JPS6447075U - - Google Patents
Info
- Publication number
- JPS6447075U JPS6447075U JP14161887U JP14161887U JPS6447075U JP S6447075 U JPS6447075 U JP S6447075U JP 14161887 U JP14161887 U JP 14161887U JP 14161887 U JP14161887 U JP 14161887U JP S6447075 U JPS6447075 U JP S6447075U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- film
- printed wiring
- flexible printed
- conductive foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 5
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図は本考案の第１の実施例を示す断面図、
第２図は第２の本考案の実施例を示す断面図、第
３図は本考案の第３の実施例を示す平面図、第４
図は本考案の第４の実施例を示す斜視図、第５図
は第４図に示す線―に沿う断面図、第６図は
本考案の第５の実施例を示す斜視図、第７図は第
６図に示す線―に沿う断面図、第８図は従来
例を示す断面図である。
１１，２１，３１，４１，５１…ＦＰＣ、１２
，２２…ベースフイルム、１４，２４，３４…導
箔パターン、１６…オーバレイフイルム、１７，
２７，３７，４７ａ，４７ｂ，５７ａ，５７ｂ…
ランド、１８…ランド端部、３２…ストリツプ、
３３…開口部。
FIG. 1 is a sectional view showing a first embodiment of the present invention;
FIG. 2 is a sectional view showing a second embodiment of the present invention, FIG. 3 is a plan view showing a third embodiment of the present invention, and FIG.
The figure is a perspective view showing the fourth embodiment of the present invention, Fig. 5 is a sectional view taken along the line shown in Fig. 4, Fig. 6 is a perspective view showing the fifth embodiment of the invention, The figure is a sectional view taken along the line shown in FIG. 6, and FIG. 8 is a sectional view showing a conventional example. 11, 21, 31, 41, 51...FPC, 12
, 22... Base film, 14, 24, 34... Foil guiding pattern, 16... Overlay film, 17,
27, 37, 47a, 47b, 57a, 57b...
Land, 18...Land end, 32...Strip,
33...Opening.
Claims (1)
その上にオーバレイフイルムが形成されてフレキ
シブルプリント配線板が構成されており、このフ
レキシブル配線板のフイルムの所定領域が開口さ
れて導箔パターンの一部が露出されたフレキシブ
ルプリント配線版の導箔露出部構造において、前
記導箔露出部は、フイルムがレーザ加工により開
口されて形成されてなることを特徴とするフレキ
シブルプリント配線板の導箔露出部構造。 A conductive foil pattern is formed on the base film,
An overlay film is formed on the overlay film to constitute a flexible printed wiring board, and a predetermined area of the film of the flexible wiring board is opened to expose a part of the foil pattern, thereby exposing the conductive foil of the flexible printed wiring board. 2. A structure of a flexible printed wiring board, wherein the exposed conductive foil portion is formed by opening a film by laser processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14161887U JPS6447075U (en) | 1987-09-18 | 1987-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14161887U JPS6447075U (en) | 1987-09-18 | 1987-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6447075U true JPS6447075U (en) | 1989-03-23 |
Family
ID=31406843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14161887U Pending JPS6447075U (en) | 1987-09-18 | 1987-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6447075U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60262485A (en) * | 1984-06-11 | 1985-12-25 | 株式会社日立製作所 | Method of producing printed circuit board |
| JPS62145797A (en) * | 1985-12-19 | 1987-06-29 | 日立化成工業株式会社 | Manufacture of flexible printed circuit |
-
1987
- 1987-09-18 JP JP14161887U patent/JPS6447075U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60262485A (en) * | 1984-06-11 | 1985-12-25 | 株式会社日立製作所 | Method of producing printed circuit board |
| JPS62145797A (en) * | 1985-12-19 | 1987-06-29 | 日立化成工業株式会社 | Manufacture of flexible printed circuit |
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