JPH01163370U - - Google Patents
Info
- Publication number
- JPH01163370U JPH01163370U JP6033088U JP6033088U JPH01163370U JP H01163370 U JPH01163370 U JP H01163370U JP 6033088 U JP6033088 U JP 6033088U JP 6033088 U JP6033088 U JP 6033088U JP H01163370 U JPH01163370 U JP H01163370U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- board
- wiring board
- power supply
- multilayer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案の第１実施例たる要部断面図、
第２図は本考案の第２実施例たる要部断面図、第
３図は本考案の効果を説明するために多層プリン
ト配線基板を不平衡ストリツプラインとしてモデ
ル化した説明図、第４図は本考案の効果を説明す
るために多層プリント配線基板を平衡ストリツプ
ラインとしてモデル化した説明図、第５図は従来
のプリント配線基板の一例を示す要部断面図であ
る。
１：基板（プリプレグ）、２：信号線を含む回
路パターン層、３：電源線又は接地線の面パター
ン層。
FIG. 1 is a sectional view of the main part of the first embodiment of the present invention,
Fig. 2 is a sectional view of the main part of the second embodiment of the present invention, Fig. 3 is an explanatory diagram in which a multilayer printed wiring board is modeled as an unbalanced stripline to explain the effects of the invention, and Fig. 4 5 is an explanatory diagram in which a multilayer printed wiring board is modeled as a balanced stripline in order to explain the effects of the present invention, and FIG. 5 is a sectional view of essential parts showing an example of a conventional printed wiring board. 1: Substrate (prepreg), 2: Circuit pattern layer including signal lines, 3: Surface pattern layer of power supply line or ground line.
Claims (1)
に信号線となる回路パターンを形成すると共に、
基板表面に電源線や接地線を面パターンにて形成
してなることを特徴とするプリント配線基板。 In a multilayer printed wiring board, a circuit pattern that becomes a signal line is formed on the inner layer of the board, and
A printed wiring board characterized by having power supply lines and ground lines formed in a planar pattern on the surface of the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6033088U JPH01163370U (en) | 1988-05-07 | 1988-05-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6033088U JPH01163370U (en) | 1988-05-07 | 1988-05-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01163370U true JPH01163370U (en) | 1989-11-14 |
Family
ID=31286040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6033088U Pending JPH01163370U (en) | 1988-05-07 | 1988-05-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01163370U (en) |
-
1988
- 1988-05-07 JP JP6033088U patent/JPH01163370U/ja active Pending
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