JPS62145399U - - Google Patents
Info
- Publication number
- JPS62145399U JPS62145399U JP3258786U JP3258786U JPS62145399U JP S62145399 U JPS62145399 U JP S62145399U JP 3258786 U JP3258786 U JP 3258786U JP 3258786 U JP3258786 U JP 3258786U JP S62145399 U JPS62145399 U JP S62145399U
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- circuit
- ground
- base insulating
- ground circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010408 film Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案の実施例を示す。第２図は本考
案の実施例の一部断面を示す。第３図イは従来よ
りのシールド付ＦＰＣを断面で示し、同ロは使用
説明図である。第４図イ，ロはプリント配線導体
の形状を示す。
１…ベース絶縁フイルム、６…信号回路、７…
アース回路、８…絶縁フイルム、９…グランド穴
、１０…導電性印刷回路、１１…絶縁カバーレイ
フイルム、１２…端子部。
FIG. 1 shows an embodiment of the invention. FIG. 2 shows a partial cross section of an embodiment of the invention. FIG. 3A shows a conventional shielded FPC in cross section, and FIG. 3B is an explanatory diagram of its use. Figures 4A and 4B show the shape of the printed wiring conductor. 1...Base insulation film, 6...Signal circuit, 7...
Earth circuit, 8... Insulating film, 9... Ground hole, 10... Conductive printed circuit, 11... Insulating cover lay film, 12... Terminal section.
Claims (1)
された信号回路及びアース回路を間にして前記ベ
ース絶縁フイルムと絶縁フイルムとを接着し、前
記アース回路上で、ベース絶縁フイルム及び／又
は絶縁フイルムに設けたグランド穴を含み、導電
性印刷回路によつて、アース回路とシールド層を
同時に接続形成し、更に絶縁カバーレイ層を形成
したシールド付フレキシブル配線板。 The base insulating film and the insulating film are bonded on the base insulating film with a signal circuit and a ground circuit fixed in a predetermined arbitrary shape in between, and the base insulating film and/or the insulating film are provided on the ground circuit. A flexible wiring board with a shield that includes a ground hole, connects a ground circuit and a shield layer at the same time using a conductive printed circuit, and further forms an insulating coverlay layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3258786U JPS62145399U (en) | 1986-03-06 | 1986-03-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3258786U JPS62145399U (en) | 1986-03-06 | 1986-03-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62145399U true JPS62145399U (en) | 1987-09-12 |
Family
ID=30839407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3258786U Pending JPS62145399U (en) | 1986-03-06 | 1986-03-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62145399U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0233999A (en) * | 1988-07-23 | 1990-02-05 | Sakai Denshi Kogyo Kk | Flexible printed circuit forming body having electromagnetic wave shield |
| JP2017143275A (en) * | 2013-12-26 | 2017-08-17 | インクテック カンパニー， リミテッドＩｎｋｔｅｃ Ｃｏ．， Ｌｔｄ． | Production method of electromagnetic wave shielding film and electromagnetic wave shielding film produced by the method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5529276U (en) * | 1978-08-16 | 1980-02-26 |
-
1986
- 1986-03-06 JP JP3258786U patent/JPS62145399U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5529276U (en) * | 1978-08-16 | 1980-02-26 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0233999A (en) * | 1988-07-23 | 1990-02-05 | Sakai Denshi Kogyo Kk | Flexible printed circuit forming body having electromagnetic wave shield |
| JP2017143275A (en) * | 2013-12-26 | 2017-08-17 | インクテック カンパニー， リミテッドＩｎｋｔｅｃ Ｃｏ．， Ｌｔｄ． | Production method of electromagnetic wave shielding film and electromagnetic wave shielding film produced by the method |
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