PCB comprises a first surface; the at least one electronic device comprises a first surface and a second surface opposite to the first surface, and the first surface of the at least one electronic device is assembled on the first surface of the PCB; the at least one ceramic piece comprises a first surface and a second surface opposite to the first surface, and the first surface of each at least one ceramic piece is assembled on the second surface of an electronic device.
Please refer to the schematic diagram of the power converter shown in fig. 1, and refer to fig. 2 and 3 in combination, wherein fig. 2 is an exploded view of the power converter, and fig. 3 is a schematic diagram of a casing of the power converter not shown. The power converter includes:
the PCB 1 comprises a first surface 11;
at least one electronic device, such as the first electronic device 2, the second electronic device 3 and the third electronic device 4 in fig. 1 to 3, each comprising a first face and a second face opposite to the first face, such as the first electronic device 2 in fig. 1 to 3 comprising a first face 21 and a second face 22 opposite to the first face 21, the second electronic device 3 comprising a first face 31 and a second face 32 opposite to the first face 31, the third electronic device 4 comprising a first face 41 and a second face 42 opposite to the first face 41, the first face of the at least one electronic device being assembled to the first face of the PCB, such as the first face 21 of the first electronic device 2 in fig. 1 to 3 being assembled to the first face 11 of the PCB, the first face 31 of the second electronic device 3 being assembled to the first face 11 of the PCB, the first face 41 of the third electronic device 4 being assembled to the first face 11 of the PCB;
at least one ceramic sheet, such as the first ceramic sheet 5, the second ceramic sheet 6 and the third ceramic sheet 7 in fig. 1 to 3, each comprises a first face and a second face opposite to the first face, such as the first ceramic sheet 5 in fig. 1 to 3 comprises a first face 51 and a second face 52 opposite to the first face 51, the second ceramic sheet 6 comprises a first face 61 and a second face 62 opposite to the first face 61, the third ceramic sheet 7 comprises a first face 71 and a second face 72 opposite to the first face 71, each of the first face of the at least one ceramic sheet is assembled to the second face of an electronic device, such as the first face 51 of the first ceramic sheet 5 is assembled to the second face 22 of the first electronic device 2 in fig. 1 to 3, the first face 61 of the second ceramic sheet 6 is assembled to the second face 32 of the second electronic device 3, and the first face 71 of the third ceramic sheet 7 is assembled to the second face 42 of the third electronic device 4.
In an embodiment, the second faces of the at least one electronic device are identical in shape and equal in area. As in fig. 1 to 3, the second faces of the first electronic device 2, the second electronic device 3, and the third electronic device 4 are all square and have equal areas. Specifically, the first electronic device 2, the second electronic device 3 and the third electronic device 4 are hexahedral structures, and then the shapes of the first surface 11 sides assembled on the PCB board 1 are square, the areas are also equal, and the at least one electronic device may be a power device, a resistor, and the like.
In an embodiment, the at least one electronic device is the same height between the electronic devices. As in fig. 1 to 3, the first electronic device 2, the second electronic device 3, and the third electronic device 4 are the same in height. I.e. the distance between the first side and the second side of all electronic devices is the same.
I.e. the at least one electronic device forms an electronic device of the same size. The ceramic plate has good heat conduction and heat dissipation effects, and the ceramic plate is assembled on each at least one electronic device, so that heat of the corresponding electronic device can be transferred to the ceramic plate, and the good heat dissipation effects are achieved.
In an embodiment, each of the at least one ceramic sheet covers a corresponding electronic device. That is, the ceramic plate corresponding to the heat dissipation of the electronic device covers the electronic device, so that the heat dissipation of the electronic device can be conducted to the housing 8 through the ceramic plate.
In an embodiment, each of the at least one ceramic sheets covers a corresponding electronic device, and an area of each of the at least one ceramic sheets is larger than an area of a second face of the corresponding electronic device. That is, the electronic device is covered by the ceramic plate for heat dissipation corresponding to the electronic device, so that heat dissipation of the electronic device can be conducted to the housing 8 through the ceramic plate, and the area of the first surface 51 of the first ceramic plate 5 is larger than that of the second surface 22 of the first electronic device 2, the area of the first surface 61 of the second ceramic plate 6 is larger than that of the second surface 32 of the second electronic device 3, and the area of the first surface 71 of the third ceramic plate 7 is larger than that of the second surface 42 of the third electronic device 4. So that the heat dissipation of the electronic device can be conducted to the shell 8 through the ceramic plate, and no heat dissipation drain area exists.
In an embodiment, the shape of the first face of each of the at least one ceramic sheets is the same as the shape of the second face of the corresponding electronic device. As shown in fig. 1 to 3, the second surface 22 of the first electronic device 2 is square in shape, the first surface 51 of the first ceramic sheet 5 is also square in shape, the second surface 32 of the second electronic device 3 is square in shape, the first surface 61 of the second ceramic sheet 6 is also square in shape, the second surface 42 of the third electronic device 4 is square in shape, and the first surface 71 of the third ceramic sheet 7 is also square in shape. The best heat dissipation effect can be achieved under the conditions of saving the area of the ceramic plate, the occupied area of the space in the power converter and reducing the cost.
In an embodiment, the thickness between the first and second faces of the at least one ceramic sheet is the same. As shown in fig. 1 to 3, the thicknesses of the first ceramic sheet 5, the second ceramic sheet 6 and the third ceramic sheet 7 are the same, so that when the PCB assembly 100 shown in fig. 3 is assembled with the housing 8, the first ceramic sheet 5, the second ceramic sheet 6 and the third ceramic sheet 7 can all contact the housing 8, and a solid heat dissipation path is formed from the electronic device to the ceramic sheet to the housing, which is beneficial for heat dissipation of all the electronic devices. Without the presence of electronics contacting the housing 8, while the presence of electronics does not contact the housing 8.
In an embodiment, the at least one electronic device is assembled on the PCB board by soldering, and the at least one ceramic chip is simultaneously assembled on the corresponding electronic device by soldering. As shown in fig. 1 and 3, the first electronic device 2, the second electronic device 3 and the third electronic device 4 are all assembled on the PCB board by solder, and the first ceramic chip 5, the second ceramic chip 6 and the third ceramic chip 7 are all assembled on the first electronic device 2, the second electronic device 3 and the third electronic device 4 by solder, respectively. Specifically, after all electronic devices and ceramic sheets are fed, the first electronic device 2, the second electronic device 3 and the third electronic device 4 are positioned at corresponding assembly positions on the PCB, the first ceramic sheet 5, the second ceramic sheet 6 and the third ceramic sheet 7 are positioned on the first electronic device 2, the second electronic device 3 and the third electronic device 4 respectively, and then the first electronic device 2, the second electronic device 3 and the third electronic device 4 are welded on the PCB once through furnace welding, and simultaneously the first ceramic sheet 5, the second ceramic sheet 6 and the third ceramic sheet 7 are welded on the first electronic device 2, the second electronic device 3 and the third electronic device 4 to form the PCB assembly shown in fig. 3. The specifications of the electronic devices are the same, and the shapes and the sizes of the ceramic plates are the same, so that the electronic devices can be in a fool type installation mode, are convenient to automatically install and assemble, improve the production efficiency and reduce the manual assembly cost.
In an embodiment, the power converter further comprises a housing 8, the second face of the at least one ceramic sheet being in contact with the housing, as in fig. 1 the second face 52 of the first ceramic sheet 5, the second face 62 of the second ceramic sheet 6 and the second face 72 of the third ceramic sheet 7 being in contact with the housing 8. By assembling the ceramic plate between each of the at least one electronic device and the housing, heat of the corresponding electronic device can be transferred to the housing 8 in contact with the ceramic plate, thereby achieving a good heat dissipation effect.
In an embodiment, the PCB includes a plurality of mounting holes, and the housing includes a plurality of mounting holes, and the plurality of mounting members pass through the mounting holes on the PCB and the mounting holes on the housing to fix the PCB to the housing and contact the second face of the at least one ceramic sheet with the housing. As shown in fig. 1 to 3, the PCB board 1 includes a plurality of mounting holes 12, and the case 8 includes a plurality of mounting holes 81 (as shown in fig. 1 to 3, the mounting holes 81 may be mounting holes formed on a fixing member assembled to the case 8), and a plurality of mounting members 9 pass through the mounting holes 12 on the PCB board and the mounting holes 81 on the case 8 to fix the PCB board 1 with the case 3. And the second surface of the first ceramic sheet 5, the second surface of the second ceramic sheet 6, and the second surface of the third ceramic sheet 7 are brought into contact with the case 8, a solid heat dissipation path can be formed between the first ceramic sheet 5, the second ceramic sheet 6, and the third ceramic sheet 7 and the case 8.
Further, a heat dissipating material is included between the second face of the at least one ceramic sheet and the housing. For example, the first ceramic sheet 5, the second ceramic sheet 6 and the third ceramic sheet 7 each comprise a heat dissipation material between the second face and the housing 8. The heat dissipation material may be a solid heat dissipation material or a heat dissipation material that is solid after cooling, such as heat conductive mud, so as to ensure that the second faces of the first ceramic sheet 5, the second ceramic sheet 6 and the third ceramic sheet 7 form a solid heat dissipation path with the housing 8, thereby increasing the reliability of heat dissipation.
In one embodiment, the housing 8 is a metal housing, such as a housing for enclosing the PCB board assembly 100.
As described above, taking an example in which the electronic device includes the first electronic device 2, the second electronic device 3, and the third electronic device 5, the corresponding ceramic sheets include the first ceramic sheet 5, the second ceramic sheet 6, and the third ceramic sheet 7. In practical application, the number of electronic devices and corresponding ceramic chips may be determined according to an actual power converter, and is not particularly limited.
For a power converter including a plurality of electronic devices with the same specification and size, when the power converter works, the plurality of electronic devices welded on the PCB board generate heat, so that heat dissipation is required for the generated electronic devices to improve the efficiency of the power converter. The heat conductivity of the ceramic plate is up to 20W/m.K to 30W/m.K, one surface of the ceramic plate is welded with the electronic device by utilizing the good heat conduction and radiation characteristics of the ceramic plate, and the other surface of the ceramic plate is directly connected with the metal shell, or the ceramic plate is coated with heat conduction mud and then connected with the metal shell, so that the reliability of radiation is improved, and the heat of the electronic device is transmitted to the metal shell through the ceramic plate for radiation.
Meanwhile, the ceramic plate also has good insulating property, and can ensure the electrical insulating property and solve the safety problem under the condition of smaller space.
By adopting the scheme of the utility model, in the power converter product with compact design space, the heat conduction and heat dissipation requirements are met, and the electrical insulation requirements are also met.
By adopting the scheme of the utility model, the distances from each electronic device to the radiating surface of the metal shell are consistent (the thicknesses of the ceramic plates), so that each electronic device is uniformly radiated, the radiating consistency is good, and the efficiency of the power converter product can be improved.
At present, with the development of ceramic materials, the heat conductivity coefficient of the ceramic materials is further improved, and the capacities of heat conduction, heat convection and heat radiation of the ceramic materials are greatly enhanced. So that the ceramic sheet has the following properties: can resist large current, can strike high voltage, can prevent leakage breakdown, has no noise, can not generate coupling parasitic capacitance with a power device, thus simplifying the filtering process, the required creepage distance is shorter than the metal body requirement, so that the plate space is further saved, and the design of engineers and the passing of electric authentication are facilitated.
The technical scheme provided by the utility model is convenient and fast to automatically install and assemble, improves the production efficiency, reduces the manual assembly cost, improves the insulating heat dissipation effect of the electronic device in the power converter, and simultaneously meets the miniaturization design requirement of the product.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the utility model.
Claims (10)
1. A power converter, comprising:
the PCB comprises a first surface;
the at least one electronic device comprises a first surface and a second surface opposite to the first surface, and the first surface of the at least one electronic device is assembled on the first surface of the PCB;
the at least one ceramic piece comprises a first surface and a second surface opposite to the first surface, and the first surface of each at least one ceramic piece is assembled on the second surface of an electronic device.
2. The power converter of claim 1, wherein the second sides of the at least one electronic device are identical in shape and equal in area.
3. The power converter of claim 2, wherein the at least one electronic device is the same height.
4. A power converter according to claim 2 or 3, wherein each of the at least one ceramic tile covers a corresponding electronic device.
5. A power converter according to claim 2 or 3, wherein each of the at least one ceramic sheets covers a corresponding electronic device, and each of the at least one ceramic sheets has an area that is larger than an area of a second face of the corresponding electronic device.
6. A power converter according to claim 2 or 3, wherein the shape of the first face of each of the at least one ceramic sheets is the same as the shape of the second face of the corresponding electronic device.
7. The power converter of claim 1, wherein the at least one electronic device is assembled on a PCB board by solder, and the at least one ceramic chip is simultaneously assembled on a corresponding electronic device by solder.
8. The power converter of claim 1, further comprising a housing, the second face of the at least one ceramic wafer being in contact with the housing.
9. The power converter of claim 8, wherein the PCB includes a plurality of mounting holes and the housing includes a plurality of mounting holes, the plurality of mounting members passing through the mounting holes in the PCB and the mounting holes in the housing to secure the PCB to the housing.
10. The power converter of claim 8 or 9, wherein a heat sink material is included between the second face of the at least one ceramic sheet and the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223041029.3U CN219919518U (en) | 2022-11-16 | 2022-11-16 | Power supply converter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223041029.3U CN219919518U (en) | 2022-11-16 | 2022-11-16 | Power supply converter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219919518U true CN219919518U (en) | 2023-10-27 |
Family
ID=88439888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223041029.3U Active CN219919518U (en) | 2022-11-16 | 2022-11-16 | Power supply converter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219919518U (en) |
-
2022
- 2022-11-16 CN CN202223041029.3U patent/CN219919518U/en active Active
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