CN212786090U

CN212786090U - Novel wire circuit board for etching copper-clad aluminum wire

Info

Publication number: CN212786090U
Application number: CN201921418526.6U
Authority: CN
Inventors: 王定锋; 徐文红; 冉崇友; 徐磊; 琚生涛; 冷求章
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-08-24
Filing date: 2019-08-24
Publication date: 2021-03-23
Anticipated expiration: 2029-08-24

Abstract

The utility model relates to a novel lead circuit board for etching copper-clad aluminum wires, in particular to a lead circuit board which is characterized in that leads are arranged in parallel and covered on a base material with glue, a front cover film is drilled and then attached on the leads arranged in parallel to form a solder mask layer and an anti-etching layer, at the position where the circuit needs to be disconnected, the covering film is provided with a hole to expose the conducting wire for etching, etching-resistant ink is printed and dried at the position of a bonding pad and the position of a metal connecting point on the circuit to protect the bonding pad, the etching-resistant layer comprises two materials, in some locations the cover film is an etch resist, in some locations the ink is superimposed on the etch resist formed on the cover film layer, then the etching liquid etches the exposed copper-clad aluminum conductor to cut off the copper-clad aluminum conductor, and the alkaline de-inking liquid is used for removing the anti-etching ink, thus the novel conductor circuit board for etching the copper-clad aluminum conductor is manufactured.

Description

Novel wire circuit board for etching copper-clad aluminum wire

Technical Field

The utility model relates to a circuit board field, concretely relates to novel wire circuit board of etching copper clad aluminum wire.

Background

The utility model discloses a series of conductor board patents before people, for example: patent numbers: 201010232487.8, patent name: a single-sided circuit board manufactured by juxtaposing flat wires and a manufacturing method thereof are disclosed in the patent number: 201010232506.7, patent name: the method for manufacturing the single-sided circuit board by adopting the juxtaposed leads has the following patent numbers: 201010232506.7, patent name: the method comprises the following steps of respectively using insulating layers to simultaneously carry out hot pressing on two surfaces of a flat wire to manufacture a single-sided circuit board, wherein the method comprises the following steps: 201010232526.4, patent name: the single-sided circuit board is manufactured by bonding juxtaposed flat leads by using a thermosetting adhesive film, and the patent number is as follows: 201010232547.6, patent name: the method for manufacturing the single-sided circuit board by using the transshipment adhesive film and the juxtaposed flat wires adopts a mode of die cutting or drilling by a drilling machine to break the wires, and has the defects of high die opening cost and inflexible design due to the use of the die, difficulty in changing once the die opening is finished, high cost due to the adoption of a mode of heavy drilling for drilling, insufficient alignment precision and high defective scrap due to easy drilling deviation.

In order to overcome above defect and not enough, the utility model discloses a with the wire parallel arrangement cover close on the substrate of taking the glue, will open porose front cover membrane and paste the wire of parallel arrangement, some holes are the solder joint window, live the solder joint with anti-etching printing ink protection, another part hole is the window of wire disconnection department, expose the wire in the window, take the mode of etching to make the wire etching disconnection that will expose in the window, form the circuit, design flexibility like this, it is with low costs.

SUMMERY OF THE UTILITY MODEL

According to the utility model, a substrate layer with glue on the bottom surface is provided; a middle wire circuit layer; covering a solder mask layer on the front side; a break opening disposed on the intermediate conductor circuit layer conductor circuit; a bonding pad and a metal connection point on the wire; the method is characterized in that a plurality of disconnection openings which are completely disconnected from the middle are formed on all the leads or part of the leads of the lead circuit, the completely disconnected leads are copper-clad aluminum leads, the disconnection openings of the copper-clad aluminum leads which are disconnected from the middle display a near-sighted C-shaped structure on the section of the leads which is cut towards the longitudinal direction (the long direction), aluminum in the middle of the leads forms a recess, a hole is arranged on a front cover film at the disconnection opening of the copper-clad aluminum leads, the disconnection position of the leads is at the hole edge position of the hole of the front cover film, the disconnection surface of the leads and the edge surface of the hole of the cover film are on one section or close to one section, or the disconnection position of the leads is in the hole of the cover film, the leads at the disconnection position of the leads are exposed out of the hole of the cover film, the bonding pad is a bonding pad of a welding element, and is arranged on the two leads or, the metal connection point is a connection point used for being connected with a power supply circuit or a connection point used for being interconnected between circuit boards, a plurality of holes are arranged on the covering film, wherein a part of the holes are a bonding pad window and a metal connection point window, and a part of the holes are windows at the disconnected positions of the leads.

According to a preferred embodiment of the present invention, the novel conductor circuit board for etching copper-clad aluminum wires is characterized in that the cover film is a polyimide film with glue or a PET film with glue.

According to a preferred embodiment of the present invention, the novel conducting wire circuit board for etching copper-clad aluminum wires is characterized in that the substrate with glue is polyimide PI substrate with glue, or PET substrate, or epoxy glass fiber substrate, or phenolic aldehyde substrate, or ceramic substrate.

According to the utility model discloses a preferred embodiment, a novel wire circuit board of etching copper clad aluminum wire, its characterized in that, the wire of intermediate conductor circuit layer all be copper clad aluminum wire, or partly be copper clad aluminum wire partly be the copper line, the complete etching disconnection only copper clad aluminum wire.

According to the preferred embodiment of the present invention, the novel conducting wire circuit board for etching copper-clad aluminum wire is characterized in that the insulation ink is printed at the cut-off position of the etched copper-clad aluminum wire, so that the cut-off port forms insulation protection.

According to a preferred embodiment of the present invention, the novel conductor circuit board for etching copper-clad aluminum wires is characterized in that a metal plate with glue can be pasted on the back of the conductor circuit board.

The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.

Drawings

The features, objects, and advantages of the present invention will become more apparent from the reading of the specification in conjunction with the following drawings, a brief description of which follows.

Fig. 1 is a schematic plan view of a tape base material with wires arranged in parallel.

Fig. 2 is a schematic plan view of the front cover film.

Fig. 3 is a schematic plan view of the front cover film attached to the wires in alignment.

Fig. 4 is a schematic plan view of the solder joint window after printing resist ink thereon.

FIG. 5 is a schematic cross-sectional view of a copper-clad aluminum wire at an etching break, a break surface of the copper-clad aluminum wire and an edge surface of a covering film hole on a cross section.

Fig. 6 is a schematic cross-sectional view of the copper-clad aluminum wire at the etching break, the break position of the copper-clad aluminum wire in the hole of the cover film, and the lead at the break position of the lead exposed from the hole of the cover film.

Fig. 7 is a schematic cross-sectional view of applying insulating ink to the cut-off portion after copper clad aluminum wire etching to form insulation protection at the cut-off portion.

FIG. 8 is a schematic plan view of a novel conductor circuit board made of etched copper-clad aluminum wires.

Detailed Description

The present invention will be described in detail below by taking preferred embodiments as examples.

It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.

A plurality of coils of copper-clad aluminum conductors 2 are placed on a pay-off rack of a wire covering machine, and are positioned and distributed through a spacing rod mould arranged on the wire covering machine to be covered and adhered with a PI substrate 1 with glue at the bottom layer (as shown in figure 1).

The PI film is punched with solder joint windows 3.1, 3.2, 3.3, 3.4 and windows 3.5, 3.6 at the positions where the wires need to be cut off by using a designed and manufactured die to manufacture a front cover film 3 (as shown in fig. 2).

The front cover film 3 is oppositely mounted on the copper-clad aluminum conductor 2, the copper-clad aluminum conductor 2 is exposed from the punched windows 3.1, 3.2, 3.3 and 3.4 of the front cover film 3 to form welding spots 3.1a, 3.2a, 3.3a and 3.4a, meanwhile, the copper-clad aluminum conductor 2 is also exposed from the punched windows 3.5 and 3.6 of the front cover film 3 (as shown in figure 3), hot pressing is carried out at 180 ℃ for 60 seconds under the pressure of 150kg, so that the front cover film 3, the copper-clad aluminum conductor 2 and the PI base material 1 with glue at the bottom layer are firmly bonded together, and baking and curing are carried out in an oven at the temperature of 150 ℃ for 60 minutes.

Printing a layer of anti-corrosion ink 3.1a, 3.2a, 3.3a and 3.4a on a screen printing machine by using a silk screen manufactured according to design data to respectively protect welding spots (as shown in figure 4) by using anti-corrosion ink 3.1b, 3.2b, 3.3b and 3.4b, drying after printing, and then etching and removing the copper-clad aluminum conductor 2 exposed at the windows 3.5 and 3.6 at an etching section on an etching film removing production line by using an aqueous solution mainly containing hydrochloric acid, copper dichloride and aluminum trichloride as an etching solution to form a circuit, wherein the aluminum etching speed in the aluminum conductor 2 is higher than that of copper, so that the section of the conductor cut towards the longitudinal direction at the section position after etching disconnection forms a short-sight C-shaped structure 2.1, aluminum in the middle of the copper-clad aluminum conductor forms a recess, and the copper-clad aluminum conductor 2 is at the section position, the section position where the aluminum conductor is disconnected by etching, the cover film 2 and the edge of the window 3.5 or the window 3.6 of the die-cut 3 are shown in a section (as shown in figure 5) Or, the copper-clad aluminum wire 2 is in the etched broken position, the broken surface of the copper-clad aluminum wire 2 and the hole of the window 3.5 or 3.6 punched by the cover film 3, the copper-clad aluminum wire 2 at the broken position is exposed from the window 3.5 or/and 3.6 (as shown in fig. 6), the anti-etching line ink 3.1b, 3.2b, 3.3b, 3.4b printed on the welding spots 3.1a, 3.2a, 3.3a, 3.4a is removed by using caustic soda aqueous solution at the film removing section, then the insulating ink 4 is printed at the broken position after the copper-clad aluminum wire is etched, so that the broken opening forms insulating protection (as shown in fig. 7), and then the conducting wire circuit board is manufactured through the processes of silk-screen printing characters, OSP surface antioxidation treatment, molding, FQC inspection, packaging and the like (as shown in fig. 8).

Alternatively, a metal plate with adhesive can be attached to the back of the lead circuit board.

The present invention has been described in detail with reference to the accompanying drawings, which illustrate a specific embodiment of a novel conductor circuit board for etching copper-clad aluminum wires. It will be understood by those skilled in the art, however, that the foregoing is illustrative and descriptive of some specific embodiments only, and not limiting as to the scope of the invention, and particularly the scope of the claims.

Claims

1. A novel wire circuit board for etching copper-clad aluminum wires comprises:

a base material layer with glue on the bottom surface;

a middle wire circuit layer;

covering a solder mask layer on the front side;

a break opening disposed on the intermediate conductor circuit layer conductor circuit;

a bonding pad and a metal connection point on the wire;

the method is characterized in that a plurality of disconnection openings which are completely disconnected from the middle are formed on all wires or part of the wires of the wire circuit, the completely disconnected wires are copper-clad aluminum wires, the disconnection openings of the copper-clad aluminum wires which are disconnected from the middle are formed on the wires, the cross section of the wires which are longitudinally cut shows a near-sighted C-shaped structure, aluminum in the middle of the wires forms a recess, the disconnection openings of the copper-clad aluminum wires in the middle are formed, holes are formed in the front cover film, the positions where the wires are disconnected are located at the hole edge positions of the holes of the front cover film, the disconnection surfaces of the wires and the edge surfaces of the holes of the cover film are located on one cross section or close to one cross section, or the disconnection positions of the wires are located in the holes of the cover film, the wires at the disconnection positions of the wires are exposed from the holes of the cover film, the bonding pad is a bonding pad of a welding element, is arranged on the two wires or arranged on two, Or the connection point is used for interconnection between circuit boards, a plurality of holes are arranged on the covering film, wherein a part of the holes are pad windows and metal connection point windows, and a part of the holes are windows at the disconnected positions of the wires.

2. The novel conducting wire circuit board for etching copper-clad aluminum wires as claimed in claim 1, wherein the cover film is a polyimide film with glue or a PET film with glue.

3. The novel conducting wire circuit board for etching copper-clad aluminum wires as claimed in claim 1, wherein the substrate with glue is polyimide PI substrate with glue, or PET substrate, or epoxy glass fiber substrate, or phenolic aldehyde substrate, or ceramic substrate.

4. The novel conducting wire circuit board for etching copper-clad aluminum wires as claimed in claim 1, wherein the conducting wires of the middle conducting wire circuit layer are all copper-clad aluminum wires, or a part of the conducting wires are copper-clad aluminum wires and a part of the conducting wires are copper wires, and only the copper-clad aluminum wires are completely etched and disconnected.

5. The novel conducting wire circuit board for etching copper-clad aluminum wires as claimed in claim 1, wherein insulating ink can be printed at the cut-off position of the etched copper-clad aluminum wires to form insulation protection at the cut-off position.

6. The novel conducting wire circuit board for etching copper-clad aluminum wires as claimed in claim 1, wherein a metal plate with glue is pasted on the back surface of the conducting wire circuit board.