JP3457296B2 - Electronic equipment housing - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a housing for electronic equipment in which electronic equipment such as heat-generating electronic parts is housed. For example, a high-density printed circuit board for housing electronic equipment for automobiles, etc. The present invention relates to a structure of a housing for electronic equipment, which has excellent water resistance, vibration resistance, mass productivity, and the like. Hereinafter, the heat-generating electronic component is also referred to as a heat-generating component, the electronic device casing is referred to as a casing, and the printed circuit board is also referred to as an electronic substrate.

[0002]

2. Description of the Related Art Generally, as a structure of a housing for housing an electronic substrate, a two-piece structure including a housing portion in which a box bottom and a box body are integrated and a box lid is the simplest structure. They are disclosed in Japanese Patent Application Laid-Open No. 8-148842, "Electronic Equipment" (Prior Art 1).
And Japanese Patent Laid-Open No. 11-346418 "Vehicle electronic device"
(Prior art example 2) and the like. Although the publication of the conventional example 2 does not discuss how to effectively dissipate the heat generated by the heat-generating components mounted on the electronic substrate, the publication of the conventional example 1 discloses that the heat-generating components are insulated electronic circuits. As a component, a concept is proposed in which the electronic component is brought into contact with a sheet metal cover to protect an electrical short and improve a heat radiation effect. Further, the above-mentioned prior art example 2 discloses a structure in which the connector housing and the box lid (cover) are integrated and the electronic board is fixed to the box lid.

Further, as a case structure of a three-piece structure in which a box lid portion as a cover and a box bottom portion are vertically attached to a box body portion as an intermediate frame to which an electronic substrate is fixed, as a cover. ,
Japanese Patent Application Laid-Open No. 6-318790 "Case" (Prior art example 3)
Also, Japanese Patent Application Laid-Open No. 8-181471 "Electronic control device"
(Prior art example 4). In the publication of the above-mentioned conventional example 3, the seal by the adhesive fixing material between the intermediate frame (box body part) and the upper and lower covers (box lid part, box bottom part) is concerned. There is no discussion about improving emission. The prior art example 4 discloses a structure in which the heat generating component is pressed against the intermediate frame member by utilizing the elastic force of the electronic substrate to effectively dissipate the heat.

On the other hand, according to JP-A-8-204072, "Electronic Component Cooling Device" (Conventional Example 5), heat generated by a heat-generating component fixed to one surface of a double-sided electronic substrate is through-hole plated. It is shown that heat is transferred to the other surface through the hole and is fixed to a part of the heat conductive casing through a heat conductive elastic insulating sheet. Furthermore, JP-A-11-266078
According to Japanese Patent Laid-Open Publication "Through-Hole Filling Resin Composition and Multilayer Printed Wiring Board" (Conventional Example 6), a filling material is filled in a through-hole plating hole of an electronic substrate, and the filling material is used as a conductor layer. A method of manufacturing a multilayer substrate coated with is described.

[0005]

With the miniaturization and high density of electronic boards, it is important to improve the heat dissipation of heat-generating components. There is a demand for a housing for electronic devices that meets various requirements such as high productivity and mass productivity. However, in the above-mentioned conventional example 1, there is a problem that the insulated electronic circuit component having poor heat conductivity is simply brought into contact with the box lid, and sufficient heat conduction cannot be expected. Further, in Conventional Example 4, it is necessary to reduce the stress on the soldering portion of the heat-generating component, and there is a problem that the crimping force depending on the elastic force of the electronic substrate cannot be sufficiently increased.

The present invention solves the above-mentioned problems and is a housing for electronic equipment which accommodates small-sized and high-density electronic boards which are excellent in heat dissipation, vibration resistance, mass productivity, and waterproofness, and particularly in the environment. It is an object of the present invention to provide a housing for electronic devices that can be installed outside the cabin of a severe automobile.

[0007]

A first aspect of the present invention is a housing for an electronic device, which is assembled in a box shape by a box bottom portion, a box body portion, and a box lid portion, and in which an electronic board on which electronic components are mounted is stored. At
The electronic board has elasticity, and in a state where the electronic board is fixed to the box bottom, at least a part of an edge of the electronic board is locked to the box body, and the box bottom and the box body are provided. It is characterized in that they are pressed against each other by the elasticity of the electronic substrate in the assembled state.

According to a second aspect of the present invention, in the first aspect, the fixing portion of the electronic board to the box bottom is deeper than the hooking portion of the electronic board to the box body in the depth direction. It is characterized by

A third aspect of the present invention is an electronic equipment casing in which a box bottom portion, a box body portion, and a box lid portion are assembled in a box shape, and an electronic substrate on which electronic components are mounted is stored. A fitting groove for receiving the edge of the box lid is provided on the upper end surface of the box, and a notch is provided on the edge of the box lid so that the edge of the box lid is fitted in the groove of the box body. When assembled, the adhesive filled in the fitting groove is allowed to flow in and out of the edge through the notch.

According to a fourth aspect of the present invention, in any one of the first to third aspects, at least a portion of the edge of the box lid portion that is fitted into the groove of the box body portion is gradually outward toward the tip of the edge. It is characterized in that it has a shape that expands to.

A fifth invention is characterized in that, in any one of the first to fourth inventions, a plurality of connector housings provided on the outer surface of the box body are provided separately.

According to a sixth aspect of the present invention, in any one of the first to fifth aspects of the invention, the box bottom portion is made of a heat conductive member, and a heat conductive mounting protrusion for mounting an electronic component is mounted on a substantially vertical side surface. It is characterized in that it is erected from the bottom of the box through a notch provided in the electronic board.

According to a seventh aspect of the present invention, in any one of the first to sixth aspects, the box bottom portion is made of a heat conductive member, and has a heat conductive mounting protrusion for mounting an electronic component on a substantially horizontal plane. It is characterized in that it is erected from the bottom of the box through a notch provided in the electronic board.

According to an eighth invention, in any one of the first to seventh inventions, in the electronic board, at least the through hole plating hole in the region where the heat-generating component is mounted is filled with the filling material, and the filling material is also filled. A plating layer is formed on both end surfaces of the through hole, and heat of the heat generating component is transferred to the bottom of the box made of a heat conductive member through the through hole plating hole.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1. Embodiment 1 is
A housing for electronic equipment, which is formed by assembling three members of a box bottom portion, a box body portion, and a box lid portion. This housing contains an elastic electronic substrate, and the electronic substrate is fixed to the box bottom portion. In this state, at least a part of the edge of the electronic board is locked to the hooking portion of the box body, and the box body and the box bottom are assembled, and the elasticity of the electronic board causes the box body to move. And the bottom of the box are in pressure contact with each other.

The first embodiment will be described below with reference to FIGS. 1 to 8. 1 is a plan view of a housing, FIG. 2 is a plan view of a housing with a box lid removed, FIG. 3 is a sectional view taken along line AA of FIG. 1, FIG. 4 is an enlarged sectional view of a connector housing portion, and FIG. FIG. 6 is a sectional view of a wall-shaped mounting projection, and FIG. 6 is an enlarged sectional view showing an assembled state of the box bottom portion, the electronic substrate, and the box tubular portion.

First, a description will be given centering on FIG. 3 with reference to FIGS. The case shown in the figure is made up of three members, a base as the box bottom 10, an annular frame as the box body 23, and a cover as the box lid 30, and various electronic components 41 are provided.
The electronic board 40 equipped with a to 41h is the box bottom 1
It is built in a substantially horizontal state with an appropriate distance from 0. The electronic board 40 is fixed to the box bottom 10 through screw holes provided in correspondence with the fixing portions 13a to 13d formed to project in appropriate places on the box bottom 10. Electronic board 4
Fixing 0 to the box bottom 10 will be described later. In addition, at least the box bottom portion 10 and the box body portion 23 among the above-mentioned three members.
Is formed of a heat conductive member such as a die-cast aluminum product.

In FIG. 3, the outer peripheral edge of the box bottom 10 is
At the time of assembly, a fitting groove 14 having a concave cross section is formed in an annular shape on a lower end surface of a box body portion 23, which will be described later, to receive an engaging projection portion 23b formed in an annular shape. As shown in FIGS. 2 and 5, from the bottom surface of the box bottom portion 10, through the cutout portion 40a of the electronic substrate 40, a transmission as a mounting protrusion 15 having a thermal conductivity and formed in a vertical wall shape is formed. The heat rib is integrally formed with the box bottom portion 10 in the illustrated example. By using the substantially vertical side surface of the mounting protrusion 15 having such thermal conductivity as the mounting surface of the heat-generating electronic component, compared to the case where the electronic component is installed flat in the housing,
Since the installation space can be significantly reduced, the housing can be downsized and the installation floor area can be reduced.
In addition, at four corners of the box bottom portion 10, mounting feet 11a to 12d having mounting holes 12a to 12d (FIG. 1) for mounting the housing are formed.
11d is provided.

In FIGS. 3, 4 and 6, the box body portion 23
Is formed in a square tube shape in this example, and a fitting protrusion 23b that fits into a fitting groove 14 formed so as to circulate along the outer peripheral edge of the box bottom 10 is formed on the lower end surface thereof. An annular lid groove 23a having a concave cross section is formed on the upper end surface of the protruding portion to receive the edge 31 of the box lid portion 30.
2 and 6, the inner peripheral surface of the box body portion 23 is provided with hook portions 24a to 24c having screw holes to which an edge side portion of an electronic board 40 described later is fixed. In FIG. 2, among the three hooking portions 24a to 24c, two of the hooking portions 24a and 24b are at both ends of one side of the edge of the electronic substrate 40, and one of the hooking portions 24c is the other side opposite to the one side. Is arranged at the apex of the triangle at the center of the length direction of the.

On the other hand, the fixing portion of the electronic board 40 to the box bottom portion 10 is a center 13a of the side between the two hooking portions 24a and 24b, and a center 13b of the surface of the electronic board 40.
Both ends 13c, 13 of the side where the hooking portion 24c is provided
and 13a to 13d are arranged in the figure.
The term refers to a screw hole for the fixing portion formed in the electronic board 40, but substantially refers to the fixing portion located below the screw hole). Among these four fixing portions 13a to 13d, the triangle having the three fixing portions 13a, 13c and 13d as vertices is arranged symmetrically with the triangle having the hooking portions 24a, 24b and 24c as vertices.

Fixing portions 13a-13b of the electronic substrate 40
As shown in FIG. 6, the locking portions 24a to 24c of the lid body 23 are the fixing portions (13a in the example of the drawing) of the electronic substrate 40 to the box bottom portion 10 in the depth direction of the housing. The electronic board 40 is set to have a deeper positional relationship than the hooking portion (24a in the illustrated example) with the box body portion 23. Therefore, by using, as the electronic board 40, a board having elasticity that rebounds and restores against bending due to an external force, the box bottom part 10 and the box body part 23 are separated from each other through the electronic board 40. In the assembled state, the box bottom 10 and the box body 23
And are pressed against each other. The electronic board 40 of this example uses a glass epoxy board, and a large number of electronic parts such as heat generating parts 41a to 41h are soldered and mounted on both surfaces of the electronic board 40.

Referring again to FIG. 6, the assembly of the box bottom portion 10 and the box body portion 23 via the electronic board 40 will be described. The electronic board 40 having elasticity is provided at three positions on the edge side on the inner wall of the box body 23, that is, on the inner peripheral surface side, and with respect to the screw holes of the hooking portions 24a to 24c, arrows 61 in the figure. The fixing portions 13a to 13c, which are fastened in a direction by screws (not shown) and are provided at appropriate positions of the electronic substrate 40, respectively, are provided with arrows 62 in the figure with respect to the substrate fixing portions protruding from the bottom surface of the box bottom 10. Tighten and fix it in the direction by screws (not shown).

In this case, the distance T between the contact surface of the engaging portion 24a with the electronic substrate 40 and the contact surface of the substrate fixing portion 13a with the electronic substrate 40 is smaller than the thickness t of the electronic substrate 40. Since the positional relationship between the hooking portion 24a and the board fixing portion 13a is set so as to become larger, that is, the fixing portion 13 of the electronic board 40 with the box bottom portion 10 in the depth direction of the housing.
a to 13d, more accurately, the surface of the electronic substrate 40 is the fixed portion 1
3a to 13d are in contact with the box body portion 23 of the electronic board 40, and more precisely, the surface of the electronic board 40 is deeper than the area in which the surface stop portions 24a to 24c are contacted ( (Lower) position, the electronic board 40
The box bottom part 10 and the box body part 23 are temporarily assembled through the via, and the box body part 23 and the box bottom part 10 are pressed against each other by the elasticity of the electronic substrate 40 in the temporary assembled state. Therefore, when the box bottom portion 10 and the box body portion 23 are bonded and fixed using an appropriate adhesive, the work can be facilitated because the assembly state can be stabilized, and the sealing can be achieved. To be enhanced.

Next, the connector housing 20 provided integrally with the box body portion 23 of the housing will be described. 2 to 4, the connector housing 20 of the first embodiment is shown.
Is divided into a plurality of parts, which are functionally provided by one, and in this example, the functions are divided into two and provided as divided connector housings 20a and 20b, respectively. Both of the split connector housings 20a and 20b are resin-molded by, for example, PBT (polybutylene terephthalate) or the like, and have a large number of bent (right-angle type) connection pins 22a and 22b and a box body, respectively. It is provided with protective cylinder portions 21a and 21b for protecting the connection pins 22a and 22b protruding to the outer peripheral surface side of the portion 23.

FIG. 4 shows a state in which the mating connector 50 is connected to the split connector housing 20a, and the connection pin 22a of the split connector housing 20a and the female pin (not shown) of the mating connector housing 50 are fitted in contact with each other. Is configured to. An annular groove 51 is provided in the mating connector 50 so as to sandwich the protective cylinder portion 21a, and an elastic packing 52 made of, for example, a rubber material is attached to the inner peripheral surface of the annular groove 51. With this elastic packing, it is possible to secure higher waterproofness as compared with the conventional one. In addition, the function of the connector housing 20 which is conventionally provided by one is divided into a plurality of divided connector housings 20a,
By providing the split connector housings 20a and 20b separately, it is possible to easily attach / detach each of the split connector housings 20a, 20b to / from the mating connector 51 without requiring an unreasonable force as compared with the related art.

Next, the box lid portion 30 will be described. In FIGS. 3 and 6, the box lid portion 30 is a cover made of, for example, sheet metal, which covers the upper surface side of the box body portion 23. The edge of the box lid 30 is
At least a portion of the box body portion 23 that is fitted into the lid groove 23a has a cross-sectional shape that forms an outer peripheral bent portion 31 that gradually expands toward the edge tip. In addition, the opening slope portion 3 of the outer peripheral bent portion 31 formed on the edge of the box lid portion 30.
3 is provided with a peripheral edge cut portion 32 as a cut surface of an edge punched and cut by press working, and a plurality of edge cutout portions 34 provided at appropriate intervals along the edge.

The opening slope 33 is fitted into the concave lid groove 23a of the box body 23 when the box lid 30 is closed, and is fixed by the adhesive sealing material 70 filled in the lid groove 23a.
In this case, the inner wall surface on the outer peripheral side of the lid groove 23a and the peripheral cutting portion 3
A box lid portion 30 is formed in advance so that a gap G is formed between the two, that is, the edge cut surface. The gap G, together with the edge cutout 34, promotes fluidization of the filled adhesive sealing material 70 in the lid groove 23a, whereby the edge or opening of the box lid portion 30 housed in the lid groove 23a. The adhesive sealing material 70 is applied to the inner and outer peripheral edges of the slope portion 33 quickly and uniformly to improve fixation and sealing performance.

Next, the mounting projection 15 will be described. In FIGS. 3 and 5, the board notch 4 is provided at an appropriate position of the electronic board 40.
0a is provided, a heat transfer rib as a mounting projection 15 integrally formed with the box bottom portion 10 having heat conductivity is formed in a wall shape through the substrate cutout portion 40a, and the substantially vertical wall On the wall surface, a heat generating component 41d such as a transistor soldered to the electronic board 40 is elastically attached to the clip 60a, 60.
Crimp through b. As a result, the heat-generating component 41d, which requires a large planar installation space, can be installed vertically in the vertical direction, so that the planar installation space of the housing can be significantly reduced.

Assembly of the housing of the first embodiment will be described. First, many electronic components including the heat generating components 41a to 41h are mounted on the electronic substrate 40. Next, the electronic board 40 is screwed and fixed to the box body portion 23 in which a large number of connection pins 22a and 22b are press-fitted into the split connector housings 20a and 20b, respectively, and connected using a jet soldering device or the like. The pins 22a and 22b are soldered to the electronic board 40. Next, after the adhesive sealing material 70, which is, for example, a silicon-based thermosetting adhesive, is injected into the fitting groove 14 of the box bottom portion 10, the electronic board 40 is attached to the box bottom portion 1 with a board fixing screw or the like.
Tighten and fix to 0.

In the above assembly process, when the electronic board 40 is fixed to the box bottom 10 with the board fixing screws,
The electronic substrate 40 is deformed within the elastic deformation, and the distance T in FIG. 6 is compressed. As a result, the box body 23 and the box bottom 10
Will be temporarily pressure-bonded to each other via the electronic board 40, so that the box body portion 2 is kept until the adhesive sealing material 70 is cured.
Assembling stability of 3 and the box bottom 10 is secured.

To mount the thus-assembled housing on, for example, the body of an automobile, the mounting feet 11a to 11d of the box bottom 10 having high mechanical strength and heavy weight are installed at predetermined positions, and then the housing is mounted. The mating connectors 50 prepared in advance are connected to the body split connectors 20a and 20b, respectively. In addition, by forming the box bottom portion 10 provided with the mounting feet 11a to 11d as a weight body and using the built-in electronic board 40 as a glass epoxy material, the electronic board 40 and the adhesive sealing material portion 70 at the time of practical operation can be obtained. The effect of the vibration load can be reduced, and the strength of the electronic substrate 40 can be increased.

Further, according to the first embodiment, the heat generating parts 41a to 41h are provided by the elastic fastening members 60a and 60b.
Since it is brought into close contact with the heat transfer rib as the mounting member 15, it is possible to absorb the stress of the soldering part due to the expansion and contraction of the lead wire due to the generated heat, and to surely dissipate the heat, and to generate a large number of heat-generating components. The mounting area of 41a to 41h can be reduced. In addition, for example, an adhesive sealing material 70 which is a thermosetting adhesive of silicon type is injected into the groove 23a for the lid, and then the box lid portion 30 is placed and heated and dried, so that the box bottom portion 10 and the box tubular portion 23. It is possible to assemble the housing by integrating the three members, that is, the box lid section 30 and the box lid section 30.

Embodiment 2. In the second embodiment, in place of the wall-shaped mounting projection 15 having the substantially vertical mounting surface in the first embodiment, a trapezoidal mounting projection 16 having a substantially horizontal mounting surface on the top surface is provided. It is a thing. This will be described with reference to FIG. FIG. 7 is a vertical cross-sectional view of the mounting protrusion 16 having a thermal conductivity and having a mounting surface formed substantially horizontally. In FIG. 7, a mounting protrusion 16 having heat conductivity, which is formed in a trapezoidal shape so that the top surface faces the upper surface side of the electronic substrate 40 through the cutout portion 40b of the electronic substrate 40, is the mounting protrusion 15 described above. Similarly, is formed integrally with the box bottom portion 10.

The heat-generating component 41i such as a transistor with a bent lead wire soldered to the electronic board 40 is fixed with a fixing screw 6.
It is fixed to the mounting projection 16 with a screw 63. Since the heat generating component 41i is soldered to the electronic substrate 40 via the bent lead wire as shown in the drawing, even if the lead wire expands or contracts due to temperature change, the lead wire expands or contracts due to the generated heat. The stress of the soldering portion is absorbed by the bent portion of the lead wire, and the soldering portion is not unnecessarily stressed.

Mounting protrusion 1 having such thermal conductivity
By using the substantially horizontal top surface or flat surface of 6 as the mounting surface of the heat-generating component, the height of the housing is higher than that of the wall-shaped mounting projection 15 having the substantially vertical mounting surface of the first embodiment. The (depth) direction can be reduced. If only the mounting projection 15 having a substantially vertical mounting surface is provided inside the housing, the installation floor area of the housing can be reduced, and only the heat conductive projection 16 is provided inside the housing. If provided, the height of the housing can be reduced. Further, the mounting projection 15 having a substantially vertical mounting surface and the mounting projection 1 having the substantially horizontal mounting surface
By appropriately combining and using 6 and 6, it is possible to provide a compact housing having a small housing volume.

Embodiment 3. In the third embodiment, in the electronic board 40 according to the first or second embodiment, at least the through-hole plating hole in the region where the heat-generating component is mounted is filled with the filling material, and the through-hole filled with the filling material. A plating layer is applied to both end surfaces of the heat generating component to transfer the heat of the heat generating component to the bottom of the box made of a heat conductive member through the through hole plating hole. This will be described below with reference to FIGS. 8 and 9. FIG. 8 is a partially enlarged vertical cross-sectional view showing a state where the electronic board is attached to the bottom of the box, and FIG. 9 is a plan view of the electronic board.

In FIGS. 8 and 9, 17 is a heat transfer surface located on the bottom surface of the box bottom portion 10, and 18 is a soft and heat conductive insulating sheet 18 made of, for example, a silicon material. The heater 18 is arranged in close contact with the heat transfer surface 17. A heat transfer / insulating adhesive may be used instead of the heat transfer insulating sheet 18.

Reference numeral 42a denotes a collector terminal as a heat dissipation electrode provided on a heat generating component 41j which is a power transistor having a planar structure, and 42c and 42d denote emitter terminals and base terminals as second and third electrodes. The collector terminal as the heat dissipation electrode 42a has a large area over substantially the entire surface of the heat generating component 41j.

44a and 44b are the collector terminals 42a.
Copper foil pattern, 43a-43i (43d-
43i refers to FIG. 9) is a large number of through-hole plating holes provided in the electronic substrate 40, 45a and 45b connect the copper foil patterns 44a and 44b, for example, a first plating layer by copper plating, 46a, 46b are solder resist layers, 4
7a to 47i are the through-hole plating holes 43a to 43.
a filler such as an epoxy resin filled in i, 48
Reference numerals a and 48b are second plating layers for blocking the filling material, for example, copper plating, and 49a is a solder layer for the heat dissipation electrode 42a. The fillers 47a to 47i preferably have thermal conductivity.

Further, the solder layers 49c and 49d (49d is not shown) for the second and third electrodes 42c and 42d, the second plating layers 48c and 48d, and the first plating layer 45.
c, 45d (45d is not shown), or copper foil pattern
The parts 44c, 44d (44d is not shown) and the like are electrically separated from the heat dissipation electrode 42a.

According to the third embodiment, the electronic substrate 40
Heat generating component 41j mounted on the front side of the plate by a flat mounting structure
The generated heat can be efficiently transferred from the back surface of the electronic board 40 to the box bottom portion 10 through the through-hole plating holes 43a to 43c of the electronic board 40. In addition, the through-hole plating holes 43a to 43c are filled with the filling material 47.
The holes are closed by a to 47c, and plating layers (second plating layers) 48c and 48d are formed on both ends of the closed through-hole plating holes 43a to 43c. Solder can be prevented from flowing into the holes 43a to 43c, and a wide contact plane with the heat transfer surface can be secured. Further, by providing a larger number of similar through-hole plating holes 43a to 43c, the thermal conductivity can be improved, so that the heat generating component 4 to be mounted is mounted.
Depending on 0j, the temperature rise can be further reduced.

In the first to third embodiments, the electronic board 40 and the box body 23 are fixed to each other by using a hook integrally formed with the box body 23 and a hole provided in the electronic board 40 instead of using screws. May be forcedly fitted (not shown), or the rivet may be press-fitted into the box bottom 10 so that the head of the rivet presses the electronic board, or the pins integrally formed with the box bottom 10 are caulked. Also good (not shown). In addition, in the first to third embodiments, the box lid 30 and the box body 23
Instead of the adhesive fixing by the adhesive sealing material 70, the packing and the screw can be used for fixing (not shown). In this case, although extra parts and the like are required, maintenance and inspection are easy. Further, in the third embodiment, as a means for fixing the heat-generating component 41i, a rivet or a caulking method may be used instead of the fixing screw 63 (not shown).

[0043]

According to the first to eighth inventions,
Due to the elasticity of the electronic substrate, the case to be assembled can be fixed in a state where the box bottom and the box body are pressed against each other in a combined state, so that the adhesive sealing material between the box body and the box bottom is It becomes easy to transfer between steps until it hardens. Further, since the box lid can be attached in the above state, the work of assembling the housing can be efficiently performed.
In addition, before the box lid is attached, it has already been electrically completed, so the product test using the check terminals on the electronic board and the mating connector should be done with the box lid removed. Can also be done easily.

According to the third and fourth inventions, the adhesive strength of the box lid portion to the box body portion due to the adhesive sealing material is higher than in the conventional case, so that the fixing and sealing properties of both portions are more reliable. Can be

According to the fifth aspect of the invention, the function of the connector housing, which is conventionally provided by one, is divided into a plurality of divided connector housings. Therefore, it is impossible to attach / detach the divided connector housing to / from the mating connector. It can be done easily without requiring a lot of force.

According to the sixth aspect, the heat-generating component provided on the electronic substrate can be securely mounted to the bottom of the box by heat transfer, and the installation space of the housing can be reduced.

According to the seventh aspect of the present invention, the heat-generating component provided on the electronic substrate can be securely mounted on the bottom of the box by heat transfer, and the height of the housing can be reduced.

According to the eighth aspect of the invention, the heat generated by the heat-generating component mounted on the front surface side of the electronic board by the flat mounting structure is transferred from the back surface of the electronic board by utilizing the through-hole plating hole of the electronic board. Heat can be efficiently transferred to the bottom of the box. Further, since the through-hole plated hole is filled with a filling material and the plated layers are formed on both end sides of the through-hole, it is possible to prevent the solder from flowing into the through-hole plated hole, A wide contact plane with the heat transfer surface can be secured. Furthermore, since the thermal conductivity can be improved by providing more similar through-hole plating holes, the temperature rise can be reduced depending on the heat-generating components to be mounted.

[Brief description of drawings]

FIG. 1 is a plan view of a housing according to a first embodiment.

FIG. 2 is a plan view of a housing with a box lid removed.

3 is a cross-sectional view taken along the line AA of FIG.

FIG. 4 is an enlarged cross-sectional view of a connector housing portion.

FIG. 5 is a cross-sectional view of a wall-shaped mounting protrusion.

FIG. 6 is an enlarged cross-sectional view showing an assembled state of the box bottom portion, the electronic substrate, and the box cylinder portion.

FIG. 7 is a partial cross-sectional view of the housing according to the second embodiment.

FIG. 8 is a sectional view of an electronic board according to a third embodiment.

9 is a plan view of the electronic substrate of FIG.

[Explanation of symbols]

10 Box Bottom, 13a to 13d Fixed Part, 14 Fitting Groove, 52 Elastic Packing, 15 Mounting Protrusion (Wall) 16
Mounting protrusion (trapezoid), 17 heat transfer surface, 18 insulating sheet (heat conductive insulating layer), 20a, 20b split connector housing, 22a, 22b connection pin, 23 box body (housing), 23a edge fitting Mating groove, 24a to 24c hooking portion, 30 box lid portion (housing), 31 edge (periphery bending portion),
32 peripheral edge cutting part, 33 opening slope part, 34 edge notch part, 40 electronic board, 41a to 41j heat generating component, 43
a-43c through-hole plated holes, 44a, 44b
Copper foil pattern, 45a, 45b First plating layer, 47
a to 47i Filler, 48a, 48b Second plating layer. 60a, 60b Elastic body, 70 Adhesive sealing material, G
Gap, T distance, t thickness.

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP 2002-316597 (JP, A) JP 11-312884 (JP, A) JP 2001-85866 (JP, A) JP 11-251764 ( JP, A) JP 11-261254 (JP, A) JP 2000-183574 (JP, A) JP 2001-308566 (JP, A) JP 9-283886 (JP, A) JP 2000- 349466 (JP, A) JP 9-23536 (JP, A) JP 6-77674 (JP, A) JP 9-238419 (JP, A) JP 10-243527 (JP, A) JP-A-8-181471 (JP, A) JP-A-11-266078 (JP, A) Actually open 6-9190 (JP, U) Actually open 58-142988 (JP, U) Actually open 62-158897 (JP, U) Actual Kaihei 3-2699 (JP, U) Japanese Patent Publication 6-52831 (JP, B2) (58) Fields investigated (Int.Cl. ⁷ , D B name) H05K 7/14 H05K 5/00-5/06 H05K 7/20

Claims (8)

(57) [Claims] 1. A housing for an electronic device, which is assembled in a box shape by a box bottom portion, a box body portion, and a box lid portion, and in which an electronic substrate on which electronic components are mounted is stored, wherein the electronic substrate has elasticity. In a state in which the electronic board is fixed to the box bottom, at least a part of an edge of the electronic board is locked to the box body, and the box bottom and the box body are assembled. A housing for an electronic device, wherein the housings are pressed against each other by the elasticity of the electronic substrate. 2. The method according to claim 1, wherein, in the depth direction of the housing, the fixing portion of the electronic board to the box bottom is deeper than the hooking portion of the electronic board to the box body. For electronic devices. 3. A housing for an electronic device, which is assembled in a box shape with a box bottom portion, a box body portion, and a box lid portion, and in which an electronic board on which electronic components are mounted is stored, wherein an upper end surface of the box body portion is provided. A fitting groove for receiving the edge of the box lid is provided, and a cutout is provided at the edge of the box lid,
When the edge of the box lid is fitted into the groove of the box body when assembled, the adhesive filled in the fitting groove is allowed to flow through the notch into and out of the edge. Claim 1
Alternatively, the electronic device casing according to claim 2. 4. The edge of the box lid has a shape in which at least a portion fitted into the groove of the box body gradually expands outward toward the tip of the edge. The electronic device casing according to claim 3. 5. The connector housing provided on the outer surface of the box body is divided into a plurality of parts and is provided.
A housing for an electronic device according to claim 4. 6. The bottom of the box is made of a heat conductive material, and a mounting protrusion having heat conductivity for mounting an electronic component is attached to a substantially vertical side surface from the bottom of the box through a notch formed in the electronic board. The housing for electronic equipment according to any one of claims 1 to 5, which is raised. 7. The box bottom is made of a heat conductive member, and a mounting protrusion having heat conductivity for mounting an electronic component on a substantially horizontal plane is passed from a bottom of the box through a notch provided in the electronic board. The housing for electronic equipment according to any one of claims 1 to 5, which is raised. 8. In an electronic board, at least a through-hole plating hole in a region where a heat-generating component is mounted is filled with a filling material, and a plating layer is formed on both end surfaces of the through-hole filled with the filling material. 8. The electronic device casing according to claim 1, wherein the heat of the heat generating component is transferred to the bottom of the box made of a heat conductive member through the through hole plating hole. .