CN216596157U - Computer water-cooling heat dissipation device - Google Patents

Abstract

The utility model provides a computer water-cooling heat dissipation device, which comprises a first shell, a second shell, a circuit board and a sealing element. The second shell comprises a main body and a retaining wall. The main body and the first housing are arranged in a first direction. The retaining wall connecting main body is arranged with the first shell in a second direction, and the first direction is vertical to the second direction. The circuit board is arranged between the first shell and the second shell and used for arranging electronic elements. The sealing element is arranged between the first shell and the second shell, the first shell comprises a first surface facing the main body, a second surface back facing the main body and a third surface facing the retaining wall, and the sealing element is in contact with the third surface and is separated from the first surface.

Description

Computer water-cooling heat dissipation device

Technical Field

The utility model relates to a computer water-cooling heat dissipation device

Background

In an electronic device, such as an electronic device for a vehicle, it is an important issue how to maintain a stable temperature during operation of the device. For example, a water-cooled heat dissipation method can be used to reduce the temperature generated during the operation of the electronic device. For such a heat dissipation method, the electronic device body needs to have good sealing performance. In the industry, it is common to glue one of the shells and then place the other shell in a tight fit. However, this manner of assembly is still not entirely satisfactory.

SUMMERY OF THE UTILITY MODEL

Some embodiments of the utility model provide a computer water-cooling heat dissipation device, which includes a first housing, a second housing, a circuit board, and a sealing element. The second shell comprises a main body and a retaining wall. The main body and the first housing are arranged in a first direction. The retaining wall connecting main body is arranged with the first shell in a second direction, and the first direction is vertical to the second direction. The circuit board is arranged between the first shell and the second shell and used for arranging electronic elements. The sealing element is arranged between the first shell and the second shell, the first shell comprises a first surface facing the main body, a second surface back facing the main body and a third surface facing the retaining wall, and the sealing element is in contact with the third surface and is separated from the first surface.

In some embodiments, the second face is spaced from the retaining wall and the sealing element contacts the second face.

In some embodiments, the retaining wall is spaced apart from the first housing by a gap.

In some embodiments, the gap is between 0.3mm to 0.5 mm.

In some embodiments, the second surface of the first housing defines a datum plane, and the retaining wall is higher than the datum plane.

In some embodiments, the height that the wall extends from the datum surface is greater than 3 mm.

In some embodiments, the distance of the sealing element from the body and the distance of the first housing from the body are different in the first direction.

In some embodiments, the computer water-cooling heat sink further includes a conductive element, wherein the groove is formed on a side of the second housing facing the first housing, and the conductive element is disposed in the groove and directly and electrically connected to the first housing and the second housing.

In some embodiments, the second housing is formed by die-casting, so that the main body and the retaining wall are integrally formed.

In some embodiments, the computer water-cooling heat dissipation device further includes a fixing element disposed on the first housing and the second housing for fixing the relative position of the first housing and the second housing, and the sealing element is spaced apart from the fixing element.

Drawings

The embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, various features are not drawn to scale and are merely illustrative. In fact, the dimensions of the elements may be arbitrarily expanded or reduced to clearly illustrate the features of the present invention.

Fig. 1A and 1B are schematic views of a computer water-cooling heat dissipation apparatus according to some embodiments of the present invention, viewed from different directions.

Fig. 2 is an exploded view of a computer water-cooling heat dissipation device according to some embodiments of the present invention.

FIG. 3 is a top view of a computer water-cooling heat sink according to some embodiments of the present invention.

Fig. 4A is a cross-sectional view taken along line a-a in fig. 3.

Fig. 4B is an enlarged view of fig. 4A.

FIG. 5 is a schematic diagram of some components of a computer water-cooling heat sink.

Description of the reference numerals

10 first casing

11 first side

12 the second side

13: third surface

14,17 projecting part

15,16 setting part

20: second housing

22 main body

24: retaining wall

25: groove body

26 an extension part

27,71 top surface

28: groove

30: circuit board

32,34,36 interface

40,64, cover body

42,52 opening

50,62 elastic element

60 bearing seat

70 sealing element

80 conductive element

90,92 fixing element

100 computer water cooling heat sink

D is distance

H is height

S is a reference plane

W1 width

W2 gap

Detailed Description

Various embodiments or examples are disclosed below to practice various features of the provided subject matter, and embodiments of specific elements and arrangements thereof are described below to illustrate the present invention. These examples are, of course, intended to be illustrative only and should not be construed as limiting the scope of the utility model. For example, references in the specification to a first feature being formed over a second feature include embodiments in which the first feature is in direct contact with the second feature, as well as embodiments in which additional features are formed between the first feature and the second feature, i.e., the first feature and the second feature are not in direct contact.

Moreover, where specific reference numerals or designations are used in various embodiments, these are merely used to identify the utility model in a simplified and clear manner, and are not intended to necessarily represent a particular relationship between the various embodiments and/or structures discussed. Furthermore, forming, connecting, and/or coupling another feature over, to, and/or to another feature in the present disclosure may include embodiments in which features are formed in direct contact, and may also include embodiments in which additional features may be formed interposing the above-described features, such that the above-described features may not be in direct contact. Furthermore, spatially relative terms, such as "vertical," "above," "upper," "lower," "bottom," and the like, may be used herein to facilitate describing one element(s) or feature(s) from another element(s) or feature(s) in the drawings and are intended to encompass different orientations of the device in which the feature is included.

In the present invention, the terms "about", "approximately", "substantially" generally mean within 20%, preferably within 10%, more preferably within 5%, or within 3%, or within 2%, or within 1%, or within 0.5% of a given value or range. In this regard, a given quantity is an approximate quantity, i.e., the meanings of "about", "about" and "substantially" are implied unless specifically stated otherwise.

Furthermore, the use of ordinal numbers such as "first," "second," etc., in the specification and claims to modify a claim element does not by itself connote any preceding ordinal number of the claim element, nor does it denote the order of a given claim element from another claim element or method of manufacture, but are used merely to distinguish one claim element having a certain name from another element having a same name.

Referring to fig. 1A to 3, fig. 1A and 1B are schematic views of a computer water-cooling heat sink 100 according to some embodiments of the present invention, viewed from different directions, fig. 2 is an exploded view of the computer water-cooling heat sink 100 according to some embodiments of the present invention, and fig. 3 is a top view of the computer water-cooling heat sink 100 according to some embodiments of the present invention. As shown in fig. 1 to 3, the computer water-cooling heat dissipation apparatus 100 mainly includes a first housing 10, a second housing 20, a circuit board 30, a cover 40, an elastic element 50, a supporting base 60, and an elastic element 62.

In some embodiments, the first housing 10 and the second housing 20 may be arranged in a Z direction (a first direction), and an accommodating space may be formed between the first housing 10 and the second housing 20 to protect other components disposed therein. In some embodiments, the first housing 10 may comprise a metal material, such as aluminum, and may be formed by stamping, etc. Therefore, the first housing 10 may have a degree of deformation. Then, the first casing 10 can be abutted against the second casing 20, so that the second casing 20 and the first casing 10 are deformed together, thereby sealing the gap between the first casing 10 and the second casing 20 to achieve the waterproof and dustproof effects. In some embodiments, the first and second cases 10 and 20 may contact each other at portions of the edges.

In some embodiments, the second casing 20 may be a side contacting a water cooling device (not shown) for performing water cooling heat dissipation. In some embodiments, the second housing 20 may be made of die-cast, forged or machined parts, and is used as a main component of the computer water-cooling heat sink 100, so as to control the deformation amount and reduce the thickness of the second housing 20, thereby achieving the miniaturization of the computer water-cooling heat sink 100. In some embodiments, the computer water-cooling heat dissipation device 100 can be installed in electronic applications such as personal computers, monitors, televisions, video cameras, automobiles, and the like, so as to achieve the waterproof and dustproof effects.

In some embodiments, the circuit board 30 may be a Printed Circuit Board (PCB) or a Flexible Printed Circuit (FPC), however, the utility model is not limited thereto. The circuit board 30 may be disposed between the first housing 10 and the second housing 20, for example, in the accommodating space. Various electronic components may be disposed on the circuit board 30, such as on the circuit board 30 through the carrier 60. In some embodiments, the first casing 10 may include a protrusion 14 thereon corresponding to the carrier 60, for example, the protrusion may overlap the carrier 60 in the Z-direction. The protruding portion 14 may protrude in the Z direction for accommodating the carrier 60 (and the electronic components disposed thereon) protruding from the circuit board 30.

In addition, the circuit board 30 may have a plurality of interfaces 32 and 34 for allowing other external electronic components to be electrically connected to the electronic components on the circuit board 30 through the interfaces 32 and 34. In other words, the interfaces 32 and 34 can be exposed from the computer hsd 100. In order to prevent other substances from entering the computer water-cooling heat sink 100 through the side where the interface 32 is disposed, an additional cover 40 and an elastic element 50 may be disposed on the side. The cover 40 may have a plurality of openings 42, the elastic element 50 may have a plurality of openings 52, and the interface 32 may be exposed to the computer water-cooling heat sink 100 through the openings 42 and 52.

In some embodiments, the second housing 20 may have a slot 25 thereon, and the cover 40 and the elastic element 50 may be disposed on the slot 25. In some embodiments, the elastic element 50 may be made of an elastic material, such as a rubber material, a resin, a foam, a silicone, a rubber, a plastic, or a combination thereof, which is not limited herein, depending on the application, so as to fill the space between the interface 32, the interface 34, and the cover 40 and prevent other substances from entering between the first casing 10 and the second casing 20.

In some embodiments, as shown in fig. 3, the interface 32 may be at least partially exposed from the first housing 10, and the interface 34 may not be exposed from the first housing 10, so as to allow the computer water-cooling heat sink 100 to be provided with interfaces having different functions to meet various requirements.

In some embodiments, as shown in fig. 1B and fig. 2, the other side of the computer water-cooling heat dissipation device 100 may further include an interface 36, an elastic element 62, and a cover 64, which have functions similar to those of the interface 32, the elastic element 50, and the cover 40, and may allow the computer water-cooling heat dissipation device 100 to be connected to other elements on the other side, which is not described herein again in detail.

The first housing 10 and the second housing 20 can be fixed relative to each other by a fixing element 90. In some embodiments, the second housing 20 may have a plurality of extending portions 26, and fixing elements 92 may be disposed on the extending portions 26 for fixing the computer water-cooling heat sink 100 to other external devices. The fixing elements 90 and 92 can be screws, or can be fixed by locking, adhering, or engaging. In some embodiments, the first housing 10 may have additional setting portions 15 and 16, corresponding to the positions of the fixing elements 90. The setting parts 15 may be located at both sides of the first housing 10 and protrude from the center of the first housing 10 in the X direction, and the setting parts 16 may be recessed toward the center of the first housing 10 in the Y direction, thereby allowing a large space for setting the fixing member 90. In some embodiments, as shown in fig. 3, the extension 26 may be exposed from the first housing 10 when viewed from the Z direction, so that the provision of the extension 26 may be facilitated. In some embodiments, the distance that the extension 26 extends in the X direction from the first housing 10 as viewed from the Z direction may be different from the distance that the setting portion 15 extends in the X direction from the first housing 10, for example, the extension 26 may extend a longer distance to increase design flexibility.

In some embodiments, a protrusion 17 extending in a specific direction (e.g., X direction) may be provided on the first housing 10. The protrusion 17 may allow increasing the mechanical strength of the first housing 10, and may also provide the wire at a position corresponding to the protrusion 17 in the aforementioned accommodation space to protect the wire. In some embodiments, the length of each protrusion 17 may be different from one another.

Fig. 4A is a cross-sectional view taken along line a-a in fig. 3, and fig. 4B is an enlarged view of fig. 4A. As shown in fig. 4A and 4B, the second housing 20 may have a groove 28 on a surface facing the first housing 10. In some embodiments, a conductive element 80 may be disposed in the groove 28 to allow the first housing 10 to be electrically connected with the second housing 20. The conductive element 80 may comprise, for example, a conductive adhesive, and can simultaneously achieve the functions of bonding the first casing 10 and the second casing 20 and providing electrical connection.

FIG. 5 is a schematic diagram of some components of the computer water cooling heat sink 100. Details of a structure similar to that of figure 4B are depicted. As shown in fig. 5, the second housing 20 may include a main body 22 and a retaining wall 24. The main body 22 is aligned with the first housing 10 in a first direction (e.g., Z direction), and the retaining wall 24 is connected to the main body 22 and aligned with the first housing 10 in a second direction (e.g., X direction). It should be noted that the first direction and the second direction may be perpendicular to each other. In some embodiments, the retaining wall 24 and the first housing 10 may be spaced apart from each other. In addition, since the second housing 20 can be formed by die-casting, the main body 22 can be integrally formed with the retaining wall 24 to increase mechanical strength.

Referring back to fig. 3, the retaining wall 24 may surround the first housing 10. For example, as shown on the left side of fig. 3, wall 24 may include a plurality of discrete portions. Alternatively, as shown on the right side of FIG. 3, the retaining wall 24 may also extend continuously along the side of the computer water-cooled heat sink 100, depending on the design requirements.

In order to achieve the dustproof and waterproof functions, a sealing element 70 may be disposed between the retaining wall 24 and the first housing 10 to fill a gap between the first housing 10 and the second housing 20 during assembly. For example, the first housing 10 may be disposed on the second housing 20, then the fixing element 90 is disposed to fix the relative positions of the first housing 10 and the second housing 20, and the sealing element 70 is disposed from the outside, i.e., the sealing element 70 may be disposed by using an external dispensing method. Therefore, the speed of the manufacturing process can be increased, and the time required by the manufacturing process is reduced. In some embodiments, the sealing element 70 may be disposed outside the computer water-cooling heat sink 100 after testing the computer water-cooling heat sink 100 and ensuring that the internal components meet the requirements. On the other hand, the sealing element 70 can flow along the gap between the first casing 10 and the second casing 20 and be uniformly distributed in the whole gap, so as to achieve the effect of a full-circle sealing compound, thereby ensuring the bonding strength and preventing unwanted foreign matters from entering the computer water-cooling heat dissipation device 100.

In some embodiments, the sealing element 70 may include a pressure-sensitive adhesive, such as a flowable adhesive, for example, a heat-curable adhesive, a photo-curable adhesive, a hot-melt adhesive, a moisture-curable adhesive, a two-part adhesive, etc., but the utility model is not limited thereto. By disposing the sealing element 70 between the first casing 10 and the second casing 20, and after the sealing element 70 is cured, the computer water-cooling heat sink 100 can be allowed to meet the waterproof specifications of IP6K9K and IP6K 8. Further, the sealing member 70 may be spaced apart from the fixing member 90 to facilitate removal of the fixing member 90. In some embodiments, the fixing element 90 can be designed to be locked to the second housing 20 and spaced apart from the sidewall of the hole 17 of the first housing 10 (or not locked to the hole 17) to avoid the assembly failure caused by the tolerance that may be generated during the assembly.

In some embodiments, the first housing 10 may include a first face 11, a second face 12, and a third face 13, wherein the first face 11 may face the main body 22, the second face 12 may face away from the main body 22 and be spaced apart from the retaining wall 24, and the third face may face the retaining wall 24. In some embodiments, the sealing element 70 may be disposed between the retaining wall 24 and the first housing 10, and may directly contact the second face 12 and the third face 13 to engage the first housing 10 and the second housing 20. In some embodiments, the first face 11 may directly contact the body 22, and the sealing element 70 may be spaced apart from the first face 11. Thereby, the gap between the first housing 10 and the second housing 20 can be filled. In addition, the conductive element 80 can directly contact the first surface 11 and the main body 22 to electrically connect the first casing 10 and the second casing 20.

Since the sealing element 70 can be separated from the first surface 11, the first housing 10 and the second housing 20 can be easily disassembled, so as to prevent the time required for re-disassembling the computer water-cooling heat sink 100 if the test fails when testing other electronic components disposed in the computer water-cooling heat sink 100 after the assembly, thereby saving the cost required in the manufacturing process. For example, if the testing result of the electronic device in the computer water-cooling heat sink 100 is failed, since the sealing element 70 does not contact the first surface 11, the first housing 10 and the second housing 20 can be separated by a small force, and the remaining sealing element 70 can be removed, and then the assembling process can be repeated or discarded, so as to save the time required in the manufacturing process, thereby reducing the cost.

In some embodiments, the sealing element 70 may be spaced a distance D from the body 22 in the Z direction to reduce the amount of force required to disassemble the first housing 10 and the second housing 20. That is, in the first direction (Z direction), the distance D of the sealing member 70 from the main body 22 and the distance of the first housing 10 from the main body 22 are different. In addition, in the X direction, the width of the wall 24 is W1, and the wall 24 and the first housing 10 are separated by a gap W2, wherein the width W1 may be greater than the gap W2. For example, the width W1 may be about 2mm, while the gap W2 may be between about 0.3mm to about 0.5 mm. Thereby, the retaining wall 24 having the larger width W1 can have sufficient mechanical strength. In addition, by designing the gap W2 to be between about 0.3mm and about 0.5mm, the problem that the sealing element 70 is difficult to flow between the retaining wall 24 and the first housing 10 if the gap W2 is too small can be avoided. In addition, the problem that if the gap W2 is too large, it is difficult for the sealing element 70 to contact the retaining wall 24 and the first housing 10 at the same time can be avoided. Therefore, the computer water-cooling heat sink 100 can be allowed to meet the waterproof specifications of IP6K9K and IP6K 8.

In some embodiments, the retaining wall 24 may be designed to be higher than the first housing 10 in order that the retaining wall 24 may further limit the flow position of the sealing element 70. For example, the second surface 12 of the first housing 10 may define a reference plane S, and the top surface 27 of the retaining wall 24 may be higher than the reference plane S. For example, the height H that the top surface 27 of the wall 24 extends from the datum surface S in the Z direction may be greater than about 3mm to ensure that the sealing element 70 does not flow beyond the wall 24 to reach other elements.

In some embodiments, the top surface 71 of the sealing element 70 may have a circular arc shape and is exposed to the computer heatsink 100 to increase the fixing property of the sealing element 70, thereby allowing the computer heatsink 100 to meet the waterproof specifications of IP6K9K and IP6K 8.

In summary, the present invention provides a computer water-cooling heat dissipation device, which includes a first housing, a second housing, a circuit board, and a sealing element. The second shell comprises a main body and a retaining wall. The main body and the first housing are arranged in a first direction. The retaining wall connecting main body is arranged with the first shell in a second direction, and the first direction is vertical to the second direction. The circuit board is arranged between the first shell and the second shell and used for arranging electronic elements. The sealing element is arranged between the first shell and the second shell, the first shell comprises a first surface facing the main body, a second surface back facing the main body and a third surface facing the retaining wall, and the sealing element is in contact with the third surface and is separated from the first surface. Therefore, the time spent in the process can be reduced, the development cost in the research and development can be saved, and the selective development process can be carried out to meet the requirements of various functions so as to reduce the research and development cost. Further, such a configuration may also allow for selection of verification requirements.

Although embodiments of the present invention and their advantages have been described above, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the utility model as defined by the appended claims. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification, but it is to be understood that any process, machine, manufacture, composition of matter, means, method and steps, presently existing or later to be developed, that will be obvious to one skilled in the art from this disclosure may be utilized according to the present application as substantially the same function or achieve substantially the same result as the corresponding embodiments described herein. Accordingly, the scope of the present application includes the processes, machines, manufacture, compositions of matter, means, methods, and steps described above. In addition, each claim constitutes an individual embodiment, and the scope of protection of the present invention also includes combinations of the respective claims and embodiments.

Claims (10)

1. A computer water-cooling heat dissipation device is characterized by comprising:

a first housing;

a second housing comprising:

a main body, arranged with the first housing in a first direction: and

a retaining wall connected with the main body and arranged with the first shell in a second direction, wherein the first direction is vertical to the second direction;

a circuit board arranged between the first shell and the second shell for arranging an electronic element; and

and a sealing element disposed between the first casing and the second casing, wherein the first casing includes a first surface facing the main body, a second surface facing away from the main body, and a third surface facing the retaining wall, and the sealing element contacts the third surface and is spaced apart from the first surface.

2. The water-cooled heat sink for computers as claimed in claim 1, wherein the second surface is spaced apart from the retaining wall, and the sealing member contacts the second surface.

3. The water-cooled heat sink for computers as claimed in claim 1, wherein the retaining wall is separated from the first housing by a gap.

4. The apparatus of claim 1, wherein the gap is between 0.3mm and 0.5 mm.

5. The water-cooled heat sink for computers as claimed in claim 1, wherein the second surface of the first housing defines a datum plane, and the retaining wall is higher than the datum plane.

6. The water-cooled heat sink for computers as claimed in claim 5, wherein the height of the retaining wall extending from the datum plane is greater than 3 mm.

7. The water-cooled heat sink for computers as claimed in claim 1, wherein the distance between the sealing member and the main body is different from the distance between the first housing and the main body in the first direction.

8. The apparatus of claim 1, further comprising a conductive element, wherein a groove is formed on a side of the second housing facing the first housing, and the conductive element is disposed in the groove and directly electrically connected to the first housing and the second housing.

9. The water-cooled heat sink for computers as claimed in claim 1, wherein the second housing is formed by die-casting so that the main body and the retaining wall are integrally formed.

10. The water-cooled heat sink for computers as claimed in claim 1, further comprising a fixing element disposed on the first housing and the second housing for fixing the relative positions of the first housing and the second housing, wherein the sealing element is spaced apart from the fixing element.

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