CN213694276U - Waterproof mechanism for flexible circuit board - Google Patents
Waterproof mechanism for flexible circuit board Download PDFInfo
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- CN213694276U CN213694276U CN202022790897.6U CN202022790897U CN213694276U CN 213694276 U CN213694276 U CN 213694276U CN 202022790897 U CN202022790897 U CN 202022790897U CN 213694276 U CN213694276 U CN 213694276U
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Abstract
A waterproof mechanism for a flexible circuit board comprises a substrate, wherein insulating layers are arranged on two sides of the substrate, a waterproof layer is arranged on the outer side of each insulating layer, a first heat dissipation plate and a second heat dissipation plate are arranged on the outer side of each waterproof layer, and the first heat dissipation plate and the second heat dissipation plate are connected through a plurality of screws; the periphery of the substrate is provided with a U-shaped plate in a surrounding mode, and the first heat dissipation plate, the second heat dissipation plate and the U-shaped plate are matched; the U-shaped plate is provided with a mounting plate, and the mounting plate is provided with a mounting hole; the U-shaped plate is half-wrapped on the substrate, and the side wall of the U-shaped plate is connected with the substrate through glue; the utility model discloses in set up first heating panel, second heating panel, waterproof layer and heat insulation layer and solved current flexible line way board and have that water-proof effects is poor, reinforcing flexible line way board radiating effect.
Description
Technical Field
The utility model relates to a flexible line way board field, concretely relates to waterproofing mechanism for flexible line way board.
Background
Flexible circuit boards, also known as "flexible boards," are printed circuits made from flexible, insulating substrates. The flexible wiring board can provide excellent electrical performance, can meet the design requirements for smaller and higher density mounting, and also contributes to reduction in assembly processes and enhancement in reliability. The flexible circuit board is a solution to meet the requirements of miniaturization and mobility of electronic products.
The application environment of the existing circuit board is greatly changed, and the application environments of some circuit boards are wet, so that the circuit board is required to have better waterproof and moistureproof performances. Therefore, the waterproof performance of the flexible circuit board is very important.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art, the utility model provides a waterproofing mechanism for flexible line way board, the flexible line way board application environment of being convenient for is comparatively moist.
The utility model provides a following technical scheme:
a waterproof mechanism for a flexible circuit board comprises a substrate, wherein insulating layers are arranged on two sides of the substrate, a waterproof layer is arranged on the outer side of each insulating layer, a first heat dissipation plate and a second heat dissipation plate are arranged on the outer side of each waterproof layer, and the first heat dissipation plate is arranged on one side of the substrate; the second heat dissipation plate is arranged on the other side of the substrate; the first heat dissipation plate and the second heat dissipation plate are connected through a plurality of screws; the first heat dissipation plate is provided with a connecting pipe; the second heat dissipation plate is provided with a connecting part; the screw penetrates through the connecting pipe and is in threaded connection with the connecting part; a sealing ring is arranged between the screw and the first heat dissipation plate;
the periphery of the substrate is provided with a U-shaped plate in a surrounding mode, and the first heat dissipation plate, the second heat dissipation plate and the U-shaped plate are matched; the U-shaped plate is provided with a mounting plate, and the mounting plate is provided with a mounting hole; the U-shaped plate is half-wrapped on the substrate, and the side wall of the U-shaped plate is connected with the substrate through glue; a feeding opening for injecting glue is formed in the side wall of the U-shaped plate; the feeding opening is a tapered hole, and the aperture of the inner side of the feeding opening is smaller than that of the outer side of the feeding opening.
Preferably, a plurality of radiating fins are uniformly arranged on the first radiating plate and the second radiating plate; the radiating fins are perpendicular to the first radiating plate and the second radiating plate.
Preferably, the upper side and the lower side of the U-shaped plate are wedge-shaped; the side edges of the first heat dissipation plate and the second heat dissipation plate are arranged to be in an inverted wedge shape; the wedge-shaped inclined plane of the U-shaped plate is attached to the wedge-shaped inclined planes of the first heat dissipation plate and the second heat dissipation plate; the first heat dissipation plate and the second heat dissipation plate extrude the U-shaped plate towards the middle.
Preferably, rubber layers are arranged on the upper side and the lower side of the U-shaped plate; the rubber layer is arranged between the U-shaped plate and the substrate.
Preferably, the insulating layer is a polytetrafluoroethylene layer or a polyvinylidene fluoride layer.
Preferably, the waterproof layer is a polyurethane waterproof coating layer or a waterproof breathable film layer.
Compared with the prior art, the utility model has the advantages of it is following and effect:
the utility model discloses in set up waterproof layer and heat insulation layer and solved current flexible line way board and have that water-proof effects is poor, take place electronic component short circuit phenomenon easily, caused certain economic loss, and reduced circuit board life's problem.
The utility model discloses in set up first heating panel and second heating panel, reinforcing flexible line way board radiating effect, the base plate encircles all around and is equipped with the U template, wraps up the protection all around to the base plate, is convenient for simultaneously to the installation of base plate.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a structural diagram of a waterproof mechanism for a flexible printed circuit board according to the present invention.
In the figure: the heat dissipation plate comprises a U-shaped plate 1, a feeding port 11, a mounting plate 12, a mounting hole 13, a first heat dissipation plate 2, a connecting pipe 21, a heat dissipation plate 22, screws 3, a sealing ring 31, a rubber layer 4, glue 5, a second heat dissipation plate 6 and a connecting part 61; 7 waterproof layer, 8 insulating layer, 9 base plate.
Detailed Description
The utility model discloses a concrete implementation way does:
referring to the drawings, in a first embodiment, a waterproof mechanism for a flexible printed circuit includes a substrate 9, wherein insulating layers 8 are disposed on two sides of the substrate 9, and the insulating layers 8 are polytetrafluoroethylene layers; a waterproof layer 7 is arranged on the outer side of the insulating layer 8, and the waterproof layer 7 is a polyurethane waterproof coating layer; a first heat dissipation plate 2 and a second heat dissipation plate 6 are arranged on the outer side of the waterproof layer 7, and the first heat dissipation plate 2 is arranged on one side of the substrate 9; the second heat dissipation plate 6 is arranged on the other side of the substrate 9; a plurality of radiating fins 22 are uniformly arranged on the first radiating plate 2 and the second radiating plate 6; the radiating fins 22 are perpendicular to the first radiating plate 2 and the second radiating plate 6, so that the radiating effect of the flexible circuit board is enhanced; the first heat dissipation plate 2 and the second heat dissipation plate 6 are connected through a plurality of screws 3; the first heat dissipation plate 2 is provided with a connecting pipe 21; the second heat dissipation plate 6 is provided with a connecting part 61; the screw 3 passes through the connecting pipe 21, and the screw 3 is in threaded connection with the connecting part 61, so that the first heat dissipation plate 2, the second heat dissipation plate 6 and the substrate 9 are connected into a whole; a sealing ring 31 is provided between the screw 3 and the first heat sink 2 to prevent water leakage between the screw 3 and the first heat sink 2.
The periphery of the substrate 9 is provided with a U-shaped plate 1 in a surrounding manner, and the first heat dissipation plate 2 and the second heat dissipation plate 6 are matched with the U-shaped plate 1; the upper side and the lower side of the U-shaped plate 1 are wedge-shaped; the side edges of the first heat dissipation plate 2 and the second heat dissipation plate 6 are arranged to be in an inverted wedge shape; the wedge-shaped inclined plane of the U-shaped plate 1 is attached to the wedge-shaped inclined planes of the first heat dissipation plate 2 and the second heat dissipation plate 3; the first heat dissipation plate 2 and the second heat dissipation plate 3 extrude the U-shaped plate 1 towards the middle, and water leakage among the U-shaped plate 1, the first heat dissipation plate 2 and the second heat dissipation plate 3 is prevented.
Rubber layers 4 are arranged on the upper side and the lower side of the U-shaped plate 1; the rubber layer 4 is arranged between the U-shaped plate 1 and the base plate 9, so that the U-shaped plate 1 is prevented from scratching the base plate 9; the U-shaped plate 1 is provided with a mounting plate 12, and the mounting plate 12 is provided with a mounting hole 13 so as to mount the substrate 9; the U-shaped plate 1 is half-wrapped on the base plate 9, and the side wall of the U-shaped plate 1 is connected with the base plate 9 through glue 5; a feeding port 11 for injecting glue is arranged on the side wall of the U-shaped plate 1; the feed inlet 11 is a tapered hole, and the aperture of the inner side of the feed inlet 11 is smaller than that of the outer side of the feed inlet 11, so that glue can be injected into the U-shaped plate 1 and the substrate 9 to be adhered together.
In the second embodiment, the insulating layer 8 is replaced with a polyvinylidene fluoride layer; the waterproof layer 7 is replaced by a waterproof breathable film layer.
The working principle is as follows: the substrate is provided with the waterproof layer and the heat insulating layer, so that the problems that the conventional flexible circuit board is poor in waterproof effect, the short circuit phenomenon of an electronic element is easy to occur, certain economic loss is caused, and the service life of the circuit board is shortened are solved; the U-shaped plate 1 is half-wrapped on the base plate 9, glue is injected into the U-shaped plate 1 and the base plate 9 through the feeding port 11, and the U-shaped plate 1 and the base plate 9 are adhered together; the screw 3 is in threaded connection with the connecting part 61 to integrally connect the first heat dissipation plate 2, the second heat dissipation plate 6 and the substrate 9; the first heat dissipation plate 2 and the second heat dissipation plate 6 are matched with the U-shaped plate 1, and the heat dissipation effect of the flexible circuit board is enhanced.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The utility model provides a waterproof mechanism for flexible line way board which characterized in that: the heat dissipation structure comprises a substrate (9), wherein insulating layers (8) are arranged on two sides of the substrate (9), a waterproof layer (7) is arranged on the outer side of each insulating layer (8), a first heat dissipation plate (2) and a second heat dissipation plate (6) are arranged on the outer side of each waterproof layer (7), and the first heat dissipation plate (2) is arranged on one side of the substrate (9); the second heat dissipation plate (6) is arranged on the other side of the substrate (9); the first heat dissipation plate (2) and the second heat dissipation plate (6) are connected through a plurality of screws (3); the first heat dissipation plate (2) is provided with a connecting pipe (21); the second heat dissipation plate (6) is provided with a connecting part (61); the screw (3) passes through the connecting pipe (21) and is in threaded connection with the connecting part (61); a sealing ring (31) is arranged between the screw (3) and the first heat dissipation plate (2);
the periphery of the substrate (9) is provided with a U-shaped plate (1) in a surrounding mode, and the first heat dissipation plate and the second heat dissipation plate are matched with the U-shaped plate (1); the U-shaped plate (1) is provided with a mounting plate (12), and the mounting plate (12) is provided with a mounting hole (13); the U-shaped plate (1) is half-wrapped on the base plate, and the side wall of the U-shaped plate (1) is connected with the base plate (9) through glue; a feeding port (11) for injecting glue is arranged on the side wall of the U-shaped plate (1); the feeding port (11) is a tapered hole, and the aperture of the inner side of the feeding port (11) is smaller than that of the outer side of the feeding port (11).
2. The waterproof mechanism for a flexible wiring board according to claim 1, characterized in that: a plurality of radiating fins (22) are uniformly arranged on the first radiating plate (2) and the second radiating plate (6); the radiating fins (22) are perpendicular to the first radiating plate (2) and the second radiating plate (6).
3. The waterproof mechanism for a flexible wiring board according to claim 1, characterized in that: the upper side and the lower side of the U-shaped plate (1) are wedge-shaped; the side edges of the first heat dissipation plate (2) and the second heat dissipation plate (6) are arranged to be in an inverted wedge shape; the wedge-shaped inclined plane of the U-shaped plate (1) is attached to the wedge-shaped inclined planes of the first heat dissipation plate (2) and the second heat dissipation plate (6); the first heat dissipation plate (2) and the second heat dissipation plate (6) extrude the U-shaped plate (1) towards the middle.
4. The waterproof mechanism for a flexible wiring board according to claim 1, characterized in that: rubber layers (4) are arranged on the upper side and the lower side of the U-shaped plate (1); the rubber layer (4) is arranged between the U-shaped plate (1) and the base plate (9).
5. The waterproof mechanism for a flexible wiring board according to claim 1, characterized in that: the insulating layer (8) is a polytetrafluoroethylene layer or a polyvinylidene fluoride layer.
6. The waterproof mechanism for a flexible wiring board according to claim 1, characterized in that: the waterproof layer (7) is a polyurethane waterproof coating layer or a waterproof breathable film layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022790897.6U CN213694276U (en) | 2020-11-26 | 2020-11-26 | Waterproof mechanism for flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022790897.6U CN213694276U (en) | 2020-11-26 | 2020-11-26 | Waterproof mechanism for flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213694276U true CN213694276U (en) | 2021-07-13 |
Family
ID=76736816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022790897.6U Active CN213694276U (en) | 2020-11-26 | 2020-11-26 | Waterproof mechanism for flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213694276U (en) |
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2020
- 2020-11-26 CN CN202022790897.6U patent/CN213694276U/en active Active
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