JPS61121776U - - Google Patents
Info
- Publication number
- JPS61121776U JPS61121776U JP368385U JP368385U JPS61121776U JP S61121776 U JPS61121776 U JP S61121776U JP 368385 U JP368385 U JP 368385U JP 368385 U JP368385 U JP 368385U JP S61121776 U JPS61121776 U JP S61121776U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- foil
- mirror surface
- rough surface
- adhered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
第１図は本考案の実施例を示す拡大断面図、第
２図は従来技術によるものの拡大断面図である。
１……配線基板、１ａ……鏡面、１ｂ……疎面
、２……ベース、３……接着剤。
FIG. 1 is an enlarged sectional view showing an embodiment of the present invention, and FIG. 2 is an enlarged sectional view of a conventional technology. 1...Wiring board, 1a...Mirror surface, 1b...Rough surface, 2...Base, 3...Adhesive.
Claims (1)
、銅箔等の金属箔による配線基板の、前記疎面を
プリンテイング面とし、前記鏡面を所望材料製の
ベースへ接着して成ることを特徴とするプリント
配線基板。 A wiring board made of metal foil such as iron foil or copper foil, with one side having a mirror surface and the other side having a rough surface, the rough surface being used as a printing surface, and the mirror surface being adhered to a base made of a desired material. A printed wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP368385U JPS61121776U (en) | 1985-01-17 | 1985-01-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP368385U JPS61121776U (en) | 1985-01-17 | 1985-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61121776U true JPS61121776U (en) | 1986-07-31 |
Family
ID=30478542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP368385U Pending JPS61121776U (en) | 1985-01-17 | 1985-01-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61121776U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5260962A (en) * | 1975-11-14 | 1977-05-19 | Matsushita Electric Works Ltd | Method of producing copper surface layer board |
| JPS56108295A (en) * | 1980-01-31 | 1981-08-27 | Fujitsu Ltd | Method of forming high density printed circuit board pattern |
| JPS5736889A (en) * | 1980-08-14 | 1982-02-27 | Matsushita Electric Works Ltd | PURINTOKAIROYOKIBANNOSEIHO |
-
1985
- 1985-01-17 JP JP368385U patent/JPS61121776U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5260962A (en) * | 1975-11-14 | 1977-05-19 | Matsushita Electric Works Ltd | Method of producing copper surface layer board |
| JPS56108295A (en) * | 1980-01-31 | 1981-08-27 | Fujitsu Ltd | Method of forming high density printed circuit board pattern |
| JPS5736889A (en) * | 1980-08-14 | 1982-02-27 | Matsushita Electric Works Ltd | PURINTOKAIROYOKIBANNOSEIHO |
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