JPS6056472A - Soldering method of metallic plug socket - Google Patents

Soldering method of metallic plug socket

Info

Publication number
JPS6056472A
JPS6056472A JP16591783A JP16591783A JPS6056472A JP S6056472 A JPS6056472 A JP S6056472A JP 16591783 A JP16591783 A JP 16591783A JP 16591783 A JP16591783 A JP 16591783A JP S6056472 A JPS6056472 A JP S6056472A
Authority
JP
Japan
Prior art keywords
solder
hollow conductive
soldering
wire
pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16591783A
Other languages
Japanese (ja)
Inventor
Sukeaki Hamanaka
亮明 浜中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Priority to JP16591783A priority Critical patent/JPS6056472A/en
Publication of JPS6056472A publication Critical patent/JPS6056472A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/08Soldering by means of dipping in molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Molten Solder (AREA)

Abstract

PURPOSE:To solder a metallic plug socket with high efficiency and high reliability by exposing the top ends of the conductors of insulation-covered fine wire groups, inserting the same into hollow conductive pins and dipping the projecting parts thereof into a solder tank then cutting away the projecting part. CONSTITUTION:All the required lead wires 06 are exposed by (l) from the top ends. The respective bare wires 07 are inserted into hollow conductive pins 01 to make projecting parts 08. The total number of the projecting parts 08 of a plug socket inserted with the bare wires 07 is dipped for a prescribed length in the solder 09 in a melting tank 010. The projecting parts are removed from the tank 010 at the point of the time when the molten solder 09 ascends in the capillary gaps among the fine wire groups by capillarity up to the opposite end face of the pins 01. The wire 08a parts into which the solder is penetrated are cut away. The time for soldering is reduced by the above-mentioned method and solderability with high reliability is provided and the pins having high strength are obtd.

Description

【発明の詳細な説明】 本発明はメタルコンセントのハンダ付は方法に係り、特
に電算機、通信機、制御機器等の各種機器のリード線用
メタルコンセントに適用し得るメタルコンセントのハン
ダ付は方法に関する、。
[Detailed Description of the Invention] The present invention relates to a method for soldering a metal outlet, and in particular, a method for soldering a metal outlet that can be applied to metal outlets for lead wires of various devices such as computers, communication devices, and control equipment. Regarding.

従来例えば電算機、通信、制御等の各機器のケーブルで
は、多数のリード線の着脱部に第1図に示すようなメタ
ルコンセントが用いられている。この種コンセントは、
ピンの本数、ピッチ連結部の構造など種々の形態があり
、多種少量的であるため、一点一点を手作業によるノ・
ンダ付を行なっている。例えば第1図において1はピン
、2は空洞部、3は絶縁樹脂板、4はコネクタ一部(連
結部)、5はスナップリング、6はリード線、7は裸線
、8はノ・ンダ、9は7′−ンダごててアク、空洞部2
に対応してその深さよシや\長いリード線6のビニール
被覆部を除去し、ハンダごて9にて裸線7とノ・ンダ8
を加熱して溶融した一1ンダ8を裸線7に十分浸透した
後、空洞部2に挿入してその近傍を加熱しながらハンダ
8を更に浸透凝固させる。この作業を1点1点手作業で
実施している。従って上記従来のハンダ付は方法では以
下のような欠点があった。
2. Description of the Related Art Conventionally, in cables for various devices such as computers, communications, and control devices, metal outlets as shown in FIG. 1 have been used at the attachment/detachment portions of a large number of lead wires. This kind of outlet is
There are various forms such as the number of pins and the structure of the pitch connection part, and because they are produced in a wide variety and in small quantities, each piece is made by hand.
We are doing the underwriting. For example, in Fig. 1, 1 is a pin, 2 is a hollow part, 3 is an insulating resin plate, 4 is a part of the connector (connecting part), 5 is a snap ring, 6 is a lead wire, 7 is a bare wire, and 8 is a non-conductor. , 9 is 7'-nda iron, hollow part 2
Corresponding to the depth, remove the vinyl coating of the long lead wire 6, and solder the bare wire 7 and the soldering iron 8 with a soldering iron 9.
After heating and melting the solder 8 to sufficiently penetrate the bare wire 7, the solder 8 is inserted into the cavity 2 and the vicinity thereof is heated to further penetrate and solidify the solder 8. This work is carried out manually one by one. Therefore, the conventional soldering method described above has the following drawbacks.

■ 1点1点行なうので作業能率が悪い。■ Work efficiency is poor because each point is done one by one.

■ 裸m7を空洞部2に挿入後その近傍を溶融ハンダが
浸透するまで加熱を要するのでその所要時間が長く、各
点の累積所要時間は莫大となる。
(2) After inserting the bare m7 into the cavity 2, it is necessary to heat the vicinity thereof until the molten solder penetrates, so the time required is long, and the cumulative time required at each point is enormous.

■ 各点のピッチが微小な場合には、ノ、X71ダごて
の接近が困難であったシ、接近できてもリード線6のビ
ニール部の焼損を生じることがある。
(2) If the pitch of each point is minute, it is difficult to approach the X71 iron, and even if it is possible to approach, the vinyl portion of the lead wire 6 may be burnt out.

■ 空洞部2が浅いため、ハンダの浸透が不十分である
と導通不良ならびに折損を生じることがある。
- Since the cavity 2 is shallow, insufficient solder penetration may result in poor conductivity and breakage.

本発明は上記の事情に鑑みて提案されたもので、その発
明の目的とするところは、上記従来方法における諸欠点
を解消し、高能率且つ信頼性の高いメタルコンセントの
ハンダ付は方法を提供するにある。
The present invention has been proposed in view of the above circumstances, and the purpose of the invention is to solve the various drawbacks of the above conventional methods and provide a highly efficient and reliable method for soldering metal outlets. There is something to do.

本発明者は従来方法によるメタルコンセントのハンダ付
は方法におけるハンダ付は所要時間が莫大である要因を
解析した結果、1点1点のリード線および空洞部の近傍
が所定温度に上昇するまでの所要時間が最大ネックであ
ることが判明した。従って予め全点数の裸線を6空洞部
に挿入した後、全点数のハンダ付けを同時に行えばよい
ことを見極めた。
The inventor of the present invention analyzed the reason why the conventional method of soldering a metal outlet requires an enormous amount of time, and found that it takes a long time until the lead wires at each point and the vicinity of the cavity rise to a predetermined temperature. It turned out that the time required was the biggest bottleneck. Therefore, we determined that it would be sufficient to insert all the bare wires into the six cavities in advance and then solder all the wires at the same time.

本発明は上記の知見に基いてなされたもので、本発明に
よるメタルコンセントのハンダ付は方法に絶縁板に垂直
に立設された中空導通ビンを有するメタルコンセントに
おいて、絶縁材で被覆された細線群導線の先端を上記中
空導通ピンの長さよりも長く裸線とし、この裸線な上記
中空導通ピンに挿入貫通して上記中空導通ピンの先端に
突出させ、これにより、突出した上記裸線な溶融ハンダ
槽中に浸漬してハンダを浸透させ、その後これを上記溶
融ハンダ槽中がら引き上けてその突出部を切除すること
を特徴とし、各探線を各中空導通ピンの先端に突出させ
て溶融ハンダ槽中に浸漬し、各裸線の細線群に毛細管現
象で溶融ハンダを浸透させて各裸線と各中空導通ピンの
空間部をハンダで充満させ、全点数のハンダ付けを同時
に実施し得るようにして高能率且つ信頼性の高いハンダ
付けを行い得るようにしたものである。
The present invention has been made based on the above knowledge, and the method of soldering a metal outlet according to the present invention is to use a thin wire covered with an insulating material in a metal outlet having a hollow conductive bottle vertically installed on an insulating plate. The tip of the group conducting wire is a bare wire longer than the length of the hollow conductive pin, and the bare wire is inserted through the hollow conductive pin and protrudes from the tip of the hollow conductive pin. It is characterized in that it is immersed in a molten solder bath to allow solder to permeate therein, and then pulled up from the molten solder bath to cut off its protruding portion, and each probe wire is made to protrude from the tip of each hollow conductive pin. immersed in a molten solder bath, each thin wire group is penetrated with molten solder by capillary action, filling the space between each bare wire and each hollow conductive pin with solder, and soldering all points at the same time. This makes it possible to perform highly efficient and reliable soldering.

本発明の一実施例を添付図面を参照して詳細に説明する
An embodiment of the present invention will be described in detail with reference to the accompanying drawings.

fr 2図〜第4図にそれぞれ本発明によるメタルコン
セントのハンダ伺は方法の手順を示す説明(2)であり
、この中で第2図に中空部・通ピンへのリード線挿入状
況、第3図は全点同時ハンダ付状況、第4図は余贅部を
除去して仕上げる状況をそれぞれ示している。
fr Figures 2 to 4 are explanations (2) showing the steps of the method for soldering a metal outlet according to the present invention, in which Figure 2 shows the state of lead wire insertion into the hollow part/through pin, and Figure 3 shows the situation in which all points are soldered at the same time, and Figure 4 shows the situation in which the remaining parts are removed and finished.

第2図〜第4図においてθノは中空導通ピン、02は中
空部、03に絶縁樹脂板、04はコネクタ一部(連結部
)、05はスナップリング、06はリード線、o7は裸
線、o8は突出部、08 a 113 ハy タが浸透
した線、09は溶融ハンダ、010は溶融槽、011は
ヒーター、!は裸線の長さ、hはビンの旨さである。
In Figures 2 to 4, θ is a hollow conductive pin, 02 is a hollow part, 03 is an insulating resin plate, 04 is a part of the connector (connecting part), 05 is a snap ring, 06 is a lead wire, and o7 is a bare wire. , o8 is the protruding part, 08 a 113 is the line penetrated by the wire, 09 is the molten solder, 010 is the melting tank, 011 is the heater, ! is the length of the bare wire and h is the taste of the bottle.

上記本発明の一実施例の方法について説明する。A method according to an embodiment of the present invention will be described.

(1)全所要のリード、v06の先端からノ(A>h)
だけ、裸にし要すれば裸線07の細線群を挿入容易化の
ためねじると共にペーストを塗布する。
(1) All required leads, from the tip of v06 (A>h)
If necessary, twist the thin wire group of bare wires 07 to facilitate insertion and apply paste.

(2)夫々の裸線07を所定の所定位置の貫通中空導通
ピンθノに挿入し、ビン先端から突出させて突出部08
を作る。
(2) Insert each bare wire 07 into the through-hole conductive pin θ at a predetermined position, and make it protrude from the tip of the bottle to form the protruding part 08.
make.

(3) ヒータ011の取付けられた浴を諷槽θ10内
で予めハンダ09を溶融状態にして、?fJ記(2)で
裸線07を挿入したコンセントの突出部08先端の全数
をハンダθ9の浴融面に所定長浸漬し、所定時間放置す
ることにより、突出部08および中空導通ピン01の温
度上昇に伴い溶融ハンダ09はf■1線群の毛細間隙を
毛細管現象で矢印の如く中借導通ビン01の反対の端面
まで上昇した時点で溶融4@oz。
(3) The solder 09 is melted in advance in the bath θ10 in which the heater 011 is attached. By immersing all the tips of the protruding parts 08 of the outlet into which the bare wires 07 are inserted in fJ (2) for a predetermined length into the melting surface of the solder θ9 and leaving them for a predetermined time, the temperature of the protruding parts 08 and the hollow conductive pins 01 can be lowered. As it rises, the molten solder 09 rises through the capillary gap of the f1 line group to the opposite end face of the conductive bottle 01 as shown by the arrow, and melts to 4 oz.

から取シ出丁。なお前記(1)でペーストを塗布しない
場合には、ハンダ付前に(3)と同様の方式で溶融ペー
スト槽に突出部08の先端を浸漬して浸透させれば更に
能率的となる。
Karatorishi is out. If the paste is not applied in (1) above, it will be more efficient if the tip of the protrusion 08 is immersed in the molten paste bath in the same manner as in (3) before soldering.

(4)その後第4図に示すJ:りにハンダが浸透した線
08EL部を切除して完成する。
(4) After that, the line 08EL shown in FIG. 4 where the solder penetrated is cut out to complete the process.

以上により、本発明によれば以下の如き優れ次効果が奏
せられるものである。
As described above, according to the present invention, the following excellent effects can be achieved.

■ 貫通中空導通ビ/とすることにより、リード線の挿
入、保持が容易となる。
■ By using a through-hole conductor, it is easy to insert and hold the lead wire.

■ ピン先端に裸線θ7の突出部08を設けることによ
り、細線群の毛細群の毛4411管現象により1溶融ハ
ンダ(溶融ペーストの場合もある)を浸透できる。
(2) By providing the protrusion 08 of the bare wire θ7 at the tip of the pin, 1 molten solder (or molten paste) can penetrate through the capillary 4411 phenomenon of the thin wire group.

■ 各中空導通ピン01に谷株純07′J2r:全数挿
入しrc状態で一挙(同時)にノ・ンダ付けを行うため
、ハンダ付(加熱時間総計)を大幅に短縮できる。
■ Jun Tanikata 07'J2r: All the hollow conductive pins 01 are inserted and soldered at once (simultaneously) in the RC state, so the soldering (total heating time) can be significantly shortened.

■ ピン先端からノ・ンダ付けを行うため、背面のビン
配列ピッチが徹小であっても7、ンダ付けが実施でき、
リードff1JO6のビニールを焼損することがない。
■ Since soldering is performed from the tip of the pin, soldering can be performed even if the pitch of the bin arrangement on the back is extremely small.
The vinyl of lead ff1JO6 will not be burned out.

■ 毛細管現象は、J411線群間隙を溶融ノ・ンダが
浸透充満させながら進行するため、伝熱面積が増大する
ので、温度上昇が速かとなり、従つて浸透も速かとなり
、長時間加熱がなくなり、絶縁樹脂板03及びリード線
06のビニールを焼損することがない。
■ Capillarity progresses as the molten powder permeates and fills the gap between the J411 wire groups, increasing the heat transfer area, resulting in a faster temperature rise and therefore faster penetration, making it difficult to heat for a long time. Therefore, the vinyl of the insulating resin plate 03 and the lead wire 06 will not be burned out.

■ ハンダ付は後に、中空導通ピンと裸線の間隙は、下
方から順次充満されていくので加熱膨張空気は上方へ放
出され、欠陥の少い中実ピンとなるので、信頼性の高い
ハンダ付けと強度の高いピンが得られる。
■ After soldering, the gap between the hollow conductive pin and the bare wire is filled sequentially from below, so the heated and expanded air is released upwards, resulting in a solid pin with fewer defects, resulting in highly reliable soldering and strength. A high pin can be obtained.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来例の説明図、第2図〜第4図はそれぞれ本
発明によるメタルコンセントのハンダ付は方法の手順を
示す説明図である。 01・・・中空導通ピン、02・・・中空部、03・・
・絶縁樹脂板、04・・・コネクタ一部(連結部)、0
5・・・スナップリング、06・・・リード線、07・
・・裸線、08・・・突出部、08a・・・ハンダが浸
透した線、09°°・溶融ハンダ、010−溶融槽、0
1ノ・・・ヒーター、!・・・裸線の長さ、ho・ピン
の高さ。
FIG. 1 is an explanatory diagram of a conventional example, and FIGS. 2 to 4 are explanatory diagrams each showing the steps of a method for soldering a metal outlet according to the present invention. 01...Hollow conduction pin, 02...Hollow part, 03...
・Insulating resin plate, 04... Connector part (connection part), 0
5...Snap ring, 06...Lead wire, 07.
... Bare wire, 08... Protrusion, 08a... Line penetrated with solder, 09°° - Molten solder, 010- Melting tank, 0
1. Heater! ...Length of bare wire, height of ho/pin.

Claims (1)

【特許請求の範囲】[Claims] 絶縁板に垂直に立設された中空導通ピンを有するメタル
コンセントにおいて、絶縁材で被覆された細線群導線の
先端を上記中空導通ビンの長さよシも長く裸線とし、こ
の裸線な上記中空導通ビンに挿入貫通して上記中空導通
ビンの先端に突出させ、これによシ突出した上記裸線を
溶融ハンダ槽中に浸漬してハンダを浸漬させ〜その後こ
れを上記溶融ハンダ槽中から引き上げてその突出部を切
除することを特徴とするメタルコンセントのハンタ付ケ
方法。
In a metal outlet having a hollow conductive pin installed perpendicularly to an insulating plate, the tip of the thin wire group conductor covered with an insulating material is a bare wire that is longer than the length of the hollow conductive bottle, and the bare wire is connected to the hollow conductive pin. The bare wire is inserted into a conductive bottle and penetrated to protrude from the tip of the hollow conductive bottle, and then the protruding bare wire is dipped into a molten solder bath to be immersed in solder. Then, it is pulled out from the molten solder bath. A method for attaching a handle to a metal outlet, characterized by cutting off a protruding part of the handle.
JP16591783A 1983-09-09 1983-09-09 Soldering method of metallic plug socket Pending JPS6056472A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16591783A JPS6056472A (en) 1983-09-09 1983-09-09 Soldering method of metallic plug socket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16591783A JPS6056472A (en) 1983-09-09 1983-09-09 Soldering method of metallic plug socket

Publications (1)

Publication Number Publication Date
JPS6056472A true JPS6056472A (en) 1985-04-02

Family

ID=15821463

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16591783A Pending JPS6056472A (en) 1983-09-09 1983-09-09 Soldering method of metallic plug socket

Country Status (1)

Country Link
JP (1) JPS6056472A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS64492U (en) * 1987-06-22 1989-01-05
JPH0279384A (en) * 1988-09-14 1990-03-19 Matsushita Electric Works Ltd Soldering method of package for electric device
JPH04312782A (en) * 1991-04-10 1992-11-04 Murata Mfg Co Ltd Connector attaching method
JP6461444B1 (en) * 2018-02-13 2019-01-30 サンワサプライ株式会社 Manufacturing method of cable with connector

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS64492U (en) * 1987-06-22 1989-01-05
JPH0279384A (en) * 1988-09-14 1990-03-19 Matsushita Electric Works Ltd Soldering method of package for electric device
JPH0514391B2 (en) * 1988-09-14 1993-02-24 Matsushita Electric Works Ltd
JPH04312782A (en) * 1991-04-10 1992-11-04 Murata Mfg Co Ltd Connector attaching method
JP6461444B1 (en) * 2018-02-13 2019-01-30 サンワサプライ株式会社 Manufacturing method of cable with connector
WO2019159218A1 (en) * 2018-02-13 2019-08-22 サンワサプライ株式会社 Connector-attached cable and method for manufacturing same

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