GB9900165D0 - Heat sink - Google Patents

Heat sink

Info

Publication number
GB9900165D0
GB9900165D0 GB9900165A GB9900165A GB9900165D0 GB 9900165 D0 GB9900165 D0 GB 9900165D0 GB 9900165 A GB9900165 A GB 9900165A GB 9900165 A GB9900165 A GB 9900165A GB 9900165 D0 GB9900165 D0 GB 9900165D0
Authority
GB
United Kingdom
Prior art keywords
heat sink
sink
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9900165A
Other versions
GB2345576A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ericsson Mobile Communication UK Ltd
Original Assignee
Ericsson Mobile Communication UK Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Mobile Communication UK Ltd filed Critical Ericsson Mobile Communication UK Ltd
Priority to GB9900165A priority Critical patent/GB2345576A/en
Publication of GB9900165D0 publication Critical patent/GB9900165D0/en
Publication of GB2345576A publication Critical patent/GB2345576A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB9900165A 1999-01-05 1999-01-05 Heat-sink of ICs and method of mounting to PCBs Withdrawn GB2345576A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9900165A GB2345576A (en) 1999-01-05 1999-01-05 Heat-sink of ICs and method of mounting to PCBs

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9900165A GB2345576A (en) 1999-01-05 1999-01-05 Heat-sink of ICs and method of mounting to PCBs

Publications (2)

Publication Number Publication Date
GB9900165D0 true GB9900165D0 (en) 1999-02-24
GB2345576A GB2345576A (en) 2000-07-12

Family

ID=10845593

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9900165A Withdrawn GB2345576A (en) 1999-01-05 1999-01-05 Heat-sink of ICs and method of mounting to PCBs

Country Status (1)

Country Link
GB (1) GB2345576A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107889338A (en) * 2016-09-30 2018-04-06 雅达电子国际有限公司 Heat sink assembly for Surface mounted devices

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1395098B1 (en) 2002-09-02 2009-08-26 Eberspächer catem GmbH & Co. KG Electrical heating for vehicle
DE10335129B3 (en) * 2003-07-31 2005-06-23 Kathrein-Werke Kg Cooling arrangement for arranged on a printed circuit board electrical components, in particular SMD components
US20080158821A1 (en) * 2004-11-30 2008-07-03 Telefonaktiebolaget Lm Ericsson (Publ) Printed Board Assembly with Improved Heat Dissipation
CN105580501B (en) * 2014-02-12 2018-10-19 华为终端（东莞）有限公司 The method of printed circuit board and manufacture printed circuit board
CN105283031A (en) * 2014-07-11 2016-01-27 台达电子工业股份有限公司 Heat dissipation module and combination method
CN104883133A (en) * 2015-06-19 2015-09-02 苏州英诺迅科技股份有限公司 GaAs and LDMOS/GaN mixed integrated microwave amplifier based on PCB process
US10269678B1 (en) 2017-12-05 2019-04-23 Nxp Usa, Inc. Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB821830A (en) * 1955-08-29 1959-10-14 Mullard Radio Valve Co Ltd Improvements in and relating to semi-conductor devices
GB851544A (en) * 1957-10-28 1960-10-19 English Electric Valve Co Ltd Improvements in or relating to semi-conductor devices
GB2135525B (en) * 1983-02-22 1986-06-18 Smiths Industries Plc Heat-dissipating chip carrier substrates
FR2625038B1 (en) * 1987-12-22 1990-08-17 Cit Alcatel METHOD AND DEVICE FOR COOLING AN INTEGRATED CIRCUIT HOUSING
JP3326799B2 (en) * 1991-05-01 2002-09-24 ソニー株式会社 Degaussing device
US5514327A (en) * 1993-12-14 1996-05-07 Lsi Logic Corporation Powder metal heat sink for integrated circuit devices
US5617294A (en) * 1995-09-29 1997-04-01 Intel Corporation Apparatus for removing heat from an integrated circuit package that is attached to a printed circuit board
US5784255A (en) * 1995-12-04 1998-07-21 Integrated Device Technology, Inc. Device and method for convective cooling of an electronic component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107889338A (en) * 2016-09-30 2018-04-06 雅达电子国际有限公司 Heat sink assembly for Surface mounted devices

Also Published As

Publication number Publication date
GB2345576A (en) 2000-07-12

Similar Documents

Publication Publication Date Title
TW498993U (en) Heat sink assembly
GB2325781B (en) Heat sink
TW491376U (en) Heat sink
TW510642U (en) Heat dissipating
GB9918815D0 (en) Heat sink
TW516800U (en) Heat sink assembly
TW450381U (en) Heat sink device
GB2323434B (en) Heat sink
TW484794U (en) Heat sink
GB9900165D0 (en) Heat sink
TW453470U (en) Heat dissipation structure
TW490042U (en) Improved heat sink structure
TW534583U (en) Improved heat sink structure
PL332346A1 (en) Heat sink
TW428745U (en) Side-blowing heat sink structure
TW433443U (en) Improved heat sink structure
TW474558U (en) Heat sink structure
SG75929A1 (en) Heat sink assembly
TW506568U (en) Heat sink assembly
TW510522U (en) Heat sink assembly
CA96562S (en) Heat sink
TW499157U (en) Heat dissipation
TW477438U (en) Heat sink device
GB9804184D0 (en) Heat sink
GB9722655D0 (en) Heat sink

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)