JPH0143916Y2 - - Google Patents

Info

Publication number
JPH0143916Y2
JPH0143916Y2 JP1983198873U JP19887383U JPH0143916Y2 JP H0143916 Y2 JPH0143916 Y2 JP H0143916Y2 JP 1983198873 U JP1983198873 U JP 1983198873U JP 19887383 U JP19887383 U JP 19887383U JP H0143916 Y2 JPH0143916 Y2 JP H0143916Y2
Authority
JP
Japan
Prior art keywords
shield plate
convex portion
circuit board
printed circuit
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983198873U
Other languages
Japanese (ja)
Other versions
JPS60109389U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19887383U priority Critical patent/JPS60109389U/en
Publication of JPS60109389U publication Critical patent/JPS60109389U/en
Application granted granted Critical
Publication of JPH0143916Y2 publication Critical patent/JPH0143916Y2/ja
Granted legal-status Critical Current

Links

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  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

【考案の詳細な説明】 〔考案の利用分野〕 本考案は、テレビチユーナなどの高周波機器に
用いられるシールド板付プリント基板構造体に関
する。
[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a printed circuit board structure with a shield plate used in high frequency equipment such as a television tuner.

〔考案の背景〕[Background of the idea]

第1図乃至第5図は従来のシールド板付プリン
ト基板構造体の取付構造を示すもので、第1図
は、シールド板1を取り付けたプリント基板2を
筐体3に収納する際の斜視図である。第1図にお
いて、シールド板1の下方先端部には凸部4が形
成してあり、プリント基板2の上面の部品搭載面
5にはコンデンサやコイル等の電子部品6が搭載
してある。該プリント基板2の下面は半田付面7
になつていて、前記シールド板1をプリント基板
2に取り付ける際には、一般に、部品搭載面5上
に配置挿入された電子部品6と、凸部4をプリン
ト基板2の下方へ突出させたシールド板1とを一
緒にデイツプし、該半田付面7にて電子部品6お
よびシールド板1の半田付けを同時に行う。そし
て、筐体3の底面にはシールド板1の凸部4より
も若干口径の広い透孔8が設けてあり、図の矢印
A方向より凸部4を該透孔8に挿通し、筐体3内
にプリント基板2を収納する。
1 to 5 show the mounting structure of a conventional printed circuit board structure with a shield plate, and FIG. 1 is a perspective view when the printed circuit board 2 with the shield plate 1 attached is housed in the casing 3. be. In FIG. 1, a convex portion 4 is formed at the lower tip of a shield plate 1, and an electronic component 6 such as a capacitor or a coil is mounted on a component mounting surface 5 on the upper surface of a printed circuit board 2. The lower surface of the printed circuit board 2 is the soldering surface 7
When the shield plate 1 is attached to the printed circuit board 2, the electronic components 6 are arranged and inserted on the component mounting surface 5, and the shield plate 1 is attached with the convex portion 4 projecting downward from the printed circuit board 2. The electronic component 6 and the shield plate 1 are simultaneously soldered on the soldering surface 7. A through hole 8 having a diameter slightly wider than the convex part 4 of the shield plate 1 is provided on the bottom surface of the casing 3. The convex part 4 is inserted into the through hole 8 from the direction of arrow A in the figure, and the casing is The printed circuit board 2 is housed in the inside.

しかしながら、従来例では凸部4の先端が平坦
面になつているため、第2図の要部正面図および
第3図の要部側面図に示す如く、前記デイツプ半
田付け時に凸部4の先端部に半田9が溜りやす
く、このため透孔8への挿入に困難を来し、場合
によつては半田を除去しなければならないことも
あつた。
However, in the conventional example, since the tip of the convex part 4 is a flat surface, as shown in the front view of the main part in FIG. 2 and the side view of the main part in FIG. Solder 9 tends to accumulate in the parts, which makes it difficult to insert into the through hole 8, and in some cases, the solder has to be removed.

また、透孔8に挿通した凸部4は、第4図の要
部正面図および第5図の要部側面図に示す如く、
下方よりデイツプ半田付けもしくは手半田付けを
行つて筐体3に固定するが、前述の如く凸部4と
透孔8との間にはクリアランスがあるので、該デ
イツプ半田付け時の浮き防止もしくは該手半田付
け時の脱落防止のため、凸部4の筐体3より突き
出た部分を折り曲げて仮固定する必要があつた。
さらに、第4図および第5図に示す如く、前述し
たクリアランスがあるため凸部4に付着する半田
9の量が不十分となり、場合によつては後工程で
修正半田付けが必要となつた。
Further, the convex portion 4 inserted into the through hole 8 is as shown in the front view of the main part in FIG. 4 and the side view of the main part in FIG.
It is fixed to the casing 3 by dip soldering or manual soldering from below, but as mentioned above, there is a clearance between the protrusion 4 and the through hole 8, so it is necessary to prevent the dip from floating or to prevent it from floating when soldering the dip. In order to prevent it from falling off during manual soldering, it was necessary to bend and temporarily fix the part of the convex part 4 that protruded from the housing 3.
Furthermore, as shown in FIGS. 4 and 5, due to the above-mentioned clearance, the amount of solder 9 adhering to the convex portion 4 was insufficient, and in some cases, corrective soldering was required in a subsequent process. .

〔考案の目的〕[Purpose of invention]

本考案はかかる従来の欠点を解消しようとする
もので、その目的とするところは、プリント基板
に半田付けされたシールド板の筐体への取り付け
が容易かつ確実なシールド板付プリント基板構造
体を提供するにある。
The present invention attempts to eliminate such conventional drawbacks, and its purpose is to provide a printed circuit board structure with a shield plate in which the shield plate soldered to the printed circuit board can be easily and securely attached to the housing. There is something to do.

〔考案の概要〕[Summary of the idea]

この目的を達成するために、本考案は、シール
ド板の凸部を上部(基部)が筐体の透孔より幾分
幅広で下部(先端)に向けて次第に幅狭となる先
細り形状に形成するとともに、該凸部に下方を臨
む切欠きを設けたことを特徴とする。
In order to achieve this objective, the present invention forms the convex part of the shield plate into a tapered shape that is slightly wider at the upper part (base) than the through hole of the housing and gradually becomes narrower towards the lower part (tip). The present invention is also characterized in that the convex portion is provided with a notch that faces downward.

〔考案の実施例〕[Example of idea]

以下、本考案の実施例を図面に基づいて説明す
る。
Hereinafter, embodiments of the present invention will be described based on the drawings.

第6図乃至第10図は本考案のシールド板付プ
リント基板構造体の一実施例を示すもので、従来
例について説明した第1図乃至第5図と対応する
部分には同一の符号をつけている。
Figures 6 to 10 show an embodiment of the printed circuit board structure with a shield plate of the present invention, and parts corresponding to those in Figures 1 to 5 describing the conventional example are given the same reference numerals. There is.

第6図は、シールド板1を取り付けたプリント
基板2を筐体3に収納する際の斜視図であり、該
シールド板1の下方先端部に形成してある凸部4
の形状に特徴がある。すなわち、該凸部4は先細
りになつていて、下方を臨む鋭角三角形状の切欠
き4aが設けてあり、該切欠き4aを挟む凸部4
の2つの先端4bは鋭く尖つている。そして、凸
部4の幅は、上部では筐体3の透孔8の幅よりも
広くなつているが、先端4bに近付くにつれて先
細りになつているため下部では透孔8の幅よりも
狭くなつている。かかる凸部4をプリント基板2
の下面の半田付面7より突出させた状態にした
後、シールド板1を、部品搭載面5上に配置挿入
された電子部品6とともにデイツプし、該半田付
面7にてシールド板1および電子部品6を半田付
けする。そして、シールド板1の前記凸部4を、
図の矢印A方向より筐体3の透孔8に挿入する。
FIG. 6 is a perspective view of the printed circuit board 2 to which the shield plate 1 is attached when it is housed in the housing 3.
It is characterized by its shape. That is, the convex portion 4 is tapered and has an acute triangular notch 4a facing downward, and the convex portion 4 sandwiching the notch 4a
The two tips 4b of are sharply pointed. The width of the convex portion 4 is wider than the width of the through hole 8 of the housing 3 at the upper part, but it becomes narrower than the width of the through hole 8 at the lower part because it tapers as it approaches the tip 4b. ing. The convex portion 4 is connected to the printed circuit board 2.
After making the shield plate 1 protrude from the lower soldering surface 7, the shield plate 1 is dipped together with the electronic component 6 placed and inserted on the component mounting surface 5, and the shield plate 1 and the electronic component are placed on the soldering surface 7. Solder component 6. Then, the convex portion 4 of the shield plate 1 is
Insert into the through hole 8 of the housing 3 from the direction of arrow A in the figure.

このとき、凸部4には切欠き4aが設けてあつ
て先端4bが先鋭になつているため、第7図の要
部正面図および第8図の要部側面図に示す如く、
前述したデイツプ半田付け時に凸部4の先端部に
付着する半田9の量は微量である。したがつて、
凸部4は透孔8に容易に挿入することができる。
At this time, since the protrusion 4 is provided with a notch 4a and the tip 4b is sharp, as shown in the front view of the main part in FIG. 7 and the side view of the main part in FIG.
The amount of solder 9 that adheres to the tip of the convex portion 4 during the dip soldering described above is very small. Therefore,
The protrusion 4 can be easily inserted into the through hole 8.

また、凸部4は先細りになつており、かつ凸部
4の切欠き4aを挟んで対向している部分には若
干の弾性力が生じるため、透孔8に挿入する凸部
4は該透孔8と強嵌合することになり、おのずか
ら仮固定がなされる。したがつて、透孔8に挿通
した凸部4を下方より筐体3に半田付けする際
に、特別に仮固定を施す必要はない。さらに、こ
のとき、第9図の要部正要図および第10図の要
部側面図に示す如く、半田9は凸部4の切欠き4
aにも流れ込んで付着するため、半田量は十分と
なり安定した保持力が得られる。
Further, the convex portion 4 is tapered, and some elastic force is generated in the portions of the convex portion 4 facing each other across the notch 4a, so that the convex portion 4 inserted into the through hole 8 is This results in a strong fit with the hole 8, and temporary fixation is automatically performed. Therefore, when soldering the convex portion 4 inserted into the through hole 8 to the housing 3 from below, there is no need for special temporary fixing. Furthermore, at this time, the solder 9 is applied to the notch 4 of the convex portion 4, as shown in the schematic view of the main part in FIG. 9 and the side view of the main part in FIG.
Since the solder also flows into and adheres to a, the amount of solder is sufficient and a stable holding force can be obtained.

〔考案の効果〕[Effect of idea]

以上説明したように、本考案によれば、プリン
ト基板に半田付けしたシールド板の凸部を筐体の
透孔に容易に挿入することができ、しかも、該凸
部を筐体に半田付けする際に特別な仮固定が不要
となるとともに半田付着量が増加して保持力が向
上する。
As explained above, according to the present invention, the protrusion of the shield plate soldered to the printed circuit board can be easily inserted into the through hole of the casing, and the protrusion is soldered to the casing. At the same time, special temporary fixing is not required, and the amount of solder adhesion increases, resulting in improved holding power.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図乃至第5図は従来例を示すもので、第1
図はシールド板を取り付けたプリント基板を筐体
に収納する際の斜視図、第2図は筐体の透孔に挿
入するシールド板の凸部の正面図、第3図は第2
図の側面図、第4図は筐体に半田付けされたシー
ルド板の凸部の正面図、第5図は第4図の側面
図、第6図乃至第10図は本考案の一実施例を示
すもので、第6図はシールド板を取り付けたプリ
ント基板を筐体に収納する際の斜視図、第7図は
筐体の透孔に挿入するシールド板の凸部の正面
図、第8図は第7図の側面図、第9図は筐体に半
田付けされたシールド板の凸部の正面図、第10
図は第9図の側面図である。 1……シールド板、2……プリント基板、3…
…筐体、4……凸部、4a……切欠き、4b……
凸部先端、7……半田付面、8……透孔、9……
半田。
Figures 1 to 5 show conventional examples.
The figure is a perspective view of the printed circuit board with the shield plate attached when it is stored in the housing, Figure 2 is a front view of the convex part of the shield plate inserted into the through hole of the housing, and Figure 3 is the second
4 is a front view of the convex portion of the shield plate soldered to the housing, FIG. 5 is a side view of FIG. 4, and FIGS. 6 to 10 are one embodiment of the present invention. Figure 6 is a perspective view of the printed circuit board with the shield plate attached when it is stored in the housing, Figure 7 is a front view of the protrusion of the shield plate inserted into the through hole of the housing, and Figure 8 is a perspective view of the printed circuit board with the shield plate attached. The figure is a side view of Figure 7, Figure 9 is a front view of the convex part of the shield plate soldered to the housing, and Figure 10 is a side view of Figure 7.
The figure is a side view of FIG. 9. 1... Shield plate, 2... Printed circuit board, 3...
...Housing, 4...Protrusion, 4a...Notch, 4b...
Convex tip, 7...Soldering surface, 8...Through hole, 9...
solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 下方先端部に凸部を設けたシールド板と、下面
の半田付面より前記凸部を突出させて該半田付面
にて前記シールド板を半田付けするプリント基板
と、底面に前記凸部を挿通する透孔を設けて該凸
部を下方より半田付けし前記プリント基板を収納
する筐体とを備えたものにおいて、前記凸部をそ
の突出基部が前記透孔より幾分幅広で先端に向け
て次第に幅狭となる先細り形状に形成するととも
に、該凸部に下方を臨む切欠きを設けたことを特
徴とするシールド板付プリント基板構造体。
A shield plate having a convex portion at its lower tip, a printed circuit board with the convex portion protruding from a soldering surface on the lower surface and the shield plate being soldered on the soldering surface, and the convex portion being inserted through the bottom surface. and a casing for housing the printed circuit board, the protrusion being soldered from below, and the protruding base of the protrusion being somewhat wider than the through-hole and directed toward the tip. 1. A printed circuit board structure with a shield plate, characterized in that the shield plate is formed into a tapered shape that gradually becomes narrower, and the convex portion is provided with a notch facing downward.
JP19887383U 1983-12-27 1983-12-27 Printed circuit board structure with shield plate Granted JPS60109389U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19887383U JPS60109389U (en) 1983-12-27 1983-12-27 Printed circuit board structure with shield plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19887383U JPS60109389U (en) 1983-12-27 1983-12-27 Printed circuit board structure with shield plate

Publications (2)

Publication Number Publication Date
JPS60109389U JPS60109389U (en) 1985-07-25
JPH0143916Y2 true JPH0143916Y2 (en) 1989-12-19

Family

ID=30758270

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19887383U Granted JPS60109389U (en) 1983-12-27 1983-12-27 Printed circuit board structure with shield plate

Country Status (1)

Country Link
JP (1) JPS60109389U (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50136758U (en) * 1974-04-25 1975-11-11

Also Published As

Publication number Publication date
JPS60109389U (en) 1985-07-25

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