JPH03112963U - - Google Patents

Info

Publication number
JPH03112963U
JPH03112963U JP2139690U JP2139690U JPH03112963U JP H03112963 U JPH03112963 U JP H03112963U JP 2139690 U JP2139690 U JP 2139690U JP 2139690 U JP2139690 U JP 2139690U JP H03112963 U JPH03112963 U JP H03112963U
Authority
JP
Japan
Prior art keywords
base film
display
film
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2139690U
Other languages
Japanese (ja)
Other versions
JPH054294Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2139690U priority Critical patent/JPH054294Y2/ja
Publication of JPH03112963U publication Critical patent/JPH03112963U/ja
Application granted granted Critical
Publication of JPH054294Y2 publication Critical patent/JPH054294Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案に係るフレキシブル形プリント
配線板の一実施例を示す要部の断面図、第2図は
フレキシブル形プリント配線板の従来例を示す要
部の断面図、第3図はカバーレイフイルムに粗面
を形成した場合の要部断面図である。 1……ベースフイルム、2……導体層、3……
カバーレイフイルム、4……表示文字等、5……
粗面、10……表示用孔、11……表示部。
Fig. 1 is a sectional view of the main parts showing an embodiment of the flexible printed wiring board according to the present invention, Fig. 2 is a sectional view of the main parts showing a conventional example of the flexible printed wiring board, and Fig. 3 is the cover. FIG. 2 is a sectional view of a main part when a rough surface is formed on a ray film. 1...Base film, 2...Conductor layer, 3...
Coverlay film, 4...Display characters, etc., 5...
Rough surface, 10... display hole, 11... display section.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 柔軟性を有するベースフイルム上に導体層を形
成し、かつベースフイルムの表面全体をカバーレ
イフイルムによつて被覆し前記導体層を保護した
フレキシブル形プリント配線板において、前記カ
バーレイフイルムに表示用孔を形成して前記ベー
スフイルムの一部を外部に露呈させ、この露呈部
を表示文字等の表示部としたことを特徴とするフ
レキシブル形プリント配線板。
In a flexible printed wiring board in which a conductor layer is formed on a flexible base film, and the entire surface of the base film is covered with a coverlay film to protect the conductor layer, the coverlay film is provided with display holes. A flexible printed wiring board characterized in that a part of the base film is exposed to the outside by forming a base film, and the exposed part is used as a display part for display characters and the like.
JP2139690U 1990-03-05 1990-03-05 Expired - Lifetime JPH054294Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2139690U JPH054294Y2 (en) 1990-03-05 1990-03-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2139690U JPH054294Y2 (en) 1990-03-05 1990-03-05

Publications (2)

Publication Number Publication Date
JPH03112963U true JPH03112963U (en) 1991-11-19
JPH054294Y2 JPH054294Y2 (en) 1993-02-02

Family

ID=31524445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2139690U Expired - Lifetime JPH054294Y2 (en) 1990-03-05 1990-03-05

Country Status (1)

Country Link
JP (1) JPH054294Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009295620A (en) * 2008-06-02 2009-12-17 Hitachi Cable Ltd Metal-coated substrate for printed wiring board, printed wiring board, and method of manufacturing the same
JP2013533605A (en) * 2010-05-20 2013-08-22 スリーエム イノベイティブ プロパティズ カンパニー Enhanced adhesion of flexible circuit cover film

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009295620A (en) * 2008-06-02 2009-12-17 Hitachi Cable Ltd Metal-coated substrate for printed wiring board, printed wiring board, and method of manufacturing the same
JP2013533605A (en) * 2010-05-20 2013-08-22 スリーエム イノベイティブ プロパティズ カンパニー Enhanced adhesion of flexible circuit cover film

Also Published As

Publication number Publication date
JPH054294Y2 (en) 1993-02-02

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