CN214381561U - Shock-resistant circuit board structure - Google Patents
Shock-resistant circuit board structure Download PDFInfo
- Publication number
- CN214381561U CN214381561U CN202120179388.1U CN202120179388U CN214381561U CN 214381561 U CN214381561 U CN 214381561U CN 202120179388 U CN202120179388 U CN 202120179388U CN 214381561 U CN214381561 U CN 214381561U
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- CN
- China
- Prior art keywords
- circuit board
- groove
- sides
- chip
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000035939 shock Effects 0.000 title description 5
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000012856 packing Methods 0.000 claims 1
- 230000003139 buffering effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model provides an antidetonation circuit board structure, which comprises a circuit board, circuit board upper end edge is equipped with first recess, second recess, third recess, first recess both sides all are equipped with a plurality of first pads, second recess both sides all are equipped with a plurality of second pads, third recess both sides all are equipped with a plurality of third pads, the circuit board middle part is equipped with the chip groove, chip groove both sides all are equipped with a plurality of fourth pads, chip tank bottom portion still is equipped with a plurality of running through the louvre of circuit board, four angles of circuit board all are equipped with the arc and dodge the groove, the arc dodges the inslot side and fills there is first rubber pad. The utility model discloses an antidetonation circuit board structure has excellent anti-seismic performance to set up a plurality of grooves that are used for equipment such as holding chip, power connector, whole thickness after can reducing the circuit board wiring.
Description
Technical Field
The utility model relates to a circuit board technical field, concretely relates to shock-resistant circuit board structure.
Background
Circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. The development of the circuit board has been over 100 years old, the design is mainly a layout design, and the circuit board has the main advantages of greatly reducing errors of wiring and assembly and improving the automation level and the production labor rate. The circuit board in the prior art generally has the problem of poor anti-seismic performance, so that the circuit board cracks; in addition, in the conventional circuit board structure, the chip module, the power module and the like are usually directly soldered on the circuit board, which is relatively thick, and the thinner devices such as mobile phones and notebook computers are not conducive to the thinning development of the devices, and the above-mentioned problems are urgently needed to be solved.
SUMMERY OF THE UTILITY MODEL
To above problem, the utility model provides an antidetonation circuit board structure has excellent anti-seismic performance to set up a plurality of grooves that are used for equipment such as holding chip, power connector, whole thickness after can reducing the circuit board wiring.
In order to achieve the above object, the present invention provides the following technical solutions:
the utility model provides an antidetonation circuit board structure, includes the circuit board, circuit board upper end edge is equipped with first recess, second recess, third recess, first recess both sides all are equipped with a plurality of first pads, second recess both sides all are equipped with a plurality of second pads, third recess both sides all are equipped with a plurality of third pads, the circuit board middle part is equipped with the chip groove, chip groove both sides all are equipped with a plurality of fourth pads, chip tank bottom portion still is equipped with a plurality of louvres that run through the circuit board, four angles of circuit board all are equipped with the arc and dodge the groove, the arc dodges the inslot side and fills there is first rubber pad.
Specifically, the thickness of the circuit board is 2-5 mm, and the depths of the first groove, the second groove, the third groove and the chip groove are 0.5-1 mm.
Specifically, the circuit board is provided with a mounting hole, and a second rubber pad is arranged on the inner wall of the mounting hole.
Specifically, the edge of the lower end of the circuit board is provided with a rectangular open slot.
Specifically, the edge of the right side of the circuit board is provided with a semicircular open slot, and the inner wall of the semicircular open slot is provided with an electromagnetic shielding pad.
The utility model has the advantages that:
the utility model discloses a circuit board structure all is equipped with the arc at four angles of circuit board and dodges the groove, and the arc is dodged the inslot side and is filled there is first rubber pad, and the circuit board installation back utilizes the elasticity of first rubber pad, can improve the anti-seismic performance of circuit board to offer the chip groove that is used for the holding chip, be used for holding power connector, signal connector's first recess, second recess, third recess, can reduce the whole thickness after the circuit board wiring.
Drawings
Fig. 1 is a schematic structural view of an anti-seismic circuit board structure of the present invention.
The reference signs are: the circuit board comprises a circuit board 1, a first groove 2, a second groove 3, a third groove 4, a first pad 5, a second pad 6, a third pad 7, a chip groove 8, a fourth pad 9, a heat dissipation hole 10, an arc avoidance groove 11, a first rubber pad 12, a mounting hole 13, a second rubber pad 14, a rectangular open groove 15, a semicircular open groove 16 and an electromagnetic shielding pad 17.
Detailed Description
The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.
Referring to FIG. 1:
an anti-seismic circuit board structure comprises a circuit board 1, wherein the front end face of the circuit board 1 is provided with a copper-plated circuit layer, the upper end edge of the circuit board 1 is provided with a first groove 2, a second groove 3 and a third groove 4, a plurality of first pads 5 are arranged on two sides of the first groove 2, a plurality of second pads 6 are arranged on two sides of the second groove 3, a plurality of third pads 7 are arranged on two sides of the third groove 4, a power connector can be accommodated in the first groove 2, a wiring terminal of the power connector is welded on the first pad 5 to realize the electrical connection between the power connector and the circuit board 1, a signal connector can be accommodated in the second groove 3, a wiring terminal of the power connector is welded on the second pad 6 to realize the electrical connection between the signal connector and the circuit board 1, a signal connector can be accommodated in the third groove 4, and a wiring terminal of the power connector is welded on the third pad 7, in order to realize the electrical connection between the signal connector and the circuit board 1, the middle part of the circuit board 1 is provided with a chip groove 8, both sides of the chip groove 8 are provided with a plurality of fourth bonding pads 9, a chip can be accommodated in the chip groove 8, and the wiring terminal of the chip is welded on the fourth bonding pads 9 to realize the electrical connection between the chip and the circuit board 1, the bottom of the chip groove 8 is also provided with a plurality of heat dissipation holes 10 penetrating through the circuit board 1, the heat generated during the working of the chip can be transferred to the outside through the heat dissipation holes 10 to improve the heat dissipation efficiency of the chip, four corners of the circuit board 1 are provided with arc avoiding grooves 11, the inner sides of the arc avoiding grooves 11 are filled with first rubber pads 12, when the circuit board 1 is installed, the circuit board 1 needs to be fixed in the equipment to be installed by using screws, the positions of the arc avoiding grooves 11 correspond to the positions of the screws, the first rubber pads 12 are added in the inner sides of the arc avoiding grooves 11, the first rubber pads 12 have excellent elastic buffering performance, the shock resistance of the circuit board 1 after installation can be improved.
Preferably, the thickness of the circuit board 1 is 2-5 mm, and the depths of the first groove 2, the second groove 3, the third groove 4 and the chip groove 8 are 0.5-1 mm.
Preferably, in order to prevent the circuit board 1 from loosening, the circuit board 1 is further provided with a mounting hole 13, the position of the circuit board 1 is fixed through the matching of the mounting hole 13 and a screw, the inner wall of the mounting hole 13 is provided with a second rubber pad 14, the second rubber pad 14 also has excellent elastic buffering performance, and the shock resistance of the circuit board 1 after being mounted can be improved.
Preferably, the edge of the lower end of the circuit board 1 is provided with a rectangular open slot 15, and parts such as a clamping slot and the like can be accommodated in the rectangular open slot 15.
Preferably, the edge of the right side of the circuit board 1 is provided with a semicircular open slot 16, the semicircular open slot 16 is used for accommodating the button cell, and in order to avoid mutual electromagnetic interference between the button cell and the circuit board, the inner wall of the semicircular open slot 16 is provided with an electromagnetic shielding pad 17.
The above embodiments only represent one embodiment of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (5)
1. An anti-seismic circuit board structure comprises a circuit board (1) and is characterized in that a first groove (2), a second groove (3) and a third groove (4) are arranged at the edge of the upper end of the circuit board (1), a plurality of first bonding pads (5) are arranged on both sides of the first groove (2), a plurality of second bonding pads (6) are arranged on both sides of the second groove (3), a plurality of third bonding pads (7) are arranged on both sides of the third groove (4), a chip groove (8) is arranged in the middle of the circuit board (1), a plurality of fourth bonding pads (9) are arranged on both sides of the chip groove (8), a plurality of heat dissipation holes (10) penetrating through the circuit board (1) are also arranged at the bottom of the chip groove (8), four angles of circuit board (1) all are equipped with the arc and dodge groove (11), the arc dodges groove (11) inboard packing and has first rubber pad (12).
2. An earthquake-resistant circuit board structure according to claim 1, characterized in that the thickness of the circuit board (1) is 2-5 mm, and the depth of the first groove (2), the second groove (3), the third groove (4) and the chip groove (8) is 0.5-1 mm.
3. An earthquake-resistant circuit board structure according to claim 1, characterized in that the circuit board (1) is provided with a mounting hole (13), and a second rubber pad (14) is arranged on the inner wall of the mounting hole (13).
4. An earthquake-resistant circuit-board structure according to claim 1, characterized in that the lower edge of the circuit board (1) is provided with a rectangular open slot (15).
5. An earthquake-resistant circuit board structure as claimed in claim 1, characterized in that the right side edge of the circuit board (1) is provided with a semicircular opening groove (16), and the inner wall of the semicircular opening groove (16) is provided with an electromagnetic shielding pad (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120179388.1U CN214381561U (en) | 2021-01-22 | 2021-01-22 | Shock-resistant circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120179388.1U CN214381561U (en) | 2021-01-22 | 2021-01-22 | Shock-resistant circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214381561U true CN214381561U (en) | 2021-10-08 |
Family
ID=77959256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120179388.1U Expired - Fee Related CN214381561U (en) | 2021-01-22 | 2021-01-22 | Shock-resistant circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214381561U (en) |
-
2021
- 2021-01-22 CN CN202120179388.1U patent/CN214381561U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211008 |