JP3119072B2 - High frequency equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency device such as an electronic tuner.

[0002]

2. Description of the Related Art A conventional high-frequency device of this type is shown in FIGS. FIG. 6 is a longitudinal sectional view of a conventional high-frequency device, FIG. 7 is a perspective view of the high-frequency device with a cover removed, FIG. 8 is a plan view near an auxiliary shield plate, and FIG. It is a perspective view. High-frequency device 50 shown in FIG.
Is a circuit board 51, a frame 52, and two covers 5
3 and 53.

The circuit board 51 is formed of a rectangular printed circuit board or the like.
A plurality of electronic components 54 are mounted and fixed by soldering at required positions on the printed wiring 512 (not shown). On the circuit board 51, an appropriate number of electronic components 54 are provided.
, A required number of circuit blocks are formed.

The frame 52 includes a rectangular cylindrical frame 55 made of a thin metal plate which is externally fitted and joined so as to surround the outer periphery of the circuit board 51, and a circuit board 51 on the inner circumference of the rectangular cylindrical frame 55.
And a grid-like wall portion 56 for mutually partitioning a circuit block composed of a plurality of electronic components 54 on the surface 511 side.

The cover 53 is made of a thin metal plate having a rectangular shape with a shallow bottomed cylinder, and is externally fitted to the upper and lower openings of the rectangular cylinder frame 521 of the frame 52 so as to close it.

The above-mentioned wall portion 56 of the frame 52 is
Three strip-shaped protrusions 5 provided on three sides of the rectangular cylinder frame 55
51, 552, 553, a rectangular cylinder frame 55 and a separate shield plate 57. Two (551, 55) of the three protruding pieces 551, 552, 553 of this rectangular cylinder frame 55
2) and three branch pieces 571 and 57 of the shield plate 57
Two of 573 and 573 (571 and 572) are opposed to each other with a required gap. Electronic parts such as feedthrough capacitors 54A, 54A,
4A are arranged. This feedthrough capacitor 54A is
It is accommodated and arranged in the through hole 513 of the circuit board 51.

[0007] Then, in order to press each feedthrough capacitor 54A, 54A disposed in the two separating portions 58, 58 toward the circuit board 51 and to substantially close the separating portions 58, 58, two circuit block regions 59 are formed. , 59 are fitted with auxiliary shield plates 60, 60 each having a substantially L-shape in plan view.

[0008]

By the way, in the above-mentioned conventional example, since the feedthrough capacitor 54A disposed in the separating portion 58 is pressed toward the circuit board 51 and the separating portion 58 is almost closed, the frame 52 is bothersome. Square tube frame 55
And an auxiliary shield plate 60 that is separate from the shield plate 57, but this increases the number of components,
High production costs have resulted.

Therefore, an object of the present invention is to reduce the manufacturing cost by integrally forming a portion having the same role as that of a conventional auxiliary shield plate with a frame.

[0010]

SUMMARY OF THE INVENTION The present invention comprises a circuit board on which a plurality of electronic components are mounted, and a frame mounted to surround the outer periphery of the circuit board, wherein the frame surrounds the outer periphery of the circuit board. A high-frequency device comprising a cylindrical frame fitted as described above, and a lattice-shaped wall portion that partitions a circuit block composed of a plurality of electronic components on the circuit board from each other on the inner periphery of the cylindrical frame is as follows. Configuration.

In the present invention, a separating portion for arranging electronic components is provided on the wall portion so as to extend between adjacent circuit block regions, and the wall portion or the cylindrical frame is bent so as to fall down to the circuit board side. In this state, the bent pieces that press the electronic components disposed in the separating section toward the circuit board and substantially close the separating section are integrally connected.

[0012]

In other words, the bent piece is bent so that the electronic component is placed on the separation portion of the wall portion and then turned down to the circuit board side. In this bent state, the electronic component placed on the separation portion is bent. The separator is pressed toward the circuit board side and substantially closes the separation portion.

As described above, the bent piece of the present invention plays a role similar to that of the conventional auxiliary shield plate. Since the bent piece is integrated with the frame, the number of parts is smaller than in the conventional example. Become.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the present invention will be described below with reference to the embodiments shown in FIGS. 1 to 5 relate to an embodiment of the present invention. FIG. 1 is a longitudinal sectional view of a high-frequency device, FIG. 2 is a perspective view of the high-frequency device with a cover removed, and FIG.
FIG. 4 is a plan view of the vicinity of the bent piece, FIG. 4 is an exploded perspective view of the high-frequency device, and FIG. 5 is a cross-sectional view showing a procedure for mounting and fixing the feedthrough capacitor. The high-frequency device 10 in the example is a circuit board 1
, A frame 2, and two covers 3, 3.

The circuit board 1 is formed of a rectangular printed wiring board or the like, and a plurality of electronic components 4 are mounted at required positions on the printed wiring (not shown) on the front and back surfaces 11 and 12 of the circuit board 1. . In addition, on the circuit board 1, a required number of circuit blocks are formed as an appropriate number of electronic components 4 as a unit.

The frame 2 is a rectangular cylindrical frame 2 made of a thin metal plate which is externally fitted and connected so as to surround the outer periphery of the circuit board 1.
1 and a grid-like wall portion 22 that partitions a circuit block composed of a plurality of electronic components 4 on the surface 11 side of the circuit board 1 on the inner periphery of the rectangular tube frame 21.

The cover 3 is made of a thin metal plate having a rectangular shape with a shallow bottomed cylinder, and is fitted to the upper and lower openings of the rectangular cylinder frame 21 of the frame 2 so as to close it.

The wall portion 22 of the frame 2 is formed of three strip-shaped projections 21 provided on three sides of the rectangular cylindrical frame 21.
1, 212, and 213, a rectangular tube frame 21, and a separate shield plate 23. Two of the three protruding pieces 211, 212, and 213 (211, 21
2) and three branch pieces 231 and 23 of the shield plate 23
Two of the components 2 and 233 (231 and 232) are arranged to face each other with a required gap. Electronic components such as feedthrough capacitors 4A, 4A extending between adjacent circuit block regions 25,... Are arranged in the separation portions 24, 24 formed by the two gaps. This feedthrough capacitor 4A
Are arranged in the through holes 13 of the circuit board 1.

The main body of the shield plate 23 presses the feedthrough capacitor 4A, which is arranged in the separating portion 24 in a bent state so as to fall down to the circuit board 1 side, toward the circuit board 1 and attaches the separating portion 24 to the circuit board 1 side. The bent pieces 234 that are substantially closed are integrally connected. The bent piece 234 has a V-shaped notch formed at the distal end thereof. By applying the notch to the outer periphery of the feedthrough capacitor 4A, the separation portion 24 can be formed while firmly preventing the feedthrough capacitor 4A from coming out. It is designed to block as much as possible.

A procedure for manufacturing such a high-frequency device 10 will be briefly described.

The rectangular cylindrical frame 21 of the frame 2 is combined with a shield plate 23, and one opening side of the rectangular cylindrical frame 21 is immersed in a solder bath (not shown). Thereby, the solder enters and is held in a part of each contact portion between the rectangular cylinder frame 21 and the shield plate 23.

The circuit board 1 is mounted on the square cylindrical frame 2 of the frame 2.
1 from the other opening side.

The feedthrough capacitor 4 with respect to the circuit board 1
A is attached, and the bent piece 234 is bent so as to fall down, and the feedthrough capacitor 4A is held on the circuit board 1. The separating portion 24 of the frame 2 is substantially closed by the bent piece 234.

The other opening side of the square tube frame 21 is immersed in a solder bath. As a result, the solder penetrates and is held in substantially the entire contact portions between the rectangular cylinder frame 21 and the shield plate 23.

The electronic component 4 is placed on the solder adhered to required portions of the front surface 11 and the back surface 12 of the circuit board 1 by
With. Then, by drying the solder, the electronic component 4 and the feedthrough capacitor 4A are fixed to the circuit board 1 and the shield plate 23 is fixed to the rectangular cylinder frame 21.

The covers 3 are attached to the upper and lower openings of the rectangular tube frame 21 of the frame 2.

As described above, in this embodiment, an example is described in which the electronic component 4 and the frame 2 are collectively soldered to the circuit board 1 by the reflow method. Is also good.

The present invention is not limited to the above embodiment. For example, in the above embodiment, only the circuit block composed of the electronic components 4 on the front surface 11 of the circuit board 1 is shielded by the wall portion 22. Can also be shielded with a separate shield plate. Further, it goes without saying that the numbers of the separation portions 24 and the bent pieces 234 in which the feedthrough capacitors 4A are arranged can be appropriately changed according to the design of the circuit block.

[0029]

According to the present invention, the number of component parts can be reduced by integrally connecting a bent piece having a function of temporarily fixing an electronic component disposed in a separation portion of a wall portion of a frame and closing the separation portion to the frame. Since it is smaller than before, it is possible to contribute to a reduction in manufacturing cost.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing one embodiment of a high-frequency device of the present invention.

FIG. 2 is a perspective view of the high-frequency device with a cover removed.

FIG. 3 is a plan view near a bent piece.

FIG. 4 is an exploded perspective view of the high-frequency device.

FIG. 5 is a sectional view showing a procedure for mounting and fixing the feedthrough capacitor.

FIG. 6 is a longitudinal sectional view of a conventional high-frequency device.

FIG. 7 is a perspective view of the high-frequency device with a cover removed.

FIG. 8 is a plan view near an auxiliary shield plate.

FIG. 9 is an exploded perspective view of the high-frequency device.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 high-frequency device 2 frame 3 circuit board 4 electronic component 21 frame rectangular tube frame 22 frame wall 234 bent piece 24 separating portion 25 circuit block area

Continuation of the front page (56) References JP-A-61-142795 (JP, A) JP-A-5-259685 (JP, A) JP-A-1-176995 (JP, U) JP-A-4-67387 (JP) , U) Japanese Utility Model Application Hei 2-47841 (JP, U) Japanese Utility Model Application Hei 6-44197 (JP, U) Japanese Utility Model Application Hei 1-146594 (JP, U) (58) Fields surveyed (Int. Cl. ⁷ , DB Name) H05K 9/00

Claims (1)

(57) [Claims] 1. A tubular frame having a circuit board on which a plurality of electronic components are mounted, and a frame attached to surround the outer periphery of the circuit board, wherein the frame is fitted so as to surround the outer periphery of the circuit board. And a grid-like wall portion that partitions a circuit block composed of a plurality of electronic components on the circuit board from each other on an inner periphery of the cylindrical frame, wherein the wall portion includes an adjacent circuit block. Separation portions for disposing electronic components are provided astride between the regions, and the wall portion or the cylindrical frame is provided with the electronic components to be disposed on the separation portions in a bent state so as to be tilted toward the circuit board side. A high-frequency device characterized in that a bent piece that presses toward the circuit board and substantially closes the separation portion is integrally connected.