JPH07142906A - Cover body fitting structure for dielectric filter - Google Patents

Cover body fitting structure for dielectric filter

Info

Publication number
JPH07142906A
JPH07142906A JP30868893A JP30868893A JPH07142906A JP H07142906 A JPH07142906 A JP H07142906A JP 30868893 A JP30868893 A JP 30868893A JP 30868893 A JP30868893 A JP 30868893A JP H07142906 A JPH07142906 A JP H07142906A
Authority
JP
Japan
Prior art keywords
lid
circuit board
protrusion
hole
dielectric resonator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30868893A
Other languages
Japanese (ja)
Inventor
Junji Chikada
淳二 近田
Hirobumi Nishizawa
博文 西澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FDK Corp
Original Assignee
FDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FDK Corp filed Critical FDK Corp
Priority to JP30868893A priority Critical patent/JPH07142906A/en
Publication of JPH07142906A publication Critical patent/JPH07142906A/en
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)

Abstract

PURPOSE:To easily position a cover body, to easily fix it without less man-hours, to improve the reliability of fixing and to eliminate an excessive fitting space at a peripheral part. CONSTITUTION:A dielectric resonator 12 is loaded on a circuit substrate 10, and the connection circuit part 14 is formed. The metallic cover body 22 is covered and shielded so that the external surface of the dielectric resonator 12 and the ground pattern of the circuit substrate are conducted. The cover body 22 has plural projections 22a which are diffusively arranged donward at the lower end of the side board, and a projection engagement part into which the respective projections 22a can be inserted and which has a conductive film conducting with the ground pattern on a side wall surface is provided for the circuit substrate 10. The respective projections 22a are inserted into the projection engagement part and they are solder-fixed. The projection engagement part is a hole (through hole 20 and the like) or a groove. The projections can be fixed by a pressure-fitting system instead of soldering.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、誘電体フィルタのシー
ルド用金属製蓋体の取付け構造に関するものである。更
に詳しく述べると、金属製蓋体の側板下端に複数の突起
を形成して、回路基板の突起係合部に挿入することで、
誘電体共振器と回路基板の両方に対して確実に且つ容易
に結合可能とした蓋体取付け構造に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for mounting a metallic lid for shielding a dielectric filter. More specifically, by forming a plurality of protrusions on the lower end of the side plate of the metal lid body and inserting the protrusions into the protrusion engagement portion of the circuit board,
The present invention relates to a lid mounting structure that can be reliably and easily coupled to both a dielectric resonator and a circuit board.

【0002】[0002]

【従来の技術】携帯電話や自動車電話などの各種移動通
信機器では、分波器なども含めて種々の誘電体フィルタ
が用いられている。従来、誘電体フィルタとして、図8
に示すように、回路基板10上に複数の同軸型誘電体共
振器12を搭載すると共に、その結合回路部14を設け
て前記各誘電体共振器12同士を結合し、所望のフィル
タ特性を発現させる構造がある。このような誘電体フィ
ルタでは、電波漏れの防止及び減衰特性改善のために、
その上部に金属製の蓋体16を被せ、誘電体共振器12
の外表面及び回路基板10のアースパターンと導通させ
る必要がある。
2. Description of the Related Art Various mobile communication devices such as mobile phones and car phones use various dielectric filters including a duplexer. Conventionally, as a dielectric filter, FIG.
As shown in FIG. 3, a plurality of coaxial dielectric resonators 12 are mounted on the circuit board 10, and a coupling circuit portion 14 thereof is provided to couple the dielectric resonators 12 to each other to develop desired filter characteristics. There is a structure that allows it. In such a dielectric filter, in order to prevent radio wave leakage and improve attenuation characteristics,
A metal lid 16 is placed on the top of the dielectric resonator 12
Must be electrically connected to the outer surface of the circuit board and the ground pattern of the circuit board 10.

【0003】従来の蓋体16は、各側板下部を水平外向
きに折り曲げて接続片16aを形成すると共に、上面に
長穴16bを形成する構造である。蓋体16を回路基板
10上に載せ、周辺の接続片16aを回路基板10の表
面側アースパターン11a,11bに半田付けすると共
に、各誘電体共振器12の上面(メタライズされてい
る)と蓋体16とを長穴16bを利用して半田付けして
アースをとる。なお回路基板10上に描かれている多数
の小穴18はスルーホール(周壁面に導体層が形成され
ている)であって、表面側アースパターン11a,11
bと裏面のアースパターンとを電気的に接続する機能を
果たす。
The conventional lid 16 has a structure in which lower portions of the side plates are bent horizontally outward to form a connecting piece 16a and an elongated hole 16b is formed on the upper surface. The lid 16 is placed on the circuit board 10, the peripheral connecting pieces 16a are soldered to the surface side ground patterns 11a and 11b of the circuit board 10, and the upper surface (metallized) of each dielectric resonator 12 and the lid are covered. The body 16 and the body 16 are soldered to each other using the elongated holes 16b to be grounded. The large number of small holes 18 drawn on the circuit board 10 are through holes (a conductor layer is formed on the peripheral wall surface), and the surface side ground patterns 11a, 11 are formed.
It has a function of electrically connecting b to the ground pattern on the back surface.

【0004】[0004]

【発明が解決しようとする課題】このような取付け構造
のため、従来の蓋体16は、その高さ方向の寸法精度が
非常に厳しかった。しかし蓋体16は金属薄板曲げ加工
により製造されているため、実際には蓋体の高さ方向の
精度は不十分であり、多少のばらつきは避けられなかっ
た。そのため図9のAに示すように、蓋体16の高さが
不足する場合は、その接続片16aが回路基板10から
浮いてギャップg1 ができ、回路基板10の表面側アー
スパターンとの半田付けが困難になる。逆に、図9のB
に示すように、蓋体16が高すぎると、誘電体共振器1
2の上面から浮いてギャップg2 ができて、誘電体共振
器12の上面との半田付けが難しくなる。そして例え半
田付けが行えたとしても、長期間にわたる使用中に温度
変化や振動などによる過大なストレスが加わって、誘電
体共振器12の外表面のメタライズ層が剥離する虞もあ
り、信頼性に欠ける。
Due to such a mounting structure, the conventional lid 16 has very strict dimensional accuracy in the height direction. However, since the lid body 16 is manufactured by bending a thin metal plate, the accuracy in the height direction of the lid body is not sufficient in practice, and some variation cannot be avoided. Therefore, as shown in A of FIG. 9, when the height of the lid 16 is insufficient, the connecting piece 16a floats from the circuit board 10 to form a gap g 1 and solder with the surface side ground pattern of the circuit board 10. It becomes difficult to attach. Conversely, B in FIG.
If the lid 16 is too high as shown in FIG.
2 is floated from the upper surface of the dielectric resonator 12 to form a gap g 2, which makes soldering with the upper surface of the dielectric resonator 12 difficult. Even if soldering can be performed, the metallized layer on the outer surface of the dielectric resonator 12 may be peeled off due to excessive stress due to temperature change, vibration, etc. during long-term use. Lack.

【0005】また従来構造では、蓋体16が回路基板1
0に対してフリーであり単に載せているだけとなるた
め、例えばリフローによる半田付け工程では、位置ずれ
が生じ易く、作業性も悪い。更に、蓋体16の側板下部
を水平外向きに折り曲げて接続片16aとし、回路基板
10に面接触させて半田付けするため、その分、接続固
定のために誘電体共振器12の周辺に広いスペースが必
要となり、その結果、フィルタが大きくなってしまう。
Further, in the conventional structure, the lid 16 is the circuit board 1.
Since it is free with respect to 0 and is simply placed, for example, in the soldering process by reflow, positional deviation easily occurs and workability is poor. Further, the lower side plate of the lid 16 is bent horizontally outward to form a connection piece 16a, which is brought into surface contact with the circuit board 10 for soldering. Therefore, the area is wide around the dielectric resonator 12 for connection fixing. Space is required, resulting in a large filter.

【0006】本発明の目的は、上記のような従来技術の
欠点を解消し、蓋体を容易に位置決めでき、固定も工数
が少なく簡単に行うことができ、取付けの信頼性が高
く、しかも周辺部に広い取付けスペースを必要としない
ためフィルタの小形化を図ることができる誘電体フィル
タの蓋体取付け構造を提供することである。
The object of the present invention is to eliminate the above-mentioned drawbacks of the prior art, to easily position the lid, to fix the lid easily with a small number of steps, and to provide a high reliability of attachment and the surrounding area. It is an object of the present invention to provide a lid mounting structure for a dielectric filter, which can reduce the size of the filter because a large mounting space is not required for the portion.

【0007】[0007]

【課題を解決するための手段】本発明は、回路基板上に
誘電体共振器を搭載すると共にその結合回路部を形成
し、前記誘電体共振器の外表面及び回路基板のアースパ
ターンと導通するように金属製の蓋体を被せてシールド
する構造の誘電体フィルタにおいて、前記金属製の蓋体
の側板下端に複数の突起を下向きに分散配設し、各突起
が挿入可能で且つ側壁面にアースパターンと導通する導
体膜を有する突起係合部を回路基板に設けて、各突起を
突起係合部に挿入して半田付け固定する誘電体フィルタ
の蓋体取付け構造である。ここで突起係合部は、貫通穴
(例えばスルーホール、即ち周壁面に導体層を設けて基
板上下の導体パターン間を接続する小穴)でもよいし、
回路基板の側面に形成した溝(例えばスルーホールを中
心付近で切断した形状)などでもよい。
According to the present invention, a dielectric resonator is mounted on a circuit board and a coupling circuit portion thereof is formed so as to be electrically connected to an outer surface of the dielectric resonator and a ground pattern of the circuit board. As described above, in the dielectric filter having a structure in which the lid made of metal is covered and shielded, a plurality of protrusions are distributed downward at the lower end of the side plate of the metal lid, and each protrusion can be inserted and the side wall surface can be inserted. This is a lid mounting structure for a dielectric filter in which a protrusion engagement portion having a conductor film that is electrically connected to the ground pattern is provided on the circuit board, and each protrusion is inserted into the protrusion engagement portion and fixed by soldering. Here, the projection engaging portion may be a through hole (for example, a through hole, that is, a small hole that connects the conductor patterns on the upper and lower sides of the substrate by providing a conductor layer on the peripheral wall surface).
It may be a groove formed on the side surface of the circuit board (for example, a shape obtained by cutting a through hole near the center).

【0008】また金属製の蓋体の側板下端に分散配置す
る複数の突起を、先端が膨出した形状とし、各突起を挿
入するための突起係合穴を回路基板に設けて、突起先端
の膨出部分を突起係合穴に圧入して固定するような構成
にしてもよい。その場合は、導通固定が確実に行われる
ならば、必ずしも半田付けする必要はない。
Further, a plurality of protrusions dispersedly arranged at the lower end of the side plate of the metallic lid body have a bulged tip, and a protrusion engaging hole for inserting each protrusion is provided on the circuit board to make the protrusion tip end The bulging portion may be press-fitted into the protrusion engagement hole to be fixed. In that case, it is not always necessary to solder if the conduction and fixing are surely performed.

【0009】[0009]

【作用】蓋体の側板下端の突起を回路基板の突起係合部
に挿入することで、回路基板に対して蓋体の位置決めが
なされ、半田付け工程でも蓋体の位置ずれは生じない。
蓋体側板の下縁が回路基板に当接していなくても前記突
起を利用して固定できるため、蓋体の高さ寸法に多少ば
らつきがあっても、該突起がその高さ寸法のばらつきを
吸収する。これによって蓋体上部は常に誘電体共振器の
外表面に密着し、且つ突起と突起係合部を用いて回路基
板への固定が可能となる。蓋体には側板下部に水平外向
きの接続片が存在しないので、回路基板に余分な蓋体接
合用の広いスペースが要らなくなる。
By inserting the protrusion at the lower end of the side plate of the lid into the protrusion engaging portion of the circuit board, the lid is positioned with respect to the circuit board, and the displacement of the lid does not occur even in the soldering process.
Even if the lower edge of the lid side plate is not in contact with the circuit board, it can be fixed by using the protrusion, so that even if the height of the lid varies, the protrusion causes variation in height. Absorb. As a result, the upper portion of the lid is always in close contact with the outer surface of the dielectric resonator, and the protrusion and the protrusion engaging portion can be used for fixing to the circuit board. Since there is no horizontal outward connecting piece in the lower part of the side plate of the lid body, an extra large space for joining the lid body to the circuit board is not required.

【0010】[0010]

【実施例】図1は本発明に係る誘電体フィルタの蓋体取
付け構造の一実施例を示す分解斜視図である。ここで誘
電体フィルタ自体の基本的な構造は、図8に示す従来技
術と同様にしてある。回路基板10上に2個の同軸型誘
電体共振器12を並置すると共に、結合回路用パターン
を設け結合コンデンサなどの部品を搭載して結合回路部
14を構成している。同軸型誘電体共振器12は、直方
体状の誘電体ブロックに貫通穴を形成し、該貫通穴が開
口している一方の面を除く外表面と貫通孔の内面とにメ
タライズ層を形成した構造であり、該貫通孔にL型リー
ド端子13の一部を挿入し、反対側の部分を結合回路用
パターンに接続する。回路基板10の表面側アースパタ
ーン11a,11bの部分に多数のスルーホール(内周
壁に導体層を形成した貫通穴)20を設けて裏面のアー
スパターンとの電気的接続を図る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an exploded perspective view showing an embodiment of a structure for mounting a lid of a dielectric filter according to the present invention. Here, the basic structure of the dielectric filter itself is the same as that of the conventional technique shown in FIG. The two coaxial dielectric resonators 12 are arranged side by side on the circuit board 10, and a coupling circuit pattern is provided to mount components such as a coupling capacitor to configure the coupling circuit unit 14. The coaxial dielectric resonator 12 has a structure in which a through hole is formed in a rectangular parallelepiped dielectric block, and a metallized layer is formed on the outer surface except one surface where the through hole is open and the inner surface of the through hole. Then, a part of the L-type lead terminal 13 is inserted into the through hole, and the opposite part is connected to the coupling circuit pattern. A large number of through holes (through holes in which a conductor layer is formed on the inner peripheral wall) 20 are provided in the front surface side ground patterns 11a and 11b of the circuit board 10 for electrical connection with the back surface ground pattern.

【0011】これら誘電体共振器12及びその結合回路
部14を覆うように、金属製の蓋体22を回路基板10
上に取り付ける。蓋体22は、各側板下部に1個以上の
突起22aを設けると共に、上面に長穴22bを形成し
た構造であり、金属薄板の打抜き曲げ加工によって製作
される。突起22aは単なるストレートな角柱形状であ
ってよい。側板の高さ寸法は横置きした誘電体共振器の
高さ以下に設定する。この実施例では、回路基板10に
設けた多数のスルーホール20のうちの一部を突起係合
穴として兼用している。従って各突起22aは、突起係
合穴となるスルーホール20に対応する位置に形成さ
れ、且つそのスルーホール22は突起22aが挿入可能
な大きさになっている。
A metal lid 22 is provided on the circuit board 10 so as to cover the dielectric resonator 12 and the coupling circuit portion 14 thereof.
Install on top. The lid 22 has a structure in which one or more protrusions 22a are provided in the lower part of each side plate and an elongated hole 22b is formed in the upper surface, and is manufactured by punching and bending a thin metal plate. The protrusion 22a may have a mere straight prismatic shape. The height of the side plate is set to be less than or equal to the height of the horizontally placed dielectric resonator. In this embodiment, some of the many through holes 20 provided in the circuit board 10 are also used as the projection engaging holes. Therefore, each protrusion 22a is formed at a position corresponding to the through hole 20 serving as a protrusion engaging hole, and the through hole 22 has a size into which the protrusion 22a can be inserted.

【0012】図2に示すように、各突起22aを突起係
合穴となるスルーホール20に挿入する。そして、その
状態で突起22aとスルーホール20とを半田付けし、
蓋体22を固定する。また長穴22bを利用して蓋体2
2を誘電体共振器12に半田付けする。前記のように蓋
体22の側板高さは横置きした誘電体共振器12の高さ
以下に設定されているので、蓋体22の高さ寸法に多少
ばらつきがあると、図3に示すように蓋体22の上面が
誘電体共振器12の上面に密着した時に、蓋体22の側
板の下縁は回路基板10の上面よりもやや浮いた(符号
fで示す)状態となる。突起22aはスルーホール20
内に挿入されているので、位置決めがなされ且つ確実に
半田付けを行える。ほぼ全体が金属製の蓋体やアースパ
ターンで取り囲まれる構成のため、回路基板10と蓋体
側板の下縁との間に多少の隙間ができても、電波漏れは
ほとんど生じず、減衰特性が悪化することもない。
As shown in FIG. 2, the protrusions 22a are inserted into the through holes 20 serving as protrusion engaging holes. Then, in this state, the protrusion 22a and the through hole 20 are soldered,
The lid 22 is fixed. Also, using the long hole 22b, the lid 2
2 is soldered to the dielectric resonator 12. As described above, since the side plate height of the lid body 22 is set to be equal to or lower than the height of the dielectric resonator 12 placed horizontally, if the height dimension of the lid body 22 varies a little, as shown in FIG. When the upper surface of the lid body 22 is in close contact with the upper surface of the dielectric resonator 12, the lower edge of the side plate of the lid body 22 is slightly floating (indicated by symbol f) from the upper surface of the circuit board 10. The protrusion 22a is the through hole 20.
Since it is inserted inside, the positioning is performed and the soldering can be surely performed. Since the structure is almost entirely surrounded by the metal lid and the ground pattern, even if there is a slight gap between the circuit board 10 and the lower edge of the lid side plate, almost no radio wave leakage occurs and the attenuation characteristic is reduced. It does not get worse.

【0013】図4は突起を半田付けする方法の例を示し
ている。図4のAは、蓋体22の各突起22aにそれぞ
れ半田リング24を嵌め込んで、回路基板10のスルー
ホール20に挿入し、リフロー炉を通して一括して半田
付けする例である。また図4のBは、回路基板10で突
起係合穴となるスルーホール20の周囲に環状に半田ペ
ースト26を塗布しておき、そのスルーホール20に蓋
体22の突起22aを挿入して、同じくリフロー炉を通
して一括して半田付けする例である。勿論、1箇所ずつ
半田付けを行うことも自由である。
FIG. 4 shows an example of a method of soldering the protrusions. 4A is an example in which the solder rings 24 are fitted into the respective protrusions 22a of the lid body 22, inserted into the through holes 20 of the circuit board 10, and soldered together through a reflow furnace. In FIG. 4B, the solder paste 26 is annularly applied around the through hole 20 serving as the projection engaging hole in the circuit board 10, and the projection 22a of the lid 22 is inserted into the through hole 20. Similarly, this is an example of collectively soldering through a reflow furnace. Of course, it is also free to solder one by one.

【0014】図5は、本発明の他の実施例を示す分解斜
視図である。基本的な構成は前記図1と同様であるの
で、対応する部分には同一符号を付し、それらについて
の説明は省略する。この実施例の特徴は、突起22aを
挿入する突起係合部として、回路基板10の側面に形成
した溝30を用いている点である。この溝30は、スル
ーホールをその中心付近で切断したものと考えてよく、
表面に導体層があり、それによって回路基板10の表面
側アースパターン11a,11bと裏面のアースパター
ンとを電気的に接続している。この各溝30に蓋体22
の突起22aを嵌め込んで半田付けする。この場合も、
半田リングを取り付ける構成でもよいし、半田ペースト
を塗布する構成でもよい。この構成は、溝構造であるた
めに、回路基板10をより一層小さくできる利点があ
る。
FIG. 5 is an exploded perspective view showing another embodiment of the present invention. Since the basic configuration is the same as that in FIG. 1, corresponding parts are designated by the same reference numerals, and description thereof will be omitted. The feature of this embodiment is that the groove 30 formed on the side surface of the circuit board 10 is used as a projection engaging portion into which the projection 22a is inserted. The groove 30 may be considered to be a through hole cut near the center thereof,
There is a conductor layer on the front surface, and thereby the front surface side ground patterns 11a and 11b of the circuit board 10 and the back surface ground patterns are electrically connected. A lid 22 is provided in each groove 30.
The projection 22a is fitted and soldered. Also in this case,
The structure may be such that a solder ring is attached or a solder paste is applied. Since this structure has a groove structure, there is an advantage that the circuit board 10 can be made smaller.

【0015】図6は本発明の更に他の実施例を示してい
る。ここでは図面を簡略化するために突起と突起係合穴
のみを描いてある。ここで、金属製の蓋体の側板下端に
形成する突起32は、先端が鉤状に膨出した形状であ
る。回路基板10には、各突起32を挿入するための突
起係合穴(ここではスルーホール34を兼ねている)を
設ける。そして突起32をスルーホール34に圧入させ
て固定する。スルーホール34は、突起32の形状に応
じて、図6のAのように円形穴でもよいし、Bのような
長穴でもよい。このようにして蓋体は機械的に固定され
るが、実際には更に半田付けすることが望ましい。
FIG. 6 shows another embodiment of the present invention. Here, in order to simplify the drawing, only the projection and the projection engagement hole are drawn. Here, the projection 32 formed on the lower end of the side plate of the metallic lid has a shape in which the tip bulges like a hook. The circuit board 10 is provided with projection engagement holes (also serving as through holes 34 here) for inserting the projections 32. Then, the protrusion 32 is pressed into the through hole 34 and fixed. The through hole 34 may be a circular hole as shown in A of FIG. 6 or an elongated hole as shown in B, depending on the shape of the protrusion 32. In this way the lid is mechanically fixed, but in practice it is desirable to solder it further.

【0016】本発明は誘電体フィルタ単体のみならず、
回路基板上に他の回路ブロックなどと共に搭載する場合
にも適用できる。その一例を図7に示す。図7では回路
基板40上にフィルタ部と増幅器モジュール42とを設
けている。ここでフィルタ部は図1と同様である。誘電
体共振器12及びその結合回路部14を覆うように蓋体
22を設ける。この蓋体22の側板下端に突起22aを
分散配置して、回路基板40の突起係合部となるスルー
ホール42に挿入し、半田付けする。また上面の長穴2
2bを利用して誘電体共振器12に半田付けする。
The present invention is not limited to the dielectric filter alone,
It can also be applied when mounted on a circuit board together with other circuit blocks. An example thereof is shown in FIG. In FIG. 7, the filter section and the amplifier module 42 are provided on the circuit board 40. Here, the filter unit is the same as in FIG. A lid 22 is provided so as to cover the dielectric resonator 12 and the coupling circuit portion 14 thereof. The protrusions 22a are dispersedly arranged on the lower end of the side plate of the lid body 22, and are inserted into the through holes 42 serving as the protrusion engaging portions of the circuit board 40 and soldered. Moreover, the long hole 2 on the upper surface
2b is used to solder to the dielectric resonator 12.

【0017】以上、本発明のいくつかの実施例について
説明したが、本発明はこのような構成のみに限定される
ものではない。誘電体共振器の構造並びにその設置個数
(段数)、結合回路部の構造などは任意である。本発明
は、誘電体フィルタ単体にも適用できるし、他の回路モ
ジュールと共に回路基板上に設ける構成とすることもで
きる。
Although some embodiments of the present invention have been described above, the present invention is not limited to such a configuration. The structure of the dielectric resonator, the number of installed (the number of stages), the structure of the coupling circuit unit, and the like are arbitrary. The present invention can be applied to a dielectric filter alone or can be provided on a circuit board together with other circuit modules.

【0018】[0018]

【発明の効果】本発明は上記のように、金属製蓋体の側
板下端に複数の突起を形成して、回路基板の突起係合部
に挿入するように構成したので、回路基板に対して蓋体
の位置決めがなされ、半田付け工程でも蓋体の位置ずれ
は生じない。また蓋体側板の下縁が回路基板に当接して
いなくても前記突起を利用して固定できるため、蓋体の
高さ寸法に多少ばらつきがあっても、該突起がその高さ
寸法のばらつきを吸収する。これらの結果、誘電体共振
器と回路基板の両方に対して確実に且つ容易に固定する
ことができ、外部のストレスにも強く、信頼性も向上す
る。更に本発明では、蓋体には側板下部に水平外向きの
接続片が存在しないので、回路基板に広い接合用のスペ
ースが要らなくなり、その分、誘電体フィルタの小形化
を図ることができる。
As described above, according to the present invention, since a plurality of protrusions are formed on the lower end of the side plate of the metallic lid and are inserted into the protrusion engaging portions of the circuit board, the circuit board is Since the lid is positioned, the lid is not displaced even in the soldering process. Further, even if the lower edge of the lid side plate is not in contact with the circuit board, the protrusion can be used to fix the lid, so that even if the height of the lid varies, the protrusion varies in height. Absorbs. As a result, they can be reliably and easily fixed to both the dielectric resonator and the circuit board, are strong against external stress, and improve reliability. Further, in the present invention, since the lid does not have the horizontally outward connecting piece at the lower part of the side plate, the circuit board does not need a large space for joining, and the dielectric filter can be downsized accordingly.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る蓋体取付け構造の一実施例を示す
分解斜視図。
FIG. 1 is an exploded perspective view showing an embodiment of a lid mounting structure according to the present invention.

【図2】その突起と突起係合部の部分拡大斜視図。FIG. 2 is a partially enlarged perspective view of the protrusion and the protrusion engaging portion.

【図3】その突起と突起係合部の部分断面図。FIG. 3 is a partial cross-sectional view of the protrusion and the protrusion engaging portion.

【図4】突起の突起係合部への取付け方法を示す説明
図。
FIG. 4 is an explanatory view showing a method of attaching a protrusion to a protrusion engaging portion.

【図5】本発明に係る蓋体取付け構造の他の実施例を示
す分解斜視図。
FIG. 5 is an exploded perspective view showing another embodiment of the lid mounting structure according to the present invention.

【図6】突起の突起係合部への取付け状態の他の実施例
を示す説明図。
FIG. 6 is an explanatory view showing another embodiment of a state in which the protrusion is attached to the protrusion engaging portion.

【図7】本発明の応用例を示す説明図。FIG. 7 is an explanatory diagram showing an application example of the present invention.

【図8】従来技術の一例を示す分解斜視図。FIG. 8 is an exploded perspective view showing an example of a conventional technique.

【図9】その突起と突起係合部の部分断面図。FIG. 9 is a partial cross-sectional view of the protrusion and the protrusion engaging portion.

【符号の説明】[Explanation of symbols]

10 回路基板 11a,11b 表面側アースパターン 12 誘電体共振器 14 結合回路部 20 スルーホール 22 蓋体 22a 突起 22b 長穴 10 Circuit Boards 11a, 11b Surface Side Ground Pattern 12 Dielectric Resonator 14 Coupling Circuit Section 20 Through Hole 22 Lid 22a Protrusion 22b Oblong Hole

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 回路基板上に誘電体共振器を搭載すると
共にその結合回路部を形成し、前記誘電体共振器の外表
面及び回路基板のアースパターンと導通するように金属
製の蓋体を被せてシールドする構造の誘電体フィルタに
おいて、前記金属製の蓋体の側板下端に複数の突起を下
向きに分散配設し、各突起が挿入可能で且つ側壁面にア
ースパターンと導通する導体膜を有する突起係合部を回
路基板に設けて、各突起を突起係合部に挿入して半田付
け固定することを特徴とする誘電体フィルタの蓋体取付
け構造。
1. A dielectric resonator is mounted on a circuit board and a coupling circuit portion thereof is formed, and a metal lid is provided so as to be electrically connected to an outer surface of the dielectric resonator and an earth pattern of the circuit board. In a dielectric filter having a structure of covering and shielding, a plurality of projections are distributed downwardly on the lower end of the side plate of the metal lid, and a conductive film which can be inserted into each projection and is electrically connected to the ground pattern on the side wall surface is provided. A lid mounting structure for a dielectric filter, characterized in that a protrusion engaging portion having the protrusion is provided on a circuit board, and each protrusion is inserted into the protrusion engaging portion and fixed by soldering.
【請求項2】 回路基板上に誘電体共振器を搭載すると
共にその結合回路部を形成し、前記誘電体共振器の外表
面及び回路基板のアースパターンと導通するように金属
製の蓋体を被せてシールドする構造の誘電体フィルタに
おいて、前記金属製の蓋体の側板下端に先端膨出形状の
複数の突起を下向きに分散配設し、各突起を挿入するた
めの突起係合穴を回路基板に設けて、各突起を突起係合
穴に圧入させて固定することを特徴とする誘電体フィル
タの蓋体取付け構造。
2. A dielectric resonator is mounted on a circuit board and a coupling circuit portion thereof is formed, and a metallic lid is provided so as to be electrically connected to an outer surface of the dielectric resonator and a ground pattern of the circuit board. In a dielectric filter having a structure of covering and shielding, a plurality of protrusions having a bulge at the tip are dispersedly arranged downward at the lower end of a side plate of the metal lid, and a protrusion engaging hole for inserting each protrusion is formed in a circuit. A lid mounting structure for a dielectric filter, which is provided on a substrate, and presses each projection into a projection engagement hole to fix it.
JP30868893A 1993-11-15 1993-11-15 Cover body fitting structure for dielectric filter Pending JPH07142906A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30868893A JPH07142906A (en) 1993-11-15 1993-11-15 Cover body fitting structure for dielectric filter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30868893A JPH07142906A (en) 1993-11-15 1993-11-15 Cover body fitting structure for dielectric filter

Publications (1)

Publication Number Publication Date
JPH07142906A true JPH07142906A (en) 1995-06-02

Family

ID=17984092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30868893A Pending JPH07142906A (en) 1993-11-15 1993-11-15 Cover body fitting structure for dielectric filter

Country Status (1)

Country Link
JP (1) JPH07142906A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6192577B1 (en) 1996-10-28 2001-02-27 Telefonaktiebolaget Lm Ericsson Method for shielding of electronics
EP1085593A2 (en) * 1999-09-14 2001-03-21 Murata Manufacturing Co., Ltd. Dielectric resonator device, dielectric duplexer, and communication apparatus incorporating same
KR100703083B1 (en) * 2005-07-13 2007-04-06 삼성전기주식회사 A Module Assembly
JP2007299996A (en) * 2006-05-01 2007-11-15 Alps Electric Co Ltd Circuit board mounting structure
JP2010093220A (en) * 2008-10-13 2010-04-22 Askey Computer Corp Circuit board equipped with isolation cover, and assembling method thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6192577B1 (en) 1996-10-28 2001-02-27 Telefonaktiebolaget Lm Ericsson Method for shielding of electronics
EP1085593A2 (en) * 1999-09-14 2001-03-21 Murata Manufacturing Co., Ltd. Dielectric resonator device, dielectric duplexer, and communication apparatus incorporating same
EP1085593A3 (en) * 1999-09-14 2002-09-18 Murata Manufacturing Co., Ltd. Dielectric resonator device, dielectric duplexer, and communication apparatus incorporating same
US6573809B1 (en) 1999-09-14 2003-06-03 Murata Manufacturing Co., Ltd. Dielectric resonator device, dielectric duplexer, and communication apparatus incorporating same
KR100703083B1 (en) * 2005-07-13 2007-04-06 삼성전기주식회사 A Module Assembly
JP2007299996A (en) * 2006-05-01 2007-11-15 Alps Electric Co Ltd Circuit board mounting structure
JP2010093220A (en) * 2008-10-13 2010-04-22 Askey Computer Corp Circuit board equipped with isolation cover, and assembling method thereof

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