JPS58116237U - Molded solder bonding structure of thick film module - Google Patents

Molded solder bonding structure of thick film module

Info

Publication number
JPS58116237U
JPS58116237U JP1149982U JP1149982U JPS58116237U JP S58116237 U JPS58116237 U JP S58116237U JP 1149982 U JP1149982 U JP 1149982U JP 1149982 U JP1149982 U JP 1149982U JP S58116237 U JPS58116237 U JP S58116237U
Authority
JP
Japan
Prior art keywords
thick film
film module
bonding structure
solder bonding
molded solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1149982U
Other languages
Japanese (ja)
Inventor
高井　輝男
慎司 小林
Original Assignee
株式会社日立製作所
日立ビデオエンジニアリング株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所, 日立ビデオエンジニアリング株式会社 filed Critical 株式会社日立製作所
Priority to JP1149982U priority Critical patent/JPS58116237U/en
Publication of JPS58116237U publication Critical patent/JPS58116237U/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、セラミック基板裏面に電極印刷をほどこした
構造図、第２図は本考案の一実施例を示す斜視図である
。 １・・・セラミック基板、２・・・電極、３・・・放熱
板、４・・・成形ハンダ。FIG. 1 is a structural diagram showing electrodes printed on the back surface of a ceramic substrate, and FIG. 2 is a perspective view showing an embodiment of the present invention. 1... Ceramic board, 2... Electrode, 3... Heat sink, 4... Molded solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] パンダ接着可能な金属放熱板に電子回路を形成したセラ
ミック基板を接着する時、セスミック基板裏面に電極印
刷をほどこし、−その基板と放熱板との間に成形ハンダ
をはさみ、加熱しハンダ溶融接着を行なうことを特徴と
する厚膜モジュールの成形パンダ接着構造。When bonding a ceramic substrate with an electronic circuit formed on a metal heat sink that can be bonded to a metal heat sink, electrodes are printed on the back of the sesmic substrate, molded solder is sandwiched between the substrate and the heat sink, and the solder is melted and bonded by heating. The molded panda adhesive structure of the thick film module is characterized by:
JP1149982U 1982-02-01 1982-02-01 Molded solder bonding structure of thick film module Pending JPS58116237U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1149982U JPS58116237U (en) 1982-02-01 1982-02-01 Molded solder bonding structure of thick film module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1149982U JPS58116237U (en) 1982-02-01 1982-02-01 Molded solder bonding structure of thick film module

Publications (1)

Publication Number Publication Date
JPS58116237U true JPS58116237U (en) 1983-08-08

Family

ID=30024106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1149982U Pending JPS58116237U (en) 1982-02-01 1982-02-01 Molded solder bonding structure of thick film module

Country Status (1)

Country Link
JP (1) JPS58116237U (en)

Similar Documents

Publication Publication Date Title
JPS60111068U (en) flexible printed circuit board
JPS58116237U (en) Molded solder bonding structure of thick film module
JPS5911520U (en) Piezoelectric resonant components
JPS5971595U (en) sheet heating element
JPS5942097U (en) Heat sink mounting structure
JPS599552U (en) Hybrid thick film integrated circuit
JPS6049662U (en) Chip component mounting structure
JPS58175668U (en) printed wiring board
JPS59138259U (en) Manufacturing method of printed circuit board with heatsink
JPS58131654U (en) Thick film electrode structure
JPS59195752U (en) hybrid integrated circuit
JPS6124781U (en) liquid crystal display device
JPS58116234U (en) Thick film module heat sink
JPS5918495U (en) circuit board equipment
JPS6068659U (en) hybrid integrated circuit
JPS60190062U (en) Hybrid integrated circuit device
JPS58159764U (en) magnetoelectric conversion element
JPS6081674U (en) Ceramic hybrid integrated circuit device
JPS5834768U (en) Printed board
JPS60141153U (en) hybrid circuit
JPS5942070U (en) Mounting structure for small electrical parts
JPS5970396U (en) printed wiring board
JPS58184860U (en) circuit board
JPS5851448U (en) Power transistor mounting structure
JPS59158179U (en) liquid crystal display device