JPH0173963U - - Google Patents
Info
- Publication number
- JPH0173963U JPH0173963U JP1987170622U JP17062287U JPH0173963U JP H0173963 U JPH0173963 U JP H0173963U JP 1987170622 U JP1987170622 U JP 1987170622U JP 17062287 U JP17062287 U JP 17062287U JP H0173963 U JPH0173963 U JP H0173963U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- covered
- mounting board
- connection terminal
- connecting terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 7
- 230000005496 eutectics Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図ａは本考案の一実施例を示す側面図、第
１図ｂは前記実施例の正面図、第１図ｃは前記実
施例の上面図、第２図ａは従来例の側面図、第２
図ｂは従来例の正面図である。
１…基板、２…フイルムキヤリア、７…フイル
ムキヤリアデバイス接続端子、８…基板接続端子
、９…ボンデイングツール。
Fig. 1a is a side view showing an embodiment of the present invention, Fig. 1b is a front view of the embodiment, Fig. 1c is a top view of the embodiment, and Fig. 2a is a side view of the conventional example. , second
FIG. b is a front view of a conventional example. DESCRIPTION OF SYMBOLS 1... Board, 2... Film carrier, 7... Film carrier device connection terminal, 8... Board connection terminal, 9... Bonding tool.
Claims (1)
第１の接続端子と、 フイルムキヤリア上にあり、第２の金属で被覆
された第２の接続端子と、 前記第１の接続端子と第２の接続端子とに挾ま
れた、前記第１の金属と第２の金属との金属共晶
とを備えてなることを特徴とする実装基板。 ２ 上記第１の金属と第２の金属とは同一である
ことを特徴とする実用新案登録請求の範囲第１項
記載の実装基板。[Claims for Utility Model Registration] 1. A first connecting terminal located on an insulating substrate and covered with a first metal; a second connecting terminal located on a film carrier and covered with a second metal; A mounting board comprising: a metal eutectic of the first metal and the second metal sandwiched between the first connection terminal and the second connection terminal. 2. The mounting board according to claim 1, wherein the first metal and the second metal are the same.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987170622U JPH0173963U (en) | 1987-11-06 | 1987-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987170622U JPH0173963U (en) | 1987-11-06 | 1987-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0173963U true JPH0173963U (en) | 1989-05-18 |
Family
ID=31461724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987170622U Pending JPH0173963U (en) | 1987-11-06 | 1987-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0173963U (en) |
-
1987
- 1987-11-06 JP JP1987170622U patent/JPH0173963U/ja active Pending
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