JPH03112963U - - Google Patents
Info
- Publication number
- JPH03112963U JPH03112963U JP2139690U JP2139690U JPH03112963U JP H03112963 U JPH03112963 U JP H03112963U JP 2139690 U JP2139690 U JP 2139690U JP 2139690 U JP2139690 U JP 2139690U JP H03112963 U JPH03112963 U JP H03112963U
- Authority
- JP
- Japan
- Prior art keywords
- base film
- display
- film
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010408 film Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 3
- 239000012787 coverlay film Substances 0.000 claims description 3
Landscapes
- Structure Of Printed Boards (AREA)
Description
第1図は本考案に係るフレキシブル形プリント
配線板の一実施例を示す要部の断面図、第2図は
フレキシブル形プリント配線板の従来例を示す要
部の断面図、第3図はカバーレイフイルムに粗面
を形成した場合の要部断面図である。
1……ベースフイルム、2……導体層、3……
カバーレイフイルム、4……表示文字等、5……
粗面、10……表示用孔、11……表示部。
Fig. 1 is a sectional view of the main parts showing an embodiment of the flexible printed wiring board according to the present invention, Fig. 2 is a sectional view of the main parts showing a conventional example of the flexible printed wiring board, and Fig. 3 is the cover. FIG. 2 is a sectional view of a main part when a rough surface is formed on a ray film. 1...Base film, 2...Conductor layer, 3...
Coverlay film, 4...Display characters, etc., 5...
Rough surface, 10... display hole, 11... display section.
Claims (1)
成し、かつベースフイルムの表面全体をカバーレ
イフイルムによつて被覆し前記導体層を保護した
フレキシブル形プリント配線板において、前記カ
バーレイフイルムに表示用孔を形成して前記ベー
スフイルムの一部を外部に露呈させ、この露呈部
を表示文字等の表示部としたことを特徴とするフ
レキシブル形プリント配線板。 In a flexible printed wiring board in which a conductor layer is formed on a flexible base film, and the entire surface of the base film is covered with a coverlay film to protect the conductor layer, the coverlay film is provided with display holes. A flexible printed wiring board characterized in that a part of the base film is exposed to the outside by forming a base film, and the exposed part is used as a display part for display characters and the like.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2139690U JPH054294Y2 (en) | 1990-03-05 | 1990-03-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2139690U JPH054294Y2 (en) | 1990-03-05 | 1990-03-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03112963U true JPH03112963U (en) | 1991-11-19 |
JPH054294Y2 JPH054294Y2 (en) | 1993-02-02 |
Family
ID=31524445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2139690U Expired - Lifetime JPH054294Y2 (en) | 1990-03-05 | 1990-03-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH054294Y2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009295620A (en) * | 2008-06-02 | 2009-12-17 | Hitachi Cable Ltd | Metal-coated substrate for printed wiring board, printed wiring board, and method of manufacturing the same |
JP2013533605A (en) * | 2010-05-20 | 2013-08-22 | スリーエム イノベイティブ プロパティズ カンパニー | Enhanced adhesion of flexible circuit cover film |
-
1990
- 1990-03-05 JP JP2139690U patent/JPH054294Y2/ja not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009295620A (en) * | 2008-06-02 | 2009-12-17 | Hitachi Cable Ltd | Metal-coated substrate for printed wiring board, printed wiring board, and method of manufacturing the same |
JP2013533605A (en) * | 2010-05-20 | 2013-08-22 | スリーエム イノベイティブ プロパティズ カンパニー | Enhanced adhesion of flexible circuit cover film |
Also Published As
Publication number | Publication date |
---|---|
JPH054294Y2 (en) | 1993-02-02 |