JP2011165776A - Three-terminal capacitor and method of mounting the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a three-terminal capacitor, along with a method of mounting the same, capable of preventing a short circuit between lands in a mounting part, and capable of enhancing the mounting quality. <P>SOLUTION: The three-terminal capacitor 1-1 includes a chip 2 involving a through-electrode 3 and ground electrodes 4-1 and 4-2, external electrodes 5-1 and 5-2, and a ground external electrode 6. Further, the central part of the three-terminal capacitor 1-1 is provided with a through-bore 7 penetrating the central part of the ground external electrode 6 and the chip 2. By this arrangement, when such a situation that a solder 300 is lifted up from a through-hole 210 is caused, the lifted-up solder is allowed to escape into the through-bore 7, thereby preventing short circuit between a ground-side connecting land and a hot-side connecting land in which the three-terminal capacitor 1-1 is mounted. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a feedthrough type three-terminal capacitor mounted on a pair of hot-side connection lands and one ground-side connection land on a substrate, and a mounting method thereof.

Conventionally, in order to reduce the equivalent series inductance (ESL) of this type of three-terminal capacitor when used for supplying electric power to a power supply of a high-speed IC, various mounting devices have been devised.
FIG. 17 is a perspective view showing a partially broken three-terminal capacitor mounting structure according to a conventional example.
The three-terminal capacitor mounting structure shown in FIG. 17 is a technique disclosed in Patent Document 1, and the equivalent series inductance of the entire structure is reduced by regulating the direction of the current flowing on the ground side connection land.
Specifically, a ground-side connection land 203 is arranged below the circumferential ground external electrode 101 that wraps around the central body of the three-terminal capacitor 100, and a through-hole 210 whose lower end is connected to a ground (not shown). , Formed at the center of the ground side connection land 203. Then, the ground external electrode 101 of the three-terminal capacitor 100 and the ground side connection land 203 are connected by soldering by reflow processing.
Thereby, the noise currents I1 and I2 flowing out from the ground external electrode 101 of the three-terminal capacitor 100 flow from opposite directions toward the through hole 210, flow into the through hole 210, and are discharged to the ground (not shown).
Therefore, since the noise currents I1 and I2 flow so as to face each other in opposite directions, the magnetic fields generated by the respective currents cancel each other, and an equivalent series between the ground external electrode 101, the ground side connection land 203, and the through hole 210 is obtained. Inductance is reduced. As a result, the total equivalent series inductance including the three-terminal capacitor 100 and the substrate can be reduced.

JP 2003-282348 A

However, the conventional techniques described above have the following problems.
FIG. 18 is a cross-sectional view for explaining the problems of the prior art.
In FIG. 17, there may be a structure in which a land (not shown) is provided at a position directly behind the mounting surface of the three-terminal capacitor 100 and the through hole 210 is connected to the land. In such a structure, when a three-terminal capacitor 100 is mounted and a chip component such as a three-terminal capacitor (not shown) is to be soldered to the land on the back side of the substrate by reflow processing, the land on the land is shown in FIG. The melted solder 300 may flow into the through hole 210 and protrude from the opening on the three-terminal capacitor 100 side. When such a phenomenon occurs, the raised solder 300 is pushed by the lower surface of the three-terminal capacitor 100 and spreads from both sides (left and right sides in FIG. 18) of the ground side connection land 203 toward the hot side connection lands 201 and 202. There is a possibility that the ground side connection land 203 and the hot side connection lands 201 and 202 are short-circuited.
In this prior art, the circular ground external electrode 101 is applied to the three-terminal capacitor 100 to connect the ground external electrode 101 and the ground-side connection land 203, as shown in FIG. As described above, also in the case of the three-terminal capacitor 100 ′ using a pair of ground external electrodes 101 ′ and 101 ′ having a U-shaped cross section, the solder 300 protrudes from the through hole 210 and is short-circuited as described above. An accident may occur.

  The present invention has been made to solve the above-described problem, and provides a three-terminal capacitor capable of preventing a short circuit between lands in a mounting portion and improving the mounting quality, and a mounting method thereof. Objective.

In order to solve the above-described problems, the invention of claim 1 includes a chip body formed of an insulating member, a through electrode embedded in the chip body and having front and rear ends exposed at the front and rear surfaces of the chip body, A ground electrode facing the through electrode in the vertical direction and having both ends exposed on both side surfaces of the chip body, and first and second electrodes formed on the front and rear surfaces of the chip body and electrically connected to both ends of the through electrode, respectively. A three-terminal capacitor comprising a second external electrode and a circular ground external electrode provided so as to wrap around the center of the body of the chip body and electrically connected to both ends of the ground electrode, A through hole that penetrates from the center of the lower surface of the electrode in the vertical direction of the body portion of the chip body is provided. Between the inner hole of the through electrode, by interposing an insulating member, the through electrode is configured to set so as not to be exposed in the through hole.
With such a configuration, the first and second hot-side connection lands are arranged on the substrate at a predetermined interval, and the ground-side connection land having a through hole at the center is formed by the first and second hot-side connection lands. When disposed in the central space between them, the three-terminal capacitor of the present invention can be mounted on these ground side connection lands and the first and second hot side connection lands.
Specifically, the first and second external electrodes of the three-terminal capacitor are placed on the first and second hot-side connection lands, and the through hole is positioned directly above the through hole. The ground external electrode is placed on the ground side connection land. Thereafter, by performing a reflow process, the first and second external electrodes can be connected to the first and second hot-side connection lands, and the ground external electrode can be connected to the ground-side connection lands. This completes the mounting of the three-terminal capacitor.
Incidentally, a land may be provided at a position directly behind the mounting surface of the three-terminal capacitor, and a through hole may be connected to this land. In such a case, if a chip component such as a three-terminal capacitor is to be soldered to the land by a reflow process with the three-terminal capacitor mounted, the melted solder may flow from the through hole. Then, this solder rises from the through-hole opening of the ground side connection land to which the three-terminal capacitor is connected, and tends to spread toward the first and second hot side connection lands.
However, by mounting the three-terminal capacitor of the present invention as described above, the solder raised from the through hole enters the through hole from the opening of the through hole located at the center of the lower surface of the ground external electrode, and the first and It does not spread to the second hot side connection land side. Therefore, during the reflow process on the back surface side, there is no situation where the solder spreads and the ground side connection land and the first and second hot side connection lands are short-circuited.
Further, in the three-terminal capacitor of the present invention, the hole through the through electrode is set to have a larger diameter than the through hole, and between the outside of the through hole located in the hole and the inside of the through electrode hole, Since the insulating member is interposed so that the through electrode is not exposed in the through hole, the solder that has entered the through hole does not come into contact with the through electrode.
When a noise current is generated in the wiring to which the first and second hot side connection lands are connected in a state where the three-terminal capacitor is mounted, the noise current is generated from one of the first and second external electrodes of the three-terminal capacitor. It flows into the through electrode and is discharged from the ground external electrode to the ground side connection land through the ground electrode opposite to the through electrode. At this time, since the noise current flows on the ground side connection land from opposite directions toward the center through hole, the magnetic fields generated by the respective currents cancel each other, and the ground external electrode, the ground side connection land, and the through hole The equivalent series inductance between is reduced.

According to a second aspect of the present invention, there is provided a chip body formed of an insulating member, a through electrode embedded in the chip body and having front and rear ends exposed at the front and rear surfaces of the chip body, and opposed to the through electrode in the vertical direction. A ground electrode having both ends exposed on both side surfaces of the chip body; first and second external electrodes formed on the front and rear surfaces of the chip body and electrically connected to both ends of the through electrode; A bent first ground external electrode formed from one side surface to at least a lower surface edge portion and connected to one end portion of the ground electrode in the center portion of the body body, and the body center portion of the chip body And a bent second ground external electrode formed from the other side surface to at least the lower surface edge and connected to the other end of the ground electrode. A through hole penetrating in the vertical direction from the central portion of the bottom surface of the body portion is provided, and the hole extending through the through electrode is set to have a larger diameter than the through hole, and the outside of the through hole located in the hole and the through electrode An insulating member is interposed between the inside of the through hole and the through electrode is set not to be exposed in the through hole.
With such a configuration, the first and second external electrodes of the three-terminal capacitor are placed on the first and second hot side connection lands, and the through hole is positioned directly above the through hole. The first and second ground external electrodes can be placed on the ground-side connection land. Thereafter, by performing a reflow process, the first and second external electrodes are connected to the first and second hot-side connection lands, and the first and second ground external electrodes are connected to the ground-side connection land. can do.
Further, even if a situation occurs in which the solder rises from the through hole, the solder enters the through hole from the opening of the through hole located at the center of the lower surface of the body portion of the chip body. There is no situation where the ground side connection land and the first and second hot side connection lands are short-circuited by spreading to the second hot side connection land side.
Also, in this three-terminal capacitor, the hole through the through electrode is set to have a larger diameter than the through hole, so that the solder that has entered the through hole does not come into contact with the through electrode.

According to a third aspect of the present invention, in the three-terminal capacitor according to the second aspect, a conductive film is attached to the inner wall of the through hole, and the conductive film and the ground electrode are electrically connected.
With this configuration, when a situation occurs in which the solder rises from the through hole, the solder enters the through hole from the opening of the through hole located at the center of the lower surface of the body portion of the chip body and passes through the conductive film. Since it is electrically connected to the ground electrode, the ground electrode inside the chip body and the external through-hole are electrically connected via solder.

According to a fourth aspect of the present invention, there is provided an insulating chip body, a through electrode embedded in the chip body and having front and rear ends exposed at the front and rear surfaces of the chip body, opposite to the through electrode in the vertical direction, and both ends thereof A ground electrode exposed on each side of the chip body; first and second external electrodes formed on the front and rear surfaces of the chip body and electrically connected to both ends of the through electrode; and the body of the chip body A three-terminal capacitor that is provided so as to wrap around the central portion of the ground electrode and is electrically connected to both ends of the ground electrode. It is set as the structure which provided the recessed part dented only predetermined height upwards over the lower surface.
With this configuration, the first and second external electrodes of the three-terminal capacitor are placed on the first and second hot-side connection lands, and the concave portion is positioned directly above the through hole. The electrode can be placed on the ground side connection land. Thereafter, by performing a reflow process, the first and second external electrodes can be connected to the first and second hot-side connection lands, and the ground external electrode can be connected to the ground-side connection lands.
Even if the solder is raised from the through hole, the solder enters the recess located at the center of the lower surface of the ground external electrode, so that the solder is connected to the first and second hot-side connections. There is no situation where the ground side connection land and the first and second hot side connection lands are short-circuited.

According to a fifth aspect of the present invention, there is provided an insulating chip body, a through electrode embedded in the chip body and having front and rear ends exposed at the front and rear surfaces of the chip body, opposite to the through electrode in the vertical direction, and both ends thereof A ground electrode exposed on each side of the chip body; first and second external electrodes formed on the front and rear surfaces of the chip body and electrically connected to both ends of the through electrode; and the body of the chip body A bent first ground external electrode formed from one side surface to at least a lower surface edge portion and connected to one end portion of the ground electrode in the central portion of the chip portion, and the other in the central portion of the body portion of the chip body. A three-terminal capacitor comprising a bent second ground external electrode formed at least from the side surface to the lower surface edge and connected to the other end of the ground electrode, the body of the chip body A structure in which a concave portion concaved by a predetermined height upward from the plane central part.
With this configuration, the first and second external electrodes of the three-terminal capacitor are placed on the first and second hot-side connection lands, and the concave portion is positioned directly above the through hole. The second ground external electrode can be placed on the ground-side connection land. Thereafter, by performing a reflow process, the first and second external electrodes are connected to the first and second hot-side connection lands, and the first and second ground external electrodes are connected to the ground-side connection land. can do.
Further, even if a situation in which the solder rises from the through hole occurs, the solder enters the recess located at the center of the lower surface of the body portion of the chip body, so that the solder is connected to the first and second hot side connections. There is no situation where the ground side connection land and the first and second hot side connection lands are short-circuited.

According to the invention of claim 6, a three-terminal capacitor is provided at the center between the first and second hot side connection lands disposed at a predetermined interval on the substrate and the first and second hot side connection lands. A 3-terminal capacitor mounting method for mounting on a ground-side connection land that is disposed in a space and has a through hole in the center thereof, wherein the 3-terminal capacitor is as claimed in any one of claims 1 to 3. Using a three-terminal capacitor, the first and second external electrodes of the three-terminal capacitor are connected to the first and second hot side connection lands, and the through hole is positioned directly above the through hole. The ground external electrode is connected to the ground side connection land.
With such a configuration, even if a situation occurs in which the solder rises from the through hole, the solder enters the through hole of the three-terminal capacitor from the opening of the through hole. There is no situation where the ground side connection land and the first and second hot side connection lands are short-circuited by spreading to the side connection land side.

According to the seventh aspect of the present invention, a three-terminal capacitor is provided at the center between the first and second hot-side connection lands disposed at a predetermined interval on the substrate and the first and second hot-side connection lands. A three-terminal capacitor mounting method for mounting on a ground-side connection land disposed in a space and having a through hole in the center thereof, wherein the three-terminal capacitor is a three-terminal capacitor. The first and second external electrodes of the three-terminal capacitor are connected to the first and second hot-side connection lands, and the ground external electrode is connected with the recess positioned right above the through hole. It is configured to be connected to the ground side connection land.
With such a configuration, even if a situation occurs in which the solder rises from the through hole, the solder enters the recess of the three-terminal capacitor, so that the solder spreads to the first and second hot-side connection lands. Thus, a situation in which the ground side connection land and the first and second hot side connection lands are short-circuited does not occur.

  As described above in detail, according to the present invention, the solder protruding from the through-hole toward the mounted three-terminal capacitor is released into the through-hole or the recess provided in the three-terminal capacitor, so that the ground side connection land And the first and second hot-side connection lands are prevented from being short-circuited, so that a high-quality three-terminal capacitor mounting board can be provided.

It is a perspective view which permeate | transmits and shows the inside of the 3 terminal capacitor | condenser which concerns on 1st Example of this invention. It is a disassembled perspective view which shows a 3 terminal capacitor | condenser. It is arrow AA sectional drawing of FIG. It is arrow BB sectional drawing of FIG. It is a perspective view which shows the mounting method of a 3 terminal capacitor | condenser. It is sectional drawing which shows the mounting method of a 3 terminal capacitor. It is sectional drawing for demonstrating the short-circuit prevention effect by a 3 terminal capacitor | condenser. It is sectional drawing which shows an equivalent series inductance reduction effect. It is a perspective view which shows the 3 terminal capacitor based on 2nd Example of this invention. FIG. 10 is a sectional view taken along the line CC in FIG. 9. It is sectional drawing for demonstrating the short-circuit prevention effect of a 3 terminal capacitor | condenser. It is a perspective view which shows the 3 terminal capacitor | condenser which concerns on 3rd Example of this invention. It is arrow DD sectional drawing of FIG. It is sectional drawing for demonstrating the short-circuit prevention effect of a 3 terminal capacitor. It is a perspective view which shows the 3 terminal capacitor based on 4th Example of this invention. It is arrow EE sectional drawing of FIG. FIG. 10 is a perspective view showing a part of a mounting structure of a three-terminal capacitor according to a conventional example. It is sectional drawing for demonstrating the problem of a prior art. FIG. 11 is a perspective view showing a partially broken three-terminal capacitor mounting structure according to another conventional example.

  The best mode of the present invention will be described below with reference to the drawings.

  1 is a perspective view showing the interior of a three-terminal capacitor according to a first embodiment of the present invention, FIG. 2 is an exploded perspective view showing the three-terminal capacitor, and FIG. FIG. 4 is a cross-sectional view taken along the line AA, and FIG. 4 is a cross-sectional view taken along the line BB in FIG.

  As shown in FIG. 1, the three-terminal capacitor 1-1 of this embodiment includes a chip body 2 including a through electrode 3 and ground electrodes 4-1 and 4-2, and an external electrode 5 as a first external electrode. -1 and an external electrode 5-2 as a second external electrode, and a ground external electrode 6.

The chip body 2 is formed of an insulating material, and the through electrode 3 and the ground electrodes 4-1 and 4-2 are laminated in the chip body 2.
Specifically, as shown in FIG. 2, the ground electrode 4-1 was formed on the insulating layer 21 constituting the chip body 2, and the insulating layer 22 was stacked on the ground electrode 4-1. And the penetration electrode 3 was produced | generated on the insulating layer 22, and the insulating layer 23 was laminated | stacked on the penetration electrode 3. FIG. Thereafter, the ground electrode 4-2 is formed on the insulating layer 23, and finally the insulating layer 24 is laminated on the ground electrode 4-2, whereby the through electrode 3 and the ground electrodes 4-1 and 4-2 are formed. The included chip body 2 was formed.
In the through electrode 3 formed in this way, the front end 3a and the rear end 3b are exposed on the front surface 2a and the rear surface 2b of the chip body 2 as shown in FIG.
On the other hand, as shown in FIG. 4, the ground electrode 4-1 is positioned on the lower side and faces the through electrode 3, and both ends 4 a and 4 b are exposed on both side surfaces 2 c and 2 d of the chip body 2. Yes.
Further, the ground electrode 4-2 is located on the upper side and faces the through electrode 3, and both ends 4a and 4b thereof are exposed on both side surfaces 2c and 2d of the chip body 2, respectively.

As shown in FIG. 1, the external electrodes 5-1 and 5-2 are respectively formed on the front surface 2 a side and the rear surface 2 b side (see FIG. 3) of the chip body 2 and are connected to the through electrode 3.
Specifically, as shown in FIG. 3, the external electrodes 5-1 and 5-2 have a U-shaped cross section, and are formed on both ends 3 a and 3 b of the through electrode 3 on the front surface 2 a and the rear surface 2 b of the chip body 2. Each is electrically connected.

  On the other hand, as shown in FIGS. 1 and 2, the ground external electrode 6 has a circular shape and is provided so as to wrap around the central portion of the body of the chip body 2. The ground external electrode 6 is electrically connected to both ends 4a and 4b of the ground electrodes 4-1 and 4-2 exposed on both side surfaces 2c and 2d of the chip body 2, as shown in FIG. .

In this embodiment, such a three-terminal capacitor 1-1 is provided with a through hole 7 as shown in FIG.
That is, as shown in FIG. 4, the through-hole 7 penetrates from the center of the lower surface 6 a of the ground external electrode 6 toward the upper portion of the body of the chip body 2 and opens at the upper surface 6 b of the ground external electrode 6.
Specifically, as shown in FIG. 2, the holes 7a to 7d having the same diameter communicated with the insulating layer 21 and the ground electrode 4-1, the insulating layer 22 and the through electrode 3, and the insulating layer 23 and the ground electrode 4-2. The holes 7e and 7f that are formed in the insulating layer 24 and communicate with the holes 7a to 7d are formed on the lower surface 6a and the upper surface 6b of the ground external electrode 6, respectively.

  Further, as shown in FIG. 2, the insulating layer 22 and the through electrode 3 are formed with the hole 7b constituting the through hole 7, but the through electrode 3 is also formed with the hole 30 having a diameter larger than that of the hole 7b. is doing. The hole 30 is set to have a diameter larger than that of the hole 7b, and an insulating member 20 that forms the chip body 2 is interposed between the outer side of the hole 7b and the inner side of the hole 30 so that the through electrode 3 has a hole. 7b is not exposed.

Next, a method for mounting the three-terminal capacitor of this embodiment will be described.
FIG. 5 is a perspective view illustrating a mounting method of the three-terminal capacitor 1-1, and FIG. 6 is a cross-sectional view illustrating a mounting method of the three-terminal capacitor 1-1.
As shown in FIG. 5, on the board 200 on which the three-terminal capacitor 1-1 is mounted, for example, a hot-side connection land 201 connected to an external power source (not shown) and a hot side connected to a power source terminal of an IC (not shown). Side connection lands 202 are provided at predetermined intervals. The ground side connection land 203 is disposed in a central space between the hot side connection lands 201 and 202. Further, a through hole 210 for reducing equivalent series inductance is provided at the center of the ground side connection land 203 and connected to a ground (not shown).

In order to mount the three-terminal capacitor 1-1 on the board 200, as shown in FIG. 6, the external electrodes 5-1 and 5-2 of the three-terminal capacitor 1-1 are placed on the hot-side connection lands 201 and 202. The ground external electrode 6 is placed on the ground-side connection land 203 with the through hole 7 positioned right above the through hole 210.
Thereafter, by performing a reflow process, the external electrodes 5-1 and 5-2 are connected to the hot-side connection lands 201 and 202, and the ground external electrode 6 is connected to the ground-side connection land 203 to obtain 3 The terminal capacitor 1-1 is completely mounted.

FIG. 7 is a cross-sectional view for explaining the short-circuit preventing effect of the three-terminal capacitor 1-1.
By the way, in the mounting state, the through-hole 210 is connected to a land (not shown) provided directly behind the mounting surface of the 3-terminal capacitor 1-1, and chip parts such as a 3-terminal capacitor (not shown) are reflowed on the land. May be soldered. In such a case, the melted solder 300 flows in from the through-hole 210 through the land-side opening, and as shown in FIG. 7, flows out from the opening 210a in the through-hole 210 of the ground-side connection land 203 and rises. There is a risk of spreading to the hot-side connection lands 201 and 202 side.
In the mounted state, the through hole 7 of the three-terminal capacitor 1-1 penetrates from the center portion of the lower surface 6a of the ground external electrode 6 in the upward direction of the body portion of the chip body 2, so that the through hole 7 is a through hole. Located just above 210. Therefore, the solder 300 raised from the opening 210a of the through hole 210 enters the through hole 7 from the hole 7e on the lower surface 6a of the ground external electrode 6 opened right above. For this reason, the solder 300 does not overflow from the through hole 210 and spread on the spaces S1 and S2 from both sides of the lower surface 6a of the ground external electrode 6.
Therefore, by using the three-terminal capacitor 1-1 of this embodiment, it is possible to prevent the occurrence of a situation in which the ground-side connection land 203 and the hot-side connection lands 201 and 202 are short-circuited by the raised solder 300. .

As described above, the solder 300 overflowing from the through-hole 210 enters the through-hole 7 of the three-terminal capacitor 1-1 and heads toward the upper surface 6b of the ground external electrode 6. Therefore, as shown by the broken line in FIG. However, it may be in a state of being in contact with the ground electrodes 4-1 and 4-2. In such a case, the ground electrodes 4-1 and 4-2 are directly connected to the through hole 210 through the solder 300.
On the other hand, when the solder 300 contacts the through electrode 3, the through electrode 3 and the ground electrodes 4-1 and 4-2 are short-circuited, which is not preferable. However, in the three-terminal capacitor 1-1 of this embodiment, the hole 30 of the through electrode 3 is set to have a larger diameter than the hole 7b of the through hole 7, and between the outside of the hole 7b and the inside of the hole 30. Since the insulating member 20 forming the chip body 2 is interposed so that the through electrode 3 is not exposed in the hole 7b, the solder 300 entering the through hole 7 is in contact with the through electrode 3. Absent.

FIG. 8 is a cross-sectional view showing an equivalent series inductance reduction effect.
In the mounted state of the three-terminal capacitor 1-1, when a high-frequency noise current is generated at the power supply terminal of the IC due to an IC switching operation or the like, the noise current is changed from the hot-side connection land 201 to the three-terminal capacitor 1 in FIG. -1 through the through electrode 3 through the external electrode 5-1. As shown in FIG. 8, noise currents I1 and I2 are discharged from the ground external electrode 6 to the ground-side connection land 203 through the ground electrodes 4-1 and 4-2. At this time, as indicated by arrows, the noise currents I1 and I2 flow on the ground side connection land 203 from opposite directions toward the central through hole 210. As a result, the magnetic fields generated by the respective currents I1 and I2 cancel each other, and the equivalent series inductance between the ground external electrode 6, the ground side connection land 203, and the through hole 210 is reduced.

  As described above, according to this embodiment, the solder 300 raised from the through hole 210 is released into the through hole 7 and the recess of the three-terminal capacitor 1-1, and the ground side connection land 203 and the hot side connection land 201, Since a short circuit with 202 is prevented, a high-quality three-terminal capacitor mounting board can be provided.

Next explained is the second embodiment of the invention.
FIG. 9 is a perspective view showing a three-terminal capacitor according to a second embodiment of the present invention, and FIG. 10 is a sectional view taken along the line CC in FIG.
This embodiment is different from the first embodiment in the configuration of the ground external electrode.
That is, as shown in FIG. 9, the three-terminal capacitor 1-2 of this embodiment has a pair of ground external electrodes 6-1 and 6-2.
Specifically, as shown in FIG. 10, the ground external electrode 6-1 as the first ground external electrode extends from the side surface 2 c to the edge of the upper surface 2 e and the lower surface 2 f at the center of the body portion of the chip body 2. As a whole, it forms a folded shape with a U-shaped cross section. The ground external electrode 6-1 is connected to the ends 4a of the ground electrodes 4-1 and 4-2, and the electrical connection between the ground external electrode 6-1 and the ground electrodes 4-1 and 4-2 is established. Is planned.
Further, a ground external electrode 6-2 as a second ground external electrode is formed from the side surface 2d to the edge of the upper surface 2e and the lower surface 2f at the center of the body portion of the chip body 2, and the ground external electrode 6-6. 2 also has a folded shape with a U-shaped cross section as a whole. The ground external electrode 6-2 is also connected to the ends 4b of the ground electrodes 4-1 and 4-2, and electrical connection between the ground external electrode 6-2 and the ground electrodes 4-1 and 4-2 is performed. Is planned.

In the three-terminal capacitor 1-2 having such ground external electrodes 6-1 and 6-2, the through hole 7 is formed only in the chip body 2.
Specifically, the through-hole 7 penetrates from the center of the body lower surface 2f of the chip body 2 to the upper surface 2e side.
A conductive film 70 is formed on the inner wall of the through hole 7, and the conductive film 70 and the ground electrodes 4-1 and 4-2 are electrically connected. Note that whether or not the conductive film 70 is formed on the inner wall of the through hole 7 is arbitrary, and a three-terminal capacitor in which the conductive film 70 is not formed on the inner wall of the through hole 7 is also an embodiment of the present invention, and is within the scope of the invention. Of course, it is included.

Next, a method for mounting the three-terminal capacitor 1-2 of this embodiment will be described.
FIG. 11 is a cross-sectional view for explaining the short-circuit preventing effect of the three-terminal capacitor 1-2.
As shown in FIG. 11, in the case of the three-terminal capacitor 1-2, as in the case of the three-terminal capacitor 1-1 of the first embodiment, the external electrodes 5-1 and 5-2 (see FIG. 9) are connected to the substrate. 200, and placed on the hot-side connection lands 201 and 202 (see FIGS. 5 and 6) on the ground 200, and with the through holes 7 positioned directly above the through holes 210, the ground external electrodes 6-1 and 6- 2 can be placed on the ground side connection land 203. In this state, by performing reflow processing, the external electrodes 5-1 and 5-2 are connected to the hot-side connection lands 201 and 202, and the ground external electrodes 6-1 and 6-2 are connected to the ground-side connection land 203. Can be connected.
Even if the solder 300 is raised from the through hole 210, the solder 300 raised from the through hole 210 enters the through hole 7 from the opening of the through hole 7 of the chip body 2. A short circuit between the connection land 203 and the hot-side connection lands 201 and 202 can be prevented.

In the three-terminal capacitor 1-2 of this embodiment, since the conductive film 70 is formed on the inner wall of the through hole 7, if the solder 300 enters the through hole 7, the ground electrodes 4-1 and 4-2 Is electrically connected to the external through hole 210 through the conductive film 70 and the solder 300.
Since other configurations, operations, and effects are the same as those in the first embodiment, description thereof is omitted.

Next explained is the third embodiment of the invention.
12 is a perspective view showing a three-terminal capacitor according to a third embodiment of the present invention, and FIG. 13 is a sectional view taken along the line DD in FIG.
This embodiment differs from the first embodiment in that a recess is provided instead of the through hole 7.
That is, as shown in FIG. 12, the three-terminal capacitor 1-3 of this embodiment has a recess 8 on the lower side.
Specifically, as shown in FIG. 13, the lower surface 6a of the ground external electrode 6 and the lower surface 2f of the chip body 2 are recessed upward by a predetermined height so that the lower side of the three-terminal capacitor 1-3 is lowered. A recess 8 was formed.

Next, a method for mounting the three-terminal capacitor 1-3 of this embodiment will be described.
FIG. 14 is a cross-sectional view for explaining the short-circuit preventing effect of the three-terminal capacitor 1-3.
As shown in FIG. 14, the external electrodes 5-1 and 5-2 (see FIG. 12) of the three-terminal capacitor 1-3 are connected on the hot-side connection lands 201 and 202 (see FIG. 5), and the recess 8 is formed. The ground external electrode 6 is connected to the ground-side connection land 203 while being positioned directly above the through hole 210.
In such a state, the three-terminal capacitor 1-3 can be mounted by performing a reflow process.
Even if the solder 300 is raised from the through hole 210, the solder 300 raised from the through hole 210 enters the recess 8 located at the center of the lower surface of the ground external electrode 6. A short circuit between the connection land 203 and the hot-side connection lands 201 and 202 is prevented.
Since other configurations, operations, and effects are the same as those in the first embodiment, description thereof is omitted.

Next explained is the fourth embodiment of the invention.
15 is a perspective view showing a three-terminal capacitor according to a fourth embodiment of the present invention, and FIG. 16 is a cross-sectional view taken along line EE in FIG.
This embodiment differs from the second embodiment in that a recess is used instead of the through hole 7.
That is, as shown in FIG. 15, the three-terminal capacitor 1-4 of this embodiment has a recess 8 ′ on the lower side of the chip body 2.
Specifically, as shown in FIG. 16, a concave portion 8 'is formed below the three-terminal capacitor 1-4 by denting the central portion of the lower surface 2f of the chip body 2 by a predetermined height upward. did.
Other configurations, operations, and effects are the same as those of the second embodiment, and thus description thereof is omitted.

  1-1 to 1-4: 3-terminal capacitor, 2 ... chip body, 2a ... front surface, 2b ... rear surface, 2c, 2d ... side surface, 2e, 6b ... upper surface, 2f, 6a ... lower surface, 3 ... through electrode, 3a ... Front end, 3b ... Rear end, 4-1, 4-2 ... Ground electrode, 4a, 4b ... End, 5-1, 5-2 ... External electrode, 6, 6-1, 6-2 ... Ground external electrode, 7 ... Through hole, 7a-7f, 30 ... hole, 8,8 '... recess, 20 ... insulating member, 21-24 ... insulating layer, 70 ... conductive film, 200 ... substrate, 201,202 ... hot side connection land 203 ... Ground side connection land 210 ... Through hole 300 ... Solder.

Claims (7)

A chip body formed of an insulating member; a through electrode embedded in the chip body and having front and rear ends exposed at the front and rear surfaces of the chip body; and opposed to the through electrode in the vertical direction and both ends at both sides of the chip body A ground electrode exposed on the surface, first and second external electrodes formed on the front and rear surfaces of the chip body and electrically connected to both ends of the through electrode, respectively, and the center of the body of the chip body A three-terminal capacitor provided with a circular external ground electrode provided so as to wind a part and electrically connected to both ends of the ground electrode,
Providing a through hole penetrating in the vertical direction of the body of the chip body from the center of the lower surface of the ground external electrode,
The hole extending through the through electrode is set to have a diameter larger than that of the through hole, and the insulating member is interposed between the outside of the through hole located in the hole and the inside of the through electrode. The through electrode is set not to be exposed in the through hole.
A three-terminal capacitor. A chip body formed of an insulating member; a through electrode embedded in the chip body and having front and rear ends exposed at the front and rear surfaces of the chip body; and opposed to the through electrode in the vertical direction and both ends at both sides of the chip body A ground electrode exposed on the surface, first and second external electrodes formed on the front and rear surfaces of the chip body and electrically connected to both ends of the through electrode, respectively, and the center of the body of the chip body A bent first ground external electrode formed from one side surface to at least a lower surface edge portion and connected to one end portion of the ground electrode, and the other side surface in the center portion of the body portion of the chip body. And a folded second ground external electrode formed over at least a lower surface edge and connected to the other end of the ground electrode,
Providing a through hole penetrating in the vertical direction from the center of the lower surface of the body of the chip body,
The hole extending through the through electrode is set to have a diameter larger than that of the through hole, and the insulating member is interposed between the outside of the through hole located in the hole and the inside of the through electrode. The through electrode is set not to be exposed in the through hole.
A three-terminal capacitor. The three-terminal capacitor according to claim 2,
A conductive film was attached to the inner wall of the through hole, and the conductive film and the ground electrode were electrically connected.
A three-terminal capacitor. Insulating chip body, penetrating electrodes included in the chip body and having front and rear ends exposed at the front and rear surfaces of the chip body, and facing the penetrating electrodes in the vertical direction and both ends on both side surfaces of the chip body, respectively Winding the exposed ground electrode, first and second external electrodes respectively formed on the front and rear surfaces of the chip body and electrically connected to both ends of the through electrode, and the central part of the body of the chip body A three-terminal capacitor including a circular ground external electrode provided so as to be electrically connected to both ends of the ground electrode,
Provided with a recess that is recessed by a predetermined height upward from the center of the bottom surface of the ground external electrode to the bottom surface of the body of the chip body,
A three-terminal capacitor. Insulating chip body, penetrating electrodes included in the chip body and having front and rear ends exposed at the front and rear surfaces of the chip body, and facing the penetrating electrodes in the vertical direction and both ends on both side surfaces of the chip body, respectively One of the exposed ground electrode, the first and second external electrodes formed on the front and rear surfaces of the chip body and electrically connected to both ends of the through electrode, respectively, at the center of the body of the chip body A bent first ground external electrode formed over at least the lower surface edge from the side surface and connected to one end of the ground electrode, and at least the lower surface from the other side surface in the center of the body portion of the chip body A three-terminal capacitor comprising a bent second ground external electrode formed over the edge and connected to the other end of the ground electrode,
Provided with a recess recessed by a predetermined height upward from the center of the lower surface of the body of the chip body,
A three-terminal capacitor. A three-terminal capacitor is disposed in a central space between the first and second hot side connection lands disposed at a predetermined interval on the substrate, and the first and second hot side connection lands. A mounting method of a three-terminal capacitor to be mounted on a ground side connection land having a through hole in a central portion,
The three-terminal capacitor according to any one of claims 1 to 3 is used as the three-terminal capacitor.
The first and second external electrodes of the three-terminal capacitor are connected to the first and second hot-side connection lands, and the through hole is positioned directly above the through hole. The electrode was connected to the ground side connection land,
A mounting method for a three-terminal capacitor, characterized in that: A three-terminal capacitor is disposed in a central space between the first and second hot side connection lands disposed at a predetermined interval on the substrate, and the first and second hot side connection lands. A mounting method of a three-terminal capacitor to be mounted on a ground side connection land having a through hole in a central portion,
As the three-terminal capacitor, the three-terminal capacitor according to claim 4 or claim 5,
The first and second external electrodes of the three-terminal capacitor are connected to the first and second hot-side connection lands, and the concave portion is positioned directly above the through hole. Connected to the ground side connection land,
A mounting method for a three-terminal capacitor, characterized in that:

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