JP2890808B2 - Electronics - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device used for a high-frequency device or the like.

2. Description of the Related Art In recent years, with the practical use of satellite broadcasting and the spread of cable TV, demands for higher performance of high-frequency electronic devices have been increasing day by day.

Conventionally, this type of electronic device has a configuration as shown in FIGS. That is, reference numeral 1 denotes a shield case, and another shield case 2 is disposed inside the shield case 1 to prevent unwanted radiation, which is one of important high-frequency performances, from entering. A signal from an electronic component (not shown) mounted inside the shield case 2 is extracted by a feedthrough capacitor 3 implanted in a frame of the shield case 2. It was connected to the feedthrough capacitor 4 implanted in the frame. The signal from the feedthrough capacitor 4 is once received by the wiring board 5, and is further extracted from the wiring board 5 to the outside by the cable 6. Then, the cable 6 was input to the shield case 7 as the second high-frequency unit, and was connected to the wiring board 8 mounted therein.

However, in such a conventional configuration, since the shield case 1, the shield case 7, and two high-frequency units are used, it is necessary to connect these two high-frequency units with the cable 6. Was. Therefore, the two high-frequency units are connected by the cable 6, but at this time, the cable 6 functions as an antenna. Therefore, there is a problem in that the cable 6 reduces the original function of the shield cases 1 and 7 for preventing the unnecessary radiation from jumping in and out.

The present invention solves such a problem.
The purpose is to improve shielding performance and reduce unnecessary radiation.

Means for Solving the Problems To achieve this object, an electronic device according to the present invention comprises a large-sized high-frequency unit and a small-sized high-frequency unit disposed therein, and the large-sized high-frequency unit has a shield case. And a wiring board mounted in the shield case, and an electronic component mounted on the wiring board, and the wiring board is fitted with the small high-frequency unit provided at an end thereof. A notch, a plurality of recesses provided in the notch, and a wiring pattern connected to the recess. The small high-frequency unit is fitted in the notch, and the small An input / output terminal having an L-shaped bent portion provided on a side surface of the high frequency unit is fitted into the concave portion.

Operation With the above configuration, the small high-frequency unit is fitted into the notch of the wiring board mounted in the shield case of the large high-frequency unit. As a result, it is possible to prevent unnecessary radiation from jumping into or out of these units. This 2
Since a cable for connecting the two units is unnecessary, unnecessary radiation from the connection cable is also eliminated, the shielding performance of the electronic device is improved, and the unnecessary radiation is reduced.

Embodiment FIG. 1 is an exploded perspective view of an electronic apparatus according to an embodiment of the present invention, and FIG. 2 is a sectional view of a main part thereof.

Hereinafter, a large-sized high-frequency unit will be described with reference to the drawings. Reference numeral 11 denotes a shield case formed of a frame, and shield cases 12 and 13 formed of lids are fitted into openings of the shield case 11. A wiring board 14 on which electronic components (not shown) are mounted is mounted inside the shield case 11. A cutout 15 is formed at one end of the wiring board 14. This notch
15 is provided with a small high-frequency unit described later.
Further, a plurality of U-shaped recesses 16 are provided on the end surface of the cutout 15, and a wiring pattern connected to electronic components and the like mounted on the wiring board 14 is guided to the recess 16. Has been.

 Next, a small high-frequency unit will be described.

Reference numeral 17 denotes a shield case formed of a frame, and an opening of the shield case 17 has a shield case 18 formed of a lid.
And 19 are fitted. Also, this shield case 17
Inside the wiring board 20 on which electronic components (not shown) are mounted.
Is installed. A feedthrough capacitor 21 is implanted on one side surface of the shield case 17, and one terminal of the feedthrough capacitor 21 is connected to a wiring pattern of the wiring board 20.

The other terminal of the feedthrough capacitor 21 is bent in an L shape.

The vertical size of the small high-frequency unit configured as described above is A, and the horizontal size is B. At this time, the notch 15 of the wiring board 14 mounted inside the large-sized high-frequency unit
Is the vertical dimension A and the horizontal dimension B of the small high-frequency unit.
Designed slightly larger. Then, the small-sized high-frequency unit is fitted and disposed in the cutout portion 15.

The input / output terminal of the feedthrough capacitor 21 having the L-shaped bent portion fits into the recess 16 of the wiring board 14. And, since the concave portion 16 formed on the wiring board 14 has a U-shaped shape, when assembling a small high-frequency unit, the recess 16 of the small high-frequency unit and the cutout 15 of the wiring board 14 are formed. Is absorbed, and the recess 16 can be easily soldered to the wiring pattern. The L-shaped bent portion also absorbs stress when an external force is applied, so that cracks or the like in soldering do not occur.

Further, the shield case 17 of the small high-frequency unit has a top surface portion 17a in a part. The top surface 17a is provided with a hole 22 which is burred for screw fixing and is tapped. The shield case 18 also has a hole 23 at a position corresponding to the hole 22.

Similarly, the shield case 11 of the large-sized high-frequency unit has a top surface portion 11a in a part. And the top part 11a
Is also provided with a hole 24, the shield case of which is the lid
Holes 12 are also provided at positions corresponding to the holes 24 in the hole 12. The hole 23 provided in the shield case 18 and the hole 24 provided in the shield case 11 are larger than the hole 22 provided in the shield case 17 and smaller than the head of the screw 26. The hole 25 provided in the shield case 12 is larger than the head of the screw 26. Then, as shown in FIG. 2, the shield case 11 and the shield case 18 are firmly fastened to the shield case 17 with screws 26, and the shield case 12 is put on the shield case 11. Accordingly, only the lid of the shield case 12 can be removed while the shield cases 17, 18, and 11 are kept in close contact, so that repair can be easily performed.

As described above, according to the present embodiment, a part of the shield case of the large high-frequency unit re-shields the small high-frequency unit. In addition, there is no need to provide a connection wiring board 5, a cable 6, or a feedthrough capacitor 4. Therefore, there is no reduction in the shielding performance due to the cable 6, and a reasonable and high shielding effect is obtained.

In addition, the work of connecting the units is not required, and the workability of assembly is improved.

Furthermore, as a result of rationalization of the number of parts, downsizing of the electronic device can be realized.

Furthermore, cost can be reduced as a result of rationalization of the number of parts.

Effects of the Invention As described above, according to the present invention, a small high-frequency unit is fitted into a cutout portion of a wiring board mounted in a shield case of a large high-frequency unit. Since the shield is further shielded by the shield case of the high-frequency unit, unnecessary radiation can be prevented from jumping into or out of the small high-frequency unit. Furthermore, since a cable for connecting these two units is not required, unnecessary radiation from the connection cable is also eliminated,
The shielding performance of this electronic device is improved, and unnecessary radiation can be reduced. Moreover, it also has the following effects.

That is, also in the present invention, since the connection between the small high-frequency unit and the wiring board is performed by the concave portion and the input / output terminal having the L-shaped bent portion fitted into the concave portion, even if an external force is applied. Also, stress is absorbed, and no solder cracks occur.

Furthermore, as shown in the conventional example, there is no need to separately provide a shield case, or to provide a wiring board for connection, a cable, or a feedthrough capacitor. Therefore, the work of connecting the units is not required, and the workability is improved.

Further, as a result of rationalization of the number of parts, downsizing of the electronic device can be realized.

Furthermore, cost reduction can be achieved as a result of rationalization of the number of parts.

[Brief description of the drawings]

1 is an exploded perspective view of an electronic device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a main part thereof, FIG. 3 is an exploded perspective view of a conventional electronic device, and FIG. It is. 11,12,13 …… Shield cases for large high-frequency units,
17,18,19 …… Shield cases for small high-frequency units,
14 ... wiring board, 15 ... notch, 16 ... recess, 21 ...
... Through capacitor.

Claims (1)

(57) [Claims] 1. A large-sized high-frequency unit and a small-sized high-frequency unit disposed therein, wherein the large-sized high-frequency unit includes a shield case, a wiring board mounted in the shield case, and a wiring board. An electronic component mounted on a substrate, wherein the wiring board has a notch provided at an end thereof and having a size to which the small high-frequency unit is fitted, and a plurality of notches provided in the notch. And a wiring pattern connected to the concave portion, the small high-frequency unit is fitted into the cutout portion, and an L-shaped bent portion provided on a side surface of the small high-frequency unit is formed. An electronic device in which an input / output terminal is fitted in the recess.