JP2908326B2 - High frequency module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a high-frequency module having a shielded circuit block.

[0002]

2. Description of the Related Art Conventionally, when an electronic device is housed to perform electromagnetic shielding, it has been performed as follows. (1) Assembling and fixing of the upper and lower casings is performed by screwing, or a complicated connection terminal is provided on one or both casings and pressed and connected (actually 3-4375).
7, Japanese Utility Model Laid-Open No. 4-20290). (2) Also, in order to obtain an electromagnetic shield for each circuit block, a shield plate formed for each circuit block is connected to a circuit board to partition the circuit board (Japanese Patent Application Laid-Open No. 61-244098).
No.). (3) Further, a metal plate provided with cut-and-raised protrusions for the purpose of electromagnetic shielding between the upper and lower housings is provided, and integrally formed by screwing (Japanese Patent Application Laid-Open No. Sho 62-62).
193300).

[0003]

The above technique (1) has a problem that the number of working steps due to screw tightening is increased, and the material cost is increased due to the provision of complicated connection terminals.

In the technique (2) described above, since the shield plate is connected to the circuit board by, for example, soldering, there is a problem that the number of manufacturing steps and mass productivity are poor. In the technique (3) described above, similarly to (1), there is a problem that the number of steps due to screw tightening increases.

[0005] The present invention solves these problems,
The upper and lower cases are inserted into each other, the partition structure for each circuit block, the shield frame is inserted between the board and the case, and simple fixing parts such as claws and claw receiving parts are provided to provide electromagnetic shielding for each circuit block. It is intended to be realized with a simple structure.

[0006]

Means for solving the problem will be described with reference to FIG. In FIG. 1, an upper case 1 and a lower case 2 are used for shielding by placing the shield frame 3, the substrate 4, and the shield frame in this order, and include the central shielding portions 13 and 23 and the partitioning portion 1.
4, 24, and the claw receiving portion 11 (or the claw 21).

The shield frame 3 is for electrically connecting the substrate 4 to the upper case 1 or the lower case 2 and for shielding. The substrate 4 is for mounting a high-frequency circuit block.

The central shielding portions 13 and 23 are provided so that the upper case 1 and the lower case 2 enter each other to shield them. The partitions 14, 24 are provided between the circuit blocks to shield them.

The claw receiving portion 11 and the claw 21 are
7 is an example of a fixing portion that fixes the lower case 2 and the lower case 2. Next, the structure will be described.

After the shield frame 3, the substrate 4, and the shield frame 3 are placed in the upper case 1 in an overlapping manner, the lower case 2 is placed on the upper case 1, and the upper case 1 and the lower case 2 are pressed against each other to receive the nails. The part 11 and the claw 21 are engaged and fixed. As a result, there is a hole in the board 4 between the operating circuit block and the standby circuit block provided in parallel, and the upper case 1 and the lower case 2 enter each other through this hole to completely shield the shield between the two blocks. It can be carried out. Further, between the adjacent circuit blocks, there are partitions 14 and 24 of the upper case 1 and the lower case 2 for shielding, and the circuit blocks are connected by a conductive pattern of an arbitrary layer among a plurality of layers of the substrate 4. In addition, the shield is performed efficiently.

At this time, the shield frame 3 is formed of a conductive plate into a shape which comes into contact with the conductive pattern of the substrate 4 and the upper case 1 or the lower case 2 and has a U-shaped tip at arbitrary plural places. The board 4 is punched into a slightly narrower width and bent into a V-shape to electrically connect the substrate 4 to the upper case 1 or the lower case 2.

As a fixing portion for fixing the upper case 1 and the lower case 2, the upper case 1 and the lower case 2 are fixed by the claws 21 and the claw receiving portions 11, caulking or bending.

Further, the partitioning parts 14, 24 are provided for each circuit block.
Are provided for shielding. Accordingly, a structure having central shielding portions 13 and 23 in which the upper case 1 and the lower case 2 are inserted into each other, a structure having partitioning portions 14 and 24 for each circuit block, a substrate 4 and the upper case 1 and the lower case 2 are provided. By inserting the shield frame 3 between them and providing a simple fixing portion such as the claw 21 and the claw receiving portion 11, the electromagnetic shield for each circuit block can be realized with a simple structure.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments and operations of the present invention will be sequentially described in detail with reference to FIGS.

FIG. 1 is a block diagram showing an embodiment of the present invention.
FIG. 1A shows a top view and a cross-sectional view of the upper case. This is a top view and a cross-sectional view of the upper case 1, where the left side is a top view and the right side is a top cross-sectional view.

In FIG. 1A, the claw receiving portion 11 is
It is engaged with and fixed to the claws 21 of the lower case 2, and is provided at a plurality of locations around the periphery, the middle layer shielding portion 13, and the like to uniformly press and fix the shield frame 3 on the substrate 4.

The circuit block housing section 12 is a section for housing a circuit block provided on the board 4 (an element mounted on the board), and is shielded by a partition section 14 between adjacent circuit blocks. (Magnetic shield, electrostatic shield). Here, the circuit block storage unit 12
Are the same circuit, ie, an operation circuit block and a standby circuit block provided on the substrate 4, but store circuit blocks provided in parallel to operate alternately. At this time, a central shielding portion 13 is provided between the operation circuit block and the standby circuit block as shown in the figure, so that the upper case 1 and the lower case 2 enter each other, so as to form a maze structure between the circuit blocks. The shield is completely gone. Further, since signals need to be exchanged between the operation circuit blocks or between the standby circuit blocks, the signal is exchanged between the operation circuit blocks and the standby circuit blocks by the partitioning section 14. This is done by forming a characteristic pattern.

The central cutoff section 13 is for shielding between the operation circuit block and the standby circuit block.
A hole is formed in the substrate 4 and the upper case 1 and the lower case 2 are inserted into each other through the hole to form a maze structure, and the shield is completely performed with a simple structure.

The partitioning section 14 is for shielding between circuit blocks that need to exchange signals, such as between operation circuit blocks or between standby circuit blocks. Alternatively, the lower case 2 is completely brought into contact with the conductive pattern of the substrate 4 via the shield frame 3. At this time, signals and power supply between the circuit blocks are exchanged by forming the substrate 4 with a plurality of layers and providing a conductive pattern on an arbitrary internal layer to connect them to each other.

FIG. 1B shows a top view of the lower case. In FIG. 1B, the claws 21 are engaged with and fixed to the claw receiving portions 11 of the upper case 1. A plurality of claws 21 are provided around the periphery or the middle layer shielding portion 23 so that the shield frame 3 is uniformly attached to the substrate 4. It is for holding down and fixing.

The circuit block housing section 22 is a section for housing a circuit block provided on the substrate 4 (an element mounted on the substrate), and is shielded by a partition portion 24 between adjacent circuit blocks. (Magnetic shield, electrostatic shield). Here, the circuit block storage unit 22
Are the same circuit, ie, an operation circuit block and a standby circuit block provided on the substrate 4, but store circuit blocks provided in parallel to operate alternately. At this time, a central shielding portion 23 is provided between the operation circuit block and the standby circuit block as shown in the figure, and the upper case 1 and the lower case 2 enter each other, so to speak as a maze structure between the circuit blocks. The shield is completely gone. Further, since signals need to be exchanged between the operation circuit blocks or between the standby circuit blocks, the signal is exchanged between the operation circuit blocks and the standby circuit blocks. This is done by forming a characteristic pattern.

The central cutoff unit 23 shields between the operation circuit block and the standby circuit block.
A hole is formed in the substrate 4 and the upper case 1 and the lower case 2 are inserted into each other through the hole to form a maze structure, and the shield is completely performed with a simple structure.

The partition plate 24 is for shielding between circuit blocks that need to exchange signals, such as between operation circuit blocks or between standby circuit blocks. Alternatively, the lower case is completely brought into contact with the conductive pattern of the substrate 4 via the shield frame 3.
At this time, signals and power supply between the circuit blocks are exchanged by forming the substrate 4 with a plurality of layers and providing a conductive pattern on an arbitrary internal layer to connect them to each other.

FIG. 1C is a sectional view taken along the line BB ′ of FIG.
FIG. In FIG. 1C, a substrate 4 is provided with a circuit block, and is composed of a plurality of layers. As shown in FIG. 1 and the lower case 2 are completely connected to each other and shielded.

The pins 5 are for inputting and outputting signals to and from terminals on the substrate 4. FIG. 1D is an enlarged view of a portion A of FIG. 1C. In FIG. 1D,
The claw receiving portion 11 is provided on the upper case 1 and the claw 2 of the lower case 2 is provided.
1 is to be fixed.

The partitioning section 14 is for partitioning and shielding between the circuit block storage sections 12 of the upper case 1 and is provided between circuit blocks for exchanging signals.

The partitioning section 24 is for partitioning and shielding between the circuit block storage sections 22 of the lower case 2, and is provided between circuit blocks for exchanging signals. Here, the structure is bent as shown.

FIG. 1 (e) shows CC 'of FIG. 1 (a).
FIG. In (e) of FIG.
Has a maze structure in which the upper case 1 passes through the substrate 4 and enters the central blocking portion 23 of the lower case 2, and shields between the left and right circuit blocks (operation circuit block and standby circuit block) in the figure. is there.

Here, the central cut-off section 23 has a maze structure in which the upper case 1 has passed through the substrate 4 and has entered, and shields between the left and right circuit blocks (operation circuit block and standby circuit block) in the figure. Structure.

By providing the above-described structure in the upper case 1 and the lower case 2, the upper case 1 and the lower case 2 are mutually connected between the operation circuit block and the standby circuit block by the central cutoff portions 13 and 23. It is possible to form a maze structure by entering the circuit block and completely shield between these circuit blocks. Further, partitioning portions 14 and 24 are provided between adjacent circuit blocks which need to exchange signals to provide Shield, and furthermore, the claw receiving portion 11
And a plurality of claws 21 are provided on the upper case 1 and the lower case 2 and can be easily fixed simply by pressing both. Further, the conductive shield frame 3 is provided between the substrate 4 and the upper case 1 and the lower case 2. It is possible to complete the shield by inserting each of them for electrical connection and eliminating gaps.

FIG. 2 shows an example of the substrate of the present invention. FIG. 2A shows a top view of the substrate. In FIG. 2A, a circuit block 41 is a block having a predetermined function of mounting components on the substrate 4 and needs to be shielded from each other. Here, two identical circuit blocks, an upper operation circuit block and a lower standby circuit block, are provided, and are alternately operated. A hole is formed between the upper operation circuit block and the lower standby circuit block so that the above-mentioned central shielding portions 13 and 23 of the upper case 1 and the lower case 2 can enter each other to form a maze structure. Is open.

The conductive pattern 42 is a conductive pattern formed around the circuit block, and is a portion that is electrically connected to the upper case 1 or the lower case 2 via the shield frame 3 and shielded.

FIG. 2B shows an example of shielding between circuit blocks. This shows an example of connection of signal lines between circuit blocks on the substrate 4 which need to exchange signals. Here, the circuit blocks on the substrate 4 are shielded by the illustrated partitions 14 and 24, and the terminals of the circuit blocks form conductive patterns on any of the layers constituting the substrate 4. And connect it to the terminals of other circuit blocks, and configure a symmetrical attenuator (attenuator circuit) with resistors as shown in the figure to completely shield and transmit unnecessary signals to other circuit blocks as much as possible. I try not to. Here, in the high-frequency electronic equipment and parts requiring electromagnetic shielding (isolation), the resistance R ₁ in Attoneta circuit (attenuating circuit that low output signal level propagating to the other side) the two resistors R ₂ and the resistor divided into R _3, the resistor R ₂ and the resistor R ₃ and the electromagnetic shield line (electromagnetic shield wall) provided between, to the impedance matching between the input side and the output side, particularly unwanted reflections generated in a high frequency range This prevents signal distortion from occurring. This is [pi type Attoneta circuit only one conventional resistor R ₁ described above, because only the resistor R ₁ in one of the electromagnetic shielding lines adjacent are disposed, the attenuation distortion in the high frequency range is generated Therefore, there is a problem that a signal is distorted, and in order to eliminate the signal distortion, symmetrical attenuator circuits are provided in adjacent circuit blocks.

FIG. 2C shows another enlarged detailed view of the main part of FIG. 2B. Here, as shown in FIG.
The upper conductive pattern and the shield frame 3 come into contact with each other, and the notched portion of the shield frame 3
As a result, the conductive pattern of the substrate 4 is completely electrically connected to the partition 14 of the upper case 1 and the partition 24 of the lower case 2, and the substrate 4 and the partition 1
The gap between the wires 4 and 24 has almost disappeared, and it is possible to completely shield electromagnetic waves and the like.

By providing the above-described structure on the substrate 4, when the circuit blocks are separated by the partitions 14 and 24 of the upper case 1 and the lower case 2, the conductive pattern on the substrate 4 is shielded. 3, the shield (especially an electrostatic shield) can be formed by completely connecting to the upper case 1 and the lower case 2, and furthermore, the board 4 and the partitions 14, 24
It is possible to completely shield (especially, electromagnetic shielding) from electromagnetic waves and the like by eliminating the gap between them.

FIG. 3 shows an example of a shield frame according to the present invention. FIG. 3A shows a top view. This is because punching is performed in accordance with the portion of the conductive pattern 42 of the substrate 4 shown in FIG. 2A, and the conductive pattern 42 on the substrate 4 is electrically connected to the partitions 14 and 24. As shown in the figure, a U-shape is used, the width of which is narrowed earlier, punched out and bent into a U-shape to give a spring action.

FIG. 3B is an enlarged view of a U-shape punched out with a narrow width. Here, as shown in the figure, a U-shape is punched out so that the width is gradually narrowed from a portion where the root is bent at substantially the same width.

FIG. 3C shows a state where the sheet is punched and then bent in FIG. 3B. In this state, FIG.
(B), since it is bent at the portion where the width becomes narrower in the U-shape, it becomes narrower than the original surrounding width when punched out by the bending, so that it has a spring action. When they do, they do not engage, and they can stretch and shrink smoothly.

By providing the shield frame with the above-described structure, the shield frame is placed on the conductive pattern 42 of the substrate 4 and is inserted between the upper case 1 and the lower case 2 to be pressed. When fixed by the receiving portion 11, the conductive pattern of the substrate 4 can be completely electrically connected to the upper case 1 and the lower case 2 by the spring action of the bent portion of the shield frame 3 in the shape of the letter "C".
Moreover, it is possible to completely exhibit the shielding effect by eliminating the gap.

FIG. 4 shows a structural example of another embodiment of the present invention. The structure of the other embodiment is the same as that of FIG. 1 except that the upper case 1 and the lower case 2 are fixed by caulking (1) and caulking (2). Omitted.

FIG. 4A is a top view of the lower case when the upper case and the lower case are fixed. In FIG. 4A, the swaging (1) is to bend and fix a small piece of the upper case 1 inward from the periphery of the lower case 2 (described later with reference to FIG. 4D).

The caulking (2) is for expanding and fixing the cylinder (to be described later with reference to FIG. 4E). FIG. 4B is a sectional view taken along the line BB ′ of FIG.

FIG. 4C is a cross-sectional view taken along the line CC ′ of FIG.
FIG. FIG. 4D shows swaging (1).
This caulking (1) fixes the lower case 2 by placing the lower case 2 in the upper case 1 and bending the small pieces of the upper case 1 inward as shown in FIG.

FIG. 4 (d-1) is an enlarged view of a main part before caulking. FIG. 4D-2 is an enlarged view of a main part after caulking. As can be seen from the enlarged view after the crimping, after the lower case 2 is put in the upper case 1, the small pieces are bent and fixed to the left side in the figure.

FIG. 4E shows caulking (2). In this caulking (2), as shown in FIG. 4 (a), a hole of the lower case 2 is inserted into a cylinder of the upper case 1, and the upper part of the cylinder of the upper case 1 is spread to fix the lower case 2. Things.

FIG. 4 (e-1) is an enlarged view of a main part before caulking. (E-2) of FIG. 4 shows an enlarged view of a main part after caulking. As can be seen from the enlarged view after the crimping, a hole of the lower case 2 is inserted into the cylinder of the upper case 1, and then the tip of the cylinder of the upper case 1 is pushed open and fixed.

By providing the above-described caulking (1) and (2) structures in the upper case 1 and the lower case 2,
For example, after the shield frame 3, the board 4, the shield frame 3, and the lower case 2 are placed in this order in the upper case 1, they can be easily fixed by swaging (1) and (2).

[0048]

As described above, according to the present invention,
The structure in which the upper case 1 and the lower case 2 are provided with the central shielding portions 13 and 23 inserted therein, the structure in which the partitioning portions 14 and 24 are provided for each circuit block, A structure in which a shield frame 3 is provided therebetween to improve conductivity and eliminate a gap, and a claw 21 and a claw receiving portion 1
Since the structure of the fixing portion such as 1 is employed, the shield (electromagnetic shield, electrostatic shield) for each circuit block on the substrate can be realized with a simple structure. Accordingly, (1) In the high-frequency module, the central shielding portions 13 and 23 are provided between the operation circuit block and the standby circuit block.
Is provided, and the upper case and the lower case enter each other to form a maze structure, so that a shielding effect between the circuit blocks can be efficiently obtained.

(2) The upper case 1 and the lower case 2 can be fixed only by pressing, and at the same time as the fixing, the conductive action of the substrate 4 is performed by the spring action of the bent portion of the U-shaped piece of the shield frame 3. Pattern 42 and upper case 1
And the lower case 2 can be completely electrically connected to obtain a shielding effect.

(3) In the upper case 1 and the lower case 2, since the partitioning portions 14 and 24 for each circuit block are formed by the upper case 1 and the lower case 2, another special partitioning plate is provided. It is not necessary to prepare and connect to the substrate, and the upper case 1 and the lower case 2 can be automatically partitioned into circuit blocks only by pressing and fixing them, and a shielding effect can be obtained.

(4) A simple packaging is possible in which the shield frames 3 are inserted between the upper case 1 and the lower case 2 on both sides of the substrate 4 and both are simply pressed.

[Brief description of the drawings]

FIG. 1 is a structural diagram of one embodiment of the present invention.

FIG. 2 is an example of a substrate according to the present invention.

FIG. 3 is an example of a shield frame of the present invention.

FIG. 4 is a structural view of another embodiment of the present invention.

[Explanation of symbols]

 1: Upper case 11: Claw receiving part 12, 22: Circuit block storage part 13, 23: Central blocking part 14, 24: Partition part 2: Lower case 21: Claw 3: Shield frame 4: Board 41: Circuit block 42: Conductive pattern 5: Pin

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hidekatsu Yasushima 5-36-11 Shimbashi, Minato-ku, Tokyo Inside Iwaki Electronics Co., Ltd. (72) Inventor Maku Abe 5-36-11 Shimbashi, Minato-ku, Tokyo Iwaki Inside Electronics Co., Ltd. (72) Inventor Takashi Isogai 5-36-11, Shimbashi, Minato-ku, Tokyo Iwaki Electronics Co., Ltd. (58) Fields investigated (Int. Cl. ⁶ , DB name) H05K 9/00

Claims (7)

(57) [Claims] 1. A high-frequency module having a shielded circuit block, comprising: a substrate on which an operation block and a standby circuit block are provided in parallel; and a conductive member for contacting respective conductive patterns on the front and back sides around the circuit block on the substrate. Shield frame, through the hole provided between the operation circuit block and the standby circuit block on the substrate, a central blocking portion for mutually entering and shielding the upper case and the lower case , and the shield frame, A high-frequency module comprising: an upper case and a lower case provided with a fixing portion for fixing the substrate and the shield frame at a plurality of positions by inserting the substrates and the shield frames in the order of construction. 2. A high-frequency module having a shielded circuit block, comprising: a substrate on which an operation block and a standby circuit block are provided in parallel; Shielding frame, a central blocking portion for passing through the hole provided between the operation circuit block and the standby circuit block on the substrate and penetrating the upper case and the lower case to shield each other, and a circuit block on the substrate An upper case and a lower case provided with a partition part for providing and shielding between them, and a fixing part that is pressed in mutually and fixed at a plurality of places after being inserted in the configuration order of the shield frame, the substrate, and the shield frame. And a high frequency module comprising: 3. A conductive pattern is provided on the front and back of the substrate in a portion in contact with the partition as the partition, and a conductive pattern is provided on an arbitrary layer of a plurality of layers constituting the substrate. 3. The high-frequency module according to claim 2, wherein adjacent circuit blocks are connected to each other. 4. A conductive pattern is provided on the front and back of the substrate at a portion in contact with the partition as the partition, and a conductive pattern is provided on an arbitrary layer of a plurality of layers constituting the substrate. 4. The high-frequency module according to claim 3, wherein adjacent circuit blocks are connected to each other and an attenuator having a symmetrical resistance is provided in each connected adjacent circuit block. 5. The shield frame is formed of a conductive plate in a shape that comes into contact with the conductive pattern of the substrate and the upper case or the lower case. The high-frequency module according to any one of claims 1 to 4, wherein the high-frequency module is punched into a narrow width and bent into a concave shape to electrically contact the substrate and the upper case or the lower case. 6. The high-frequency module according to claim 1, wherein the fixing portion fixes the upper case and the lower case by a claw and a catch portion, caulking, or bending. 7. The high-frequency module according to claim 1, wherein said partition portion is provided for each of said circuit blocks.