JPS63201375U - - Google Patents
Info
- Publication number
- JPS63201375U JPS63201375U JP9207987U JP9207987U JPS63201375U JP S63201375 U JPS63201375 U JP S63201375U JP 9207987 U JP9207987 U JP 9207987U JP 9207987 U JP9207987 U JP 9207987U JP S63201375 U JPS63201375 U JP S63201375U
- Authority
- JP
- Japan
- Prior art keywords
- land
- foil
- conductive foil
- slit
- guide portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の第１の実施例の平面図、第２
図は第１図に示す線−に沿う断面図、第３図
は本考案の第２の実施例の縦断面図、第４図は本
考案の第３の実施例の平面図、第５図は従来のＦ
ＰＣのランド部周辺の平面図、第６図は第５図に
示す線−に沿う断面図である。
１０，１０Ａ，２０……ＦＰＣ、１２……絶縁
性ベース、１３……接着剤層、１４……導箔パタ
ーン、１４ａ，２４ａ……ストリツプ、１４ｂ，
２４ｂ……幅広導箔部、１４ｃ，２４ｃ……露出
導箔部、１４ｄ……スリツトに隣接する導箔部、
１５ａ，１５ｂ，２５ａ，２５ｂ……スリツト、
１６，２６……保護膜、１８，２８……開口部。
Figure 1 is a plan view of the first embodiment of the present invention;
The figures are a sectional view taken along the line shown in Fig. 1, Fig. 3 is a vertical sectional view of the second embodiment of the invention, Fig. 4 is a plan view of the third embodiment of the invention, and Fig. 5. is the conventional F
FIG. 6 is a plan view of the vicinity of the land portion of the PC, and is a sectional view taken along the line - shown in FIG. 5. 10, 10A, 20... FPC, 12... Insulating base, 13... Adhesive layer, 14... Conductive foil pattern, 14a, 24a... Strip, 14b,
24b...Wide foil guide portion, 14c, 24c...Exposed foil guide portion, 14d...Foil guide portion adjacent to the slit,
15a, 15b, 25a, 25b... slit,
16, 26... protective film, 18, 28... opening.
Claims (1)
つている保護膜の一部を開口して導箔を露出させ
、この露出導箔部を電気部品等接続用のランドと
なしたフレキシブルプリント配線板のランド構造
であつて、保護膜と重合する導箔部のランド外周
位置にスリツトを形成し、導箔部上下面に介在す
る接着剤層をこのスリツトを介して連結状態とな
したことを特徴とするフレキシブルプリント配線
板のランド構造。 A flexible printed wiring board in which a part of the protective film covering a conductive foil pattern formed on an insulating base is opened to expose the conductive foil, and this exposed conductive foil portion is used as a land for connecting electrical components, etc. The land structure is characterized in that a slit is formed at the outer periphery of the land of the foil guide portion that overlaps with the protective film, and the adhesive layer interposed on the upper and lower surfaces of the foil guide portion is connected through the slit. Land structure of flexible printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9207987U JPS63201375U (en) | 1987-06-17 | 1987-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9207987U JPS63201375U (en) | 1987-06-17 | 1987-06-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63201375U true JPS63201375U (en) | 1988-12-26 |
Family
ID=30953452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9207987U Pending JPS63201375U (en) | 1987-06-17 | 1987-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63201375U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6049667B2 (en) * | 1982-05-14 | 1985-11-02 | 大日精化工業株式会社 | Coating composition |
| JPS6059556B2 (en) * | 1979-03-30 | 1985-12-25 | 松下電工株式会社 | Electronic hour clock contact switching device |
-
1987
- 1987-06-17 JP JP9207987U patent/JPS63201375U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6059556B2 (en) * | 1979-03-30 | 1985-12-25 | 松下電工株式会社 | Electronic hour clock contact switching device |
| JPS6049667B2 (en) * | 1982-05-14 | 1985-11-02 | 大日精化工業株式会社 | Coating composition |
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