JP2007295030A - Microwave waveguide device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the matter of a conventional microwave waveguide device that there is room for improvement with an aspect of miniaturization of the device. <P>SOLUTION: The microwave waveguide device comprises a printed board 3, a microwave integrated circuit 1 provided on the first surface side of the printed board 3, a waveguide 2a (first waveguide) provided on the first surface side of the printed board 3 and becoming the path of a microwave inputted to the microwave integrated circuit 1 or outputted therefrom, and a waveguide 2b (second waveguide) provided on the second surface of the printed board 3 opposite to the first surface and becoming the path of a microwave. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a microwave waveguide device.

  FIG. 9A is a cross-sectional view showing a conventional microwave waveguide device. FIG. 9B is a longitudinal sectional view showing the apparatus. The illustrated microwave integrated circuit (also referred to as MIC) 15 has a microwave signal terminal 1q and a low frequency signal terminal including an intermediate frequency signal terminal 1s and a power supply terminal 1r protruding from one surface. These terminals 1q, 1r, and 1s serve as electrical connection portions between the microwave integrated circuit 15 and other microwave circuits and the electric circuit 5H. One surface of the microwave integrated circuit 15 is attached (mounted) to one surface of the metal plate 6H. The terminals 1q, 1r, and 1s protrude through the metal plate 6H.

  The other surface of the metal plate 6H is divided into a portion that forms the waveguide 2s together with the metal cover 4J, and a portion that is in close contact with one surface of the printed board 3J and is conductively connected. The terminal 1q of the microwave integrated circuit 15 is inserted into the waveguide 2s to form a coaxial / waveguide converter. The terminals 1r and 1s also project through the printed board 3J and are electrically connected to an electric circuit 5H such as an intermediate frequency signal circuit or a power supply circuit mounted on the other surface of the printed board 3J. The electric circuit 5H is covered with a metal cover 4H. The metal cover 4H electromagnetically shields the electric circuit 5H from other circuits together with the metal plate 6H (or a conductor layer formed on one surface of the printed board 3J).

A microwave waveguide device having substantially the same configuration as that shown in FIGS. 9A and 9B is disclosed in Patent Document 1. In addition to Patent Document 1, Patent Documents 2 and 3 are cited as prior art documents related to the present invention.
JP-A-9-83202 JP 2001-136008 A Japanese Patent Laid-Open No. 10-84217

  However, in the structure of the microwave waveguide device shown in FIGS. 9A and 9B, the waveguide circuit can be provided only on one plane. In particular, in the case where there are a plurality of terminals of a microwave integrated circuit constituting a coaxial / waveguide converter, if the waveguide circuit can be configured only on one plane, the waveguides are crossed in three dimensions. I can't. Therefore, the conventional microwave waveguide device has room for improvement in terms of miniaturization of the device.

  A microwave waveguide device according to the present invention includes a printed circuit board, a microwave integrated circuit provided on the first surface side of the printed circuit board, and the microwave integrated circuit provided on the first surface of the printed circuit board. A first waveguide serving as a path for microwaves input to or output from the microwave integrated circuit, and a second surface which is a surface opposite to the first surface of the printed circuit board, and And a second waveguide serving as a microwave path.

  In this microwave waveguide device, waveguides are provided on both sides of the printed circuit board. Thereby, it is also possible to arrange a plurality of waveguides so as to cross three-dimensionally. Therefore, a microwave waveguide device having a structure suitable for miniaturization is realized.

  According to the present invention, a microwave waveguide device having a structure suitable for miniaturization is realized.

  Hereinafter, preferred embodiments of a microwave waveguide device according to the present invention will be described in detail with reference to the drawings. In the description of the drawings, the same reference numerals are assigned to the same elements, and duplicate descriptions are omitted.

(First embodiment)
FIG. 1A is a cross-sectional view showing a first embodiment of a microwave waveguide device according to the present invention. FIG. 1B is a longitudinal sectional view showing the apparatus. This microwave waveguide device is provided on a printed circuit board 3, a microwave integrated circuit 1 provided on the first surface (upper surface in the drawing) side of the printed circuit board 3, and a first surface of the printed circuit board 3. And a waveguide 2a (first waveguide) serving as a microwave path that is input to or output from the microwave integrated circuit 1, and on the side opposite to the first surface of the printed circuit board 3. And a waveguide 2b (second waveguide) which is provided on a second surface (lower surface in the figure) which is a surface and serves as a path of the microwave.

  Further, the microwave waveguide device includes a microwave signal terminal 1a (first microwave input / output terminal) extending from the microwave integrated circuit 1 to the inside of the waveguide 2a, and a waveguide from the microwave integrated circuit 1. A microwave signal terminal 1d (second microwave input / output terminal) extending to the inside of the tube 2b is provided. In addition, the microwave waveguide device is provided on the first surface side of the printed board 3 with a predetermined distance from the printed board 3, and the metal plate 6 constituting the inner wall of the waveguide 2 a together with the printed board 3. (First metal plate) and a metal cover 4 (on the second surface side of the printed circuit board 3, spaced apart from the printed circuit board 3 and constituting the inner wall of the waveguide 2 b together with the printed circuit board 3 ( Second metal plate).

  In the microwave integrated circuit 1, microwave signal terminals 1a and 1d, an intermediate frequency signal terminal 1b, and a low frequency signal terminal 1c including a power supply terminal are projected from one surface (downward in the drawing). The microwave signal terminals 1a and 1d have different lengths. Specifically, the microwave signal terminal 1d is longer than the microwave signal terminal 1a. One surface of the microwave integrated circuit 1 is attached (mounted) to one surface (upper side of the drawing) of the metal plate 6. The microwave signal terminals 1a and 1d, the intermediate frequency signal terminal 1b, and the low frequency signal terminal 1c penetrate from the one surface of the metal plate 6 to the other surface (downward in the drawing). The first surface of the printed circuit board 3 is in close contact with the entire other surface of the metal plate 6 and is conductively connected.

  However, the terminals 1 b to 1 d also penetrate the printed board 3 and protrude from the other surface of the printed board 3. The portion where the terminal 1d penetrates the metal plate 6 and the printed board 3 has a coaxial structure in which the terminal 1d is a central conductor and the support 61 and the end face of the through hole of the printed board 3 described later are external conductors. The portion of the printed circuit board 3 through which the terminals 1b to 1d pass may have a through-hole structure so that the terminals 1b to 1d do not contact. Further, metal plating may be performed on the side surface in the thickness direction of the printed circuit board 3. In the following description of the embodiment, in order to facilitate understanding of the features of the embodiment, the description of the above-described components and the like will be omitted except when necessary.

  The printed board 3 is sandwiched and fixed between a metal plate 6 and a metal cover 4. Here, on both surfaces of the printed circuit board 3, as described above, the waveguides 2a and 2b are formed between the metal plate 6 and the metal cover 4, respectively. Therefore, the metal plate 6 and the printed circuit board 3 are separated from each other by a predetermined distance by the plurality of supports 61, 63, 64, 65, 66 so that only the fundamental mode passes through the waveguide 2a. The supports 61, 63, 64, 65, 66 may be formed integrally with the metal plate 6.

  Similarly, with respect to the waveguide 2b, the metal cover 4 and the printed board 3 are separated by a predetermined distance by the supports 41 to 46 so that only the fundamental mode passes. The supports 41 to 46 may be formed integrally with the metal cover 4. The support 41 also functions as a partition between the waveguide 2b and the low frequency signal circuit (electric circuit 5).

  The portions of the printed circuit board 3 facing the waveguides 2a and 2b may have both surfaces as conductors, or at least one of the conductor layers may be completely eliminated. Alternatively, the printed circuit board 3 may be a multilayer board having three or more layers, and a conductor layer may be formed only in the intermediate layer. In the absence of this conductor layer, the waveguides 2a and 2b form a dielectric layer in the printed circuit board 3 portion. Therefore, in this case, the interval between the printed board 3 and the metal plate 6 or the metal cover 4 may be set as appropriate so that only the fundamental mode passes through the waveguide 2a or the waveguide 2b.

  The waveguide 2a is configured as a portion surrounded by the metal plate 6, the printed circuit board 3, and the supports 61, 63, 64, 65, and 66. Similarly, the waveguide 2 b is configured as a portion surrounded by the metal cover 4, the printed circuit board 3, and the supports 41 to 46. The waveguide 2a and the microwave signal terminal 1a, and the waveguide 2b and the microwave signal terminal 1d form a coaxial-waveguide circuit, respectively. For example, when the microwave integrated circuit 1 is a transceiver, a microwave signal is output from the microwave signal terminal 1a to the waveguide 2a and input from the waveguide 2b to the microwave signal terminal 1d.

  On the other hand, an electrical circuit 5 such as an intermediate frequency signal circuit, a low frequency signal circuit, or a power supply circuit is provided on the second surface of the printed circuit board 3. In the portion where the electric circuit 5 is provided, the waveguide 2 b is surrounded by the metal cover 4 and the supports 41 to 46.

  The electric circuit 5 including circuit components and the like is connected to the terminals 1b and 1c of the microwave integrated circuit 1 by metal wires or the like. In the microwave waveguide device of the present embodiment, an integrated composite electric circuit is configured. In this microwave waveguide device, the power supply and the low-frequency signal are connected between the electric circuit 5 and another circuit through a wiring pattern (not shown) on the surface layer or the inner layer of the printed circuit board 3. Moreover, since the electric circuit 5 on the printed circuit board 3 has a structure sandwiched between the metal cover 4 and the metal plate 6, it is electromagnetically shielded from other circuits.

  In FIG. 1A, the opening 22A and the opening 22B of the waveguide 2a and the waveguide 2b, respectively, are on the same plane on the left side of the figure, but either one or both of the waveguides 2a and 2b. The openings 22A and 22B may be brought out on different planes by inserting an H vent.

  The effect of this embodiment will be described. In this microwave waveguide device, waveguides 2 a and 2 b are provided on both surfaces of the printed circuit board 3, respectively. Thereby, it is also possible to arrange a plurality of waveguides so as to cross three-dimensionally. Therefore, a microwave waveguide device having a structure suitable for miniaturization has been realized.

  Thus, when the coaxial-waveguide conversion circuit is provided on both sides of the printed circuit board, the size of the microwave integrated circuit, and hence the entire microwave waveguide device, can be reduced as compared with the case where the coaxial-waveguide conversion circuit is provided only on one side of the printed circuit board. Becomes easy. For this reason, the number of parts is reduced by the simplification of the structure, and thereby the manufacturing cost can be reduced. Furthermore, the effect of holding the electromagnetic shield for the electric circuit mounted on the waveguide portion and the printed circuit board is also increased.

  By the way, when a plurality of waveguides are formed on the same surface, the electromagnetic shielding properties between the waveguides are affected by the electrical contact between the printed circuit board and the support. On the other hand, when the waveguides are arranged up and down as in the present embodiment, the waveguides are separated only by the printed board having the entire surface as a metal conductor. For this reason, in the latter case, the electromagnetic shielding property between the upper and lower waveguides is high without being affected by the electrical contact between the printed circuit board and the support.

  In the present embodiment, the lower waveguide 2b is wider than the upper waveguide 2a. When the microwave integrated circuit 1 is a frequency multiplication module, the operating frequency of the output terminal is an integral multiple of that of the input terminal. In general, since the mechanical dimension of the waveguide is inversely proportional to the frequency, the waveguide dimension of the input terminal needs to be an integral multiple larger than that of the output terminal. In this structure, the input terminal is a long probe (terminal 1d), the waveguide 2b having a low frequency and a large mechanical dimension is provided on the cover side, and the metal plate 6 and the printed board 3 are simply penetrated by a coaxial structure. . Because of the coaxial structure, the through-hole diameters of the metal plate 6 and the printed circuit board 3 do not depend on the frequency and can be made small. That is, since it is possible to reduce the interval between the probes of the microwave integrated circuit 1, it is possible to contribute to the miniaturization of the microwave integrated circuit 1, and thus the entire microwave waveguide device.

(Second Embodiment)
FIG. 2 is a cross-sectional view showing a second embodiment of the microwave waveguide device according to the present invention. The microwave waveguide device shown in FIG. 2 also has a configuration based on substantially the same design concept as the microwave waveguide device shown in FIGS. 1 (a) and 1 (b). However, in the microwave waveguide device of FIG. 2, the other waveguides are formed such that the openings 22A and 22B of the waveguides 2a and 2b are oriented in the vertical direction (upward in the drawing) with respect to the metal plate 6A. Diversification of connection with devices.

  In the microwave waveguide device shown in FIG. 2, an E bend 21A (or an E corner) may be provided on the waveguide 2a of the metal plate 6A. Further, an E bend 21B (or an E corner) may be provided in the waveguide 2b portion of the metal cover 4A. A waveguide having the same size as the diameter of the waveguide 2b is passed through the printed board 3A and the metal plate 6A in the bending direction of the waveguide 2b. A conductor layer is provided on the waveguide wall portion of the printed circuit board 3A. The waveguide wall portion of the metal plate 6A has a conductor layer.

  Further, either the metal cover 4A or the metal plate 6A is set so that either one or both of the openings 22A and 22B are in a direction perpendicular to the metal cover 4A or the metal plate 6A (front side or depth direction in the drawing). An H bend (or an H corner) may be formed on one or both.

  In this case, in the waveguide 2a, an H bend (or an H corner) may be formed in the metal plate 6A so that the opening 22A is in a direction perpendicular to the metal plate 6A (front side or depth direction in the drawing). May be. The printed board 3A and the metal plate 6A do not need to be provided with through holes for the waveguide. As shown in FIG. 2, an electric circuit can be mounted on one surface of the printed board 3A.

  Similarly, in the waveguide 2b, an H bend (or an H corner) may be formed in the metal cover 4A so that the opening 22B is in a direction perpendicular to the metal cover 4A (front side or depth direction in the drawing). May be. In this case, it is not necessary to provide a through hole for the waveguide in the printed board 3A and the metal plate 6A. As shown in FIG. 2, an electric circuit can be mounted on one surface of the printed board 3A.

  In any case, the metal cover 4A and the metal plate 6A are provided with another support and a support for partitioning with the electric circuit 5 corresponding to the supports 41A and 61A in order to form the waveguide. . In this microwave waveguide device as well, it is needless to say that an electric circuit 5A including electric parts and mechanical parts can be mounted on both surfaces of the printed board 3A.

(Third embodiment)
FIG. 3 is a sectional view showing a third embodiment of the microwave waveguide device according to the present invention. The microwave waveguide device shown in FIG. 3 also has a configuration based on substantially the same design concept as the microwave waveguide device of FIG. However, in the microwave waveguide device of FIG. 3, the other waveguides are formed such that the openings 22C and 22D of the waveguides 2c and 2d are oriented in the vertical direction (downward in the drawing) with respect to the metal cover 4B. Diversification of connection with devices.

  As described with reference to FIG. 2, the metal cover 4B or the metal plate so that one of the openings 22C and 22D is in a direction perpendicular to the metal cover 4B or the metal plate 6B (front side or depth direction in the drawing). An H bend (or an H corner) may be formed on 6B.

(Fourth embodiment)
FIG. 4 is a sectional view showing a fourth embodiment of the microwave waveguide device according to the present invention. The microwave waveguide device shown in FIG. 4 also has a configuration based on substantially the same design concept as the microwave waveguide device shown in FIG. However, in the microwave waveguide device of FIG. 4, the opening 22E of the waveguide 2e is oriented in the direction perpendicular to the metal plate 6C (upward in the drawing), while the opening 22F of the waveguide 2f. Is intended to diversify the connection with other waveguide devices so as to be directed perpendicularly to the metal cover 4C (downward in the figure).

(Fifth embodiment)
FIG. 5 is a sectional view showing a fifth embodiment of the microwave waveguide device according to the present invention. The microwave waveguide device shown in FIG. 5 also has a configuration based on substantially the same design concept as the microwave waveguide device shown in FIG. However, in the microwave waveguide device shown in FIG. 5, the coupling hole 7 is provided in the printed circuit board 3D constituting the waveguides 2g and 2h, and the wave absorber 8 is provided at the end of the waveguide 2h, thereby introducing the waveguide. A wave tube directional coupler is realized.

  This structure is particularly useful when the microwave integrated circuit 1 is a transmitter, the terminal 1a is a main signal output, and the terminal 1d is an input terminal for measuring a transmission output.

(Sixth embodiment)
FIG. 6 is a sectional view showing a sixth embodiment of the microwave waveguide device according to the present invention. In the microwave waveguide device shown in FIG. 6, a plurality of microwave integrated circuits 1 are connected in cascade.

(Seventh embodiment)
FIG. 7 is a sectional view showing a seventh embodiment of the microwave waveguide device according to the present invention. In the microwave waveguide device shown in FIG. 7, the microwave signal terminal 1f of the microwave integrated circuit 11 and the microwave signal terminal 1j of another microwave integrated circuit 12 are connected to each other via the waveguide 2n. ing. Further, the microwave signal terminals 1e and 1h of the microwave integrated circuit 11 have a waveguide input / output structure with openings 22G and 22H.

  When the microwave integrated circuit 12 is an oscillator and the microwave integrated circuit 11 is a transmitter / receiver, the oscillator output signal output from the microwave signal terminal 1j is a microwave signal of the microwave integrated circuit 11 via the shared waveguide 2n. Input to terminal 1f. The microwave signal modulated or frequency-converted by the microwave integrated circuit 11 is connected to other microwave circuits via the microwave signal terminals 1e and 1h, the waveguides 2m and 2p, and the openings 22G and 22H. The

  In FIG. 7, when a transmission / reception converter module having a long probe (terminal 1f) as a low-frequency L0 input terminal and a short probe (terminals 1e and 1h) as a high-frequency RF input / output terminal is used, the same as FIG. In addition, it can contribute to miniaturization of modules and devices.

(Eighth embodiment)
FIG. 8A is a cross-sectional view showing an eighth embodiment of the microwave waveguide device according to the present invention. Moreover, FIG.8 (b) is a longitudinal cross-sectional view which shows the same apparatus. The basic structure of the microwave waveguide device shown in these figures is the same as that of the microwave waveguide device of FIG. 1, but in order to increase the mounting scale of the electric circuit, the printed circuit board 3G and metal A printed circuit board 3H is added between the cover 4G and the cover 4G. The printed circuit board 3G and the printed circuit board 3H are separated by a predetermined distance by metal blocks 81 to 87.

(A) is a cross-sectional view showing a first embodiment of a microwave waveguide device according to the present invention. (B) is a longitudinal sectional view showing the apparatus. It is sectional drawing which shows 2nd Embodiment of the microwave waveguide device by this invention. It is sectional drawing which shows 3rd Embodiment of the microwave waveguide device by this invention. It is sectional drawing which shows 4th Embodiment of the microwave waveguide device by this invention. It is sectional drawing which shows 5th Embodiment of the microwave waveguide device by this invention. It is sectional drawing which shows 6th Embodiment of the microwave waveguide device by this invention. It is sectional drawing which shows 7th Embodiment of the microwave waveguide device by this invention. (A) is a cross-sectional view showing an eighth embodiment of a microwave waveguide device according to the present invention. (B) is a longitudinal sectional view showing the apparatus. (A) is a cross-sectional view showing a conventional microwave waveguide device. (B) is a longitudinal sectional view showing the apparatus.

Explanation of symbols

1, 11, 12, 13, 15 Microwave integrated circuit (MIC)
1a, 1d, 1e, 1f, 1h, 1j, 1k, 1m, 1q Microwave signal terminals 1b, 1p, 1s Intermediate frequency signal terminals 1c, 1g, 1n, 1r Low frequency signal terminals 2a-2s Waveguides 22A-22K Openings 3, 3A-3J Printed circuit board 4, 4A-4J Metal covers 41-46, 41A-41G Supports 61, 63, 64, 65, 66, 61A-61G Supports 5, 5A-5H Electrical components 6, 6A -6H Metal plate 81-87 Metal block 7 Bonding hole 8 Wave absorber

Claims (17)

A first printed circuit board;
A microwave integrated circuit provided on the first surface side of the first printed circuit board;
A first waveguide provided on the first surface of the first printed circuit board and serving as a path of microwaves input to or output from the microwave integrated circuit;
A second waveguide provided on a second surface, which is a surface opposite to the first surface of the first printed circuit board, and serving as a path for the microwave;
A microwave waveguide device comprising: The microwave waveguide device according to claim 1, wherein
A first microwave input / output terminal extending from the microwave integrated circuit to the inside of the first waveguide;
A microwave waveguide device comprising: a second microwave input / output terminal extending from the microwave integrated circuit to the inside of the second waveguide. The microwave waveguide device according to claim 1 or 2,
The first printed circuit board is provided on the first surface side of the first printed circuit board with a predetermined distance from the first printed circuit board and constitutes an inner wall of the first waveguide together with the first printed circuit board. With a metal plate,
The second printed circuit board is provided on the second surface side of the first printed circuit board with a predetermined distance from the first printed circuit board and constitutes an inner wall of the second waveguide together with the first printed circuit board. A microwave waveguide device. The microwave waveguide device according to claim 3, wherein
The first metal plate is a microwave waveguide device having a space for mounting an electric circuit in the vicinity of a portion of the first surface of the first printed board facing the first waveguide. The microwave waveguide device according to claim 3 or 4,
A microwave waveguide device in which an E-bend is formed on the first metal plate such that an opening of the first waveguide is perpendicular to the first metal plate. The microwave waveguide device according to any one of claims 3 to 5,
An E-bend is formed in the second metal plate such that the opening of the second waveguide is perpendicular to the first metal plate, and the first metal plate and the first metal plate A microwave waveguide device in which a conductive through hole is formed in a first printed circuit board. The microwave waveguide device according to any one of claims 3 to 6,
An E-bend is formed in the first metal plate such that the opening of the first waveguide is perpendicular to the second metal plate, and the second metal plate and the second metal plate A microwave waveguide device in which a conductive through hole is formed in a first printed circuit board. The microwave waveguide device according to any one of claims 3 to 7,
A microwave waveguide device in which an E-bend is formed on the second metal plate such that an opening of the second waveguide is perpendicular to the second metal plate. The microwave waveguide device according to any one of claims 3 to 8,
A microwave waveguide device in which an H-bend is formed on the first metal plate such that an opening of the first waveguide is perpendicular to the first metal plate. The microwave waveguide device according to any one of claims 3 to 9,
A microwave waveguide device in which an H-bend is formed on the second metal plate such that an opening of the second waveguide is perpendicular to the second metal plate. The microwave waveguide device according to any one of claims 3 to 10,
A second printed circuit board provided between the first printed circuit board and the second metal plate;
The first printed circuit board and the second printed circuit board are spaced apart from each other by a metal support,
The first waveguide is provided between the first printed circuit board and the second printed circuit board;
The second waveguide is a microwave waveguide device provided between the second printed circuit board and the second metal plate. The microwave waveguide device according to any one of claims 1 to 11,
A microwave waveguide device in which a conductor layer is formed on a portion of the second surface of the first printed board facing the second waveguide. The microwave waveguide device according to any one of claims 1 to 12,
A microwave waveguide device, wherein a coupling hole is formed in the first printed circuit board, and the first waveguide and the second waveguide are electromagnetically coupled to each other through the coupling hole. The microwave waveguide device according to any one of claims 1 to 13,
A plurality of the microwave integrated circuits,
A microwave waveguide device configured such that connection between microwave signal terminals of different microwave integrated circuits is performed via the first waveguide. The microwave waveguide device according to any one of claims 1 to 13,
A plurality of the microwave integrated circuits,
A microwave waveguide device configured such that connections between different microwave signal terminals of the microwave integrated circuits are made via the second waveguide. The microwave waveguide device according to claim 14 or 15,
A microwave waveguide device configured so that connection between microwave signal terminals of different microwave integrated circuits is performed via the first and second waveguides. The microwave waveguide device according to any one of claims 1 to 16,
Portions other than the portion facing the second waveguide of the first printed circuit board are directly or indirectly connected to a low frequency signal terminal extending from the microwave integrated circuit, and electromagnetically from other circuits. A microwave waveguide device with a shielded electrical circuit.

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