JP2001136008A - Microwave waveguide device - Google Patents
Microwave waveguide deviceInfo
- Publication number
- JP2001136008A JP2001136008A JP31128999A JP31128999A JP2001136008A JP 2001136008 A JP2001136008 A JP 2001136008A JP 31128999 A JP31128999 A JP 31128999A JP 31128999 A JP31128999 A JP 31128999A JP 2001136008 A JP2001136008 A JP 2001136008A
- Authority
- JP
- Japan
- Prior art keywords
- microwave
- waveguide
- circuit board
- printed circuit
- signal terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 112
- 239000004020 conductor Substances 0.000 claims description 14
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
Landscapes
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
- Transmitters (AREA)
- Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明はマイクロ波集積回路
(MICともいう)を含むマイクロ波導波管装置に関
し、特に小型化に適するマイクロ波導波管装置に関す
る。[0001] 1. Field of the Invention [0002] The present invention relates to a microwave waveguide device including a microwave integrated circuit (MIC), and more particularly to a microwave waveguide device suitable for miniaturization.
【0002】[0002]
【従来の技術】従来のこの種のマイクロ波導波管装置に
ついて、図6の構造図を参照して説明する。(a)は横
断面図、(b)は縦断面図である。図示したマイクロ波
集積回路1はマイクロ波信号端子1aと中間周波数信号
端子1b及び電源端子1cを含む低周波数信号端子とを
一面から突出させている。これら端子1a〜1cはマイ
クロ波集積回路1と他のマイクロ波回路及び電気回路5
Dとの電気的接続部となる。マイクロ波集積回路1の一
面は、金属板6の一面に取り付けられて(搭載されて)
おり、端子1a〜1cは金属板6を貫通して突出してい
る。2. Description of the Related Art A conventional microwave waveguide device of this type will be described with reference to a structural diagram of FIG. (A) is a transverse sectional view, (b) is a longitudinal sectional view. The illustrated microwave integrated circuit 1 has a microwave signal terminal 1a and a low frequency signal terminal including an intermediate frequency signal terminal 1b and a power supply terminal 1c protruding from one side. These terminals 1 a to 1 c are connected to the microwave integrated circuit 1 and other microwave circuits and electric circuits 5.
It becomes an electrical connection with D. One surface of the microwave integrated circuit 1 is attached to (mounted on) one surface of the metal plate 6.
The terminals 1 a to 1 c penetrate the metal plate 6 and protrude.
【0003】金属板6の他面は、金属カバー9Bと共に
導波管2Eを形成する部分と、プリント基板3Dの一面
に密着すると共に導電接続される部分とに分かれる。マ
イクロ波集積回路1の端子1aは導波管2Eの内部に挿
入されて同軸・導波管変換器を形成する。端子1b及び
1cは、プリント基板3Dも貫通して突出し、プリント
基板3Dの他面に搭載された一般に複数の回路部品5a
に接続されて中間周波数信号回路,電源回路などの電気
回路5Dを形成する。電気回路5Dは、金属カバー9A
で覆われて金属板6(又はプリント基板3Dの一面に形
成された全面導体層)と共に他回路から電磁シールドさ
れている。The other surface of the metal plate 6 is divided into a portion forming the waveguide 2E together with the metal cover 9B, and a portion which is in close contact with one surface of the printed board 3D and is electrically connected. The terminal 1a of the microwave integrated circuit 1 is inserted inside the waveguide 2E to form a coaxial-waveguide converter. The terminals 1b and 1c protrude through the printed circuit board 3D, and generally include a plurality of circuit components 5a mounted on the other surface of the printed circuit board 3D.
To form an electric circuit 5D such as an intermediate frequency signal circuit and a power supply circuit. The electric circuit 5D includes a metal cover 9A.
And is electromagnetically shielded from other circuits together with the metal plate 6 (or the entire conductor layer formed on one surface of the printed circuit board 3D).
【0004】なお、図6とほぼ同じ構成のマイクロ波導
波管装置が、特開平9−83202号公報に開示されて
いる。A microwave waveguide device having substantially the same configuration as that of FIG. 6 is disclosed in Japanese Patent Application Laid-Open No. 9-83202.
【0005】[0005]
【発明が解決しようとする課題】上述した従来のマイク
ロ波導波管装置は、金属板と金属カバーが3点構成であ
るので構造的に複雑なため、部品代が高くなること,及
び組み立て工数が大きくなるという欠点があった。The conventional microwave waveguide device described above has a three-point structure consisting of a metal plate and a metal cover, and is structurally complicated, so that the cost of parts is increased and the number of assembling steps is reduced. There was a disadvantage that it became larger.
【0006】また、このマイクロ波導波管装置は、プリ
ント基板(3D)を覆う金属カバー(9A)と導波管
(2D)を構成する金属カバー(9B)を共通の金属カ
バーにしようとしても、プリント基板(3D)の厚みの
バラツキにより、金属板(6)と金属カバー(9B)と
の隙間が空いたり、プリント基板(3D)と金属カバー
(9A)との隙間が空いたりするため、電気回路の電磁
シールドが不完全になるという欠点があった。Further, in this microwave waveguide device, even if the metal cover (9A) covering the printed circuit board (3D) and the metal cover (9B) forming the waveguide (2D) are to be used as a common metal cover, Due to the variation in the thickness of the printed circuit board (3D), there is a gap between the metal plate (6) and the metal cover (9B) or a gap between the printed board (3D) and the metal cover (9A). There is a disadvantage that the electromagnetic shield of the circuit becomes incomplete.
【0007】従って、本発明の目的は、上述の欠点を解
消し、構造の簡素化により部品点数を削減して価格を低
減し、かつ、上記導波管回路及びプリント基板上の電気
回路の電磁シールドを確保できるマイクロ波導波管装置
を提供することにある。Accordingly, an object of the present invention is to eliminate the above-mentioned disadvantages, reduce the number of parts by simplifying the structure, reduce the cost, and reduce the electromagnetic wave of the waveguide circuit and the electric circuit on the printed circuit board. An object of the present invention is to provide a microwave waveguide device capable of securing a shield.
【0008】[0008]
【課題を解決するための手段】本発明によるマイクロ波
導波管装置は、マイクロ波信号端子と中間周波数信号端
子及び電源端子を含む低周波数信号端子とを一面から突
出させるマイクロ波集積回路と、一面に前記マイクロ波
集積回路を搭載して他面に前記マイクロ波信号端子及び
前記低周波数信号端子を貫通させる金属板と、一面が前
記金属板の他面に密着すると共に前記マイクロ波信号端
子及び前記低周波数信号端子の貫通部分を除いて導電接
続される第1のプリント基板と、前記第1のプリント基
板を複数の支持体によって所定間隔だけ離して前記金属
板との間に挟み込む金属カバーとを備え、前記マイクロ
波集積回路のマイクロ波信号端子のみを貫通させる前記
第1のプリント基板の他面の部分が、前記金属カバーの
所定の前記支持体との間に導波管を構成し、前記導波管
の構成部を除く前記第1のプリント基板の他面が、前記
低周波数信号端子に接続された電気回路を搭載すること
を特徴とする。SUMMARY OF THE INVENTION A microwave waveguide device according to the present invention includes a microwave integrated circuit for projecting a microwave signal terminal and a low frequency signal terminal including an intermediate frequency signal terminal and a power supply terminal from one surface, A metal plate on which the microwave integrated circuit is mounted and on which the microwave signal terminal and the low-frequency signal terminal are penetrated on the other surface, one surface of which is in close contact with the other surface of the metal plate and the microwave signal terminal and A first printed circuit board that is conductively connected except for a penetrating portion of the low-frequency signal terminal, and a metal cover that sandwiches the first printed circuit board between the metal plate at a predetermined interval by a plurality of supports. A portion of the other surface of the first printed circuit board, through which only the microwave signal terminal of the microwave integrated circuit passes, is a predetermined support of the metal cover. It constitutes a waveguide between the other surface of the first printed circuit board except for the configuration of the waveguide, characterized in that for mounting the electrical circuit connected to said low-frequency signal terminal.
【0009】前記マイクロ波導波管装置の第一は、前記
第1のプリント基板の他面の前記導波管の構成部が、全
面導体層を備える構成をとることができる。[0009] The first of the microwave waveguide devices may have a configuration in which a constituent part of the waveguide on the other surface of the first printed circuit board includes a full-surface conductor layer.
【0010】前記マイクロ波導波管装置の第二は、前記
導波管を構成する前記金属板が、前記第1のプリント基
板の一面の前記導波管の構成部の近傍において電気回路
搭載用の空間を有するように形状変更されている構成を
とることができる。[0010] A second aspect of the microwave waveguide device is that the metal plate forming the waveguide is mounted on an electric circuit near one side of the first printed circuit board. A configuration in which the shape is changed to have a space can be adopted.
【0011】前記マイクロ波導波管装置の第三は、前記
導波管が、開口部を前記金属板に対して垂直方向にする
ように前記金属カバーに形成したEベンドと前記金属板
及び前記第1のプリント基板に形成した導電性の貫通穴
を備える構成をとることができる。A third aspect of the microwave waveguide device is that the waveguide has an E-bend formed in the metal cover such that an opening is perpendicular to the metal plate, the metal plate and the E-bend. A configuration having a conductive through-hole formed in one printed circuit board can be adopted.
【0012】前記マイクロ波導波管装置の第四は、前記
導波管が、開口部を前記金属板に対して直角方向にする
ように前記金属カバーにHベンドを形成している構成を
とることができる。A fourth aspect of the microwave waveguide device is that the waveguide has an H-bend formed in the metal cover such that an opening is in a direction perpendicular to the metal plate. Can be.
【0013】前記マイクロ波導波管装置の第五は、前記
導波管が、開口部を突出した前記マイクロ波信号端子の
部分から前記金属板に対して直角方向に形成されている
構成をとることができる。A fifth aspect of the microwave waveguide device is that the waveguide is formed in a direction perpendicular to the metal plate from a portion of the microwave signal terminal projecting from an opening. Can be.
【0014】前記マイクロ波導波管装置の第六は、前記
導波管が、開口部を前記金属板に対して垂直方向にする
ようにEベンド及び貫通穴を前記金属カバーに形成した
構成をとることができる。In a sixth aspect of the microwave waveguide device, the waveguide has an E-bend and a through-hole formed in the metal cover so that an opening is perpendicular to the metal plate. be able to.
【0015】前記マイクロ波導波管装置の第七は、互い
に異なる前記マイクロ波集積回路のマイクロ波信号端子
間の接続が、共通の前記導波管を介して行なわれる構成
をとることができる。A seventh aspect of the microwave waveguide device may be configured such that connection between microwave signal terminals of the different microwave integrated circuits is performed through a common waveguide.
【0016】前記マイクロ波導波管装置の第八は、前記
第1のプリント基板の他面と前記金属カバーとの間に複
数の金属製支持体で所定の間隔を保った少なくとも1枚
のプリント基板を備え、貫通した前記マイクロ波信号端
子を含む前記第1のプリント基板の他面とこの他面に対
向する第2のプリント基板の全面導体層を有する一面と
前記金属製支持体とによって前記導波管を構成する構成
をとることができる。An eighth aspect of the microwave waveguide device is that at least one printed circuit board maintained at a predetermined distance by a plurality of metal supports between the other surface of the first printed circuit board and the metal cover. The first printed circuit board including the microwave signal terminal penetrating therethrough, the second printed circuit board facing the other surface, the entire surface of the second printed circuit board having a conductive layer, and the metal support. A configuration that constitutes a wave tube can be employed.
【0017】前記マイクロ波導波管装置の第九は、前記
導波管の構成部分を除く前記プリント基板が、前記低周
波数信号端子に直接あるいは間接的に接続されると共に
他回路に対して電磁シールドされている電気回路を搭載
する構成をとることができる。A ninth aspect of the microwave waveguide device is that the printed circuit board, excluding the components of the waveguide, is connected directly or indirectly to the low-frequency signal terminal and an electromagnetic shield is provided for other circuits. A configuration in which the electric circuit described above is mounted can be adopted.
【0018】[0018]
【発明の実施の形態】次に、本発明について図面を参照
して説明する。Next, the present invention will be described with reference to the drawings.
【0019】図1は本発明の第一の実施形態によるマイ
クロ波導波管装置の構造図であり、(a)は横断面図、
(b)は縦断面図である。図1に示したマイクロ波導波
管装置に用いるマイクロ波集積回路1は、図6に示した
マイクロ波集積回路1と同じものであり、マイクロ波信
号端子1aと中間周波数信号端子1bと電源端子を含む
低周波数信号端子1cとを一面(図の下方)から突出さ
せている。金属板6は、一面(図の上方)にマイクロ波
集積回路1の一面を取り付け(搭載し)、マイクロ波信
号端子1aと中間周波数信号端子1bと低周波数信号端
子1cとを上記一面から他面(図の下方)に貫通させ
る。プリント基板3の一面は金属板6の他面全体に密着
すると共に導電接続される。但し、端子1a〜1cはプ
リント基板3も貫通してプリント基板3の他面から突出
する。プリント基板3の端子1a〜1cが貫通する部分
は、端子1a〜1cが接触しないようなスルーホール構
造としてもよい。また、プリント基板3の厚み方向の側
面は金属メッキを行う。なお、以下の実施の形態の説明
においては、その実施の形態の特徴の把握を容易にする
ために、先述した構成要素等については必要時以外には
説明を省略する。FIG. 1 is a structural view of a microwave waveguide device according to a first embodiment of the present invention, wherein FIG.
(B) is a longitudinal sectional view. The microwave integrated circuit 1 used in the microwave waveguide device shown in FIG. 1 is the same as the microwave integrated circuit 1 shown in FIG. 6, and includes a microwave signal terminal 1a, an intermediate frequency signal terminal 1b, and a power supply terminal. The low-frequency signal terminal 1c including the low-frequency signal terminal 1c protrudes from one surface (below the drawing). The metal plate 6 has one surface of the microwave integrated circuit 1 attached (mounted) on one surface (the upper side in the figure), and the microwave signal terminal 1a, the intermediate frequency signal terminal 1b, and the low frequency signal terminal 1c are connected from the one surface to the other surface. (Below the figure). One surface of the printed board 3 is in close contact with the entire other surface of the metal plate 6 and is conductively connected. However, the terminals 1 a to 1 c penetrate the printed board 3 and protrude from the other surface of the printed board 3. The portion of the printed circuit board 3 through which the terminals 1a to 1c penetrate may have a through-hole structure such that the terminals 1a to 1c do not contact. Further, metal plating is performed on the side surface of the printed circuit board 3 in the thickness direction. In the following description of the embodiments, in order to facilitate understanding of the features of the embodiments, descriptions of the above-described components and the like will be omitted except when necessary.
【0020】プリント基板3は金属板6と金属カバー4
とで挟み込んで固定する。この時、金属カバー4の一面
はプリント基板3の他面との間に導波管2を形成する必
要があるので、導波管2に基本モードのみが通過するよ
うに複数の支持体41〜46によって金属カバー4の一
面とプリント基板3の他面とを所定間隔だけ離して固定
する。支持体41〜46は金属カバー4の上面と一体に
形成するのがよい。支持体41がプリント基板3を導波
管2と低周波数信号回路(電気回路5)との仕切りとさ
れる。プリント基板3の導波管2に相当する部分は、そ
の他面を全面導体としてもよく,あるいは導体層を全く
なくしてもよい。この導体層がない場合の導波管2はプ
リント基板3の部分が誘電体層を形成することになる。
従って、上記両者ではプリント基板3と金属カバー4の
一面との間隔を導波管2に基本モードのみが通過するよ
うに変える必要がある。また、プリント基板3の導波管
2に相当する部分の他面を導体層なしにするばあいは、
導波管2の開口部22におけるプリント基板3の側面の
金属メッキをなくする必要がある。The printed circuit board 3 includes a metal plate 6 and a metal cover 4.
And fix it. At this time, since the waveguide 2 needs to be formed between one surface of the metal cover 4 and the other surface of the printed circuit board 3, the plurality of supports 41 to 41 are provided so that only the fundamental mode passes through the waveguide 2. The one surface of the metal cover 4 and the other surface of the printed board 3 are fixed by a predetermined distance by 46. The supports 41 to 46 are preferably formed integrally with the upper surface of the metal cover 4. The support 41 serves as a partition between the printed circuit board 3 and the waveguide 2 and the low frequency signal circuit (electric circuit 5). A portion of the printed circuit board 3 corresponding to the waveguide 2 may have the entire other surface as a conductor, or may have no conductor layer at all. In the waveguide 2 having no conductor layer, the portion of the printed circuit board 3 forms a dielectric layer.
Therefore, in both cases, it is necessary to change the distance between the printed board 3 and one surface of the metal cover 4 so that only the fundamental mode passes through the waveguide 2. When the other surface of the portion corresponding to the waveguide 2 of the printed circuit board 3 has no conductor layer,
It is necessary to eliminate metal plating on the side surface of the printed circuit board 3 in the opening 22 of the waveguide 2.
【0021】図1のマイクロ波導波管装置では、金属カ
バー4の一面あるいはプリント基板3の全面導体層とし
た他面と,金属板6の支持体41,44及び45によっ
て囲まれた部分が導波管2を構成している。導波管2の
開口部22は金属板6と平行方向((b)図の左方向)
に形成されている。また、導波管2とマイクロ波信号端
子1aとが同軸-導波管回路を形成し、例えばマイクロ
波集積回路1が発振器である場合にはマイクロ波信号を
マイクロ波信号端子1aから導波管2に送出,あるいは
受信機である場合にはマイクロ波信号を導波管2からマ
イクロ波信号端子1aに入力する。In the microwave waveguide device shown in FIG. 1, one surface of the metal cover 4 or the other surface of the printed circuit board 3 as the entire conductor layer and the portion of the metal plate 6 surrounded by the supports 41, 44 and 45 are conductive. The wave tube 2 is constituted. The opening 22 of the waveguide 2 is in a direction parallel to the metal plate 6 (to the left in FIG. 2B).
Is formed. The waveguide 2 and the microwave signal terminal 1a form a coaxial-waveguide circuit. For example, when the microwave integrated circuit 1 is an oscillator, a microwave signal is transmitted from the microwave signal terminal 1a to the waveguide. 2 or a microwave signal is input from the waveguide 2 to the microwave signal terminal 1a when the receiver is a receiver.
【0022】一方、中間周波数信号回路,低周波数信号
回路および電源回路などの電気回路5が、金属カバー4
の一面と金属カバー4の支持体41〜46とで導波管2
を取り囲むように形成した部分のプリント基板3の他面
上に構成される。回路部品5a等を含む電気回路5はマ
イクロ波集積回路の端子1b及び1cと金属線等によっ
て接続され、図1のマイクロ波導波管装置は一体の複合
電気回路を構成する。なお、このマイクロ波導波管装置
の電気回路5と他回路との電源及び低周波数信号の接続
は金属カバー4に設けた貫通コンデンサや同軸線路(図
示せず)を通して行われる。また、プリント基板3上の
電気回路5は、金属カバー4と金属板6とによって挟み
こまれた構造になっているので、他回路から電磁シール
ドされている。On the other hand, the electric circuit 5 such as the intermediate frequency signal circuit, the low frequency signal circuit and the power supply circuit
And the supports 41 to 46 of the metal cover 4
Is formed on the other surface of the printed circuit board 3 in a portion formed so as to surround the printed circuit board 3. The electric circuit 5 including the circuit components 5a and the like is connected to the terminals 1b and 1c of the microwave integrated circuit by metal wires and the like, and the microwave waveguide device of FIG. 1 forms an integrated electric circuit. The connection of the power supply and the low-frequency signal between the electric circuit 5 of this microwave waveguide device and other circuits is made through a through capacitor or a coaxial line (not shown) provided on the metal cover 4. Further, since the electric circuit 5 on the printed circuit board 3 is sandwiched between the metal cover 4 and the metal plate 6, it is electromagnetically shielded from other circuits.
【0023】図2は本発明の第二の実施形態によるマイ
クロ波導波管装置の縦断面図である。FIG. 2 is a longitudinal sectional view of a microwave waveguide device according to a second embodiment of the present invention.
【0024】図2に示したマイクロ波導波管装置は、図
1のマイクロ波導波管装置とほぼ同じ設計思想に基づい
た構成となっている。従って、マイクロ波集積回路1,
導波管2及び金属カバー4は、図1のマイクロ波導波管
装置と同じである。しかしながら図2のマイクロ波導波
管装置は、プリント基板に搭載できる電気回路の規模を
大きくできる構成とするために、プリント基板3を3A
に,金属板6を6Aに形状変更している。つまり、この
マイクロ波導波管装置では、導波管2を形成するプリン
ト基板3Aの一面にも電気部品及び機構部品を含む電気
回路5Aが搭載できるように、プリント基板3Aと共に
導波管2を構成する金属板6Aを導波管2の構成部の近
傍において電気回路5A用の回路部品5bが搭載できる
直方体状の空間62を有するように形状変更している。
即ち、プリント基板3Aの金属板6Aによる空間62の
部分には回路部品5aに加えて回路部品5bを搭載し、
図1における電気回路5の規模を電気回路5Aに拡大し
ている。なお、プリント基板3Aは、他面に形成した電
気回路5Aに加え,導波管2の近傍の一面にも電気回路
5Aを搭載するので、この導波管2の部分の他面につい
ては全面に導体層を設けることが望ましい。回路部品5
bを含む部分の電気回路5Aも、金属板6Aの空間62
を形成する部分とその近傍のプリント基板3Aとで他回
路から電磁シールドされている。The microwave waveguide device shown in FIG. 2 has a configuration based on almost the same design concept as the microwave waveguide device shown in FIG. Therefore, the microwave integrated circuit 1,
The waveguide 2 and the metal cover 4 are the same as the microwave waveguide device of FIG. However, the microwave waveguide device shown in FIG. 2 requires a printed circuit board 3 of 3A in order to increase the size of an electric circuit that can be mounted on the printed circuit board.
In addition, the shape of the metal plate 6 is changed to 6A. That is, in this microwave waveguide device, the waveguide 2 is configured together with the printed board 3A so that the electric circuit 5A including the electric components and the mechanical components can be mounted on one surface of the printed board 3A forming the waveguide 2. The shape of the metal plate 6A is changed so as to have a rectangular parallelepiped space 62 in which the circuit component 5b for the electric circuit 5A can be mounted near the component of the waveguide 2.
That is, in addition to the circuit component 5a, the circuit component 5b is mounted in the space 62 defined by the metal plate 6A of the printed board 3A,
The scale of the electric circuit 5 in FIG. 1 is expanded to an electric circuit 5A. The printed circuit board 3A has the electric circuit 5A mounted on one surface near the waveguide 2 in addition to the electric circuit 5A formed on the other surface. It is desirable to provide a conductor layer. Circuit parts 5
The electric circuit 5A including the portion b also includes the space 62 of the metal plate 6A.
Are electromagnetically shielded from other circuits by the printed circuit board 3A and the portion forming the same.
【0025】図3は本発明の第三の実施形態によるマイ
クロ波導波管装置の縦断面図である。FIG. 3 is a longitudinal sectional view of a microwave waveguide device according to a third embodiment of the present invention.
【0026】図3に示したマイクロ波導波管装置も、図
1のマイクロ波導波管装置とほぼ同じ設計思想に基づい
た構成となっている。しかしながら図3のマイクロ波導
波管装置は、導波管2A(2)の開口部22Aを金属板
6B(6)に対して垂直方向(図の上方)に向けるよう
にして、他の導波管装置との接続の多様化を図ってい
る。このマイクロ波導波管装置では、金属カバー4Aの
導波管2Aの部分にEベンド21(Eコーナーでもよ
い)を設け、この導波管2Aの曲がり方向にあるプリン
ト基板3B及び金属板6Bに導波管2Aの口径と同じ寸
法の導波管を貫通させて構成している。プリント基板3
Bの導波管壁部分には導体層を設けなければならない。
金属板6Bの導波管壁部分は勿論導体層を有する。The microwave waveguide device shown in FIG. 3 also has a configuration based on almost the same design concept as the microwave waveguide device shown in FIG. However, in the microwave waveguide device of FIG. 3, the opening 22A of the waveguide 2A (2) is oriented in a direction perpendicular to the metal plate 6B (6) (upward in the figure), and the other waveguides are formed. The connection with the device is diversified. In this microwave waveguide device, an E-bend 21 (or an E-corner) may be provided in a portion of the metal cover 4A at the waveguide 2A, and guided to the printed board 3B and the metal plate 6B in the bending direction of the waveguide 2A. The waveguide is formed by penetrating a waveguide having the same size as the diameter of the waveguide 2A. Printed circuit board 3
A conductor layer must be provided on the waveguide wall portion of B.
The waveguide wall portion of the metal plate 6B has a conductor layer as a matter of course.
【0027】また、導波管2Aには、開口部22Aを金
属板6(6B)に対して直角方向(図面の手前方向又は
奥行き方向)にするように、金属カバー4AにHベンド
(Hコーナーでもよい)を形成してもよい。この場合、
プリント基板3B及び金属板6Bには、導波管用の貫通
穴を設ける必要がなく、図1のプリント基板3及び金属
板6を用いることになる。そして、図2の如く、プリン
ト基板3B(3)の一面にも電気回路を搭載できる。In the waveguide 2A, an H-bend (H corner) is formed on the metal cover 4A so that the opening 22A is at right angles to the metal plate 6 (6B) (forward or backward in the drawing). May be formed). in this case,
There is no need to provide a through hole for a waveguide in the printed board 3B and the metal plate 6B, and the printed board 3 and the metal plate 6 of FIG. 1 are used. Then, as shown in FIG. 2, an electric circuit can be mounted on one surface of the printed circuit board 3B (3).
【0028】さらに、導波管2Aの開口部22Aをマイ
クロ波集積回路1の突出したマイクロ波信号端子1aの
部分から金属板6Bに対して直角方向(図面の手前方向
又は奥行き方向)にするように形成してもよい。この場
合も、プリント基板3B及び金属板6Bには、導波管用
の貫通穴を設ける必要がなく、図1のプリント基板3及
び金属板6を用いることになる。なお、金属カバー4A
には上記導波管を構成するために別の支持体及び支持体
41に相当する電気回路5との仕切り用支持体が必要で
ある。このマイクロ波導波管装置にも、図2と同様の導
波管2を形成するプリント基板3Bの一面にも電気部品
及び機構部品を含む電気回路5Aが搭載できるようにす
ることが可能なのは勿論である。Further, the opening 22A of the waveguide 2A is made to extend in a direction perpendicular to the metal plate 6B (forward or backward in the drawing) from the protruding portion of the microwave signal terminal 1a of the microwave integrated circuit 1. May be formed. Also in this case, it is not necessary to provide a through hole for a waveguide in the printed board 3B and the metal plate 6B, and the printed board 3 and the metal plate 6 of FIG. 1 are used. The metal cover 4A
Requires a separate support and a support for partitioning the electrical circuit 5 corresponding to the support 41 in order to constitute the waveguide. In this microwave waveguide device, it is of course possible to mount an electric circuit 5A including an electric component and a mechanical component on one surface of a printed circuit board 3B forming the waveguide 2 similar to FIG. is there.
【0029】上述したとおり、図3を参照して説明した
各種のマイクロ波導波管装置は、導波管2Aの開口面2
2Aの方向を多様に変化させており、複数のマイクロ波
集積回路やマイクロ波導波管装置の接続方法を多様にす
る効果がある。As described above, the various types of microwave waveguide devices described with reference to FIG.
Since the direction of 2A is changed in various ways, there is an effect that the connecting method of a plurality of microwave integrated circuits and microwave waveguide devices is diversified.
【0030】図4は本発明の第四の実施形態によるマイ
クロ波導波管装置の一部載欠した縦断面図である。FIG. 4 is a longitudinal sectional view of a microwave waveguide device according to a fourth embodiment of the present invention, with a part thereof not shown.
【0031】図4に示したマイクロ波導波管装置は、前
述したマイクロ波集積回路1と2つのマイクロ波信号端
子11a及び11eを持つマイクロ波集積回路11とを
共通使用の導波管2Bを介して接続したものである。な
お、電気回路5Bに接続されるマイクロ波集積回路11
の中間周波数信号端子1bと低周波数信号端子1cは低
周波数信号端子11dに纏めて示している。マイクロ波
集積回路1が受信機であれば、マイクロ波集積回路11
はマイクロ波低雑音増幅器であることが多い。この場
合、マイクロ波集積回路11は、金属板6C等が形成す
る導波管2Cの開口部22Bから入力されたマイクロ波
信号をマイクロ波信号端子11eに受け,増幅されたマ
イクロ波信号をマイクロ波信号端子11aから出力す
る。このマイクロ波信号はマイクロ波集積回路1とマイ
クロ波集積回路11とが共有する導波管2Bを介して受
信機であるマイクロ波集積回路1にマイクロ波信号端子
1aから入力される。In the microwave waveguide device shown in FIG. 4, the above-mentioned microwave integrated circuit 1 and the microwave integrated circuit 11 having two microwave signal terminals 11a and 11e are connected via a commonly used waveguide 2B. Connected. The microwave integrated circuit 11 connected to the electric circuit 5B
The intermediate frequency signal terminal 1b and the low frequency signal terminal 1c are collectively shown as a low frequency signal terminal 11d. If the microwave integrated circuit 1 is a receiver, the microwave integrated circuit 11
Are often microwave low noise amplifiers. In this case, the microwave integrated circuit 11 receives the microwave signal input from the opening 22B of the waveguide 2C formed by the metal plate 6C or the like at the microwave signal terminal 11e, and converts the amplified microwave signal into the microwave. Output from the signal terminal 11a. This microwave signal is input from the microwave signal terminal 1a to the microwave integrated circuit 1 as a receiver via the waveguide 2B shared by the microwave integrated circuit 1 and the microwave integrated circuit 11.
【0032】また、マイクロ波集積回路1を発振器,マ
イクロ波集積回路11を変調送信機とすると、マイクロ
波信号端子1aから出力されたマイクロ波信号は共有の
導波管2Bを介してマイクロ波集積回路11のマイクロ
波信号端子11aに入力される。そして、マイクロ波集
積回路11によって変調及び増幅されたマイクロ波信号
は、マイクロ波信号端子11e及び開口部22Bを介し
てアンテナ等に供給される。When the microwave integrated circuit 1 is an oscillator and the microwave integrated circuit 11 is a modulation transmitter, the microwave signal output from the microwave signal terminal 1a is integrated by the microwave integrated circuit 2B via the shared waveguide 2B. The signal is input to the microwave signal terminal 11a of the circuit 11. The microwave signal modulated and amplified by the microwave integrated circuit 11 is supplied to an antenna or the like via the microwave signal terminal 11e and the opening 22B.
【0033】ここで、マイクロ波集積回路1及びマイク
ロ波集積回路11は、図1の如くマイクロ波集積回路1
を1個だけ搭載する場合と同様に、金属板6C,プリン
ト基板3C及び支持体47,48等を追加した金属カバ
ー4Bをそれぞれ一つずつ面積を増加させて備えるだけ
でよい。図4ではマイクロ波集積回路が2個だけの場合
を示したが、多数の増幅器を縦続接続する場合など,多
数のマイクロ波集積回路を用いる場合にも、金属板6
C,プリント基板3C及び金属カバー4Bはそれぞれ一
つずつ備えるだけでよい。また、電気回路5Bの規模を
拡大する場合には、金属板6Cを図2と同様の形状に変
更してよいことは勿論である。さらに、この縦続接続の
構成は図3を参照して説明した導波管2Aの開口部が金
属板6Bに対して直角方向にあるマイクロ波導波管装置
にも適用できる。Here, the microwave integrated circuit 1 and the microwave integrated circuit 11 are, as shown in FIG.
As in the case where only one is mounted, it is only necessary to increase the area of each of the metal plates 6C, the printed circuit board 3C, the metal covers 4B to which the support members 47, 48, etc. are added one by one. Although FIG. 4 shows a case where only two microwave integrated circuits are used, the metal plate 6 may be used even when a large number of microwave integrated circuits are used, such as when a large number of amplifiers are cascaded.
C, the printed circuit board 3C and the metal cover 4B need only be provided one by one. When the scale of the electric circuit 5B is increased, the metal plate 6C may be changed to the same shape as that of FIG. Furthermore, this cascade connection configuration can also be applied to the microwave waveguide device in which the opening of the waveguide 2A described with reference to FIG. 3 is perpendicular to the metal plate 6B.
【0034】図5は本発明の第五の実施形態によるマイ
クロ波導波管装置の構造図であり、(a)は横断面図、
(b)は縦断面図である。FIG. 5 is a structural view of a microwave waveguide device according to a fifth embodiment of the present invention, wherein FIG.
(B) is a longitudinal sectional view.
【0035】図5に示したマイクロ波導波管装置は、基
本的な構成は図1のマイクロ波導波管装置と同じである
が、上記電気回路の搭載規模を増加させるために、プリ
ント基板3と金属カバー4との間にプリント基板7を追
加している。金属板6に密着しているプリント基板3と
プリント基板7との間には、金属カバー4の支持体41
乃至46の位置に支持体41乃至46とほぼ同じ形状・
寸法の金属ブロック81乃至86を設置している。プリ
ント基板3の他面及びプリント基板7の一面全体に導電
体層を形成している場合には,プリント基板3の他面,
プリント基板7の一面,金属ブロック81,84及び8
5によって囲まれた部分が導波管2Cを構成する。導波
管2Dはマイクロ波信号端子1aに電気的に接続され
る。金属ブロック81乃至86は、プリント基板3の他
面と対向するプリント基板7の一面との間隔を上述の所
定寸法にして導波管2Dに高次モードが伝送しないよう
にする必要がある。プリント基板3の他面に導電体層を
形成しない場合も同様に導波管2Dに高次モードが伝送
しないようにする。The basic structure of the microwave waveguide device shown in FIG. 5 is the same as that of the microwave waveguide device shown in FIG. 1, but the printed circuit board 3 and the A printed circuit board 7 is added between the printed circuit board 7 and the metal cover 4. The support 41 of the metal cover 4 is provided between the printed board 3 and the printed board 7 which are in close contact with the metal plate 6.
The same shape as the supports 41 to 46 at the positions
Metal blocks 81 to 86 having dimensions are provided. When the conductor layer is formed on the other surface of the printed circuit board 3 and the entire surface of the printed circuit board 7,
One surface of the printed circuit board 7, metal blocks 81, 84 and 8
The portion surrounded by 5 constitutes the waveguide 2C. The waveguide 2D is electrically connected to the microwave signal terminal 1a. In the metal blocks 81 to 86, it is necessary to set the distance between the other surface of the printed circuit board 3 and the one surface of the printed circuit board 7 opposite to the above-mentioned predetermined dimension so as to prevent transmission of higher-order modes to the waveguide 2D. Similarly, when a conductor layer is not formed on the other surface of the printed circuit board 3, transmission of higher-order modes to the waveguide 2D is prevented.
【0036】電気回路5Cは、図1におけるプリント基
板3の導波管2(本図の2D)を除く他面の回路(回路
部品5aで表している)に加え、プリント基板7の両面
に搭載できる(回路部品5c乃至5eで表している)。
支持体41で隔てられたプリント基板7他面の電気回路
5Cは、支持体41に設けた貫通コンデンサや同軸線路
等(図示せず)で接続される。プリント基板3及び7上
の電気回路5Cは、金属板6と金属カバー7と金属ブロ
ック82とによって外部回路に対して電磁シールドされ
る。The electric circuit 5C is mounted on both sides of the printed circuit board 7 in addition to the circuits (represented by the circuit components 5a) on the other side of the printed circuit board 3 except for the waveguide 2 (2D in this figure) in FIG. (Represented by circuit components 5c to 5e).
The electric circuit 5C on the other surface of the printed circuit board 7 separated by the support 41 is connected by a feedthrough capacitor, a coaxial line, or the like (not shown) provided on the support 41. The electric circuit 5C on the printed circuit boards 3 and 7 is electromagnetically shielded from external circuits by the metal plate 6, the metal cover 7, and the metal block 82.
【0037】図5のマイクロ波導波管装置は、プリント
基板7と同様のプリント板及びプリント板間に所定の間
隔を保つ金属ブロック81乃至86と同様の金属ブロッ
クを多層に構成することにより、面積を一定にしたまま
電気回路5Cの規模の拡大を図ることができ、小型化の
効果が上がる。なお、プリント基板7が多層基板である
場合は、プリント基板の数を少なくすることができる。The microwave waveguide device shown in FIG. 5 has a multilayer printed circuit board similar to the printed circuit board 7 and a plurality of metal blocks similar to the metal blocks 81 to 86 for keeping a predetermined distance between the printed boards. It is possible to increase the scale of the electric circuit 5C while keeping the constant, and the effect of miniaturization is improved. When the printed board 7 is a multilayer board, the number of printed boards can be reduced.
【0038】[0038]
【発明の効果】以上説明したように本発明は、マイクロ
波信号端子と中間周波数信号端子及び電源端子を含む低
周波数信号端子とを一面から突出させるマイクロ波集積
回路と、一面に前記マイクロ波集積回路を搭載して他面
に前記マイクロ波信号端子及び前記低周波数信号端子を
貫通させる金属板と、一面が前記金属板の他面に密着す
ると共に前記マイクロ波信号端子及び前記低周波数信号
端子の貫通部分を除いて導電接続される第1のプリント
基板と、前記第1のプリント基板を複数の支持体によっ
て所定間隔だけ離して前記金属板との間に挟み込む金属
カバーとを備え、前記マイクロ波集積回路のマイクロ波
信号端子のみを貫通させる前記第1のプリント基板の他
面の部分が、前記金属カバーの所定の前記支持体との間
に導波管を構成し、前記導波管の構成部を除く前記第1
のプリント基板の他面が、前記低周波数信号端子に接続
された電気回路を搭載するので、構造の簡素化による部
品点数の削減による価格低減ができるだけでなく、導波
管部及びプリント基板搭載の電気回路に対する電磁シー
ルドを保持する効果が大である。As described above, the present invention relates to a microwave integrated circuit for projecting a microwave signal terminal and a low frequency signal terminal including an intermediate frequency signal terminal and a power supply terminal from one side, and the microwave integrated circuit on one side. A metal plate on which a circuit is mounted and the microwave signal terminal and the low-frequency signal terminal are penetrated on the other surface, and one surface of which is in close contact with the other surface of the metal plate and the microwave signal terminal and the low-frequency signal terminal A first printed circuit board that is conductively connected except for a penetrating portion, and a metal cover that sandwiches the first printed circuit board between the metal plate at a predetermined interval by a plurality of supports; A portion of the other surface of the first printed circuit board, through which only a microwave signal terminal of the integrated circuit passes, constitutes a waveguide between the metal cover and a predetermined support of the metal cover. The first except for the structure of the waveguide
Since the other surface of the printed circuit board mounts the electric circuit connected to the low-frequency signal terminal, not only the cost can be reduced by reducing the number of components due to the simplification of the structure, but also the waveguide section and the printed circuit board mounting. The effect of holding the electromagnetic shield for the electric circuit is great.
【図1】本発明の第一の実施形態によるマイクロ波導波
管装置の構造図であり、(a)は横断面図、(b)は縦
断面図である。1A and 1B are structural views of a microwave waveguide device according to a first embodiment of the present invention, wherein FIG. 1A is a cross-sectional view and FIG.
【図2】本発明の第二の実施形態によるマイクロ波導波
管装置の縦断面図である。FIG. 2 is a longitudinal sectional view of a microwave waveguide device according to a second embodiment of the present invention.
【図3】本発明の第三の実施形態によるマイクロ波導波
管装置の縦断面図である。FIG. 3 is a longitudinal sectional view of a microwave waveguide device according to a third embodiment of the present invention.
【図4】本発明の第四の実施形態によるマイクロ波導波
管装置の一部載欠した縦断面図である。FIG. 4 is a longitudinal sectional view of a microwave waveguide device according to a fourth embodiment of the present invention, with a part thereof not shown.
【図5】本発明の第五の実施形態によるマイクロ波導波
管装置の構造図であり、(a)は横断面図、(b)は縦
断面図である。5A and 5B are structural views of a microwave waveguide device according to a fifth embodiment of the present invention, wherein FIG. 5A is a cross-sectional view and FIG.
【図6】従来技術によるマイクロ波導波管装置の構造図
であり、(a)は横断面図、(b)は縦断面図である。6A and 6B are structural views of a microwave waveguide device according to a conventional technique, wherein FIG. 6A is a transverse sectional view and FIG. 6B is a longitudinal sectional view.
1,11 マイクロ波集積回路(MIC) 1a,11a,11e マイクロ波信号端子 1b 中間周波数信号端子 1c,11d 低周波数信号端子 2,2A〜2D 導波管 22,22A,22B 開口部 3,3A〜3C,7 プリント基板 4,4A,4B 金属カバー 41〜46 支持体 5,5A〜5C 電気回路 5a〜5e 回路部品 6,6A〜6C 金属板 81〜86 金属ブロック 1,11 Microwave integrated circuit (MIC) 1a, 11a, 11e Microwave signal terminal 1b Intermediate frequency signal terminal 1c, 11d Low frequency signal terminal 2,2A ~ 2D Waveguide 22,22A, 22B Opening 3,3A ~ 3C, 7 Printed circuit board 4,4A, 4B Metal cover 41-46 Support 5,5A-5C Electric circuit 5a-5e Circuit component 6,6A-6C Metal plate 81-86 Metal block
Claims (10)
子及び電源端子を含む低周波数信号端子とを一面から突
出させるマイクロ波集積回路と、一面に前記マイクロ波
集積回路を搭載して他面に前記マイクロ波信号端子及び
前記低周波数信号端子を貫通させる金属板と、一面が前
記金属板の他面に密着すると共に前記マイクロ波信号端
子及び前記低周波数信号端子の貫通部分を除いて導電接
続される第1のプリント基板と、前記第1のプリント基
板を複数の支持体によって所定間隔だけ離して前記金属
板との間に挟み込む金属カバーとを備え、 前記マイクロ波集積回路のマイクロ波信号端子のみを貫
通させる前記第1のプリント基板の他面の部分が、前記
金属カバーの所定の前記支持体との間に導波管を構成
し、 前記導波管の構成部を除く前記第1のプリント基板の他
面が、前記低周波数信号端子に接続された電気回路を搭
載することを特徴とするマイクロ波導波管装置。1. A microwave integrated circuit for projecting a microwave signal terminal and a low frequency signal terminal including an intermediate frequency signal terminal and a power supply terminal from one surface, and the microwave integrated circuit mounted on one surface and the microwave integrated circuit mounted on the other surface. A metal plate that penetrates the microwave signal terminal and the low-frequency signal terminal is electrically connected to one side of the metal plate except for a penetrating portion of the microwave signal terminal and the low-frequency signal terminal. A first printed circuit board, and a metal cover that sandwiches the first printed circuit board between the metal plate at a predetermined interval by a plurality of supports, wherein only a microwave signal terminal of the microwave integrated circuit is provided. A portion of the other surface of the first printed circuit board to be penetrated forms a waveguide between the metal cover and a predetermined support of the metal cover, and before a component of the waveguide is removed. Other surfaces of the first printed circuit board, said microwave waveguide and wherein the mounting the electrical circuit connected to the low-frequency signal terminal.
波管の構成部が、全面導体層を備えることを特徴とする
請求項1記載のマイクロ波導波管装置。2. The microwave waveguide device according to claim 1, wherein the component part of the waveguide on the other surface of the first printed circuit board includes a full-surface conductor layer.
記第1のプリント基板の一面の前記導波管の構成部の近
傍において電気回路搭載用の空間を有するように形状変
更されていることを特徴とする請求項1又は請求項2記
載のマイクロ波導波管装置。3. The shape of the metal plate constituting the waveguide is changed so as to have a space for mounting an electric circuit on one surface of the first printed circuit board in the vicinity of the component of the waveguide. The microwave waveguide device according to claim 1 or 2, wherein:
して垂直方向にするように前記金属カバーに形成したE
ベンドと前記金属板及び前記第1のプリント基板に形成
した導電性の貫通穴を備えることを特徴とする請求項1
又は請求項2記載のマイクロ波導波管装置。4. An E-shaped waveguide formed in the metal cover such that an opening is perpendicular to the metal plate.
2. A bend and a conductive through hole formed in the metal plate and the first printed circuit board.
Or the microwave waveguide device according to claim 2.
して直角方向にするように前記金属カバーにHベンドを
形成していることを特徴とする請求項1又は請求項2又
は請求項3記載のマイクロ波導波管装置。5. An H-bend is formed in the metal cover so that the waveguide has an opening perpendicular to the metal plate. The microwave waveguide device according to claim 3.
イクロ波信号端子の部分から前記金属板に対して直角方
向に形成されていることを特徴とする請求項1又は請求
項2又は請求項3記載のマイクロ波導波管装置。6. The waveguide according to claim 1, wherein the waveguide is formed in a direction perpendicular to the metal plate from a portion of the microwave signal terminal protruding from an opening. The microwave waveguide device according to claim 3.
して垂直方向にするようにEベンド及び貫通穴を前記金
属カバーに形成したことを特徴とする請求項1又は請求
項2又は請求項3記載のマイクロ波導波管装置。7. The metal cover according to claim 1, wherein the waveguide has an E-bend and a through hole formed in the metal cover so that an opening is perpendicular to the metal plate. Or the microwave waveguide device according to claim 3.
マイクロ波信号端子間の接続が、共通の前記導波管を介
して行なわれることを特徴とする請求項1乃至請求項7
のいずれか記載のマイクロ波導波管装置。8. The connection between microwave signal terminals of the microwave integrated circuit, which are different from each other, is made through a common waveguide.
The microwave waveguide device according to any one of the above.
属カバーとの間に複数の金属製支持体で所定の間隔を保
った少なくとも1枚のプリント基板を備え、貫通した前
記マイクロ波信号端子を含む前記第1のプリント基板の
他面とこの他面に対向する第2のプリント基板の全面導
体層を有する一面と前記金属製支持体とよって前記導波
管を構成することを特徴とする請求項1又は請求項2又
は請求項3記載のマイクロ波導波管装置。9. The microwave signal, wherein at least one printed circuit board is provided between the other surface of the first printed circuit board and the metal cover at a predetermined interval with a plurality of metal supports, and the microwave signal passes through the printed circuit board. The waveguide is constituted by the other surface of the first printed circuit board including the terminal, one surface of the second printed circuit board facing the other surface having the entire conductor layer, and the metal support. The microwave waveguide device according to claim 1, 2 or 3, wherein:
ント基板が、前記低周波数信号端子に直接あるいは間接
的に接続されると共に他回路に対して電磁シールドされ
ている電気回路を搭載することを特徴とする請求項1又
は請求項2又は請求項3又は請求項9記載のマイクロ波
導波管装置。10. The printed circuit board, excluding a component part of the waveguide, is mounted with an electric circuit connected directly or indirectly to the low-frequency signal terminal and electromagnetically shielded from other circuits. The microwave waveguide device according to claim 1, characterized in that:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31128999A JP3344388B2 (en) | 1999-11-01 | 1999-11-01 | Microwave waveguide device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31128999A JP3344388B2 (en) | 1999-11-01 | 1999-11-01 | Microwave waveguide device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001136008A true JP2001136008A (en) | 2001-05-18 |
JP3344388B2 JP3344388B2 (en) | 2002-11-11 |
Family
ID=18015352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP31128999A Expired - Fee Related JP3344388B2 (en) | 1999-11-01 | 1999-11-01 | Microwave waveguide device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3344388B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007295030A (en) * | 2006-04-20 | 2007-11-08 | Nec Corp | Microwave waveguide device |
JP2009213049A (en) * | 2008-03-06 | 2009-09-17 | Denso Corp | High-frequency device |
JP2009213050A (en) * | 2008-03-06 | 2009-09-17 | Denso Corp | High-frequency device |
WO2012155340A1 (en) * | 2011-05-17 | 2012-11-22 | Huawei Technologies Co., Ltd. | Microwave module |
-
1999
- 1999-11-01 JP JP31128999A patent/JP3344388B2/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007295030A (en) * | 2006-04-20 | 2007-11-08 | Nec Corp | Microwave waveguide device |
JP2009213049A (en) * | 2008-03-06 | 2009-09-17 | Denso Corp | High-frequency device |
JP2009213050A (en) * | 2008-03-06 | 2009-09-17 | Denso Corp | High-frequency device |
US8054142B2 (en) | 2008-03-06 | 2011-11-08 | Denso Corporation | Plural rectangular waveguides having longer cross-sectional lengths based on shorter waveguide line lengths |
US8134427B2 (en) | 2008-03-06 | 2012-03-13 | Denso Corporation | Waveguide tube formed by laminating a plate and substrates having waveguide passages |
WO2012155340A1 (en) * | 2011-05-17 | 2012-11-22 | Huawei Technologies Co., Ltd. | Microwave module |
US9301426B2 (en) | 2011-05-17 | 2016-03-29 | Huawei Technologies Co., Ltd. | Microwave module |
Also Published As
Publication number | Publication date |
---|---|
JP3344388B2 (en) | 2002-11-11 |
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