JPH04312782A - Connector attaching method - Google Patents
Connector attaching methodInfo
- Publication number
- JPH04312782A JPH04312782A JP3106880A JP10688091A JPH04312782A JP H04312782 A JPH04312782 A JP H04312782A JP 3106880 A JP3106880 A JP 3106880A JP 10688091 A JP10688091 A JP 10688091A JP H04312782 A JPH04312782 A JP H04312782A
- Authority
- JP
- Japan
- Prior art keywords
- connector
- frame
- case
- circuit board
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 229920003002 synthetic resin Polymers 0.000 claims description 8
- 239000000057 synthetic resin Substances 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000002791 soaking Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract 2
- 238000007598 dipping method Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 2
- -1 polybutylene terephthalate Polymers 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】この発明は、チューナ等の高周波
機器におけるシールドケースのフレームにコネクターを
取付ける方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of attaching a connector to a frame of a shield case in high frequency equipment such as a tuner.
【０００２】0002
【従来の技術】図３はチューナ等の高周波機器に用いら
れている従来のコネクター１を示しており、外周面に雄
ねじ２を設けた金属ケース３の内部に絶縁性の合成樹脂
を用いて形成したホルダー４を組込み、このホルダー４
の内部に端子５を収納した構造になっている。[Prior Art] Figure 3 shows a conventional connector 1 used in high frequency equipment such as tuners, which is formed using an insulating synthetic resin inside a metal case 3 with a male thread 2 on the outer circumferential surface. Incorporate the holder 4 that was
It has a structure in which the terminal 5 is housed inside.
【０００３】図４は上記コネクター１をチューナ等の高
周波機器におけるシールドケースのフレーム６に取付け
る従来の取付構造を示しており、フレーム６に設けた取
付孔７に外面側からケース３の端部を挿入し、ホルダー
４から突出する端子５を下向きに屈曲させ、フレーム６
の内部に組込んだ回路基板８に上記端子５を挿入すると
共に、フレーム６の内面側に突出するケース３の端部に
カシメ加工を施し、このカシメ部９と台座部１０でフレ
ーム６を挟むことにより、フレーム６にコネクター１を
固定化するようになっている。FIG. 4 shows a conventional mounting structure in which the connector 1 is mounted on a frame 6 of a shield case in a high frequency device such as a tuner. The terminal 5 protruding from the holder 4 is bent downward, and the frame 6 is inserted.
The terminal 5 is inserted into the circuit board 8 incorporated inside the frame 6, and the end of the case 3 protruding from the inner surface of the frame 6 is caulked, and the frame 6 is sandwiched between the caulked portion 9 and the pedestal portion 10. By this, the connector 1 is fixed to the frame 6.
【０００４】なお、端子５と回路基板８のパターン及び
実装電子部品とパターンの接続は、図４のように溶融半
田Ａへの浸漬によって一括半田ディップされる。[0004] The connections between the terminals 5 and the circuit board 8 patterns and the mounted electronic components and the patterns are collectively soldered dipped by dipping into molten solder A as shown in FIG.
【０００５】[0005]
【発明が解決しようとする課題】ところで、従来のコネ
クター１は内部のホルダー４が合成樹脂製であるため、
耐熱性に劣り、フレーム６に対する取付け位置は半田デ
ィップ時の溶融半田Ａに接近しないように設定しなけれ
ばならず、このため、フレーム６の高さ寸法（Ｈ）が高
くなり、高周波機器が大型化するという問題がある。[Problems to be Solved by the Invention] By the way, since the internal holder 4 of the conventional connector 1 is made of synthetic resin,
It has poor heat resistance, and the mounting position relative to the frame 6 must be set so as not to approach the molten solder A during solder dipping.As a result, the height dimension (H) of the frame 6 increases, making the high-frequency equipment large. There is a problem of becoming
【０００６】また、フレーム６に対してコネクター１は
カシメ固定されるが、フレーム６とコネクター１のケー
ス３は、材質が異なるため熱膨張率も相違し、このため
、半田ディップ時の熱によりフレーム６に対するコネク
ター１の取付け部にガタツキが発生するという問題があ
る。Furthermore, although the connector 1 is fixed to the frame 6 by caulking, the frame 6 and the case 3 of the connector 1 are made of different materials and have different coefficients of thermal expansion. There is a problem in that rattling occurs at the attachment part of the connector 1 to the connector 6.
【０００７】そこでこの発明は、上記のような問題点を
解決するため、フレームの高さ寸法を小さくして高周波
機器の小型化を実現できると共に、フレームに対してコ
ネクターを強固に固定することができるコネクターの取
付方法を提供することを目的とする。[0007] In order to solve the above-mentioned problems, the present invention makes it possible to downsize high-frequency equipment by reducing the height of the frame, and also makes it possible to firmly fix the connector to the frame. The purpose is to provide a method for attaching connectors that is possible.
【０００８】[0008]
【課題を解決するための手段】上記のような課題を解決
するため、この発明は、少なくとも外周面が易半田付性
を有するケースの内部に耐熱性と絶縁性を有する合成樹
脂を用いたホルダーを組込み、このホルダー内に端子を
収納してコネクターを形成し、このコネクターをフレー
ムの取付孔に挿入した状態でケースをフレームにカシメ
固定し、フレームの内部に収納した回路基板の少なくと
もコネクター取付け部に近接する側縁とフレーム間に隙
間を形成し、前記フレームに対するコネクターのケース
取付け位置をケース取付け部分の下部が隙間から回路基
板の下面に臨むように設定し、前記フレームに対するコ
ネクターのケース取付け部分の周囲を溶融半田への浸漬
による半田の吸上げによって半田付けするようにした方
法を採用したものである。[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention provides a holder in which a heat-resistant and insulating synthetic resin is used inside a case that has at least an outer peripheral surface that is easy to solder. , the terminals are housed in this holder to form a connector, the case is caulked and fixed to the frame with the connector inserted into the frame's mounting hole, and at least the connector mounting part of the circuit board housed inside the frame is assembled. A gap is formed between the side edge adjacent to the frame and the frame, and the case mounting position of the connector to the frame is set so that the lower part of the case mounting part faces the bottom surface of the circuit board through the gap, and the case mounting part of the connector to the frame is This method employs a method in which the surrounding area is immersed in molten solder and the solder is sucked up to perform soldering.
【０００９】[0009]
【作用】コネクターは内部のホルダーが耐熱性の合成樹
脂を用いて形成されているため耐熱性が向上し、回路基
板の半田ディップ時に下部が溶融半田に浸漬するようフ
レームに対する取付け位置を設定でき、これによってフ
レームの高さ寸法を小さくできると共に、回路基板とフ
レームの間に隙間があるため、溶融半田への浸漬時にコ
ネクター取付け部分の下部を半田に浸漬させることがで
き、毛管現象でコネクター取付け部分の周囲に半田を吸
上げて半田付け固定が行なわれる。[Function] The internal holder of the connector is made of heat-resistant synthetic resin, which improves heat resistance, and the mounting position relative to the frame can be set so that the lower part is immersed in molten solder when soldering the circuit board. This allows the height of the frame to be reduced, and since there is a gap between the circuit board and the frame, the lower part of the connector mounting part can be immersed in the solder when immersed in molten solder, and the connector mounting part can be immersed in the solder by capillary action. Solder is sucked up around the area and soldering is performed.
【００１０】0010
【実施例】以下、この発明の実施例を添付図面の図１と
図２に基づいて説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the present invention will be described below with reference to FIGS. 1 and 2 of the accompanying drawings.
【００１１】図１に示すように、コネクター１１は、金
属性ケース１３の内部にホルダー１４を組込み、このホ
ルダー１４の内部に端子１５を収納して形成され、ケー
ス１３は外周面に雄ねじ１２が設けられ、少なくとも外
周面が易半田付け性を有している。As shown in FIG. 1, the connector 11 is formed by incorporating a holder 14 inside a metal case 13 and storing a terminal 15 inside the holder 14. The case 13 has a male screw 12 on its outer circumferential surface. At least the outer peripheral surface thereof has easy solderability.
【００１２】上記ケース１３は全体を易半田付け性の金
属製材料で形成してもよいが、金属製ケースの外周面に
銀メッキや半田メッキを施して易半田付け性を付与して
もよい。The entire case 13 may be made of a metal material that is easily soldered, but the outer peripheral surface of the metal case may be plated with silver or solder to impart easy solderability. .
【００１３】また、ケース１３内に組込むホルダー１４
は、ガラス繊維等をブレンドして補強された高耐熱性及
び絶縁性の合成樹脂を用いて形成され、このような合成
樹脂としてはポリフェニレンサルファイド、ポリブチレ
ンテレフタレート、ポリエチレンテレフタレート等を例
示することができ、これによってコネクター１１の耐熱
性が向上する。[0013] Furthermore, a holder 14 to be incorporated into the case 13 is provided.
is formed using a highly heat-resistant and insulating synthetic resin reinforced by blending glass fiber, etc. Examples of such synthetic resin include polyphenylene sulfide, polybutylene terephthalate, and polyethylene terephthalate. This improves the heat resistance of the connector 11.
【００１４】上記コネクター１１を取付けるシールドケ
ースのフレーム１６にはケース１３の先端部を外面側か
ら挿入する取付孔１７が設けられ、ケース１３の先端部
をフレーム１６の内面側でカシメ加工することにより、
フレーム１６をカシメ部１９と台座部２０で両側から挟
み、フレーム１６にコネクター１１を仮固定するように
なっている。The frame 16 of the shield case to which the connector 11 is attached is provided with a mounting hole 17 into which the tip of the case 13 is inserted from the outside. ,
The connector 11 is temporarily fixed to the frame 16 by sandwiching the frame 16 between the caulking part 19 and the pedestal part 20 from both sides.
【００１５】前記フレーム１６の内部に組込んでコネク
ター１１の端子１５とパターンを接続する回路基板１８
は、コネクター取付け部に近接する側縁に切欠き２１を
設け、フレーム１６の内面との間に隙間を形成している
。A circuit board 18 that is assembled inside the frame 16 and connects the terminals 15 of the connector 11 and the pattern.
A notch 21 is provided on the side edge close to the connector mounting portion, and a gap is formed between the cutout 21 and the inner surface of the frame 16.
【００１６】上記切欠き２１の形成により、コネクター
取付け部の下部を切欠き内に納め、回路基板１８の下面
に臨むように、フレーム１６に対するコネクター１１の
取付け位置を設定している。By forming the notch 21, the mounting position of the connector 11 with respect to the frame 16 is set so that the lower part of the connector mounting portion is accommodated in the notch and faces the lower surface of the circuit board 18.
【００１７】なお、回路基板１８とフレーム１６の内面
に形成する隙間は図２に示した切欠き２１だけでなく、
回路基板１８の側縁全長をフレーム１６の内側に間隙を
もって位置させ、隙間を回路基板１８の全長にわたって
形成するようにしてもよい。Note that the gap formed between the circuit board 18 and the inner surface of the frame 16 is not limited to the notch 21 shown in FIG.
The entire length of the side edge of the circuit board 18 may be located inside the frame 16 with a gap, and the gap may be formed over the entire length of the circuit board 18.
【００１８】また、コネクター１１におけるケース１３
の雄ねじ１２部分は耐熱性のキャップ２２を着脱自在に
取付けたり、後で除去できるようなワックス等の耐熱性
マスキング等を施し、半田ディップ時に溶融半田が付着
するのを防止している。[0018] Furthermore, the case 13 in the connector 11
A heat-resistant cap 22 is removably attached to the male thread 12 portion, and a heat-resistant masking such as wax that can be removed later is applied to prevent molten solder from adhering during solder dipping.
【００１９】次に、フレームに対するコネクターの取付
け方法を説明する。Next, a method of attaching the connector to the frame will be explained.
【００２０】フレーム１６に設けた取付け孔１７にコネ
クター１１のケース１３の先端を外面側から挿入し、フ
レーム１６の内面側に突出するケース１３の先端にカシ
メ加工を施し、カシメ部１９と台座部２０でフレーム１
６を挟み、フレーム１６にコネクター１１を仮固定する
。The tip of the case 13 of the connector 11 is inserted from the outside into the mounting hole 17 provided in the frame 16, and the tip of the case 13 protruding toward the inside of the frame 16 is caulked, and the caulked portion 19 and the pedestal are connected. Frame 1 at 20
6 and temporarily fix the connector 11 to the frame 16.
【００２１】次に、フレーム１６の内側に下部から回路
基板１８を組込み、端子１５を回路基板１８に挿入すれ
ば、回路基板１８の切欠き２１がコネクター取付け部分
に臨み、フレーム１６との間に隙間を形成する。Next, when the circuit board 18 is assembled inside the frame 16 from the bottom and the terminals 15 are inserted into the circuit board 18, the notch 21 of the circuit board 18 faces the connector mounting part, and there is a space between the circuit board 18 and the frame 16. form a gap.
【００２２】上記のフレーム１６に対するコネクター１
１の仮固定状態で、コネクター１１の取付け部の下部は
回路基板１８の下面のあたりに位置することになり、こ
の状態で図１の如く溶融半田Ａに回路基板１８の下面が
接する程度までにフレーム１６を浸漬し、回路基板１８
のパターンと端子１５及び実装電子部品の半田付けを行
なう。Connector 1 to the above frame 16
1, the lower part of the mounting part of the connector 11 will be located around the bottom surface of the circuit board 18, and in this state, the bottom surface of the circuit board 18 will come into contact with the molten solder A as shown in FIG. Immerse the frame 16 and the circuit board 18
The pattern, the terminal 15, and the mounted electronic components are soldered.
【００２３】このとき、コネクター取付け部の下部が溶
融半田Ａに浸漬し、ケース１３の外表面は易半田付け性
を有するため、フレーム１６とケース１３の嵌合隙間に
沿って毛管現象で溶融半田が吸い上がり、フレーム１６
の両面で取付け部分の一部、又は全周が半田ａによって
固定される。At this time, the lower part of the connector attachment part is immersed in the molten solder A, and since the outer surface of the case 13 has easy solderability, the molten solder is immersed in the molten solder A along the fitting gap between the frame 16 and the case 13 by capillary action. is sucked up and frame 16
A part or the entire circumference of the mounting portion is fixed on both sides with solder a.
【００２４】なお、ケース１３の雄ねじ１２の部分はキ
ャップ２２又はマスキングによって覆われているので半
田の付着が生じないと共に、コネクター１１のホルダー
１４は高耐熱性の合成樹脂で形成されているため、下部
が溶融半田Ａに浸漬しても損傷の発生がない。Note that the male thread 12 of the case 13 is covered with a cap 22 or masking, so solder does not adhere to it, and the holder 14 of the connector 11 is made of a highly heat-resistant synthetic resin. No damage occurs even if the lower part is immersed in molten solder A.
【００２５】上記のように、フレーム１６に対してコネ
クター１１はカシメ部１９と半田ａによって固定化され
るため、ガタツキの発生がない確実な固定状態が得られ
ると共に、コネクター１１は回路基板１８に近付けた位
置に取付けることができるため、図１の如くフレーム１
６の高さ寸法Ｈ１ を小さくすることができ、高周波機
器の小型化が実現できる。As described above, since the connector 11 is fixed to the frame 16 by the caulking part 19 and the solder a, a secure fixed state without rattling is obtained, and the connector 11 is firmly attached to the circuit board 18. Since it can be installed close to the frame 1 as shown in Figure 1,
The height dimension H1 of 6 can be reduced, and high frequency equipment can be downsized.
【００２６】[0026]
【発明の効果】以上のように、この発明によると、コネ
クターの耐熱性を向上させると共に、回路基板の側縁で
少なくともコネクター取付部の位置にフレームとの隙間
を形成したので、コネクター取付部を半田ディップによ
って半田付けすることができ、従ってコネクターをフレ
ームに対してカシメと半田によってガタツキのないよう
強固に固定化することができる。[Effects of the Invention] As described above, according to the present invention, the heat resistance of the connector is improved, and a gap is formed between the frame and the side edge of the circuit board at least at the position of the connector mounting portion, so that the connector mounting portion is Soldering can be performed by solder dipping, and therefore, the connector can be firmly fixed to the frame by caulking and soldering without wobbling.
【００２７】また、フレームに対してコネクターの取付
け位置を回路基板に近付けることができ、その分フレー
ムの高さ寸法が小さくなり、高周波機器の小型化を実現
できる。[0027] Furthermore, the connector can be attached to the frame closer to the circuit board, and the height of the frame can be reduced accordingly, making it possible to downsize the high-frequency equipment.
【図１】この発明の取付方法を示す縦断正面図。FIG. 1 is a longitudinal sectional front view showing the mounting method of the present invention.
【図２】この発明の取付方法を示す平面図。FIG. 2 is a plan view showing the mounting method of the present invention.
【図３】従来のコネクターを示す縦断正面図。FIG. 3 is a longitudinal sectional front view showing a conventional connector.
【図４】従来の取付方法を示す縦断正面図。FIG. 4 is a longitudinal sectional front view showing a conventional mounting method.
１１ コネクター １３ ケース １４ ホルダー １５ 端子 １６ フレーム １８ 回路基板 11 Connector 13 Case 14 Holder 15 Terminal 16 Frame 18 Circuit board
Claims (1)
るケースの内部に耐熱性と絶縁性を有する合成樹脂を用
いたホルダーを組込み、このホルダー内に端子を収納し
てコネクターを形成し、このコネクターをフレームの取
付孔に挿入した状態でケースをフレームにカシメ固定し
、フレームの内部に収納した回路基板の少なくともコネ
クター取付け部に近接する側縁とフレームの間に隙間を
形成し、前記フレームに対するコネクターのケース取付
け位置をケース取付け部分の下部が隙間から回路基板の
下面に臨むように設定し、前記フレームに対するコネク
ターのケース取付け部分の周囲を溶融半田への浸漬によ
る半田の吸上げによって半田付けすることを特徴とする
コネクターの取付方法。Claim 1: A holder made of heat-resistant and insulating synthetic resin is incorporated inside a case having at least an outer peripheral surface that is easy to solder, and a terminal is housed in the holder to form a connector. The case is fixed to the frame by caulking with the connector inserted into the mounting hole of the frame, and a gap is formed between at least the side edge of the circuit board housed inside the frame near the connector mounting part and the frame, and Set the connector case mounting position so that the lower part of the case mounting part faces the bottom surface of the circuit board through the gap, and solder the area around the case mounting part of the connector to the frame by soaking it in molten solder and sucking up the solder. A connector mounting method characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3106880A JP2663742B2 (en) | 1991-04-10 | 1991-04-10 | How to attach the connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3106880A JP2663742B2 (en) | 1991-04-10 | 1991-04-10 | How to attach the connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04312782A true JPH04312782A (en) | 1992-11-04 |
| JP2663742B2 JP2663742B2 (en) | 1997-10-15 |
Family
ID=14444825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3106880A Expired - Lifetime JP2663742B2 (en) | 1991-04-10 | 1991-04-10 | How to attach the connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2663742B2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6056472A (en) * | 1983-09-09 | 1985-04-02 | Mitsubishi Heavy Ind Ltd | Soldering method of metallic plug socket |
| JPS61146334A (en) * | 1984-12-17 | 1986-07-04 | Mikasa Kagaku Kogyo Kk | Preparation of multilayered particulate matter |
| JPS61173480A (en) * | 1985-01-28 | 1986-08-05 | 三菱電機株式会社 | Soldering of lead |
-
1991
- 1991-04-10 JP JP3106880A patent/JP2663742B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6056472A (en) * | 1983-09-09 | 1985-04-02 | Mitsubishi Heavy Ind Ltd | Soldering method of metallic plug socket |
| JPS61146334A (en) * | 1984-12-17 | 1986-07-04 | Mikasa Kagaku Kogyo Kk | Preparation of multilayered particulate matter |
| JPS61173480A (en) * | 1985-01-28 | 1986-08-05 | 三菱電機株式会社 | Soldering of lead |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2663742B2 (en) | 1997-10-15 |
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