EP0201512B1 - Select solder slot termination method and product - Google Patents
Select solder slot termination method and product Download PDFInfo
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- EP0201512B1 EP0201512B1 EP85904574A EP85904574A EP0201512B1 EP 0201512 B1 EP0201512 B1 EP 0201512B1 EP 85904574 A EP85904574 A EP 85904574A EP 85904574 A EP85904574 A EP 85904574A EP 0201512 B1 EP0201512 B1 EP 0201512B1
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- European Patent Office
- Prior art keywords
- solder
- terminal
- slot
- wire
- conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
- H01R4/2416—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type
- H01R4/2445—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type the contact members having additional means acting on the insulation or the wire, e.g. additional insulation penetrating means, strain relief means or wire cutting knives
- H01R4/2462—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type the contact members having additional means acting on the insulation or the wire, e.g. additional insulation penetrating means, strain relief means or wire cutting knives the contact members being in a slotted bent configuration, e.g. slotted bight
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/023—Soldered or welded connections between cables or wires and terminals
- H01R4/024—Soldered or welded connections between cables or wires and terminals comprising preapplied solder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
- H01R4/2416—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type
- H01R4/242—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type the contact members being plates having a single slot
- H01R4/2425—Flat plates, e.g. multi-layered flat plates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
- H01R4/2416—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type
- H01R4/2445—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type the contact members having additional means acting on the insulation or the wire, e.g. additional insulation penetrating means, strain relief means or wire cutting knives
Definitions
- the present invention relates to a method and product for terminating electrical conductors and in particular to a method and product which combine insulation piercing and solder technology.
- IDC insulation displacement connection
- soldering and crimping with IDC now becoming more widely used because of productivity improvement implicit in the technique.
- the advantages of solder include a potential for excellent reliability and low cost, when performed properly and employed in large volume production utilizing sophisticated soldering equipment where the solder process can be controlled rather exactly and the parts can be readily designed to fit the process.
- hand soldering can be and is widely utilized. It is there that the five variables in soldering become most critical and sensitive to variability.
- Totally neutral acids which may be preferred for the foregoing reasons, may not break through the surface oxides intrinsic to the metal surfaces of the parts or those oxides intrinsic to the metal surfaces of the parts or those oxides developed in time by the environment and duration of inventory.
- Pores and fractures in a solder joint evidence an over application of heat caused by sudden out gassing.
- Lumpy appearance and cold joints evidence too little heat. In pot or wave solder baths, surface dross can and does plague all operations.
- crimping is usually performed by pressure application, in a tool, on a portion of a metal terminal to inelastically deform such about a bare electrical wire.
- the terminal/tool system assures excellent terminal/wire joints repeatedly with little skill required.
- Crimping typically takes a great deal of energy and even with small wires/ terminal crimps can demand 80-115 cm Kg (70 to 100 inch pounds) of work with die forces frequently exceeding 450-680 Kg (1000-1500 pounds). Larger sizes of terminal/wire indeed require forces of many thousands of pounds.
- crimping usually calls for precision displacement of dies to effect the necessary deformation and tolerances between 0.0025 and 0.0076 cm (0.001 and 0.003 inches) are not uncommon.
- high force and close tolerance characterizes most quality crimps.
- high forces and close tolerances mean precision die surfaces and precision tool linkages which inescapeably mean cost.
- high forces call for tooling dies that are quite strong and capable of bearing repeated forces and frictional engagements of the metal deformation of terminals. That fact dictates a certain size limitation, width and height, beef, if you will, limiting how close terminals may be fixed in connectors and still be crimped by practical dies. It limits how many wires can be crimped simultaneously without having to have a multi- ton force mechanism such as a press.
- high force, precision and size of crimping dies all act as major recognized limitations on crimping as a termination technology.
- IDC The concept of IDC involves stuffing an insulated wire into a slot in a metal portion of a terminal. It has evolved in two ways for separate reasons. An early use of IDC is shown in U.S. Patent No. 3,320,345 to J. E. Marley issued May 16, 1967. There, insulation displacement was employed to essentially effect stripping so as to handle very small solid wires where removal of insulation proved difficult and time consuming.
- a second aspect of IDC relates to the situation where, by the use of insulation displacement, improved productivity could be obtained due to the fact that relatively large multiples of wires could be terminated simultaneously, essentially because the forces of termination are relatively low, being measured in the tens of pounds for wire gages on the order of 18 to 26 AWG (0,4-1,0 mm), rather than in hundreds of pounds or thousands of pounds as in the case of crimp technology.
- IDC use has been more spurred by increased productivity than by merely its advantage in stripping insulation.
- Productivity improvements utilizing IDC have resulted in labor cost reductions per termination on the order of 50 to 70 percent, particularly where the IDC concept is employed in pre-loaded multiple connectors.
- IDC The main problem with IDC is a perception that what goes in easily comes out easily. Despite efforts to allay this perception by fixes with metal or plastic insulation gripping structures, many users have refrained from employing IDC technology. The success and reliability of proven solder and crimp technology has, to some extent, inhibited the use of IDC concepts.
- solder can be an excellent electrical terminal terminating technique but one must control the five critical factors or else suffer bad joints, crimp works well with little skill but takes high forces and precision tooling and is limited in center-to-center application and for multiple wire applications; and IDC gives productivity increases and self stripping but can come apart if one can pull or push the wire out of the slot that is the basis of the technology.
- a method of terminating having the features acknowledged to be known from GB-A-377160, according to the invention is characterised in that the insulated conductor is driven into the slot to effect insulation displacement from a wire core portion gripped and frictionally abraided between opposite sides of the slot to effect electrical and mechanical connection therebetween, and then reflowing the solder at the slotted terminating portion to form a solder joint at the connection.
- a preferred embodiment is characterised in that a plurality of solder coated terminals are positioned in a housing with solder coated slotted terminating portions arranged in a row, insulated conductors are driven into slots of respective terminals to effect insulation displacement from wire core portions gripped and frictionally abraided between opposite sides of said slots to effect electrical and mechanical connection therebetween, and then reflowing the solder at the slotted terminating portions to form solder joints at the connections.
- solder reflow is effected by use of electromagnetic means to generate heat when the terminals are in the housing.
- Eddy current heating results in "internal" heat which can cause a melting and pull back of insulation away from the slot prior to actual solder reflow, at least with certain foamed types of insulation. This provides less potential for contamination of the solder, wire, and slot area.
- Figure 1 shows a conductor engaging portion of an electrical terminal 10 formed by an upstanding plate portion 12 defining a pair of sharp tines 14, 16 with a slot 18 therebetween and a tapering entry 20 leading to the slot.
- the terminal can be of any known type, such as that described in U.S. Patent No. 4,040,704, the disclosure of which is incorporated herein by reference.
- An electrical wire 22, formed by a conductor 24 covered by an insulative layer 26, is poised above slot 18. The end of the wire 22 has been stripped of the insulation 26 so that the conductor 24 is bare.
- the conductor 24 is a solid copper conductor suitably tin plated in accordance with practice in the art of wire manufacture.
- the terminal slotted plate portion 12 is intended to represent the conductor engaging portion of an electrical terminal 10 which is stamped and formed of conductive metallic sheet stock having spring properties such as brass, phosphor bronze, or beryllium copper.
- the wire 22 can represent an AWG table wherein the diameter of the conductor 24 is roughly 0.000254 mm (0.010 thousands of an inch) with the outer diameter of the insulation 26 being 0.00051 mm (0.020 thousands of an inch).
- Slotted plate structures like that shown in Figure 1 include a height H which is sufficient to define a slot 18 of depth SD allowing for the insertion of the conductor 22 as indicated in Figure 2, 3, and 4 with the conductor 22 being scrubbed by insertion in the slot 18 as it travels therealong.
- the width dimension SW of the slot 18 can be considered in the range between 40% to 80% of the diameter of the conductor 22.
- the beveled entry area at the top of plate portion 12 is rendered at an angle 8 which is intended to guide or center insertion of the wire 22 so that the conductor 24 ends up in the slot 18 without being cut off or unduly deformed or pinched.
- Figure 2 shows in side elevation, partially in section a typical installation tool 28 which contains a slot 30 which fits over plate portion 12 and is arranged to press the wire 22 down into the slot 18, as shown in Figures 3 and 4.
- the length of the slot 18 is such that the conductor 24 can be moved therealong for between 1 ' to 2) times the diameter of conductor 24 without bottoming the slot 18 so as to be unduly pinched or deformed and yet to get a good scrubbing and wiping action to remove, in the case of the embodiment heretofore discussed, oxide films on the conductor 24 by a mashing and inelastic deformation of the bulk of the conductor smearing, spearing and deforming the in coating thereon and generally scrubbing the surfaces thereof along with the inner surfaces of the slot 18.
- Figure 4A shows a kind of permanent deformation of conductor 24 which results from proper proportioning of the width SW of the slot 18 relative to the diameter of the conductor 24.
- the structure of plate 12 is designed to have dimensions H, T and SW such that when a conductor 24 is stuffed or forced into the slot 18, the plate 12 is elastically deformed transversally to the slot 18 to store energy and maintain a forceful engagement with the conductor 24 and the surfaces of slot 18 throughout the life of the resulting connection. What this means is that there is sufficient stored energy to accommodate the inelastic creep that results. If the plate 12 were perfectly rigid and gave not at all there would be no reserve energy and no follow up displacement to maintain the engagement with the wire or conductor 24, other than that within the conductor 24 itself which, because of its dimensions, is relatively less than could be stored in the plate 12.
- the purpose of the slot 18 and plate .12 is to strip away insulation 26 or oxide films, to rub and scrub the relative engaging surfaces of conductor 24 and slot 18, and to fixture the conductor 24 within slot 18 in a firm manner.
- stored energy and displacement force from plate 12 to conductor 24 and the surfaces thereof are not only not necessary, but should be limited where possible and practical.
- the present invention relates to a solder or eutectic joint and stored energy, once this is accomplished, can only create stresses which are undesirable.
- a coating 32 which represents a solder or eutectic coating, on at least the plate portion 12 of the terminal 10.
- This coating may be effected in a number of ways, preferably by electro plating in a manner to keeping slot 18 clear, or reasonably clear, and the edges that define the slot sufficiently sharp to do the job of oxide and insulation film or covering displacement.
- the coating 32 is shown in Figures 1-4 as covering the entire surface of plate portion 12 and in practice this has been done with respect to various samples. In an actual example the structure shown in Figure 1-4A had the following dimensions:
- the material of the terminal 10 was BeCu 145, a hard. It was prepared by cleaning using standard electro plating practices and the plating applied was a 63/37 tin lead eutectic having a liquid temperature of 183°C (361°F), with no pasty range. With the foregoing dimensions a coating 32 of 0.025 mm (0.001 inches) in thickness was found to be sufficient to effect the job of soldering the conductor 22 to terminal 10. Coating of thicknesses of 0.051-0.076 mm (0.002 and 0.003 inches) were also utilized with good results. The coating of 0.025 mm (0.001 inches) was found to be enough and the coating of 0.075 mm (0.003 inches) was found to be not too much. Electro deposited tin lead eutectic of 90/10 type having a 183°-217°C (361°F-421°F) range was also tried with adequate results, but the 63/37 eutectic is preferred.
- eutectics and solder coatings 32 which may not extend over the entire surface of terminal 10, but may be selectively applied as by masking. It is also contemplated that eutectics may be applied by laminating, molten dipping, printing, silkscreening, plating, spraying, inlaying, mechanical attachment or the like. Those skilled in the art will also appreciate that it is preferable to apply the solder after forming the terminals as normal tin lead solder will rapidly dull dies.
- liquid temperature of the coating 32 was approximately 183°C (361°F) sufficient heat was applied to result in the soldering action in a number of different ways.
- a jet of hot nitrogen was used to effect the solder reflow.
- hot oil having a temperature well in excess of the phasing temperature of the eutectic, may also be employed.
- resistance heating, infrared, laser and as will be described in detail hereinafter, a type of eddy current heating resulting from the focusing of electromagnetic alternating fields may be used.
- FIGs 8 and 9 show an alternate terminal 34 terminating a stranded wire 36 applied in accordance with the invention.
- This terminal has a folded slotted plate portion similar to that described in U.S. Patent No. 4,261,624, the disclosure of which is incorporated herein by reference. It has been found that the invention is particularly useful with respect to pre-tinned stranded wire. Referring back to Figure 1, the reason is that in many of the commercial IDC structures which have been used over the years the practical thickness W of the plate portion 12 is thin enough to cut strands when taken with the width SW of the slot necessary to generate stored energy onto the stranded wire to effect an IDC connection.
- the slot width SW and the thickness T have been designed to cut through or breakthrough insulation resulting in a structure which tends to cut stranded conductors. This is particularly true with respect to multiple wire termination where the placement of the wire is less than in the application of one wire into one slotted plate.
- Figure 9 shows that the solder coating will reflow filling the void between the folded plates of this embodiment while securing the stranded wire therein.
- terminal embodiments shown in Figures 8 to 14 are three alternates or variations of the invention wherein the termination portion is made to receive 'an insulated wire having a conductor surrounded by insulation.
- the slotted plate portion is folded over to include a U-shaped portion.
- the embodiment of Figures 8 and 9 provides a redundancy of interface formed by a pair of plates 38, 40 connected by bights 42, 44, each plate defining a slot 46, 48, a much larger interface and allows for a different type of application of the coating.
- the solder coating 50 can be applied only to the inside region between the plates 38, 40.
- the coating 50 can be pre-applied as a stripe, or stripes, by either selective electroplating or inlaying of a solder pre-form roughly 0.025 mm (0.001 inches) thick.
- the bights of this embodiment are closed tightly so that reflow tends to wick between the interior surfaces.
- Figures 10 to 13 show a further embodiment of the present invention wherein the terminal 52 includes a folded over plate similarto the embodiment of Figures 8 and 9.
- the plates 54, 56 have upper portions 58, 60 connected by bights 62, 64 and doubles over and lower portions 66, 68 which are spread apart.
- the plates 54, 56 include slots 70, 72.
- This embodiment is intended to be used with insulation which is either relatively thick, has heat insulating characteristics, or is of a quality which is readily split.
- As the wire 74 is inserted, its insulation 76 will be split by the slots 70, 72 in the upper portions 58, 60 of the plates 54, 56 to then be actually pulled apart, as shown in Figure 12, as the bare conductor 78 is driven into and down the slots 70, 72.
- the insulation 76 can be seen totally separated in Figures 12 and 13. These figures also show the skiving action of the slots 70, 72 on conductor 78. It should also be noted, from Figure 13, that the insulation 76 can be pulled back by the heat of the reflow operation and/or pushed back by the reflowed solder.
- Figure 14 shows a further modification of the terminal of Figures 10 to 13 which includes an additional separate slotted blade portion 80 intended to be a further electrical interface with the conductor 78 forced therein.
- this embodiment is intended for especially thick insulations requiring substantial strength in the terminal.
- Figures 15 and 16 show a strip 79 of electrical terminals and a single terminal 81, respectively, stamped and formed to include a terminating portion 82 having dual slotted plates for redundancy and suitable coated with solder 84 and front-end contact with spring fingers 86 intended to mate with conductive portions of like terminals.
- This terminal is of the type described in the previously mentioned U.S. Patent No. 4,040,704.
- the terminating portion 82 includes slotted plates 88, 90 which are turned at right angles to the insertion axis of the wire 92 which tends to load the spring elements of the slotted plates in torsion giving a different clamping or fixing action relative to stripping and fixturing of the conductor 94 of the wire 92.
- a region 98 of reduced metallic cross sectional area is formed wherein terminal locking spring elements 100 have been struck-out from the plane of the metal.
- This region can be controlled in width to sharply limit the transfer of heat from the region of the slotted plates 88, 90 to the region of the spring fingers 86 to prevent annealing of the contact spring fingers.
- the bulk of the metal in the region of 98 need only be thick . enough to be structurally adequate to hold the terminal together in use and, depending upon the thermal conductivity of the metal, adequate to carry current without excessive resistance.
- Figure 17 is a perspective view of a representative electrical connector 102 containing numerous terminals 104 terminating a like number of wires 106.
- Figure 18 shows the connector 102 proximate to a tool 108 which has ferrite magnetic pole pieces 110, 112 shaped to concentrate an electromagnetic field in the region of termination of the connector terminals 104 to the wires 106.
- tool 108 reference is made to U.S. Patent No. 4,359,620 dated November 16, 1982, to Joseph R. Keller which shows an induction heating apparatus having shaped ferrite pole pieces which focus or concentrate a field of high flux density. An alternating field is produced, indicated by the broken lines between pole pieces 110, 112, which results in eddy current generation in the wire 106 and heating of the metal conductor thereof.
- the surrounding plastic housing 101 of connector 102 and the wire insulation are not affected by the field, while the focus of the field concentrated in the termination zone creates intense heating of the conductor metal and solder.
- Figures 20 to 22 show the effect of heat generation by the eddy current.
- a termination slot of a terminal 104 is shown in section with conductor 106 in the slot and its insulation 114 split, as frequently happens with the PVC, polypropylene, or polyethylene insulation in wide use in industry.
- Figure 21 shows the resulting melt and pull back of insulation 114 before reflow of the solder coating on the terminal 104.
- Figure 22 shows the terminal 104 after reflow, with the insulation pulled away, and the solder joint formed.
- This insulation pull back happens best with eddy current heating where the heat comes from the terminal 104, rather than from an external source, such as with hot nitrogen, vapor phase, resistance or infrared heating which tend to "cook" from the outside surfaces rather than generate heat in the surfaces of the metal parts.
- Figure 18 also shows the connector 102 with wires terminated. Essentially no damage is done to the housing 101 if the application of heat is quick.
- Keller induction heating system focused alternating electromagnetic field cycle times of a few seconds are possible. In general this time cycle is a function of the focus of field, the frequency of alternation and the properties of the material to be heated.
- frequencies of between 20 and 200 Khz have been tried using the Keller unit and apparatus.
- the eddy current heating approach is a preferred way when using connector housings pre-loaded with many terminals. Commercial induction machines with special coils may also be employed, as other means discussed, with results varying from barely adequate to excellent.
- Figures 20 to 22 represent almost a classic case for effecting termination with the present invention. In most instances where the wire is not prestripped, the insulation is cut only on both sides and may remain intact above and below the conductor as shown in Figures 19 and 20. This usually, but not always, will separate during the heating cycle.
- any of a number of fluxes can be used with the present invention.
- a water soluble flux could be applied immediately before reflow. If it were also electrically nonconductive and noncorrosive, it could simply be washed away after reflow. It would also be possible to precoat the terminals with an oxidizing inhibitor which would act as a cleaning agent.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
- The present invention relates to a method and product for terminating electrical conductors and in particular to a method and product which combine insulation piercing and solder technology.
- There are many acceptable ways to join electrical conductors to electrical terminals including soldering, crimping, brazing, welding and, in the last decade, a method generally referred to as insulation displacement, commonly referred to as IDC for insulation displacement connection. Each of these techniques has its place according to parameters of material cost, cost of the labor for effecting the joint and according to the resulting reliability, all in the context of a given environment of use. Put more directly, one can take less care and spend less on interconnecting wires to drive displays or motors in toys that sell for less than a day's pay than one might for like components used in a space shuttle where not only a fortune is at stake, but life itself.
- In general, the bulk of electrical terminations have been made by soldering and crimping with IDC now becoming more widely used because of productivity improvement implicit in the technique. The advantages of solder include a potential for excellent reliability and low cost, when performed properly and employed in large volume production utilizing sophisticated soldering equipment where the solder process can be controlled rather exactly and the parts can be readily designed to fit the process. When neither the geometry of the parts can be controlled nor high volume exists to underwrite volume production equipment, hand soldering can be and is widely utilized. It is there that the five variables in soldering become most critical and sensitive to variability. These five include having the right solder, the right cleanliness of surfaces to be soldered, the right fixturing to hold things still, the right pressure on the parts for heat transfer and the right amount of heat or dwell time of heat application. In the article "Soldering Technology - A Decade of Developments," International Metals Review, 1984, Volume 29, Number 2, by C. J. Thwaites, all of the foregoing aspects are mentioned in some detail with as thorough bibliography as one is likely to find, though in citing this useful article it must be stated that not all of the 449 cited references have been studied.
- When one or more of the above discussed five critical requirements for a good solder joint vary too much, trouble will surely follow. For example, when one uses the wrong solder relative to the surface of the metal or geometry of the parts to be soldered, all sorts of problems can occur - the solder will not wick well or wet to the surfaces, potential corrosion due to the electrical disparity of metals may result, the solder will not bond well and so forth. If the wrong flux is used to clean the surfaces to be soldered, poor joints are almost inevitable. Acid fluxes, suitable for plumbing, can literally eat up the relatively fragile parts used for electronic components. Totally neutral acids, which may be preferred for the foregoing reasons, may not break through the surface oxides intrinsic to the metal surfaces of the parts or those oxides intrinsic to the metal surfaces of the parts or those oxides developed in time by the environment and duration of inventory. A case of nerves and the resulting jitter, while solder is liquid, can easily spoil a solder joint and, of course, too much heat will also do so. Pores and fractures in a solder joint evidence an over application of heat caused by sudden out gassing. Lumpy appearance and cold joints evidence too little heat. In pot or wave solder baths, surface dross can and does plague all operations. An accidental introduction of organics, or build up in time of such ingredients to brighten solder, can cause dewetting, voiding, oxidation, and poor appearance problems. In a word, bad chemistry, bad metallurgy, bad practices all can limit solder as an electrical connection medium.
- The art of crimping is usually performed by pressure application, in a tool, on a portion of a metal terminal to inelastically deform such about a bare electrical wire. The terminal/tool system assures excellent terminal/wire joints repeatedly with little skill required. Crimping typically takes a great deal of energy and even with small wires/ terminal crimps can demand 80-115 cm Kg (70 to 100 inch pounds) of work with die forces frequently exceeding 450-680 Kg (1000-1500 pounds). Larger sizes of terminal/wire indeed require forces of many thousands of pounds. Moreover, crimping usually calls for precision displacement of dies to effect the necessary deformation and tolerances between 0.0025 and 0.0076 cm (0.001 and 0.003 inches) are not uncommon. Thus high force and close tolerance characterizes most quality crimps. As can be appreciated, high forces and close tolerances mean precision die surfaces and precision tool linkages which inescapeably mean cost. Additionally, high forces call for tooling dies that are quite strong and capable of bearing repeated forces and frictional engagements of the metal deformation of terminals. That fact dictates a certain size limitation, width and height, beef, if you will, limiting how close terminals may be fixed in connectors and still be crimped by practical dies. It limits how many wires can be crimped simultaneously without having to have a multi- ton force mechanism such as a press. In a word, high force, precision and size of crimping dies all act as major recognized limitations on crimping as a termination technology. For a more complete understanding of the foregoing, reference is made to the following text: "Physical Design of Electrical Systems," Volume III, Integrated Devices in Connection Technology,
Chapter 10; authored by members of The Bell Telephone Laboratories, Copyright 1971 Prentiss Hall Inc., Englewood Cliffs, N.J. - The concept of IDC involves stuffing an insulated wire into a slot in a metal portion of a terminal. It has evolved in two ways for separate reasons. An early use of IDC is shown in U.S. Patent No. 3,320,345 to J. E. Marley issued May 16, 1967. There, insulation displacement was employed to essentially effect stripping so as to handle very small solid wires where removal of insulation proved difficult and time consuming. A second aspect of IDC relates to the situation where, by the use of insulation displacement, improved productivity could be obtained due to the fact that relatively large multiples of wires could be terminated simultaneously, essentially because the forces of termination are relatively low, being measured in the tens of pounds for wire gages on the order of 18 to 26 AWG (0,4-1,0 mm), rather than in hundreds of pounds or thousands of pounds as in the case of crimp technology. Reference may be made to U.S. Patent No. 3,012,219 to E. J. Levin et al issued December 5, 1961, for a description of this latter type of IDC use.
- In fact, IDC use has been more spurred by increased productivity than by merely its advantage in stripping insulation. Productivity improvements utilizing IDC have resulted in labor cost reductions per termination on the order of 50 to 70 percent, particularly where the IDC concept is employed in pre-loaded multiple connectors.
- The main problem with IDC is a perception that what goes in easily comes out easily. Despite efforts to allay this perception by fixes with metal or plastic insulation gripping structures, many users have refrained from employing IDC technology. The success and reliability of proven solder and crimp technology has, to some extent, inhibited the use of IDC concepts.
- For a good overall understanding of the IDC technology, reference is made to AMP Incorporated publication HB5351, revision B, "Introduction to AMP Insulation Displacement Techniques and Products published by AMP Incorporated," Copyright 1976,1979 by Arlen Crandall.
- In summary, solder can be an excellent electrical terminal terminating technique but one must control the five critical factors or else suffer bad joints, crimp works well with little skill but takes high forces and precision tooling and is limited in center-to-center application and for multiple wire applications; and IDC gives productivity increases and self stripping but can come apart if one can pull or push the wire out of the slot that is the basis of the technology.
- It is known from GB-A-377 160 to terminate an insulated conductor wire to a slotted terminal formed with a solder coating extending along a slotted portion by positioning a stripped portion of the insulated conductor wire in the slot and reflowing the solder to effect a solder joint between the conductor wire and the terminal.
- It is an object of the present invention to gain the benefits of a controlled solder joint with the benefits of the insulation displacement technology.
- A method of terminating having the features acknowledged to be known from GB-A-377160, according to the invention is characterised in that the insulated conductor is driven into the slot to effect insulation displacement from a wire core portion gripped and frictionally abraided between opposite sides of the slot to effect electrical and mechanical connection therebetween, and then reflowing the solder at the slotted terminating portion to form a solder joint at the connection.
- A preferred embodiment is characterised in that a plurality of solder coated terminals are positioned in a housing with solder coated slotted terminating portions arranged in a row, insulated conductors are driven into slots of respective terminals to effect insulation displacement from wire core portions gripped and frictionally abraided between opposite sides of said slots to effect electrical and mechanical connection therebetween, and then reflowing the solder at the slotted terminating portions to form solder joints at the connections.
- Preferably solder reflow is effected by use of electromagnetic means to generate heat when the terminals are in the housing.
- Eddy current heating, as by induction, results in "internal" heat which can cause a melting and pull back of insulation away from the slot prior to actual solder reflow, at least with certain foamed types of insulation. This provides less potential for contamination of the solder, wire, and slot area.
- The invention will now be described, by way of example with reference to the accompanying partly diagrammatic drawings, in which:
- Figure 1 is a perspective view of one form of the invention showing a slotted portion of a terminal with an electrical wire poised for insertion;
- Figure 2 is a side elevation of the structure of Figure 1 showing the wire being inserted into the slot by a tool;
- Figure 3 is a perspective view of the structure of Figure 1 after the wire has been inserted;
- Figure 4 is a side elevation of Figure 3;
- Figure 4A is a perspective view of a wire which had been inserted and withdrawn to show deformation caused by the slot;
- Figure 5 is a perspective view, similar to Figure 3 after solder reflow;
- Figure 6 is a side elevation, similar to Figure 4, after solder reflow;
- Figure 7 is a vertical section through the terminal of Figure 6;
- Figure 8 is a perspective view of an alternate terminal structure terminating stranded wire;
- Figure 9 is a vertical section through the terminal of Figure 8 after solder reflow;
- Figure 10 is a perspective view of another alternate structure with an insulated wire exploded therefrom;
- Figure 11 is a perspective view, similar to Figure 10, with terminal wire fully inserted;
- Figure 12 is a side elevation, partially in section, of the terminal of Figure 11;
- Figure 13 is a side elevation, similar to Figure 12, showing the termination after solder reflow.
- Figure 14 is a side elevation, similar to Figure 13, of another alternate embodiment of a terminal incorporating the present invention;
- Figure 15 is a perspective view of a strip of terminals formed to utilize the present invention;
- Figure 16 is a perspective view of a single terminal from the strip of Figure 15;
- Figure 17 is a perspective view of a connector of a type suitable for use with the present invention;
- Figure 18 is a side elevation, partially in section, of the connector of Figure 17 in an electromagnetic heating device to effect solder reflow;
- Figure 19 is a perspective, partially broken away, of a terminal and inserted wire prior to solder reflow;
- Figure 20 is a vertical section through the terminal of Figure 19;
- Figure 21 is a vertical section, similar to Figure 20, early in the cycle of heating for solder reflow; and
- Figure 22 is a vertical section, similar to Figures 20 and 21, at the completion of solder reflow. The detailed description of the present invention is made with reference to Figures 1-4A.
- Figure 1 shows a conductor engaging portion of an
electrical terminal 10 formed by anupstanding plate portion 12 defining a pair ofsharp tines slot 18 therebetween and a taperingentry 20 leading to the slot. The terminal can be of any known type, such as that described in U.S. Patent No. 4,040,704, the disclosure of which is incorporated herein by reference. Anelectrical wire 22, formed by aconductor 24 covered by aninsulative layer 26, is poised aboveslot 18. The end of thewire 22 has been stripped of theinsulation 26 so that theconductor 24 is bare. In this particular illustration theconductor 24 is a solid copper conductor suitably tin plated in accordance with practice in the art of wire manufacture. - The terminal slotted
plate portion 12 is intended to represent the conductor engaging portion of anelectrical terminal 10 which is stamped and formed of conductive metallic sheet stock having spring properties such as brass, phosphor bronze, or beryllium copper. To give an appreciation of the relative sizes of things, thewire 22 can represent an AWG table wherein the diameter of theconductor 24 is roughly 0.000254 mm (0.010 thousands of an inch) with the outer diameter of theinsulation 26 being 0.00051 mm (0.020 thousands of an inch). Slotted plate structures like that shown in Figure 1 include a height H which is sufficient to define aslot 18 of depth SD allowing for the insertion of theconductor 22 as indicated in Figure 2, 3, and 4 with theconductor 22 being scrubbed by insertion in theslot 18 as it travels therealong. The width dimension SW of theslot 18 can be considered in the range between 40% to 80% of the diameter of theconductor 22. The beveled entry area at the top ofplate portion 12 is rendered at an angle 8 which is intended to guide or center insertion of thewire 22 so that theconductor 24 ends up in theslot 18 without being cut off or unduly deformed or pinched. - Figure 2 shows in side elevation, partially in section a
typical installation tool 28 which contains aslot 30 which fits overplate portion 12 and is arranged to press thewire 22 down into theslot 18, as shown in Figures 3 and 4. - In accordance with IDC procedures the length of the
slot 18 is such that theconductor 24 can be moved therealong for between 1 ' to 2) times the diameter ofconductor 24 without bottoming theslot 18 so as to be unduly pinched or deformed and yet to get a good scrubbing and wiping action to remove, in the case of the embodiment heretofore discussed, oxide films on theconductor 24 by a mashing and inelastic deformation of the bulk of the conductor smearing, spearing and deforming the in coating thereon and generally scrubbing the surfaces thereof along with the inner surfaces of theslot 18. Figure 4A shows a kind of permanent deformation ofconductor 24 which results from proper proportioning of the width SW of theslot 18 relative to the diameter of theconductor 24. - Thus far the disclosure heretofore given follows the general teachings of IDC practice outlined in the previously cited publication concerning IDC. There is a distinction, however, with respect to the present invention relative to the thinking behind insulation displacement and it lies with the desired spring characteristics for IDC relative to the structure of the present invention. With IDC concepts the structure of
plate 12 is designed to have dimensions H, T and SW such that when aconductor 24 is stuffed or forced into theslot 18, theplate 12 is elastically deformed transversally to theslot 18 to store energy and maintain a forceful engagement with theconductor 24 and the surfaces ofslot 18 throughout the life of the resulting connection. What this means is that there is sufficient stored energy to accommodate the inelastic creep that results. If theplate 12 were perfectly rigid and gave not at all there would be no reserve energy and no follow up displacement to maintain the engagement with the wire orconductor 24, other than that within theconductor 24 itself which, because of its dimensions, is relatively less than could be stored in theplate 12. - With respect to the present invention, the purpose of the
slot 18 and plate .12 is to strip awayinsulation 26 or oxide films, to rub and scrub the relative engaging surfaces ofconductor 24 andslot 18, and to fixture theconductor 24 withinslot 18 in a firm manner. In the present invention, stored energy and displacement force fromplate 12 toconductor 24 and the surfaces thereof are not only not necessary, but should be limited where possible and practical. The reason for this is that the present invention relates to a solder or eutectic joint and stored energy, once this is accomplished, can only create stresses which are undesirable. Of course, as part of the invention, it is necessary to have insulation displacement and wire deformation for oxide removal, scrubbing and cleaning of the slot and conductor surfaces and fixturing, plus adequate engagement for heat transfer and reflow. All of these mean that there must be some deformation and both elastic and inelastic deformation of not only theconductor 24, but of theplate 12. The point is that where IDC needs a structure which generates an appreciable residual spring force to follow through with creep, the basis of slotted beam structure, in the present invention and the interface perfected by practice in the present invention a more rigid structure is desired. Generally this can be accomplished by making H less, T greater and using harder material than with normal IDC practice. - Referring again to Figures 1 through 4A, one will see that there is a
coating 32, which represents a solder or eutectic coating, on at least theplate portion 12 of the terminal 10. This coating may be effected in a number of ways, preferably by electro plating in a manner to keepingslot 18 clear, or reasonably clear, and the edges that define the slot sufficiently sharp to do the job of oxide and insulation film or covering displacement. Thecoating 32 is shown in Figures 1-4 as covering the entire surface ofplate portion 12 and in practice this has been done with respect to various samples. In an actual example the structure shown in Figure 1-4A had the following dimensions: - H = 0.060-0.065 inches; 0.152-0.165 cm
- T = 0.010 inches; 0.025 cm
- W = 0.057 inches; 0.145 cm
- SW = 0.010 inches; 0.025 cm
- SD = 0.045 inches; 0.114 cm
- Coating = 0.001" 0.025 mm of 63/37 tin lead eutectic
- 8 = 40%
- Flux used - Superior Flux & Mfg. Co. - No. 30
- Conductor diameter = 0.013 inches; 0.33 mm
- In this example the material of the terminal 10 was BeCu 145, a hard. It was prepared by cleaning using standard electro plating practices and the plating applied was a 63/37 tin lead eutectic having a liquid temperature of 183°C (361°F), with no pasty range. With the foregoing dimensions a
coating 32 of 0.025 mm (0.001 inches) in thickness was found to be sufficient to effect the job of soldering theconductor 22 toterminal 10. Coating of thicknesses of 0.051-0.076 mm (0.002 and 0.003 inches) were also utilized with good results. The coating of 0.025 mm (0.001 inches) was found to be enough and the coating of 0.075 mm (0.003 inches) was found to be not too much. Electro deposited tin lead eutectic of 90/10 type having a 183°-217°C (361°F-421°F) range was also tried with adequate results, but the 63/37 eutectic is preferred. - It is worth noting that the invention contemplates application of eutectics and
solder coatings 32 which may not extend over the entire surface ofterminal 10, but may be selectively applied as by masking. It is also contemplated that eutectics may be applied by laminating, molten dipping, printing, silkscreening, plating, spraying, inlaying, mechanical attachment or the like. Those skilled in the art will also appreciate that it is preferable to apply the solder after forming the terminals as normal tin lead solder will rapidly dull dies. - Turning now to Figures 5 through 7, the terminal of Figures 1 through 4A is shown after application of heat to cause reflow; whereas in Figure 5 the heat has caused the
coating 32 to melt and concentrate aroundslot 18 and theconductor 24 ofwire 22. One can see this particularly in Figures 6 and 7. A number of explanations have been made for why this flow of solder to the site of engagement of the conductor and slot occurs. Capillary, meniscus, surface tension are terms that have been used to describe this phenomenon. Suffice to say it does happen and it happens regardless of the attitude of thewire 22 and terminal 10 or the influence of gravity to result in a reliable and excellent electrical and mechanical termination of theconductor 24 to the terminal 10. - While the terminations shown in Figures 1 to 9 have been with stripped wire, it should be quite clear to those skilled in the art that the present invention is equally applicable to insulated wire which requires the terminal to pierce or displace the insulation to effect termination.
- In actual examples, where the liquid temperature of the
coating 32 was approximately 183°C (361°F) sufficient heat was applied to result in the soldering action in a number of different ways. For example, in one example a jet of hot nitrogen was used to effect the solder reflow. It is contemplated that hot oil, having a temperature well in excess of the phasing temperature of the eutectic, may also be employed. Alternately, resistance heating, infrared, laser and as will be described in detail hereinafter, a type of eddy current heating resulting from the focusing of electromagnetic alternating fields may be used. - Figures 8 and 9 show an
alternate terminal 34 terminating a strandedwire 36 applied in accordance with the invention. This terminal has a folded slotted plate portion similar to that described in U.S. Patent No. 4,261,624, the disclosure of which is incorporated herein by reference. It has been found that the invention is particularly useful with respect to pre-tinned stranded wire. Referring back to Figure 1, the reason is that in many of the commercial IDC structures which have been used over the years the practical thickness W of theplate portion 12 is thin enough to cut strands when taken with the width SW of the slot necessary to generate stored energy onto the stranded wire to effect an IDC connection. Alternatively, the slot width SW and the thickness T have been designed to cut through or breakthrough insulation resulting in a structure which tends to cut stranded conductors. This is particularly true with respect to multiple wire termination where the placement of the wire is less than in the application of one wire into one slotted plate. Figure 9 shows that the solder coating will reflow filling the void between the folded plates of this embodiment while securing the stranded wire therein. - With respect to the single plate slotted beam configuration of Figures 1 to 7, practice of the present invention and manufacture thereof is relatively straightforward. The terminal embodiments shown in Figures 8 to 14 are three alternates or variations of the invention wherein the termination portion is made to receive 'an insulated wire having a conductor surrounded by insulation. In each embodiment the slotted plate portion is folded over to include a U-shaped portion.
- The embodiment of Figures 8 and 9 provides a redundancy of interface formed by a pair of
plates bights slot solder coating 50 can be applied only to the inside region between theplates coating 50 can be pre-applied as a stripe, or stripes, by either selective electroplating or inlaying of a solder pre-form roughly 0.025 mm (0.001 inches) thick. The bights of this embodiment are closed tightly so that reflow tends to wick between the interior surfaces. - Inclusion of a fairly thick film or covering of insulation does not appreciably interfere with the operation of the invention wherein the reflowing of solder tends to flow in around the wire and slot to effect termination. An ultimate test is to pull
wire terminal - Figures 10 to 13 show a further embodiment of the present invention wherein the terminal 52 includes a folded over plate similarto the embodiment of Figures 8 and 9. In this embodiment the
plates upper portions bights lower portions plates slots wire 74 is inserted, itsinsulation 76 will be split by theslots upper portions plates bare conductor 78 is driven into and down theslots insulation 76 can be seen totally separated in Figures 12 and 13. These figures also show the skiving action of theslots conductor 78. It should also be noted, from Figure 13, that theinsulation 76 can be pulled back by the heat of the reflow operation and/or pushed back by the reflowed solder. - Figure 14 shows a further modification of the terminal of Figures 10 to 13 which includes an additional separate slotted
blade portion 80 intended to be a further electrical interface with theconductor 78 forced therein. Here again this embodiment is intended for especially thick insulations requiring substantial strength in the terminal. - Figures 15 and 16 show a
strip 79 of electrical terminals and asingle terminal 81, respectively, stamped and formed to include a terminatingportion 82 having dual slotted plates for redundancy and suitable coated with solder 84 and front-end contact withspring fingers 86 intended to mate with conductive portions of like terminals. This terminal is of the type described in the previously mentioned U.S. Patent No. 4,040,704. The terminatingportion 82 includes slottedplates wire 92 which tends to load the spring elements of the slotted plates in torsion giving a different clamping or fixing action relative to stripping and fixturing of the conductor 94 of thewire 92. In addition, it will be noted when the individual terminals are separated from thecarrier strip 96, aregion 98 of reduced metallic cross sectional area is formed wherein terminal lockingspring elements 100 have been struck-out from the plane of the metal. This region can be controlled in width to sharply limit the transfer of heat from the region of the slottedplates spring fingers 86 to prevent annealing of the contact spring fingers. The bulk of the metal in the region of 98 need only be thick . enough to be structurally adequate to hold the terminal together in use and, depending upon the thermal conductivity of the metal, adequate to carry current without excessive resistance. - Figure 17 is a perspective view of a representative
electrical connector 102 containingnumerous terminals 104 terminating a like number ofwires 106. Figure 18 shows theconnector 102 proximate to atool 108 which has ferritemagnetic pole pieces connector terminals 104 to thewires 106. Regardingtool 108, reference is made to U.S. Patent No. 4,359,620 dated November 16, 1982, to Joseph R. Keller which shows an induction heating apparatus having shaped ferrite pole pieces which focus or concentrate a field of high flux density. An alternating field is produced, indicated by the broken lines betweenpole pieces wire 106 and heating of the metal conductor thereof. The surrounding plastic housing 101 ofconnector 102 and the wire insulation are not affected by the field, while the focus of the field concentrated in the termination zone creates intense heating of the conductor metal and solder. - Figures 20 to 22 show the effect of heat generation by the eddy current. In Figures 19 and 20, prior to heat generation, a termination slot of a terminal 104 is shown in section with
conductor 106 in the slot and itsinsulation 114 split, as frequently happens with the PVC, polypropylene, or polyethylene insulation in wide use in industry. Figure 21 shows the resulting melt and pull back ofinsulation 114 before reflow of the solder coating on theterminal 104. - Figure 22 shows the terminal 104 after reflow, with the insulation pulled away, and the solder joint formed. This insulation pull back happens best with eddy current heating where the heat comes from the terminal 104, rather than from an external source, such as with hot nitrogen, vapor phase, resistance or infrared heating which tend to "cook" from the outside surfaces rather than generate heat in the surfaces of the metal parts.
- Figure 18 also shows the
connector 102 with wires terminated. Essentially no damage is done to the housing 101 if the application of heat is quick. With the abovementioned Keller induction heating system, focused alternating electromagnetic field cycle times of a few seconds are possible. In general this time cycle is a function of the focus of field, the frequency of alternation and the properties of the material to be heated. As taught in Keller, frequencies of between 20 and 200 Khz have been tried using the Keller unit and apparatus. The eddy current heating approach is a preferred way when using connector housings pre-loaded with many terminals. Commercial induction machines with special coils may also be employed, as other means discussed, with results varying from barely adequate to excellent. - With regard to the practice of the invention, it will be appreciated that the structures heretofore described and shown assure that four of the five critical parameters for solder are "built in". The right solder is factory applied in construction and manufacture of the terminal for prescribed types of wire and cable. The slot and action of conductor insertion operate to assure cleaning action. The slot and plate structure assures the right fixturing to hold things still and promotes the right pressure of parts for heat transfer. By using eddy current heating from a machine with fixed pole pieces, which precisely focus the magnetic field and an appropriate timing current, the fifth parameter of right amount of heat can also be assured.
- The phenomena of solder flow to the site of conductor slot interface and the pull back of insulation by virtue of heating occur over a fairly broad range of application parameters, nevertheless and these discoveries are deemed significant to the practice and advantage of the invention.
- It should be noted that Figures 20 to 22 represent almost a classic case for effecting termination with the present invention. In most instances where the wire is not prestripped, the insulation is cut only on both sides and may remain intact above and below the conductor as shown in Figures 19 and 20. This usually, but not always, will separate during the heating cycle.
- Any of a number of fluxes can be used with the present invention. For example, a water soluble flux could be applied immediately before reflow. If it were also electrically nonconductive and noncorrosive, it could simply be washed away after reflow. It would also be possible to precoat the terminals with an oxidizing inhibitor which would act as a cleaning agent.
Claims (3)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US66174484A | 1984-10-17 | 1984-10-17 | |
US661744 | 1984-10-17 |
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EP0201512A1 EP0201512A1 (en) | 1986-11-20 |
EP0201512B1 true EP0201512B1 (en) | 1989-08-16 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP85904574A Expired EP0201512B1 (en) | 1984-10-17 | 1985-09-13 | Select solder slot termination method and product |
Country Status (8)
Country | Link |
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EP (1) | EP0201512B1 (en) |
JP (1) | JPS62500621A (en) |
KR (1) | KR880700479A (en) |
BR (1) | BR8506983A (en) |
DE (1) | DE3572425D1 (en) |
ES (2) | ES8703673A1 (en) |
IE (1) | IE56877B1 (en) |
WO (1) | WO1986002497A1 (en) |
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---|---|---|---|---|
JPS6380492A (en) * | 1986-09-24 | 1988-04-11 | 京セラエルコ株式会社 | Wiring of connector |
US5032703A (en) * | 1988-11-29 | 1991-07-16 | Amp Incorporated | Self regulating temperature heater carrier strip |
JP2891317B2 (en) * | 1993-02-03 | 1999-05-17 | 矢崎総業株式会社 | ID terminal |
EP0881708B1 (en) * | 1997-05-30 | 2003-10-15 | Yazaki Corporation | Connection structure of wire and terminal, connecting method therefor and a terminal |
DE19755719C2 (en) * | 1997-12-15 | 2002-11-07 | Bosch Gmbh Robert | Contact of a solder joint |
DE10129840B4 (en) * | 2001-06-21 | 2020-10-08 | Robert Bosch Gmbh | Electric device |
JP5532083B2 (en) | 2011-10-06 | 2014-06-25 | 株式会社デンソー | Ignition coil for internal combustion engine |
FR2983648B1 (en) * | 2011-12-01 | 2018-04-13 | Sc2N | ELECTRICAL CONNECTOR CONTACT FOR CONNECTING A WIRE TO AN ELECTRONIC COMPONENT |
JP5699949B2 (en) * | 2012-01-23 | 2015-04-15 | Tdk株式会社 | Coil parts manufacturing method and wire connecting method |
TWI460944B (en) * | 2012-09-07 | 2014-11-11 | Chief Land Electronic Co Ltd | Method and structure of solder terminal clasped with solder and connector therof |
DE102019122923A1 (en) * | 2019-08-27 | 2021-03-04 | Lisa Dräxlmaier GmbH | ARRANGEMENT FOR ELECTRICALLY CONTACTING AN ELECTRICAL CONDUCTOR |
CN212805563U (en) * | 2020-07-20 | 2021-03-26 | 漳州立达信灯具有限公司 | Metal piercing terminal and lamp |
JP7155218B2 (en) * | 2020-10-07 | 2022-10-18 | 矢崎総業株式会社 | IDC structure, electric wire with terminal and manufacturing method thereof |
US20240113452A1 (en) * | 2022-10-04 | 2024-04-04 | Te Connectivity Solutions Gmbh | Wire Tap Connector with Insultation Displacement Contact |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB377160A (en) * | 1930-01-13 | 1932-07-21 | British Thomson Houston Co Ltd | Improvements in and relating to terminals for conductors |
AU5574573A (en) * | 1972-05-30 | 1974-11-21 | Amp Inc | Electrical contact elements and connectors electrical contact elements and connectors |
NZ182873A (en) * | 1976-01-02 | 1980-11-28 | Amp Inc | Wire slitting terminal and integral housing for same |
CA1115796A (en) * | 1980-07-03 | 1982-01-05 | Northern Telecom Limited | Retainer member with dual action cantilever beams |
-
1985
- 1985-09-13 JP JP60503991A patent/JPS62500621A/en active Pending
- 1985-09-13 WO PCT/US1985/001743 patent/WO1986002497A1/en active IP Right Grant
- 1985-09-13 KR KR1019860700354A patent/KR880700479A/en not_active Application Discontinuation
- 1985-09-13 BR BR8506983A patent/BR8506983A/en unknown
- 1985-09-13 DE DE8585904574T patent/DE3572425D1/en not_active Expired
- 1985-09-13 EP EP85904574A patent/EP0201512B1/en not_active Expired
- 1985-09-20 IE IE2321/85A patent/IE56877B1/en unknown
- 1985-10-16 ES ES547905A patent/ES8703673A1/en not_active Expired
- 1985-10-16 ES ES1985289644U patent/ES289644Y/en not_active Expired
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IE852321L (en) | 1986-04-17 |
WO1986002497A1 (en) | 1986-04-24 |
ES547905A0 (en) | 1987-02-16 |
DE3572425D1 (en) | 1989-09-21 |
BR8506983A (en) | 1987-01-06 |
EP0201512A1 (en) | 1986-11-20 |
KR880700479A (en) | 1988-03-15 |
ES8703673A1 (en) | 1987-02-16 |
ES289644U (en) | 1986-03-01 |
JPS62500621A (en) | 1987-03-12 |
ES289644Y (en) | 1986-10-01 |
IE56877B1 (en) | 1992-01-15 |
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