JPH01110462U - - Google Patents
Info
- Publication number
- JPH01110462U JPH01110462U JP637688U JP637688U JPH01110462U JP H01110462 U JPH01110462 U JP H01110462U JP 637688 U JP637688 U JP 637688U JP 637688 U JP637688 U JP 637688U JP H01110462 U JPH01110462 U JP H01110462U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- double
- conductor layer
- board
- wiring patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 5
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図ないし第３図は本考案に係り、第１図ａ
，ｂはその一実施例に係る両面配線板における配
線パターンの接続構造を示す平面図および断面図
であり、第２図および第３図はその変形例を示す
断面図である。また、第４図ａ，ｂは従来例に係
る両面配線板における配線パターンの接続構造を
示す平面図および断面図である。
図において、符号１は配線基板、２ａ，２ｂお
よび３ａ，３ｂはそれぞれ配線パターン、４はス
ルーホール、５は第１の導体層、６は絶縁層、７
は第２の導体層である。
Figures 1 to 3 relate to the present invention, and Figure 1a
, b are a plan view and a sectional view showing a connection structure of wiring patterns in a double-sided wiring board according to one embodiment, and FIGS. 2 and 3 are sectional views showing a modification thereof. Further, FIGS. 4a and 4b are a plan view and a sectional view showing a connection structure of wiring patterns in a double-sided wiring board according to a conventional example. In the figure, 1 is a wiring board, 2a, 2b and 3a, 3b are wiring patterns, 4 is a through hole, 5 is a first conductor layer, 6 is an insulating layer, and 7
is the second conductor layer.
Claims (1)
を、該基板に設けられたスルーホールの内面に形
成された導体層を介して互いに接続してなる両面
配線板において、 前記スルーホールの内面に、互いに絶縁層を介
して配置された複数の導体層を形成するとともに
、 各導体層を介して前記配線パターンのそれぞれ
を互いに接続したことを特徴とする両面配線板。[Claims for Utility Model Registration] A double-sided wiring board in which wiring patterns formed on both the front and back sides of a wiring board are connected to each other via a conductor layer formed on the inner surface of a through hole provided in the board, A double-sided wiring board, characterized in that a plurality of conductor layers are formed on the inner surface of the through hole and are arranged through insulating layers, and each of the wiring patterns is connected to each other through each conductor layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP637688U JPH01110462U (en) | 1988-01-20 | 1988-01-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP637688U JPH01110462U (en) | 1988-01-20 | 1988-01-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01110462U true JPH01110462U (en) | 1989-07-26 |
Family
ID=31210501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP637688U Pending JPH01110462U (en) | 1988-01-20 | 1988-01-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01110462U (en) |
-
1988
- 1988-01-20 JP JP637688U patent/JPH01110462U/ja active Pending