JPS58124976U - electronic equipment - Google Patents
electronic equipmentInfo
- Publication number
- JPS58124976U JPS58124976U JP1997282U JP1997282U JPS58124976U JP S58124976 U JPS58124976 U JP S58124976U JP 1997282 U JP1997282 U JP 1997282U JP 1997282 U JP1997282 U JP 1997282U JP S58124976 U JPS58124976 U JP S58124976U
- Authority
- JP
- Japan
- Prior art keywords
- electronic equipment
- enamel
- film
- bonded
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
・ 第１図は、本考案の平面図、第２図は第１図の
Ａ−Ａ断面図である。
１・・・ホーロー基板、２・・・ホーロー膜、３・・・
下地［金属、４・・・金属膜、１０・・・はんだ、２０
・・・パワートランジスタ、５０・・・窓部。- Figure 1 is a plan view of the present invention, and Figure 2 is a sectional view taken along line AA in Figure 1. 1... Enamel substrate, 2... Enamel film, 3...
Base [metal, 4...metal film, 10...solder, 20
...Power transistor, 50...Window part.
Claims (1)
該除去部に発熱体をろう材で、ホーロー基板の下地金属
とメッキ等の金属膜を介して接合し、前記ホーロー基板
上に形成された膜回路と削記発熱体を接続して形成した
電子装置。Partially remove the enamel film on the enamel substrate,
A heating element is bonded to the removed portion using a brazing material, and the base metal of the enamel substrate is bonded to the metal film such as plating, and the film circuit formed on the enamel substrate is connected to the etched heating element. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1997282U JPS58124976U (en) | 1982-02-17 | 1982-02-17 | electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1997282U JPS58124976U (en) | 1982-02-17 | 1982-02-17 | electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58124976U true JPS58124976U (en) | 1983-08-25 |
Family
ID=30032160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1997282U Pending JPS58124976U (en) | 1982-02-17 | 1982-02-17 | electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58124976U (en) |
-
1982
- 1982-02-17 JP JP1997282U patent/JPS58124976U/en active Pending
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