JP3251801B2 - High frequency switch for board mounting - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency switch for mounting on a substrate.

[0002]

2. Description of the Related Art Conventionally, in a high-frequency device or the like in which a plurality of high-frequency circuits are arranged on the same substrate, in order to inspect the performance of each high-frequency circuit, signal conductors between the circuits are divided in advance, and the respective divisions are performed. After taking out the signal from the part and inspecting it,
There has been a method in which the cut portion is filled with a conductor or the like and soldered. In addition, a coaxial connector such as an earphone jack is placed on the transmission line, and a signal is taken out of the coaxial connector to inspect a high-frequency circuit connected to the transmission line. In addition, switching between a built-in speaker and an earphone in an RF (coaxial) circuit section of a wireless device such as a mobile phone, a BS TV (also sometimes used for a normal TV), a wireless device, and an external antenna. In some cases, a high-frequency switch has been used for switching between an internal antenna and the like.

[0003] As such a known high-frequency switch, a known technique is to arrange an ungrounded strip-shaped conductor plate at a right angle and at the center between the two conductors, in parallel, between the grounded conductor plates facing each other in order to achieve impedance matching. Although there was a system, the method of using the high-frequency switch was previously set in the device to two
It has been used for the purpose of setting a circuit and switching between the two circuits without breaking impedance matching. Therefore, it is necessary to provide two circuits (open circuit in the case of one circuit open) in the apparatus.

In the case of a high-frequency switch for mounting on a substrate,
Since the output direction of both circuits was horizontal to the board mounting surface with respect to the board mounting surface, when trying to extract a signal from either one of the two,
Unless a circuit for signal extraction is provided or placed on the edge of the substrate and extracted therefrom, a large space must be provided around the signal extraction port.

In the above-described conventional method for inspecting a high-frequency circuit in a high-frequency device, a signal conductor between circuits is divided in advance, a signal is taken out from the divided portion and inspected. The method of filling and soldering with such a method has a problem that it takes a lot of man-hours for inspection. In addition, in the inspection method described above, in which a coaxial connector such as an earphone jack is placed on a transmission line and a signal is taken out from the transmission line, the coaxial connector is placed on the transmission line so that only that portion of the transmission line is used. The impedance becomes low and the impedance matching is lost. Reflection occurs at the connector. Since the transmission line is placed on the transmission line without being divided, some signals also flow through the transmission line, so that there is a problem that not all signals flowing on the transmission line can be extracted.

The applicant of the present invention has proposed a high-frequency switching device for mounting a circuit board which can solve such a conventional problem as disclosed in Japanese Patent Application No. 6-80114, entitled "High-frequency switching device for mounting a substrate and high-frequency switching device." A device having a configuration as described in the specification and drawings of "Inspection method of equipment" was proposed. The principle of the high frequency switch for mounting on a board is that an ungrounded strip conductor arranged between a pair of grounded conductor plates perpendicular to the board is provided with an A circuit for taking out signals in the horizontal direction, and an A circuit perpendicular to the board. It is divided into a B circuit for extracting a signal in the direction. Such a high-frequency switch can take out signals in a direction perpendicular to the board by the B circuit, regardless of where it is placed on the circuit board, so that it can take out signals from the transmission line in a small space, and , Work efficiency was greatly improved.

FIG. 14 of the accompanying drawings is a cross-sectional view of such a high-frequency switch for mounting on a board. As shown in this figure, the high-frequency switch 10 includes an insulating case 11 and an insulating case 11. An earth plate 12, a connection plate 13, a switching spring 14, and a terminal fixing cover 15 are provided. The ground plate 12 has a ground conductor plate portion 12A that is vertically bent to both sides of the connection plate portion 13 and the switching spring portion. A circular opening 16 is provided in the ceiling of the ground plate 12 and the terminal fixing lid 15.

[0008] High-frequency switch 10 having such a configuration
Is used, for example, in a circuit of a high-frequency device as schematically shown in FIG. In this high-frequency device, for example, a high-frequency circuit module 17 such as a mobile phone is disposed on a circuit board, and a high-frequency switch 10 includes a signal conductor 19 on the circuit board connected to the high-frequency circuit module 17; It is arranged on the circuit board between the signal conductor 20 on the circuit board connected to the antenna 18. High frequency switch 10
The connection terminal of the switching spring portion 14 is connected to the signal conductor 19 by soldering or the like, and the connection terminal of the connection plate portion 13 is similarly connected to the signal conductor 20 by soldering or the like. Although not shown in FIG. 15, the connection terminals of the ground conductor plate portion 12A of the ground plate 12 are similarly connected to the ground conductor on the circuit board by soldering or the like.

In the state shown in FIG. 15, the contact portion 14A (see FIG. 14) of the switching spring portion 14 is in contact with the contact portion 13A (see FIG. 14) of the connection plate portion 13, and the signal conductor 19 The high-frequency switch 10 is impedance-matched to a signal transmission line sent from the first through the switching spring portion 14 and the connection plate portion 13 to the signal conductor 20 in the form of a so-called side edge transmission line. Therefore, the reflected signal at the high-frequency switch 10 is almost zero, and the transmission signal input through the signal conductor 19 and the transmission signal output to the signal conductor 20 have substantially the same value.

In order to inspect the performance of the high-frequency circuit module 17 on the circuit board for the high-frequency switch 10 in such a state, as shown in FIG.
A plug 23 connected to one end of a high-frequency cable 22, which is a signal extracting member, may be inserted through the opening 16 in the direction perpendicular to the circuit board. Then, since the contact portion of the plug portion 23 comes into contact with the switching spring portion 14 of the high-frequency switch 10 and pushes it down against the spring shifting force, the contact portion 14A of the switching spring portion 14 It will be separated from the contact part 13A of the part 13. As a result, the signal on the signal conductor 19 is not transmitted to the signal conductor 20. That is, in such a switching state,
The transmission signal to the signal conductor 20 becomes substantially zero. The signal of the signal conductor 19 is transmitted to the switching spring 14 and the plug 23.
Through the contact portion, and further through the high-frequency cable 22 to the measuring instrument 21. Also in this case, the high-frequency switch 10 operates in the form of a so-called side edge transmission line for the signal transmission line sent from the signal conductor 19 to the high-frequency cable 22 through the contact portion between the switching spring portion 14 and the plug portion 23. , Impedance matching. Therefore, the reflected signal at the high-frequency switch 10 is almost zero, and the transmission signal input through the signal conductor 19 and the extracted transmission signal output from the high-frequency cable 22 to the measuring instrument 21 have substantially the same value. Becomes

[0011]

As described above, the high-frequency switching device 10 having such a configuration transmits a signal between a pair of ground conductor plates opposed in parallel and in parallel with the pair of ground conductor plates. The ungrounded strip-shaped conductor plates are arranged at right angles to the grounded conductor plates for transmission, so that signals can be taken out perpendicular to the board mounting surface. Can extract the signal.
Even if such a high-frequency switch having a signal extracting function is interposed on the transmission line, it is possible to extract all signals flowing through the transmission line without breaking the impedance matching of the transmission line. For these,
The above-described high frequency switching device for mounting on a board is useful in that measurement and analysis (inspection of the quality of a circuit) and the like can be accurately performed, which was conventionally not possible because the taken-out signal was too small.

However, in the above-described configuration of the high frequency switching device for mounting on a board, both the signal transmission at the time of normal use of the device and the signal transmission at the time of signal extraction at the time of inspection and measurement depend on the so-called side edge transmission line. Therefore, the following problems remain.

First, the form of the side edge transmission line during normal use of the apparatus is substantially the same in terms of performance even when the switching spring portion is depressed during signal extraction during inspection and measurement. Since it must be kept in the form of the side edge transmission line, it is necessary to keep the height of the side edge transmission line to a certain height during normal use of the equipment, and inevitably the height of the entire high-frequency switch increases. I will. For example, it has been the utmost to keep the height of the entire high-frequency switch at about 4 mm.

The demand for lighter, thinner and smaller electronic devices is increasing year by year, and there is also a corresponding demand for lowering the height of high-frequency switching devices mounted on circuit boards of high-frequency devices. It is. Therefore, it is highly necessary that the overall height of the high-frequency switch is 4 mm or less, and it is necessary that the total height be 3 mm or less. It is difficult to meet such a need with the above-described configuration of the high-frequency switch that consistently relies on the form of the side edge transmission line.

Secondly, consistently relying on the form of the side-edge transmission line means that the form of the side-edge transmission line during normal use of the equipment is designed so as to obtain the best high-frequency performance. It is inevitable that the high-frequency performance deteriorates when the switching spring is depressed during signal extraction during inspection and measurement.

An object of the present invention is to provide a high frequency switching device for mounting on a board which can solve such a problem.

[0017]

According to the present invention, there is provided a high-frequency switch for mounting on a substrate, comprising: an insulating case which can be placed on a surface of a high-frequency device on which a ground conductor and a signal conductor are provided;
Disposed on both sides of the insulating case, when the insulating case is placed on the surface of the substrate, perpendicular to the surface of the substrate and parallel to each other and connected to the ground conductor. And a pair of grounding conductor plates, and the pair of grounding conductor plates are disposed in the insulating case so as to be perpendicular to the grounding conductor plates, and the insulating case is mounted on the surface of the substrate. Sometimes, a non-grounded strip-shaped conductor plate that can be connected to the signal conductor, the non-grounded strip-shaped conductor plate, a switching spring portion that can be connected to the signal conductor on the signal input side on the surface of the substrate, A connection plate portion that can be connected to a signal conductor on the signal output side on the surface of the substrate, wherein a free end of the switching spring portion is disposed on the surface of the substrate with respect to a free end of the connection plate portion. In a direction perpendicular to Being adapted brought into Ne shift contacting the free end of the switching spring portion, when a signal extraction member is inserted in a direction perpendicular to the upper said surface of said substrate,
At the same time as being brought into contact by the signal extracting member, the contact with the free end of the connection plate portion is released, and the switching spring portion is brought into spring-shifted contact with the connection plate portion. In the state where it is, mainly the side edge transmission line is constituted with the ground conductor plate, and in the state where the contact with the connection plate portion is released by the insertion of the signal extraction member, the substrate is mainly A microstrip transmission line or a coplanar guide transmission line is formed between the conductor strip and the conductor surface disposed in the microstrip transmission line.

According to a preferred embodiment of the present invention, the switching spring portion is connected to a signal input side signal conductor on the surface of the substrate by a conductor surface disposed on the substrate. Between them, there is always a wide part that constitutes a microstrip transmission line or a coplanar guide transmission line.

Further, according to one embodiment of the present invention, the pair of ground conductor plates are interconnected by a ground conductor cylindrical portion provided at a coaxial connection portion for the signal extracting member.

[0020]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing a first embodiment of the present invention; FIG.

FIG. 1 is a cross-sectional view of a high-frequency switch for board mounting as one embodiment of the present invention, FIG. 2 is a plan view thereof, FIG. 3 is a left side view thereof, and FIG. FIG. 5 is a bottom view. FIG. 6 is a perspective view showing a ground plate of the high-frequency switch for substrate mounting of FIG. As shown in these figures, a high-frequency switch 100 for mounting a board according to this embodiment has a coaxial connection portion for a signal extracting member, and includes an insulating case 110 and an insulating case 1.
10 and the connection plate 1
30 and a switching spring section 140. The structure of each of these members will be described below in order.

First, the insulating case 110 will be described. The insulating case 110 may be integrally formed of a plastic material or the like, and mainly has a space 111 for disposing a switching spring 140 at a lower portion, and a ground conductor cylinder of a ground plate 120 at an upper portion. It is a rectangular parallelepiped as a whole having a circular concave portion 113 for disposing the portion 122. On both sides of the insulating case 110, grooves 115 and 115A for inserting a first ground conductor plate portion 123 and a second ground conductor plate portion 124 on both sides of the ground plate 120, which will be described later, respectively, are provided. Is formed. Also, the circular recess 113 of the insulating case 110
A circular opening 114 penetrating into the space 111 is formed at the center of the bottom of. Furthermore, insulating case 1
A groove 112 for press-fitting and fixing an intermediate portion 132 of the connecting plate portion 130, which will be described later, is formed in a central portion of the right side wall of the 10 so as to communicate with the space 111. On the left side wall of the insulating case 110, there are formed grooves 112D for press-fitting and fixing both side edges of the wide portion 144 of the intermediate portion 142 of the switching spring portion 140 as described later. A cut-out portion 112A for arranging the connection terminal 133 of the connection plate portion 130 is formed in a central portion on the right side of the bottom of the insulating case 110, and a switching spring portion 140 is formed in a central portion on the left side. A notch 112B for arranging the connection terminal 143 is formed.
Notch 112C for arranging each connection terminal 126
Are formed.

Next, the ground plate 120 will be described.
Although the structure itself of the ground plate 120 is best shown in the perspective view of FIG. 6, the ground plate 120 can be integrally formed by stamping and bending a conductive metal material sheet. The grounding plate 120 includes a ceiling portion 121, a first grounding conductor plate portion 123 that is bent vertically downward from both sides of the ceiling portion 121 to be parallel to each other, and a ceiling portion 12.
Ground conductor cylindrical portion 122 extending from 1 to the right
And a second ground conductor plate portion 124 extending in parallel from both lower ends of the ground conductor cylindrical portion 122. At the lower left end of the first ground conductor plate portion 123, a connection terminal 126 connected to the ground conductor on the substrate is formed so as to be bent and extended therefrom. Also, the second
A connection terminal 126 connected to the ground conductor on the substrate is formed at the lower right end of the connection conductor plate portion 124 so as to be bent and extended therefrom.

Next, the connection plate 130 will be described.
The connection plate portion 130 can be integrally formed by punching and bending a conductive metal material sheet. The connection plate portion 130 constitutes a part of the non-grounded strip-shaped conductor plate, and has a contact portion 131 formed at one free end by a contact portion of a switching spring portion 140 described later. An intermediate portion 132 is bent from the contact portion 131 into a U-shape. At a lower end of the intermediate portion 132, a connection terminal 133 for connecting to a signal conductor on the substrate is formed so as to extend therefrom. This connection plate part 1
The contact portion 131 of the thirty is wider than the intermediate portion 132, as is well shown in FIGS.

Next, the switching spring 140 will be described. The switching spring portion 140 can be integrally formed by punching and bending a conductive metal material sheet having spring properties. The switching spring portion 140 constitutes a part of the non-grounded strip-shaped conductor plate, and has a contact portion 141 which is in contact with a contact portion 131 of the connection plate portion 130 at one free end.
Is formed, and has an intermediate portion 142 elongated from the contact portion 141. In this embodiment, the base of the intermediate portion 142 is wide as shown in FIGS. 3 and 5, and is a wide portion which is arranged closely to the bottom wall of the space 111 of the insulating case 110. 144. Further, a connection terminal 143 for connecting to a signal conductor on the substrate is formed by bending so as to extend from the wide portion 144. This switching spring portion 140
Can be integrally formed by punching and bending a metal material sheet, or can be configured by using an FPC (flexible printed circuit board). By using the FPC, cost can be reduced. In the case where the switching spring portion 140 is configured using such an FPC, the method of fixing the switching spring portion 140 to the insulating case 110 is difficult to press-fit, and therefore, a method such as integral molding or bonding is employed.

Next, a brief description will be given of an assembling sequence of the high frequency switching device 100 for mounting a substrate, which is made up of the components having such a structure. First, the connection plate portion 130 and the switching spring portion 140 are attached to the right and left sides of the insulating case 110, respectively, as shown in FIG. At this time, with respect to the lower side of the contact portion 131 of the connection plate portion 130,
The contact portion 141 of the switching spring portion 140 comes into contact with the contact portion 141 so that the contact portion 141 is slightly displaced downward. Thus, the connection plate portion 130 and the switching spring portion 140
Is attached to the insulating case 110 and the ground plate 12
0, the first ground conductor plate portion 123 has the corresponding groove 11
5, the second ground conductor plate portion 124 is provided with each corresponding groove portion 11.
5A, the ground conductor cylindrical portion 122 is in the circular concave portion 113,
The connection terminals 126 are assembled so as to be inserted into the corresponding notches 112C.

In the high-frequency switch 100 for mounting a board according to the present invention assembled as shown in FIG. 1, the contact portion 131 of the connection plate portion 130 and the contact portion 141 of the switching spring portion 140 always contact. Therefore, a signal can be transmitted from the connection terminal 143 to the connection terminal 133. From this state, when the signal extracting member is inserted through the ground conductor cylindrical portion 122 of the ground plate 120 and the opening 114 of the insulating case 110, the contact portion of the signal extracting member causes the intermediate portion 142 of the switching spring portion 140 to move downward. The contact part 141 is pressed by
The signal is transmitted from the connection terminal 143 to the contact portion of the signal extracting member apart from the connection terminal 31. When the signal extraction member is pulled out, the contact portion 141 of the switching spring portion 140
Is returned to the original state by its spring property, and comes into pressure contact with the contact portion 131 of the connection plate portion 130.

Next, an example of use of such a high-frequency switch 100 for mounting a board of the present invention and its operation will be described with reference to FIG.
This will be described in more detail with reference to FIG. FIG. 7 shows a high-frequency switching device 100 for mounting a substrate according to the present invention disposed on a high-frequency circuit substrate.
5 is a partial cross-sectional view showing a state where a coaxial connector plug 2 of a normal type connected to a coaxial cable as a signal extracting member is inserted. In the high-frequency circuit board 1 in this use example, the output-side signal conductor 1A of the input-side high-frequency circuit is disposed on the upper surface, and the input-side signal conductor 1B for the output-side high-frequency circuit or element is disposed. Have been. Although not shown in FIG. 7, of course, this high-frequency circuit board 1
A ground conductor is also provided on the upper surface of the. On the back surface of the high-frequency circuit board 1, a copper foil 1C is provided. The high-frequency switch 100 of the present invention is disposed between the signal conductor 1A and the signal conductor 1B, and is connected to the connection terminal 1 of the switching spring 140.
Reference numeral 43 is connected to the signal conductor 1A by soldering or the like, and the connection terminal 133 of the connection plate 130 is similarly connected to the signal conductor 1B by soldering or the like. Although not shown in FIG. 7, the connection terminals 126 of the first ground conductor plate portion 123 and the second ground conductor plate portion 124 of the ground plate 120 are similarly soldered to the ground conductor on the substrate 1. It is connected.

Unlike the state of FIG. 7, in a normal use state in which the coaxial connector plug 2 is not inserted into the opening 114, the state is as shown in FIG. That is, the contact portion 141 of the switching spring portion 140 is
The high-frequency switch 100 is impedance-matched to a signal transmission line that is in contact with the contact portion 131 of the signal conductor 1A and is sent from the signal conductor 1A to the signal conductor 1B through the switching spring 140 and the connection plate 130. Therefore, the reflected signal is almost zero, and the transmission signal input on the signal conductor 1A and the transmission signal output on the signal conductor 1B have substantially the same value. In the structure of the high-frequency switch 100 of the present invention, such impedance matching is performed by the wide portion 144 of the intermediate portion 142 of the switching spring portion.
, Between the copper foil 1C on the back surface of the high-frequency circuit board 1 or, when a coplanar guide conductor or the like is provided on the upper surface of the board 1, between the coplanar guide conductor and the like. In the form of a microstrip transmission line or coplanar guide transmission line and extending from the wide part 144 towards the contact part 141, the middle part of this part and the first ground on both sides thereof This is achieved by designing a circuit as a signal transmission in the form of a side edge transmission line between the conductor plate portion 123 and the second ground conductor plate portion 124.

In order to inspect the performance of the high-frequency circuit of the high-frequency device on the substrate 1 with respect to the high-frequency switch 100 in such a state, as shown in FIG. It is assumed that the coaxial connector plug 2 as a signal extracting member is inserted in the vertical direction. Then, the outer conductor 2B of the coaxial connector plug 2 is
2 and at the same time, the center conductor 2A
The contact portion 141 of the switching spring portion 140 is separated from the contact portion 131 of the connection plate portion 130 because the contact portion 141 contacts the contact portion 0 and pushes it down against the spring shifting force.
As a result, the signal on the signal conductor 1A is not transmitted to the signal conductor 1B. That is, in such a switching state, the transmission signal output to the signal conductor 1B becomes substantially zero. The signal of the signal conductor 1A is supplied to the switching spring 140
And through the central conductor 2A of the coaxial connector plug 2. Also in this case, since the high-frequency switch 100 is impedance-matched, the transmission signal to the signal conductor 1A and the transmission signal to the central conductor 2A of the coaxial connector plug 2 have substantially the same value. In the high-frequency switch 100 of the present invention, as shown in FIG. 7, when the signal extracting member 2 is inserted through the opening 114, the entire intermediate portion 142 of the switching spring portion 140 The dimensions are designed so as to be pressed against the bottom wall of the space 111 and to be as close as possible and parallel to the copper foil 1C on the back surface of the substrate 1. The impedance matching in the signal extraction state as shown in FIG.
, And the copper foil 1C on the back surface of the substrate 1, or when a coplanar guide conductor or the like is provided on the upper surface of the substrate 1, This is achieved by designing the circuit in such a manner that a signal is transmitted in the form of a strip transmission line or a coplanar guide transmission line.

According to the present invention, the high frequency switching device for mounting on a board having a coaxial connection portion using a coaxial connector plug as a signal extracting member as in this embodiment is mainly provided by the side edge during normal use. Signal transmission is performed in the form of a transmission line, and at the time of signal extraction, signal transmission is performed mainly in the form of a microstrip transmission line or a coplanar guide transmission line, thereby increasing the overall height of the high-frequency switch. It was possible to keep it lower than that, for example, it became easy to reduce it to 3 mm or less.

Next, with reference to FIGS. 8 to 13, a high frequency switching device for mounting a substrate as another embodiment of the present invention will be described. 8 is a cross-sectional view of a high-frequency switch for board mounting as another embodiment of the present invention, FIG. 9 is a plan view thereof, FIG. 10 is a left side view thereof, and FIG. 11 is a right side view thereof. , FIG. 12 is a bottom view. FIG. 13 is a perspective view showing a ground plate of the high frequency switching device for mounting a substrate in FIG. As shown in these figures, a high-frequency switch 200 for mounting a board according to this embodiment includes an insulating case 210 and an earth plate 220 mounted on the insulating case 210.
, A connection plate 230 and a switching spring 240. The structure of each of these members will be described below in order.

First, the insulating case 210 will be described. The insulating case 210 may be integrally formed of a plastic material or the like, and mainly has a space 211 for disposing a switching spring 240 at a lower portion, and a circular shape of an earth plate 220 at an upper portion. It is a rectangular parallelepiped as a whole having a circular opening 214 aligned with the opening 222. On both sides of the insulating case 210, ground conductor plate portions 224 on both sides of a ground plate 220 as described later are provided.
Is formed with a groove 215 for inserting each of them. Further, a groove 212 for press-fitting and fixing an intermediate portion 232 of the connection plate 230, which will be described later, is formed in a central portion of the right side wall of the insulating case 210 so as to communicate with the space 211. On the left side wall of the insulating case 210, an intermediate portion 242 of the switching spring portion 240 described later is provided.
212D for press-fitting and fixing both side edges of the wide portion 244 of FIG.
Are formed. A cutout portion 212A for arranging the connection terminal 233 of the connection plate portion 230 is formed at the right central portion of the bottom of the insulating case 210, and the switching spring portion 240 is formed at the left central portion. Notches 212B for arranging connection terminals 243 are formed, and notches 212C for arranging connection terminals 226 of ground plate 220 are formed at four corners.

Next, the ground plate 220 will be described.
The structure itself of the ground plate 220 is best shown in the perspective view of FIG. 13, but the ground plate 220 can be integrally formed by stamping and bending a conductive metal material sheet. The ground plate 220 has a shape having a ceiling portion 221 and a ground conductor plate portion 224 that is bent vertically downward from both sides of the ceiling portion 221 and is parallel to each other. A circular opening 222 is formed in the ceiling 221 so that a signal extracting member can be inserted. Also, at the lower ends of the four corners of the ground conductor plate portion 224,
The connection terminal 226 connected to the ground conductor on the substrate is formed so as to be bent and extended therefrom.

Next, the connection plate 230 will be described.
The connection plate 230 can be integrally formed by punching and bending a conductive metal material sheet. The connection plate portion 230 forms a part of the non-grounded strip-shaped conductor plate, and has a contact portion 231 formed at one free end by a contact portion of a switching spring portion 240 described later. It has an intermediate portion 232 bent from the contact portion 231 in a U-shape. At the lower end of the intermediate portion 232, a connection terminal 233 for connecting to a signal conductor on the substrate is formed so as to extend therefrom. This connection plate 2
The contact portion 231 of the thirty is wider than the intermediate portion 232, as is well shown in FIGS.

Next, the switching spring section 240 will be described. The switching spring portion 240 can be integrally formed by punching and bending a conductive metal material sheet having spring properties. The switching spring portion 240 constitutes a part of the non-grounded strip-shaped conductor plate, and has a contact portion 241 that is in contact with a contact portion 231 of the connection plate portion 230 at one free end.
Is formed, and has an intermediate portion 242 elongated from the contact portion 241. In this embodiment, the base of the intermediate portion 242 is wide as shown in FIG. 10 and FIG.
A wide portion 244 arranged closely to one bottom wall
It has been. Further, a connection terminal 243 for connecting to a signal conductor on the substrate is formed to be bent so as to extend from the wide portion 244. This switching spring part 2
40 can be formed by using an FPC (flexible printed circuit board) in addition to being integrally formed by punching and bending a metal material sheet. By using the FPC, cost can be reduced. In the case where the switching spring portion 240 is configured using such an FPC, since a method of fixing the switching spring portion 240 to the insulating case 210 is difficult to press-fit and fix, a method such as integral molding or adhesion is employed.

Next, a brief description will be given of an assembling sequence of the high frequency switching device 200 for mounting a substrate, which is made up of components having such a structure. First, the connection plate portion 230 and the switching spring portion 240 are attached to the right and left sides of the insulating case 210, respectively, as shown in FIG. At this time, with respect to the lower side of the contact portion 231 of the connection plate 230,
The contact portion 241 of the switching spring portion 240 is brought into contact with the contact portion 241 so that the contact portion 241 is slightly displaced downward. Thus, the connection plate 230 and the switching spring 240
Is attached to the insulating case 210,
0 to the corresponding groove portions 215 of the ground conductor plate portion 224,
Each connection terminal 226 is assembled so as to be inserted into each corresponding notch 212C. At this time,
Circular opening 222 in ceiling 221 of ground plate 220
Are aligned with the circular opening 214 of the insulating case 210.

In the high-frequency switch 200 for mounting a board according to the present invention assembled as shown in FIG. 8, the contact portion 231 of the connection plate 230 and the contact portion 241 of the switching spring 240 are always in contact. Therefore, a signal can be transmitted from the connection terminal 243 to the connection terminal 233. From this state, the signal extracting member is inserted into the opening 222 of the ground plate 220 and the opening 214 of the insulating case 210. The signal extraction member used in the high-frequency switch 200 of this embodiment is different from the signal extraction member used in the high-frequency switch 100 of the embodiment described with reference to FIGS. Differently, a so-called top-touch type coaxial connector plug is suitable. In this top-touch type coaxial connector, when inserted into the jack portion, the outer conductor arranged on the outer periphery of the center conductor is configured to be able to recede against the center conductor against an elastic shift force. ing.

When such a top-touch type coaxial connector plug as a signal extracting member is inserted into the opening 222 of the ground plate 220 and the opening 214 of the insulating case 210, first, the external conductor is connected to the ground plate 22.
0 abuts against the outer peripheral edge of the opening 222, so that when the insertion force is further applied, the center conductor relatively protrudes into the opening 222 of the ground plate 220 and the opening 214 of the insulating case 210. (The outer conductor is relatively retracted with respect to the center conductor), and the middle portion 242 of the switching spring portion 240 is pressed downward by the tip of the center conductor of the coaxial connector plug. As a result, the contact portion 241 is separated from the contact portion 231, and a signal is transmitted from the connection terminal 243 to the center conductor of the coaxial connector plug. When the coaxial connector plug is pulled out, the contact portion 241 of the switching spring portion 240 becomes
Due to its spring property, it returns to the original state and the connection plate 23
0 comes into contact with the contact portion 231.

The high-frequency switch 20 for mounting a substrate according to this embodiment
0, the use and operation of the board mounting high-frequency switch 100 of the embodiment described above with reference to FIGS.
The only difference is that a coaxial connector plug of a top touch type is used as a signal extracting member, and the other points are substantially the same, so that the description will not be repeated here. The high-frequency switch 200 of this embodiment is the same as the coaxial connection portion (11
3, 122), it is possible to further reduce the overall height and sufficiently meet the demand for a reduction in height.

[0041]

According to the present invention, the overall height of the high frequency switching device for mounting on a board can be reduced, and it is possible to meet the demand for reduction in height and size. Further, sufficient high-frequency performance can be maintained both in a normal use state and in a signal extraction state.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a high-frequency switch for board mounting as one embodiment of the present invention.

FIG. 2 is a plan view of the high-frequency switch of FIG. 1;

FIG. 3 is a left side view of the high-frequency switch of FIG. 1;

FIG. 4 is a right side view of the high-frequency switch of FIG. 1;

FIG. 5 is a bottom view of the high-frequency switch of FIG. 1;

FIG. 6 is a perspective view showing a ground plate of the high-frequency switch for substrate mounting of FIG. 1;

FIG. 7 is a partial cross-sectional view showing a state where a signal extracting member is inserted into the board mounting high-frequency switch of FIG. 1 disposed on the high-frequency circuit board.

FIG. 8 is a cross-sectional view of a high-frequency switch for board mounting as another embodiment of the present invention.

FIG. 9 is a plan view of the high-frequency switch of FIG. 8;

FIG. 10 is a left side view of the high-frequency switch of FIG. 8;

FIG. 11 is a right side view of the high-frequency switch of FIG. 8;

FIG. 12 is a bottom view of the high-frequency switch of FIG. 8;

FIG. 13 is a perspective view showing a ground plate of the high-frequency switch for substrate mounting of FIG. 8;

FIG. 14 is a cross-sectional view showing an example of a high frequency switching device for mounting a substrate on which the present invention is based.

FIG. 15 is a schematic diagram for explaining an example of use of the high frequency switching device for mounting a substrate in FIG. 14;

FIG. 16 is a schematic diagram for explaining a signal extraction state of the board mounting high-frequency switch shown in FIG. 14;

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 high-frequency circuit board 1A signal conductor 1B signal conductor 1C copper foil 2 coaxial connector plug 2A center conductor 2B outer conductor 100 high-frequency switch 110 insulating case 111 space 113 circular recess 114 opening 120 earth plate 121 ceiling 122 grounding conductor cylindrical portion 123 First ground conductor plate part 124 Second ground conductor plate part 130 Connection plate part 131 Contact part 132 Middle part 133 Connection terminal 140 Switching spring part 141 Contact part 142 Middle part 143 Connection terminal 144 Wide part

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01R 13/70-13/713 H01R 13/646 H01R 24/00-24/12 H01H 27/00 H01P 3 / 02

Claims (3)

(57) [Claims] 1. An insulating case which can be placed on a surface of a substrate of a high-frequency device on which a ground conductor and a signal conductor are provided, and disposed on both sides of the insulating case, and the insulating case is provided on the surface of the substrate. A pair of grounding conductor plates which are perpendicular to the surface of the substrate and parallel to each other when placed, and which can be connected to the grounding conductor; and between the pair of grounding conductor plates, And an ungrounded strip-shaped conductor plate that can be connected to the signal conductor when the insulating case is mounted on the surface of the substrate. A switching spring portion that can be connected to a signal conductor on a signal input side on the surface of the substrate, and a connection plate portion that can be connected to a signal conductor on a signal output side on the surface of the substrate. The switching spring The free end of the portion is always in spring-biased contact with the free end of the connection plate portion in a direction perpendicular to the surface of the substrate, and the switching spring portion The free end is brought into contact with the signal extracting member when the signal extracting member is inserted in a direction perpendicular to the surface of the substrate, and is released from contact with the free end of the connection plate portion. In a state where the switching spring portion is in spring-shifted contact with the connection plate portion, the switching spring portion mainly forms a side edge transmission line with the ground conductor plate, and the signal In a state where the contact with the connection plate portion is released by the insertion of the takeout member, the microstrip transmission line or the coplanar guide transmission line is mainly interposed between the conductor surface disposed on the substrate. Substrate mounting high frequency switching device, characterized by forming. Wherein said switching spring portion, the signal input side connected to Ru side to a signal conductor on said surface of said substrate, between said arranged conductors face to the substrate, always microstrip transmission line 2. The high-frequency switch for mounting on a board according to claim 1, further comprising a wide portion constituting a coplanar guide transmission line. 3. The high frequency switching device for mounting on a board according to claim 1, wherein the pair of ground conductor plates are interconnected by a ground conductor cylindrical portion provided at a coaxial connection portion for the signal extracting member. vessel.