JPH03109368U - - Google Patents

Info

Publication number
JPH03109368U
JPH03109368U JP1805990U JP1805990U JPH03109368U JP H03109368 U JPH03109368 U JP H03109368U JP 1805990 U JP1805990 U JP 1805990U JP 1805990 U JP1805990 U JP 1805990U JP H03109368 U JPH03109368 U JP H03109368U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
board material
laminated
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1805990U
Other languages
Japanese (ja)
Other versions
JPH0737327Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990018059U priority Critical patent/JPH0737327Y2/en
Publication of JPH03109368U publication Critical patent/JPH03109368U/ja
Application granted granted Critical
Publication of JPH0737327Y2 publication Critical patent/JPH0737327Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案実施例の断面図、第２図はその
細部を省略して示す底面図、第３図は本考案の他
の実施例の断面図、第４図はその細部を省略して
示す底面図、第５図は従来例の斜視図、第６図は
その断面図、第７図乃至第１０図はそのフレキシ
ブル部分を屈曲させた状態の図である。 １…銅張りＦＰＣ材料、２…フイルムカバーレ
イ、３…接着シート、４…銅張りＰＷＢ材料、６
…導体パターン、７…スルーホール。 Fig. 1 is a sectional view of an embodiment of the present invention, Fig. 2 is a bottom view with details omitted, Fig. 3 is a sectional view of another embodiment of the invention, and Fig. 4 is a sectional view with details omitted. FIG. 5 is a perspective view of the conventional example, FIG. 6 is a cross-sectional view thereof, and FIGS. 7 to 10 are views with the flexible portion thereof bent. 1... Copper-clad FPC material, 2... Film coverlay, 3... Adhesive sheet, 4... Copper-clad PWB material, 6
...Conductor pattern, 7...Through hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] フレキシブルプリント配線板材料と硬質プリン
ト配線板材料を接着剤を介して積層し、各々の導
体をスルーホール銅メツキにより導通させたプリ
ント配線板において、硬質プリント配線板材料が
積層されず、フレキシブルプリント配線板材料に
より形成されるフレキシブル部分の片面あるいは
両面の所定部分に導体パターンを形成し、その導
体パターン上にフイルムカバーレイを形成すると
ともに、屈曲させる必要のない部分には他の部分
よりも多くのフイルムカバーレイを形成すること
を特徴とするプリント配線板。 In a printed wiring board in which a flexible printed wiring board material and a rigid printed wiring board material are laminated via an adhesive, and each conductor is electrically connected by through-hole copper plating, the rigid printed wiring board material is not laminated, and the flexible printed wiring board material is not laminated. A conductive pattern is formed on a predetermined part of one or both sides of a flexible part made of a plate material, and a film coverlay is formed on the conductive pattern. A printed wiring board characterized by forming a film coverlay.
JP1990018059U 1990-02-23 1990-02-23 Printed wiring board Expired - Lifetime JPH0737327Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990018059U JPH0737327Y2 (en) 1990-02-23 1990-02-23 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990018059U JPH0737327Y2 (en) 1990-02-23 1990-02-23 Printed wiring board

Publications (2)

Publication Number Publication Date
JPH03109368U true JPH03109368U (en) 1991-11-11
JPH0737327Y2 JPH0737327Y2 (en) 1995-08-23

Family

ID=31521234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990018059U Expired - Lifetime JPH0737327Y2 (en) 1990-02-23 1990-02-23 Printed wiring board

Country Status (1)

Country Link
JP (1) JPH0737327Y2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003101162A (en) * 2001-09-21 2003-04-04 Kyocera Corp Flexible printed circuit board
JP2005294639A (en) * 2004-04-01 2005-10-20 Ibiden Co Ltd Flex rigid wiring board
JP2012113851A (en) * 2010-11-22 2012-06-14 Tokai Rubber Ind Ltd Wiring body connecting element
JP2016034026A (en) * 2013-12-12 2016-03-10 株式会社村田製作所 Signal transmission parts and electronic equipment
JP2023111743A (en) * 2022-01-31 2023-08-10 富士電機株式会社 Wiring board, power converter

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61111173U (en) * 1984-12-25 1986-07-14

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61111173U (en) * 1984-12-25 1986-07-14

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003101162A (en) * 2001-09-21 2003-04-04 Kyocera Corp Flexible printed circuit board
JP2005294639A (en) * 2004-04-01 2005-10-20 Ibiden Co Ltd Flex rigid wiring board
JP2012113851A (en) * 2010-11-22 2012-06-14 Tokai Rubber Ind Ltd Wiring body connecting element
JP2016034026A (en) * 2013-12-12 2016-03-10 株式会社村田製作所 Signal transmission parts and electronic equipment
JP2023111743A (en) * 2022-01-31 2023-08-10 富士電機株式会社 Wiring board, power converter

Also Published As

Publication number Publication date
JPH0737327Y2 (en) 1995-08-23

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term