GB9722655D0 - Heat sink - Google Patents

Heat sink

Info

Publication number
GB9722655D0
GB9722655D0 GB9722655A GB9722655A GB9722655D0 GB 9722655 D0 GB9722655 D0 GB 9722655D0 GB 9722655 A GB9722655 A GB 9722655A GB 9722655 A GB9722655 A GB 9722655A GB 9722655 D0 GB9722655 D0 GB 9722655D0
Authority
GB
United Kingdom
Prior art keywords
heat sink
sink
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9722655A
Other versions
GB2330690A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Technicolor SA
Original Assignee
Thomson Multimedia SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson Multimedia SA filed Critical Thomson Multimedia SA
Priority to GB9722655A priority Critical patent/GB2330690A/en
Publication of GB9722655D0 publication Critical patent/GB9722655D0/en
Priority to PCT/EP1998/006975 priority patent/WO1999022405A1/en
Publication of GB2330690A publication Critical patent/GB2330690A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB9722655A 1997-10-27 1997-10-27 A clip-on heat sink Withdrawn GB2330690A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB9722655A GB2330690A (en) 1997-10-27 1997-10-27 A clip-on heat sink
PCT/EP1998/006975 WO1999022405A1 (en) 1997-10-27 1998-10-19 Heat sink for an electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9722655A GB2330690A (en) 1997-10-27 1997-10-27 A clip-on heat sink

Publications (2)

Publication Number Publication Date
GB9722655D0 true GB9722655D0 (en) 1997-12-24
GB2330690A GB2330690A (en) 1999-04-28

Family

ID=10821148

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9722655A Withdrawn GB2330690A (en) 1997-10-27 1997-10-27 A clip-on heat sink

Country Status (2)

Country Link
GB (1) GB2330690A (en)
WO (1) WO1999022405A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2841091B1 (en) * 2002-06-14 2004-10-01 Thomson Licensing Sa APPARATUS COMPRISING A PRINTED CIRCUIT, PRINTED CIRCUIT AND ASSEMBLY COMPRISING AN ELECTRICAL OR ELECTRONIC COMPONENT AND A RADIATOR

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58180049A (en) * 1982-04-14 1983-10-21 Matsushita Electric Ind Co Ltd Heat sink device
US4509839A (en) * 1983-06-16 1985-04-09 Imc Magnetics Corp. Heat dissipator for semiconductor devices
US4609040A (en) * 1985-04-01 1986-09-02 Thermalloy Incorporated Self-securing heat sink
DE3627372C3 (en) * 1986-08-12 1994-04-14 Loewe Opta Gmbh Arrangement consisting of a printed circuit board, a heat sink and electronic components to be cooled
US4803545A (en) * 1988-03-17 1989-02-07 Motorola, Inc. Self-fixturing heat sink
JPH0547969A (en) * 1991-08-08 1993-02-26 Murata Mfg Co Ltd Heat sink
US5437561A (en) * 1991-12-09 1995-08-01 Aavid Engineering, Inc. Self-locking tab
JPH08306834A (en) * 1995-04-27 1996-11-22 Mita Ind Co Ltd Heat sink and mounting structure of electronic component which uses the heat sink

Also Published As

Publication number Publication date
GB2330690A (en) 1999-04-28
WO1999022405A1 (en) 1999-05-06

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)