RU2231236C1 - Radio-electronic unit - Google Patents

Abstract

FIELD: communications engineering; computing and other on-board and stationary control devices.

SUBSTANCE: packet-type radio-electronic unit has printed-circuit boards secured on wafers and frames with interboard connectors. Unit is assembled of modules having equally disposed base pins and interboard plug connectors, as well as L- and T-shaped frames forming external case of unit. There is groove at ends of frame incorporating flexible packing and projections for organizing labyrinth thereby ensuring desired sealing and noise immunity of structure. Side surfaces of frame are ribbed to enlarge convective heat-transfer surface, and its bottom surface serves for conductive heat transfer. So proposed unit is distinguished by reduced quantity of sealed joints, reduced size, improved heat transfer conditions for convective and conductive cooling methods, enhanced stiffness of mechanical design, and radiation safety.

EFFECT: enhanced reliability.

4 cl, 3 dwg

Description

The invention relates to electronic equipment, and in particular, to the design of batch-type blocks containing printed circuit boards mounted on plates and frames with interconnect detachable connections. The invention can be used in communication systems, computing and other devices installed on board and stationary.

Known electronic block consisting of modules (boards mounted on metal plates and frames with inter-circuit connectors) connected in a packet and compressed around the perimeter by screws (Patent RU 2132598 C1 Radio-electronic block, 6 N 05 K 7/02, claimed from 08.22.98 ; published June 27, 1999. BI No. 18).

The disadvantages of this block include:

- insufficient tightness due to the large number of sealed joints;

- the need to introduce an additional plate on which the strained unit is installed; this leads to the appearance of an additional joint, which worsens the conductive heat dissipation.

The technical result of the invention is to increase the reliability of the device by reducing the number of joints to be sealed, improving heat removal with conductive and convective cooling methods, providing a higher degree of noise immunity, radiation resistance, increasing the rigidity of the structure.

To achieve these technical results, a design of a radio-electronic unit consisting of modules with the same arrangement of base pins and board connectors, but differing in frames forming the outer case of the unit, is proposed.

The basis of the invention is the G- and T-shaped profile of the frames forming the outer casing of the block.

These frames cover internal modules with smaller flat frames. Г- and Т-shaped frames have developed side surfaces with fins for convection heat dissipation and a lower flat surface for conductive heat dissipation.

Along the external contour of the Г- or Т-shaped frames, grooves with elastic seals and protrusions are introduced to obtain a labyrinth for the purpose of additional radio protection.

The whole package is pulled together with studs (screws), which ensures uniform compression around the perimeter with great effort of all heat-conducting surfaces and guarantees high-quality heat transfer at minimum distances to the lower and side surfaces.

Г- and Т-shaped frames can have platforms with connecting holes, which, taking into account the high stiffness of the frame, provides pressing with great effort to the heat-stabilizing surface with conductive heat removal.

There is a surface that allows you to install external connectors that are soldered directly to the board or by volume mounting.

The unit has two lids with fins, which with their protrusions enter the grooves of the frames and form a single unit with the package of modules.

As a result, the unit has high stiffness, improved heat removal, increased tightness, and provides higher noise immunity.

This invention uses motherboards 9 (FIG. 1) with oval two turns, bronze contacts (AC SU No. 1100763 from 30.06.84; JP 3-145791 A, 06.23.91; WO 94/30034 A1, 12.22.94, US 4994938, 02.19.91.).

The invention is illustrated by drawings (figures 1 and 2).

Figure 1 shows a General view of the block in section. Each module consists of a board with pads 5, a heat-conducting plate 4 and a frame 1, 2, 3 with inter-circuit connectors 9.

Frames 2 and 3 with a T- and T-shaped profile (covering the frames) have a width of external surfaces corresponding to the number of modules included in it.

The number of modules included in it is determined by the circuitry and the allocated power and can vary from two to four.

The thickness of the flat part into which the motherboard connectors are inserted is the same for all frames and is determined by the height of the connector and the thickness of the board (in this case 5.9 mm).

At the ends of the outer part of the frames there are grooves with elastic seals 10 (FIG. 2) laid in them and protrusions that enter the mating grooves of the frames, clamping the seal and forming a labyrinth.

The outer side parts of the enclosing frames have developed fins for convective heat dissipation.

The lower part of the frames is flat and forms an installation surface for conductive heat removal through an additional heat-conducting gasket to a thermostabilizing platform.

The upper parts of the enclosing frames can have a dampening from the inside or from the outside for installing external connectors soldered directly to the board, or by volume mounting.

Two covers with fins 6 and 8 protrusions go into the grooves of the enclosing frames and, when tightened with screws 7, close the module package into a single unit, providing additional convective heat removal.

The extreme enclosing frames have platforms with connecting holes for attaching the unit to a thermostabilized platform and ensuring good thermal contact between them.

If the number of modules is more than ten, additional platforms with connecting holes can be provided on the intermediate covering frames, which will ensure guaranteed pressing of the block to the thermostabilized platform along the entire plane.

Pads with mounting holes are shown in figure 3.

The G- and T-shaped profile of the frames forming the outer case of the block are mainly made of alloy metals (AMg, D16 ...), by the method of machining workpieces on milling machines (depending on the type of production), providing the required accuracy class.

The electronic unit made in the described construction is installed in the satellites of the Yamal series.

Claims (4)

1. Radio-electronic block containing printed circuit boards with contact pads, mounted on heat sink plates and frames with inter-circuit connectors installed on them, connected in a package, characterized in that the outer case of the block is formed from frames of a G-and / or T-shaped profile, according to the perimeter of which are grooves and protrusions that provide a labyrinth connection. 2. The block according to claim 1, characterized in that in the grooves located at the ends of the outer part of the frames, elastic seals are laid. 3. The block according to claim 1 or 2, characterized in that on the framework forming the outer casing of the block, fins are introduced for convective heat removal. 4. The block according to claim 1, or 2, or 3, characterized in that it further comprises a surface for conductive heat dissipation.

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