JP2864212B2 - High frequency switch for board mounting and inspection method of high frequency equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency switch for mounting on a board and a method for inspecting high-frequency equipment using the high-frequency switch.

[0002]

2. Description of the Related Art Conventionally, in a high-frequency device or the like in which a plurality of high-frequency circuits are arranged on the same substrate, in order to inspect the performance of each high-frequency circuit, a signal conductor between the circuits is divided in advance and the divided portion is used. There is a method in which a signal is taken out from the device and inspected, and then the divided portion is filled with a conductor or the like and soldered.
In addition, a coaxial connector such as an earphone jack is placed on the transmission line, and a signal is taken out of the coaxial connector to inspect a high-frequency circuit connected to the transmission line. In addition, switching between a built-in speaker and an earphone in an RF (coaxial) circuit section of a wireless device such as a mobile phone, a BS TV (also sometimes used for a normal TV), a wireless device, and an external antenna. In some cases, a high-frequency switch has been used for switching between an internal antenna and the like.

[0003] As a conventionally known technique for such a high-frequency switch, a non-grounded strip-shaped conductor plate is disposed at right angles and at the center between the two conductors so as to achieve impedance matching. Although there was a system, the method of using the high-frequency switch was previously set in the device to two
It has been used for the purpose of setting a circuit and switching between the two circuits without breaking impedance matching. Therefore, it is necessary to provide two circuits (open circuit in the case of one circuit open) in the apparatus.

In the case of a high-frequency switch for mounting on a substrate,
Since the output direction of both circuits was horizontal to the board mounting surface with respect to the board mounting surface, when trying to extract a signal from either one of the two,
Unless a circuit for signal extraction is provided or placed on the edge of the substrate and extracted therefrom, a large space must be provided around the signal extraction port.

In the above-described conventional method for inspecting a high-frequency circuit in a high-frequency device, a signal conductor between circuits is divided in advance, a signal is taken out from the divided portion and inspected. The method of filling and soldering with such a method has a problem that it takes a lot of man-hours for inspection. In addition, in the inspection method described above, in which a coaxial connector such as an earphone jack is placed on a transmission line and a signal is taken out from the transmission line, the coaxial connector is placed on the transmission line so that only that portion of the transmission line is used. The impedance becomes low and the impedance matching is lost. Reflection occurs at the connector. Since the transmission line is placed on the transmission line without being divided, some signals also flow through the transmission line, so that there is a problem that not all signals flowing on the transmission line can be extracted.

[0006]

The problem of the prior art will be described in detail with reference to FIGS. 18 to 23 of the accompanying drawings. As a prior known technique, as described above, as shown schematically in FIG. 18, a non-grounded strip-shaped conductor plate is disposed at right angles between parallel grounded conductor plates and at the center between the two conductor plates, and impedance matching is performed. Has been practiced. In the case of such a configuration, FIG.
As shown by the dotted line, it has been confirmed that even if the non-grounded strip-shaped conductor plate is shifted, the impedance matching is not lost. However, even when the ground conductor plates facing in parallel are horizontal with respect to the board mounting surface, as schematically shown in FIG. 19, the ground conductor plates facing in parallel are also substantially parallel as shown in FIG. Is perpendicular to the substrate mounting surface, the two output directions of the A circuit and the B circuit are horizontal with respect to the substrate mounting surface in the configuration of the conventional high-frequency switch.

[0007] Such a conventional high-frequency switch is shown in FIG.
As shown in FIG. 2, when the circuit is arranged on the circuit board, the two output directions of the circuit A and the circuit B are horizontal to the substrate mounting surface of the circuit board. At this time, when the output of the circuit A is used to supply a signal to the transmission line, that is, the circuit, and it is desired to extract the signal from the output of the circuit B,
It is necessary to provide a circuit for taking out a signal in accordance with the output of the B circuit, or to leave a wide space around the B circuit (components cannot be mounted around the B direction), and to take out a signal from the B direction. Workability becomes very poor.

In order to solve such a problem, it is conceivable to dispose a high-frequency switch at an end of a circuit board as schematically shown in FIG. 23 using a conventional method for inspecting the performance of the entire circuit. . However, in this case, there are restrictions on where to place the high-frequency switches, and high-frequency circuits must be placed in consideration of where to place the high-frequency switches, and it is difficult to inspect the performance of each high-frequency circuit. is there.

On the other hand, as a conventional technique, as described above, when a coaxial connector is placed on a high-frequency transmission line, as shown in FIG. 21, impedance matching is lost at the coaxial connector. There was a problem that reflection occurred at the connector. In this case,
The transmission signal N is (transmission signal L−reflection signal R), and N
Becomes smaller as the frequency increases and as the power increases.

[0010] In the case shown in FIG.
When attempting to extract a signal from the coaxial connector on the transmission line in a direction perpendicular to the board without dividing the transmission line, most of the transmission signal L is transmitted as the transmission signal N, and the extraction signal M is There is a problem that only a small signal is output. The value of the take-out signal M decreases as the frequency increases and the power increases.

SUMMARY OF THE INVENTION An object of the present invention is to provide a high-frequency switch for mounting on a board which can solve the above-mentioned conventional problems, and to make it possible to inspect the performance of each high-frequency circuit using the high-frequency switch and the like. The purpose of the present invention is to provide an improved inspection method.

[0012]

As a method for solving the above-mentioned conventional problems, the present inventor has proposed a high-frequency switch for board mounting whose principle is shown in FIG. 24 of the accompanying drawings. We paid attention to. According to the principle of the present invention, an ungrounded strip-shaped conductor disposed between a pair of grounded conductor plates perpendicular to the substrate is provided with an A circuit for extracting a signal in the horizontal direction and a signal in the direction perpendicular to the substrate. B for taking out
Circuit. Such a high-frequency switch is shown in FIG.
As shown in FIG. 5, the signal can be taken out of the transmission line in a small space because the circuit B can take out the signal in a direction perpendicular to the board no matter where it is placed on the circuit board. , The working efficiency becomes very good.

According to the above principle, the high frequency switching device for mounting a substrate according to the first aspect of the present invention includes an insulating case which can be mounted on a surface of a high frequency device on which a ground conductor and a signal conductor are provided; Disposed on both sides of the insulating case, when the insulating case is placed on the surface of the substrate, perpendicular to the surface of the substrate and parallel to each other and connected to the ground conductor. And a pair of grounding conductor plates, and the pair of grounding conductor plates are disposed in the insulating case so as to be perpendicular to the grounding conductor plates, and the insulating case is mounted on the surface of the substrate. Sometimes, a non-grounded strip-shaped conductor plate that can be connected to the signal conductor, the non-grounded strip-shaped conductor plate, a switching spring portion that can be connected to the signal conductor on the signal input side on the surface of the substrate, The substrate A connection plate portion that can be connected to the signal conductor on the upper signal output side, wherein a free end of the switching spring portion is perpendicular to the surface of the substrate with respect to a free end of the connection plate portion. In the direction, the spring-displacement contact is always made, and the free end of the switching spring portion is connected to the signal extraction member when the signal extraction member is inserted in a direction perpendicular to the surface of the substrate. At the same time as being brought into contact by the member, the contact with the free end of the connection plate portion is released.

Further, a high frequency switching device for mounting a substrate according to a second feature of the present invention is an insulating case which can be mounted on a surface of a high frequency device on which a ground conductor and a signal conductor are provided, and an insulating case for the insulating case. When a pair of the insulating cases is placed on the surface of the substrate, the pair of the insulating cases are perpendicular to the surface of the substrate and parallel to each other, and can be connected to the ground conductor. A ground conductor plate, and disposed between the pair of ground conductor plates in the insulating case so as to be perpendicular to these ground conductor plates, and when the insulating case is placed on the surface of the substrate, the An ungrounded strip-shaped conductor plate that can be connected to a signal conductor, the ungrounded strip-shaped conductor plate being connected to an intermediate connection plate portion and a signal conductor on one side on the surface of the substrate. A switching spring portion; A second switching spring portion that can be connected to the signal conductor on the other side on the writing surface, wherein a free end of the first switching spring portion and a free end of the second switching spring portion are connected to the intermediate connection. The first switching spring is adapted to be always in spring-biased contact with one free end and the other free end of the plate portion in a direction perpendicular to the surface of the substrate. The free end of the portion and the free end of the second switching spring portion are respectively brought into contact with the signal extraction member when the signal extraction member is inserted in a direction perpendicular to the surface of the substrate, The intermediate connection plate is released from contact with the free end.

According to a third feature of the present invention, in a high-frequency device having a plurality of high-frequency circuits arranged on a substrate,
An inspection method for inspecting the performance of each high-frequency circuit, wherein a high-frequency switch is arranged between the high-frequency circuits,
In the high frequency switch, an ungrounded band-shaped conductor is arranged between a pair of grounded conductors perpendicular to the substrate, and the ungrounded band-shaped conductor is placed in a first state in which a signal can be taken out in a horizontal direction, with respect to the substrate. It is configured to be able to switch between a second state in which a signal can be taken out in the vertical direction, and when testing the performance of each high-frequency circuit, an adjacent high-frequency switch is switched to the second state to check the performance. At the end, by switching to the first state, the performance of each high-frequency circuit can be inspected.

In a preferred embodiment of the high-frequency switch used in the method for inspecting high-frequency equipment of the present invention, the configuration of the high-frequency switch for board mounting according to the first feature of the present invention described above is adopted. The configuration of the high-frequency switch for substrate mounting according to the second feature may be adopted.

[0017]

BRIEF DESCRIPTION OF THE DRAWINGS The invention will now be described in more detail with reference to the accompanying drawings, in particular with reference to FIGS.

FIG. 1 is a front view of a high frequency switching device for mounting a substrate as one embodiment of the present invention, FIG. 2 is a plan view thereof, and FIG. 3 is a sectional view taken along line AA of FIG. And FIG.
FIG. 4 is a sectional view taken along line BB of FIG. 3. As shown in these figures, the high frequency switch for board mounting of this embodiment includes an insulating case 10, an earth plate 20 mounted on the insulating case 10, a connecting plate 30, a switching spring 40 When,
And a terminal fixing lid 50. The structure of each of these members will be described below in order.

First, the insulating case 10 will be described.
FIG. 5 is a plan view of the insulating case 10, and FIG.
FIG. 6 is a sectional view taken along line AA of FIG. 5. This insulating case 10
It may be integrally formed of a plastic material or the like, and has a channel shape having an open upper part as a whole. On both sides of the bottom of the insulating case 10, grooves 11 for inserting the bottoms of the ground conductor plate portions on both sides of the ground plate 20 as described later are formed. Also, this insulating case 10
A substantially central portion of each groove 11 is provided with a locking groove 1 which is engaged by locking legs formed on the bottoms on both sides of the ground plate 20.
2 are formed. The space 13 above the bottom of the insulating case 10 is provided with a connection plate 30 and a switching spring 40 as described later. Further, a locking recess 14 is formed in the center of the left side of the bottom of the insulating case 10 so as to be engaged with a lower end of a fixing leg formed on the left side of the terminal fixing cover 50 as described later. At the center on the right side of the bottom of the insulating case 10 is formed a locking recess 15 which is engaged with the lower end of a fixing leg formed on the right side of the terminal fixing cover 50 as described later.

Next, the ground plate 20 will be described. FIG. 7 is a plan view of the ground plate 20, and FIG.
FIG. 4 is a cross-sectional view taken along a line A. The ground plate 20 can be integrally formed by punching and bending a conductive metal material sheet. The ground plate 20 has a ceiling 21 and a ground conductor plate 24 that is bent vertically downward from both sides of the ceiling 21 and is parallel to each other. The ceiling portion 21 has a circular opening 22 for inserting a signal extraction member as described later, and further has an engagement protrusion provided on the ceiling portion of the terminal fixing cover 50 as described later. , A circular engagement hole 23 is formed. At substantially the center of the lower portion of each ground conductor plate portion 24, a locking leg portion 25 is provided which engages with the locking groove 12 formed on both sides of the bottom of the insulating case 10. At the lower left and right ends of each ground conductor plate portion 24, connection terminals 26 connected to the ground conductor on the substrate are formed so as to be bent and extended therefrom. In addition, a projection 25A that is formed by being stamped inward is formed substantially at the center of the locking leg 25. The projection 25A
The insulating case 10 can be pressed and engaged with the inner wall of the retaining groove 12. Further, a projection 24A is formed on the left side of each of the ground conductor plate portions 24. The projection 24A is formed on the left side of the terminal fixing lid 50 as described later. It is adapted to be able to press-fit against the side wall of the part.

Next, the connection plate 30 will be described. FIG. 9 is a plan view of the connection plate portion 30, and FIG. 10 is a front view thereof. The connection plate portion 30 can be integrally formed by punching and bending a conductive metal material sheet. The connection plate portion 30 constitutes a part of the non-grounded strip-shaped conductor plate, and has a contact portion 31 formed at one free end thereof by a contact portion of a switching spring portion 40 described later. And an intermediate portion 32 extending therethrough. At a lower end of the intermediate portion 32, a connection terminal 33 for connecting to a signal conductor on the substrate is formed by bending so as to extend therefrom. The intermediate portion 32 has a pair of protrusions 32A that are formed by being pushed outward.
The pair of projections 32A are provided at intervals so as to sandwich a fixing leg of a terminal fixing cover 50 described later.

Next, the switching spring section 40 will be described.
FIG. 11 is a plan view of the switching spring portion 40, and FIG.
It is the front view. The switching spring portion 40 can be integrally formed by punching and bending a conductive metal material sheet having spring properties. The switching spring portion 40 constitutes a part of the non-grounded strip-shaped conductor plate, and has a contact portion 41 formed at one free end thereof in contact with the contact portion 31 of the connection plate portion 30. And an intermediate portion 42 extending in the direction. At the lower end of the intermediate portion 42, a connection terminal 43 for connecting to a signal conductor on the substrate is formed by bending so as to extend therefrom.

Next, the terminal fixing cover 50 will be described.
FIG. 13 is a plan view of the terminal fixing cover 50, and FIG.
FIG. The terminal fixing lid 50 may be formed integrally with a plastic material or the like. The terminal fixing lid 50 includes a ceiling 51, a fixed leg 54 vertically extending from the left side of the ceiling 51 downward, and a fixed leg 55 vertically extending from the right side downward. The ceiling 51 has a circular opening 52 for inserting a signal extraction member at a position aligned with the opening 22 of the ceiling 21 of the ground plate 20. 2
An engagement protrusion 53 that engages with the engagement hole 23 formed in the first hole 1 is formed. The lower end 54A of the fixed leg 54 is adapted to engage with the locking recess 14 of the insulating case 10,
The lower end 55A of the fixed leg 55 is engaged with the locking recess 15 of the insulating case 10.

Next, a brief description will be given of an assembling sequence of the high frequency switching device for mounting a substrate comprising the components having such a structure, particularly with reference to FIG. First, the connection plate portion 30 and the switching spring portion 40 are assembled on the left and right sides of the insulating case 10, respectively, as well shown in FIG. At this time, the contact portion 41 of the switching spring portion 40 comes into contact with the lower side of the contact portion 31 of the connection plate portion 30 so that the contact portion 41 is slightly deflected downward. In contrast to the insulating case 10 in which the connection plate 30 and the switching spring portion 40 are assembled, the lower end 54A of the fixing leg 54 of the terminal fixing lid 50 is
At the lower end 55A of the fixed leg 55.
Is engaged with the locking recess 15 of the insulating case 10, and the terminal fixing lid 50 is assembled. At this time, the vicinity of the connection terminal 33 of the connection plate portion 30 and the vicinity of the connection terminal 43 of the switching spring portion 40 are respectively the lower end 54A of the fixed leg 54 and the lower end 55A of the fixed leg 55 of the terminal fixing lid.
And the upper surface of the bottom of the insulating case 10.

In this manner, the earth plate 20 is inserted into the insulating case 10 to which the terminal fixing lid 50 is attached so that each locking leg 25 is inserted into each retaining groove 12 of the insulating case 10. And assemble. At this time, the terminal fixing lid 5
The engagement hole 23 of the ceiling portion 21 of the ground plate 20 is engaged with the engagement projection 53 of the ceiling portion 51 of the earth plate 20.
Presses the ceiling part 51 of the terminal fixing lid 50,
The terminal fixing lid 50, the connection plate part 30 and the switching spring part 40 are fixed to the insulating case 10.

In the high-frequency switch for board mounting of the present invention assembled as shown in FIG. 3, the contact portion 31 of the connection plate portion 30 and the contact portion 41 of the switching spring portion 40 always contact. Therefore, a signal can be transmitted from the connection terminal 43 to the connection terminal 33. From this state, the openings 22 of the ground plate 20 and the terminal fixing lid 50 which are aligned with each other.
When the signal extracting member is inserted through the opening 52, the portion between the intermediate portion 42 and the contact portion 41 of the switching spring portion 40 is pressed downward by the contact portion of the signal extracting member, The contact portion 41 is the contact portion 31
The signal is transmitted from the connection terminal 43 to the contact portion of the signal extracting member. When the signal extracting member is pulled out, the contact portion 41 of the switching spring portion 40 returns to its original state due to its spring property, and comes into pressure contact with the contact portion 31 of the connection plate portion 30.

Next, an example of use of such a high-frequency switch for substrate mounting according to the present invention will be described. FIG. 15 is a schematic cross-sectional view showing a high-frequency device having a plurality of high-frequency circuits arranged on a substrate, in which a high-frequency switch having the above-described structure is arranged between the high-frequency circuits. An output-side signal conductor 2A of the input-side high-frequency circuit is disposed on the substrate 2 of the high-frequency device, and an input-side signal conductor 2B of the output-side high-frequency circuit is disposed.
The high-frequency switch 1 of the present invention comprises a signal conductor 2A and a signal conductor 2A.
B, and the connection terminal 43 of the switching spring portion 40.
Is connected to the signal conductor 2A by soldering or the like, and the connection terminal 33 of the connection plate 30 is similarly connected to the signal conductor 2B by soldering or the like. Although not shown in FIG. 15, the connection terminal 26 of the ground conductor plate portion 24 of the ground plate 20 is also connected to the ground conductor on the substrate 2 by soldering or the like.

In the state as shown in FIG. 15, the contact portion 41 of the switching spring portion 40 is connected to the contact portion 31 of the connection plate portion 30.
The high-frequency switch 1 is impedance-matched to a signal transmission line that is sent from the signal conductor 2A to the signal conductor 2B through the switching spring portion 40 and the connection plate portion 30 from the signal conductor 2A. Therefore, the reflection signal R is almost close to 0, and the transmission signal L and the transmission signal N have substantially the same value.

In order to test the performance of each high-frequency circuit of the high-frequency device on the substrate 2 for the high-frequency switch 1 in such a state by the inspection method of the present invention, as shown in FIG. The signal extracting member 3 may be inserted in the direction perpendicular to the substrate 2 through 22 and 52. Then, the contact portion 4 of the signal extracting member 3 comes into contact with the switching spring portion 40 and pushes it down against the spring shifting force.
Will be separated from the contact portion 31. As a result, the signal on the signal conductor 2A is not transmitted to the signal conductor 2B. That is, in such a switching state, the transmission signal N becomes substantially zero. The signal of the signal conductor 2A is extracted through the switching spring portion 40 and the contact portion 4 of the signal extraction member 3. In this case, the transmission signal L and the extraction signal M have substantially the same value.

FIG. 17 is a schematic sectional view showing a high-frequency switch as another embodiment of the present invention in a state where it is arranged on a substrate. Since the high-frequency switch 1A of this embodiment has the same overall structure and function as those of the embodiment described with reference to FIGS. 1 to 16, the same parts will not be described repeatedly. In the embodiment of FIG. 1, the direction in which the signal can be extracted from the transmission line is limited to one direction. However, in the embodiment of FIG. 17, a signal in which the transmission direction in the transmission line is different can be extracted.

The high-frequency switch 1A of this embodiment is similar to that of FIG.
, A first switching spring portion 40A connected to one signal conductor 2A on the substrate 2, a second switching spring portion 40B connected to the other signal conductor 2B, and an intermediate connection plate. 30A. The first switching spring portion 40A and the second switching spring portion 40B are each pressed against the intermediate connecting plate portion 30A with spring properties. Further, an output port 1 and an output port 2 are provided for each of the first switching spring portion 40A and the second switching spring portion 40B so that the signal extraction member can be inserted in the direction perpendicular to the substrate 2. (These ports are equivalent to openings 22 and 52 in the embodiment of FIG. 1).

In the high-frequency switch 1A of this embodiment, the transmission line connecting the signal conductor 2A and the signal conductor 2B has the transmission signal 1 flowing in one direction and the transmission signal 2 flowing in the other direction. In this case, when it is desired to take out only the transmission signal 1, a signal takeout member is inserted into the output port 1 so that the transmission signal 1 can be taken out as the takeout signal 1. By inserting the member, the transmission signal 2 can be extracted as the extraction signal 2.

[0033]

The high-frequency switch according to the present invention includes an ungrounded strip-shaped conductor plate between a pair of ground conductor plates opposed in parallel so as to transmit a signal in parallel with the pair of ground conductor plates. Since the signals are arranged perpendicular to the ground conductor plate and can be taken out perpendicular to the board mounting surface, the signals can be taken out from a myriad of places on the board in a small space.

Even if the high-frequency switch having the signal extracting function of the present invention is interposed on the transmission line, all the signals flowing through the transmission line can be extracted without breaking the impedance matching of the transmission line. Therefore,
In the past, the extraction signal was too small to measure,
Analysis (circuit quality inspection) and the like can also be performed accurately.
According to the method for inspecting a high-frequency device using the high-frequency switch of the present invention, the performance of each high-frequency circuit of the high-frequency device can be accurately inspected without increasing the number of work steps for the inspection.

[Brief description of the drawings]

FIG. 1 is a front view of a high-frequency switch for mounting a substrate as one embodiment of the present invention.

FIG. 2 is a plan view of the high-frequency switch of FIG. 1;

FIG. 3 is a sectional view taken along line AA of FIG. 2;

FIG. 4 is a sectional view taken along line BB of FIG. 3;

FIG. 5 is a plan view of an insulating case of the high-frequency switch of FIG. 1;

FIG. 6 is a sectional view taken along line AA of FIG. 5;

FIG. 7 is a plan view of a ground plate of the high-frequency switch of FIG. 1;

FIG. 8 is a sectional view taken along line AA of FIG. 7;

FIG. 9 is a plan view of a connection plate portion of the high-frequency switch of FIG. 1;

FIG. 10 is a front view of the connection plate portion of FIG. 9;

FIG. 11 is a plan view of a switching spring portion of the high-frequency switch of FIG. 1;

FIG. 12 is a front view of the switching spring unit of FIG. 11;

FIG. 13 is a plan view of a terminal fixing cover of the high-frequency switch of FIG. 1;

14 is a partially cutaway front view of the terminal fixing cover of FIG.

FIG. 15 is a partial schematic cross-sectional view showing a state in which the high-frequency switch of the present invention is used in a high-frequency device in which a plurality of high-frequency circuits are arranged on a substrate.

FIG. 16 is a partial schematic cross-sectional view showing a state where a signal extracting member is inserted into the high-frequency switch in the state of FIG.

FIG. 17 is a schematic cross-sectional view showing a high-frequency switch as another embodiment of the present invention.

FIG. 18 is a schematic diagram for explaining an example of a conventional high-frequency switch.

FIG. 19 is a schematic diagram for explaining another example of a conventional high-frequency switch.

FIG. 20 is a schematic diagram for explaining still another example of the conventional high-frequency switch.

FIG. 21 is a schematic diagram for explaining signal extraction using a conventional coaxial connector.

FIG. 22 is a schematic diagram for explaining the relationship between the arrangement of a conventional high-frequency switch on a substrate and signal extraction.

FIG. 23 is a schematic diagram for explaining a relationship between an arrangement of a conventional high-frequency switch on a substrate and signal extraction.

FIG. 24 is a schematic diagram for explaining the principle of the high-frequency switch of the present invention.

FIG. 25 is a schematic diagram for explaining the relationship between the arrangement of a high-frequency switch of the present invention on a substrate and signal extraction.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 High frequency switch for board mounting 2 Substrate 2A Signal conductor 2B Signal conductor 3 Signal extraction member 4 Contact part 10 Insulating case 20 Ground plate 24 Ground conductor plate part 22 Opening 26 Connection terminal 30 Connection plate part 31 Contact part 33 Connection terminal 40 Switching spring part 41 Contact part 43 Connection terminal 50 Terminal fixing lid 52 Opening

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01H 27/00-27/10 G01R 31/00-G01R 31/24-31/25 H01P 1/00

Claims (5)

(57) [Claims] 1. An insulating case which can be placed on a surface of a substrate of a high-frequency device on which a ground conductor and a signal conductor are provided, and disposed on both sides of the insulating case, and the insulating case is provided on the surface of the substrate. A pair of grounding conductor plates which are perpendicular to the surface of the substrate and parallel to each other when placed, and which can be connected to the grounding conductor; and between the pair of grounding conductor plates, And an ungrounded strip-shaped conductor plate that can be connected to the signal conductor when the insulating case is mounted on the surface of the substrate. A switching spring portion that can be connected to a signal conductor on a signal input side on the surface of the substrate, and a connection plate portion that can be connected to a signal conductor on a signal output side on the surface of the substrate. The switching spring The free end of the portion is always in spring-biased contact with the free end of the connection plate portion in a direction perpendicular to the surface of the substrate, and the switching spring portion The free end is brought into contact with the signal extracting member when the signal extracting member is inserted in a direction perpendicular to the surface of the substrate, and is released from contact with the free end of the connection plate portion. A high-frequency switch for mounting on a substrate, characterized in that: 2. An insulating case that can be mounted on a surface of a substrate of a high-frequency device on which a ground conductor and a signal conductor are arranged, and disposed on both sides of the insulating case, and the insulating case is disposed on the surface of the substrate. A pair of grounding conductor plates which are perpendicular to the surface of the substrate and parallel to each other when placed, and which can be connected to the grounding conductor; and between the pair of grounding conductor plates, And an ungrounded strip-shaped conductor plate that can be connected to the signal conductor when the insulating case is mounted on the surface of the substrate. The non-grounded strip-shaped conductor plate includes an intermediate connection plate portion, a first switching spring portion that can be connected to a signal conductor on one side on the surface of the substrate, and a second switching spring portion on the other side on the surface of the substrate. Second switching spring connectable to signal conductor A free end of the first switching spring portion and a free end of the second switching spring portion,
With respect to one free end and the other free end of the intermediate connection plate portion, in a direction perpendicular to the surface of the substrate, always, it is configured to be in spring displacement contact,
The free end of the first switching spring portion and the free end of the second switching spring portion are respectively formed by the signal extracting member when the signal extracting member is inserted in a direction perpendicular to the surface of the substrate. A high-frequency switch for mounting on a board, wherein the high-frequency switch is mounted so that the contact with the free end of the intermediate connection plate is released at the same time as the contact is made. 3. An inspection method for inspecting performance of each high-frequency circuit in a high-frequency device having a plurality of high-frequency circuits arranged on a substrate, wherein a high-frequency switch is arranged between the high-frequency circuits. In the high-frequency switch, a non-grounded strip conductor is arranged between a pair of grounded conductors perpendicular to a substrate, and the ungrounded strip-shaped conductor is used as a first terminal capable of extracting a signal in a horizontal direction.
And a second state in which a signal can be taken out in a direction perpendicular to the substrate. In testing the performance of each high-frequency circuit, an adjacent high-frequency switch is connected to the second high-frequency switch. 2. The inspection method according to claim 1, wherein the state is switched to the first state when the inspection is completed. 4. The high-frequency switching device includes an insulating case mounted on the substrate between the high-frequency circuits, and disposed on both sides of the insulating case, and perpendicular to a surface of the substrate and relative to each other. A pair of ground conductor plates parallel to and connected to the ground conductor between the high-frequency circuits, and disposed in the insulating case so as to be perpendicular to the ground conductor plates between the pair of ground conductor plates, An ungrounded conductor plate connected to a signal conductor between the high-frequency circuits, wherein the ungrounded strip-shaped conductor plate is connected to a signal conductor on a signal output side of one of the high-frequency circuits. A spring portion, and a connection plate portion connected to a signal conductor on the signal input side of the other high-frequency circuit of the high-frequency circuit, wherein a free end of the switching spring portion is located at a position opposite to a free end of the connection plate portion. To the surface of the substrate And in a vertical direction,
A spring-shifted contact is made, and a free end of the switching spring portion is brought into contact with the signal extracting member when the signal extracting member is inserted in a direction perpendicular to the surface of the substrate. 4. The inspection method according to claim 3, wherein the contact with the free end of the connection plate portion is released at the same time. 5. The high-frequency switching device includes an insulating case mounted on the substrate between the high-frequency circuits, and disposed on both sides of the insulating case, perpendicular to a surface of the substrate and relative to each other. A pair of ground conductor plates parallel to and connected to the ground conductor between the high-frequency circuits, and disposed in the insulating case so as to be perpendicular to the ground conductor plates between the pair of ground conductor plates, A non-grounded strip-shaped conductor plate connected to the signal conductor between the high-frequency circuits,
The non-grounded strip-shaped conductor plate includes an intermediate connection plate portion, a first switching spring portion connected to a signal conductor of one of the high-frequency circuits of the high-frequency circuit, and a signal of the other high-frequency circuit of the high-frequency circuit. A second switching spring portion connected to a conductor, wherein a free end of the first switching spring portion and a free end of the second switching spring portion are one free end and the other of the intermediate connection plate portion. A free end of the first switching spring portion and a second switching spring portion in a direction perpendicular to the surface of the substrate at all times. The free ends of the signal extraction members are respectively inserted in a direction perpendicular to the surface of the substrate,
4. The inspection method according to claim 3, wherein the contact with the free end of the intermediate connecting plate portion is released at the same time as being brought into contact by the signal extracting member.