JPH0425269U - - Google Patents
Info
- Publication number
- JPH0425269U JPH0425269U JP6583090U JP6583090U JPH0425269U JP H0425269 U JPH0425269 U JP H0425269U JP 6583090 U JP6583090 U JP 6583090U JP 6583090 U JP6583090 U JP 6583090U JP H0425269 U JPH0425269 U JP H0425269U
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- hole
- layer
- wiring board
- lands
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009413 insulation Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Description
第１図はこの考案の実施例の一部を示す断面図
、第２図は従来の配線基板の一部を示す断面図、
第３図は第２図の平面図である。
FIG. 1 is a sectional view showing a part of an embodiment of this invention, FIG. 2 is a sectional view showing a part of a conventional wiring board,
FIG. 3 is a plan view of FIG. 2.
Claims (1)
ルが形成され、そのスルーホールの両端にランド
が形成された配線基板において、 上記配線上に絶縁層が形成され、その絶縁層が
上記ランドの外周部上に延長形成されていること
を特徴とする配線基板。[Claim for Utility Model Registration] In a wiring board in which a wiring is formed on an insulating substrate, a through hole is formed, and lands are formed at both ends of the through hole, an insulating layer is formed on the wiring, and the insulation layer is formed on the wiring. A wiring board characterized in that a layer is formed to extend on the outer periphery of the land.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6583090U JPH0425269U (en) | 1990-06-21 | 1990-06-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6583090U JPH0425269U (en) | 1990-06-21 | 1990-06-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0425269U true JPH0425269U (en) | 1992-02-28 |
Family
ID=31598017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6583090U Pending JPH0425269U (en) | 1990-06-21 | 1990-06-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0425269U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002071819A1 (en) * | 2001-03-07 | 2002-09-12 | Sony Corporation | Land portion of printed wiring board, method for manufacturing printed wiring board, and printed wiring board mounting method |
| WO2020026959A1 (en) * | 2018-07-31 | 2020-02-06 | 株式会社村田製作所 | Resin substrate, and method for manufacturing resin substrate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63119596A (en) * | 1986-11-07 | 1988-05-24 | 日本電波工業株式会社 | Circuit board and electronic equipment employing the same |
| JPS6361181B2 (en) * | 1979-11-22 | 1988-11-28 |
-
1990
- 1990-06-21 JP JP6583090U patent/JPH0425269U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6361181B2 (en) * | 1979-11-22 | 1988-11-28 | ||
| JPS63119596A (en) * | 1986-11-07 | 1988-05-24 | 日本電波工業株式会社 | Circuit board and electronic equipment employing the same |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002071819A1 (en) * | 2001-03-07 | 2002-09-12 | Sony Corporation | Land portion of printed wiring board, method for manufacturing printed wiring board, and printed wiring board mounting method |
| KR100887894B1 (en) * | 2001-03-07 | 2009-03-11 | 소니 가부시끼 가이샤 | Land portion of printed wiring board, method for manufacturing printed wiring board, and printed wiring board mounting method |
| WO2020026959A1 (en) * | 2018-07-31 | 2020-02-06 | 株式会社村田製作所 | Resin substrate, and method for manufacturing resin substrate |
| JPWO2020026959A1 (en) * | 2018-07-31 | 2021-03-25 | 株式会社村田製作所 | Resin substrate and manufacturing method of resin substrate |
| US11277919B2 (en) | 2018-07-31 | 2022-03-15 | Murata Manufacturing Co., Ltd. | Resin substrate and method for producing resin substrate |